CN216978162U - Temperature sensor volume production integrated circuit testing arrangement - Google Patents
Temperature sensor volume production integrated circuit testing arrangement Download PDFInfo
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- CN216978162U CN216978162U CN202123270318.6U CN202123270318U CN216978162U CN 216978162 U CN216978162 U CN 216978162U CN 202123270318 U CN202123270318 U CN 202123270318U CN 216978162 U CN216978162 U CN 216978162U
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Abstract
The utility model is suitable for the technical field of integrated circuit testing, and provides a temperature sensor mass production integrated circuit testing device which comprises a substrate, a supporting block, a positioning component, a clamping component and a detection unit, wherein the positioning component is arranged on the substrate, positioned on the side surface of the supporting block and used for fixing the position of an integrated circuit placed on the supporting block; the clamping assembly is arranged on the positioning assembly, and the driving end is driven to rotate manually or electrically so as to adjust the relative distance between the rod groups; the detection unit is arranged on the clamping assembly and is used for testing the contact of the integrated circuit in the process of moving along with the clamping assembly; this device is through setting up locating component, is convenient for fix the integrated circuit of different grade type in the use, can drive detecting element one side through the centre gripping subassembly that sets up and accomplish the concurrent test to integrated circuit in the testing process, and the efficiency of test is improved to very big degree.
Description
Technical Field
The utility model belongs to the technical field of integrated circuit testing, and particularly relates to a device for testing mass production integrated circuits of temperature sensors.
Background
Compared with the traditional sensor, the integrated circuit temperature sensor has the advantages of simple design, small volume, low price, high response speed, high accuracy, high integration level and the like, is widely applied to the fields of computers, communication, telecommunication, industrial control and the like, needs to test the integrated circuit in the production process, mostly adopts point-by-point or plane-by-plane measurement after the fixation of the integrated circuit temperature sensor is finished, has slower test speed and long consumed time.
Disclosure of Invention
The embodiment of the utility model aims to provide a device for testing a temperature sensor mass-produced integrated circuit, and aims to solve the technical problem that the conventional testing device is slow in testing speed.
The embodiment of the utility model is realized in such a way that the testing device for the temperature sensor mass production integrated circuit comprises a substrate and a supporting block fixedly arranged on the upper surface of the substrate, and also comprises:
the positioning assembly is arranged on the substrate, positioned on the side surface of the supporting block and used for fixing the position of the integrated circuit placed on the supporting block;
the clamping assembly is arranged on the positioning assembly, and the driving end is driven to rotate manually or electrically so as to adjust the relative distance between the rod groups; and
and the detection unit is arranged on the clamping assembly and is used for testing the contact of the integrated circuit in the process of moving along with the clamping assembly.
Preferably, the positioning assembly comprises a positioning column arranged on the substrate, a butting block connected with the positioning column in a sliding manner, a limiting rod rotatably arranged on the substrate and used for positioning the butting block, and a butting rod arranged at the bottom of the butting block;
the positioning column is fixedly provided with a fixing frame, and an elastic supporting piece is sleeved on the positioning column between the abutting block and the fixing frame;
and a plurality of limit grooves for swinging the free end of the limit rod are formed in the side surface of the abutting block.
Preferably, the bottom of the abutting rod is provided with a rubber ball, so that the integrated circuit is prevented from being damaged in the pressing process.
Preferably, the clamping assembly comprises a first clamping rod group, a second driving screw rod and a first driving screw rod, wherein the first clamping rod group is arranged oppositely, the second clamping rod group is symmetrically and slidably arranged on the first clamping rod group, the second driving screw rod is arranged on one side of the first clamping rod group, and the first driving screw rod is arranged on one side of the second clamping rod group;
the first clamping rod group is provided with a slideway for the second clamping rod group to slide;
one ends of the first driving screw rod and the second driving screw rod are in transmission connection with an external driving unit so as to adjust the positions of the first clamping rod group and the second clamping rod group.
Preferably, the other side of the first clamping rod group is provided with a first positioning rod in a sliding manner, and the other side of the second clamping rod group is provided with a second positioning rod in a sliding manner;
the first positioning rod and the second positioning rod are slidably mounted on the positioning column through positioning rings, and screw holes are formed in the positioning rings so that the first positioning rod and the second positioning rod can be fixed at different positions on the positioning column through bolts.
According to the temperature sensor mass production integrated circuit testing device provided by the embodiment of the utility model, the positioning assembly is arranged, so that different types of integrated circuits can be conveniently fixed in the use process, the clamping assembly can drive one side of the detection unit to complete simultaneous testing of the integrated circuits in the testing process, the testing efficiency is greatly improved, and in addition, the position of the clamping assembly on the positioning assembly can be adjusted through the bolt, so that the measuring work of contacts with different heights can be realized according to the requirement.
Drawings
Fig. 1 is a schematic structural diagram of a device for testing a mass-produced integrated circuit of a temperature sensor according to an embodiment of the present invention;
FIG. 2 is an enlarged view of a portion A of FIG. 1;
FIG. 3 is a cross-sectional view taken along line B-B of FIG. 1;
fig. 4 is a perspective view of a first clamping rod set in the testing apparatus for mass-produced integrated circuits of temperature sensors according to an embodiment of the present invention.
In the drawings: 1-a substrate; 2-a support block; 3-a positioning column; 4-a resisting block; 5-a fixing frame; 6-a resilient support; 7-a tightening rod; 8-a limiting groove; 9-a limiting rod; 10-clamping rod group I; 11-a slide; 12-positioning the first rod; 13-driving the first screw rod; 14-a second clamping rod group; 15-a second positioning rod; 16-driving a second screw rod; 17-detection unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
As shown in fig. 1-4, a structure diagram of a temperature sensor mass-produced integrated circuit testing apparatus according to an embodiment of the present invention includes a substrate 1, a supporting block 2, a positioning component, a clamping component and a detecting unit 17, wherein the positioning component is disposed on the substrate 1 and located at a side of the supporting block 2, and is used for fixing a position of an integrated circuit placed on the supporting block 2; the clamping assembly is arranged on the positioning assembly, and the driving end is driven to rotate manually or electrically so as to adjust the relative distance between the rod groups; the detection unit 17 is mounted on the clamping assembly, and the detection unit 17 tests the contact of the integrated circuit in the process of moving along with the clamping assembly.
In the specific implementation process of this embodiment, this device is convenient for fix the integrated circuit of different grade type in the use through setting up locating component, can drive detecting element 17 one side and accomplish the concurrent test to integrated circuit through the centre gripping subassembly that sets up in the test process, and the efficiency of test is improved to the very big degree, can also pass through the position of bolt adjustment centre gripping subassembly on locating component in addition to this realizes the measurement work to the not co-altitude contact as required.
In one embodiment of the present invention, the device is used to place the ic to be tested on the support block 2, fix the position of the ic by the positioning component, and manually or electrically drive the clamping component to operate, so as to drive the detecting unit 17 to test the contacts of the ic.
As shown in fig. 1 and fig. 2, as a preferred embodiment of the present invention, the positioning assembly includes a positioning column 3 installed on the substrate 1, a tightening block 4 connected with the positioning column 3 in a sliding manner, a limiting rod 9 rotatably installed on the substrate 1 to position the tightening block 4, and a tightening rod 7 disposed at the bottom of the tightening block 4;
a fixed frame 5 is fixedly arranged on the positioning column 3, and an elastic supporting piece 6 is sleeved on the positioning column 3 between the abutting block 4 and the fixed frame 5;
the side surface of the abutting block 4 is provided with a plurality of limiting grooves 8 for the free ends of the limiting rods 9 to swing;
the bottom of the abutting rod 7 is provided with a rubber ball, so that an integrated circuit is prevented from being damaged in the pressing process.
In the specific implementation process of the embodiment, before the integrated circuit fixing device is used, the limiting rod 9 is in a state of being separated from the limiting groove 8, the integrated circuit is placed on the supporting block 2, the abutting block 4 is pressed downwards to enable the integrated circuit to slide along the positioning column 3, the elastic supporting piece 6 is stressed to generate elastic deformation, when the rubber ball is in contact with the integrated circuit, the limiting rod 9 is stirred to enable the integrated circuit to be located in the corresponding limiting groove 8, and the abutting block 4 stops moving, so that the integrated circuit is fixed.
As shown in fig. 3 and 4, as another preferred embodiment of the present invention, the clamping assembly includes a first clamping rod set 10 disposed opposite to each other, a second clamping rod set 14 symmetrically slidably mounted on the first clamping rod set 10, a second driving screw 16 disposed on one side of the first clamping rod set 10, and a first driving screw 13 disposed on one side of the second clamping rod set 14;
the first clamping rod group 10 is provided with a slideway 11 for the second clamping rod group 14 to slide, and the detection units 17 are symmetrically and obliquely arranged on the first clamping rod group 10 and positioned at two sides of the slideway 11.
One end of each of the first driving screw 13 and the second driving screw 16 is in transmission connection with an external driving unit so as to adjust the positions of the first clamping rod group 10 and the second clamping rod group 14.
In the specific implementation process of the embodiment, the first driving screw 13 or the second driving screw 16 is rotated according to needs in the use process, and when the first driving screw 13 is rotated, the second clamping rod groups 14 are close to or far away from each other; when the second screw 16 is driven to rotate, the first clamping rod groups 10 are close to or far away from each other; during the sliding process of the first clamping rod group 10 and the second clamping rod group 14, the detection unit 17 moves synchronously along with the first clamping rod group and contacts with the contacts of the integrated circuit, and the test operation on two sides or four sides of the integrated circuit can be completed according to requirements.
As shown in fig. 3, as another preferred embodiment of the present invention, a first positioning rod 12 is slidably mounted on the other side of the first clamping rod group 10, and a second positioning rod 15 is slidably mounted on the other side of the second clamping rod group 14;
the first positioning rod 12 and the second positioning rod 15 are slidably mounted on the positioning column 3 through positioning rings, and screw holes are formed in the positioning rings so that the first positioning rod 12 and the second positioning rod 15 can be fixed at different positions on the positioning column 3 through bolts.
In the specific implementation process of this embodiment, install locating lever one 12 and locating lever two 15 at the different height of reference column 3 through the bolt, because clamping component and locating lever one 12 and two 15 sliding connection of locating lever, consequently, clamping component's position changes along with the change of locating lever one 12 and locating lever two 15 to drive detecting element 17 and test the contact of different heights, make the application range of work wider.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The utility model provides a temperature sensor volume production integrated circuit testing arrangement, includes base plate and the supporting shoe of fixed mounting in the base plate upper surface, its characterized in that still includes:
the positioning component is arranged on the substrate, positioned on the side surface of the supporting block and used for fixing the position of the integrated circuit placed on the supporting block;
the clamping assembly is arranged on the positioning assembly, and the driving end is driven to rotate manually or electrically so as to adjust the relative distance between the rod groups; and
and the detection unit is arranged on the clamping assembly and is used for testing the contact of the integrated circuit in the process of moving along with the clamping assembly.
2. The device for testing the mass production of integrated circuits with temperature sensors as claimed in claim 1, wherein the positioning assembly comprises a positioning post mounted on the substrate, a tightening block slidably connected with the positioning post, a limiting rod rotatably mounted on the substrate for positioning the tightening block, and a tightening rod disposed at the bottom of the tightening block;
the positioning column is fixedly provided with a fixing frame, and an elastic supporting piece is sleeved on the positioning column between the abutting block and the fixing frame;
and a plurality of limit grooves for swinging the free end of the limit rod are formed in the side surface of the abutting block.
3. A device for testing mass-produced integrated circuits with temperature sensors as claimed in claim 2, wherein the bottom of the tightening rod is provided with a rubber ball to avoid damaging the integrated circuits during the tightening process.
4. The device for testing the mass production of integrated circuits with temperature sensors as claimed in claim 1, wherein the clamping assembly comprises a first clamping rod set, a second driving screw rod set and a first driving screw rod set, wherein the first clamping rod set is arranged oppositely, the second clamping rod set is symmetrically and slidably arranged on the first clamping rod set, the second driving screw rod set is arranged on one side of the first clamping rod set, and the first driving screw rod set is arranged on one side of the second clamping rod set;
the first clamping rod group is provided with a slideway for the second clamping rod group to slide;
one end of each of the first driving screw rod and the second driving screw rod is in transmission connection with an external driving unit, so that the positions of the first clamping rod group and the second clamping rod group can be adjusted conveniently.
5. The device for testing the mass production of integrated circuits with temperature sensors as claimed in claim 4, wherein a first positioning rod is slidably mounted on the other side of the first clamping rod group, and a second positioning rod is slidably mounted on the other side of the second clamping rod group;
the first positioning rod and the second positioning rod are slidably mounted on the positioning column through positioning rings, and screw holes are formed in the positioning rings so that the first positioning rod and the second positioning rod can be fixed at different positions on the positioning column through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123270318.6U CN216978162U (en) | 2021-12-24 | 2021-12-24 | Temperature sensor volume production integrated circuit testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123270318.6U CN216978162U (en) | 2021-12-24 | 2021-12-24 | Temperature sensor volume production integrated circuit testing arrangement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216978162U true CN216978162U (en) | 2022-07-15 |
Family
ID=82347770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123270318.6U Active CN216978162U (en) | 2021-12-24 | 2021-12-24 | Temperature sensor volume production integrated circuit testing arrangement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216978162U (en) |
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2021
- 2021-12-24 CN CN202123270318.6U patent/CN216978162U/en active Active
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