CN216976548U - LED ceramic packaging shell - Google Patents
LED ceramic packaging shell Download PDFInfo
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- CN216976548U CN216976548U CN202220142375.1U CN202220142375U CN216976548U CN 216976548 U CN216976548 U CN 216976548U CN 202220142375 U CN202220142375 U CN 202220142375U CN 216976548 U CN216976548 U CN 216976548U
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Abstract
The utility model discloses an LED ceramic packaging shell, and relates to the technical field of ceramic packaging shells. Including ceramic base lid, ceramic base lid top center fixedly connected with mechanism that adds lustre to, ceramic base lid top both sides difference fixedly connected with heat dissipation mechanism, heat dissipation mechanism includes the heat conduction piece, heat conduction piece bottom one side is located the ceramic base lid inside and is provided with the heat absorption fin in this side equidistance, both sides run through around the heat conduction piece are provided with the louvre, ceramic base lid bottom fixedly connected with electrically conductive coupling mechanism, the ceramic base lid is including the lid shell, the corner fixed area that is used for fixed heat dissipation mechanism is seted up to lid shell top both sides. According to the utility model, the heat dissipation mechanisms for absorbing heat emitted by the LED lamp tube above the ceramic base cover when the LED lamp tube works are respectively arranged on the two sides of the top of the ceramic base cover, the conductive connecting mechanism absorbs heat emitted by the LED lamp tube below the conductive connecting mechanism when the LED lamp tube works through the contact block, and the heat is conducted out by the heat conduction block and the heat conduction plate respectively, so that the defect that the service life of the LED is influenced by heat collection inside the packaging shell is avoided.
Description
Technical Field
The utility model relates to the technical field of ceramic packaging shells, in particular to an LED ceramic packaging shell.
Background
The light emitting diode, abbreviated as LED, is a commonly used light emitting device, and emits light by energy released by electron and hole recombination, and the light emitting diode can efficiently convert electric energy into light energy, and has wide applications in modern society, such as illumination, flat panel display, medical devices, etc., and it is widely used in the illumination field, and along with the rapid development of LED technology, LED packaging materials are rapidly developed, and the existing LED packaging materials mainly are ceramic, glass composite systems and microcrystalline glass systems, and the encapsulation of LED not only requires protection of a wick, but also requires light transmission. The encapsulation of LEDs places special requirements on the encapsulation material.
Because LED can send more heat at the during operation, thereby traditional ceramic package does not have special heat conduction structure to make the ambient temperature of LED work higher, consequently can cause the influence to LED's life, and traditional packaging material can carry out the separation of certain degree to the light of LED fluorescent tube.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an LED ceramic packaging shell to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: LED ceramic package shell, including ceramic base lid, ceramic base lid top center fixedly connected with mechanism that adds lustre to, ceramic base lid top both sides fixedly connected with heat dissipation mechanism respectively, heat dissipation mechanism includes the heat conduction piece, and heat conduction piece bottom one side is located the ceramic base lid inside and is provided with the heat absorption fin at this side equidistance, and both sides run through around the heat conduction piece and are provided with the louvre, ceramic base lid bottom fixedly connected with electrically connects mechanism.
Preferably, the ceramic base cover comprises a cover shell, corner fixing areas for fixing the heat dissipation mechanism are arranged on two sides of the top of the cover shell, a center fixing area for fixing the light intensifying mechanism is arranged at the center of the top of the ceramic base cover, and a bottom packaging area for installing the conductive connection mechanism is arranged at the bottom of the ceramic base cover.
Preferably, the light intensifying mechanism comprises a light transmitting block, the top of the light transmitting block is fixedly connected with a lens, and the lens is a convex lens.
Preferably, the conductive connecting mechanism comprises a ceramic sealing plate, a printed circuit is arranged at the top of the ceramic sealing plate, electrodes are respectively embedded and fixedly connected to two sides of the ceramic sealing plate, and two ends of the printed circuit are respectively fixedly connected with the electrodes.
Preferably, the through-hole has been seted up at ceramic shrouding top center, ceramic shrouding bottom fixedly connected with heat-conducting plate, heat-conducting plate top fixedly connected with run through in the contact block of through-hole, the top of contact block is higher than ceramic shrouding.
Compared with the prior art, the utility model has the beneficial effects that:
the LED ceramic packaging shell is characterized in that heat dissipation mechanisms used for absorbing heat emitted from the LED lamp tube above the ceramic substrate cover during working are respectively installed on two sides of the top of the ceramic substrate cover, the conductive connection mechanisms absorb the heat emitted from the LED lamp tube below the ceramic substrate cover during working through the contact blocks and conduct the heat away through the heat conduction blocks and the heat conduction plate respectively, so that the working temperature of the LED lamp tube is kept, and the defect that the service life of the LED lamp tube is influenced by heat collection inside the packaging shell is avoided.
Meanwhile, the LED lamp tube needs to emit light, and in order to prevent the ceramic packaging shell from blocking the light of the LED lamp tube, the arranged light intensifying mechanism can not only transmit light through the light transmitting block but also scatter the light by utilizing the lens, so that the observable range of the light of the LED lamp tube is enlarged.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic view of a ceramic base cap according to the present invention;
FIG. 3 is a schematic structural diagram of a heat dissipation mechanism according to the present invention;
FIG. 4 is a schematic structural diagram of a light intensifying apparatus according to the present invention;
FIG. 5 is a schematic structural diagram of a conductive connection mechanism according to the present invention;
fig. 6 is a schematic diagram of the assembled structure of the present invention.
In the figure: 1. a ceramic-based cover; 101. a cover shell; 102. a central fixed area; 103. a corner fixing area; 104. a bottom encapsulation region; 2. a light intensifying mechanism; 201. a light-transmitting block; 202. a lens; 3. a heat dissipation mechanism; 301. a heat conducting block; 302. heat absorbing fins; 303. heat dissipation holes; 4. a conductive connection mechanism; 401. a ceramic seal plate; 402. a printed circuit; 403. an electrode; 404. a through hole; 405. a heat conducting plate; 406. and a contact block.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Further, it will be appreciated that the dimensions of the various elements shown in the figures are not drawn to scale, for ease of description, and that the thickness or width of some layers may be exaggerated relative to other layers, for example.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined or illustrated in one figure, it will not need to be further discussed or illustrated in detail in the description of the following figure.
Examples
In the selection process of the LED packaging shell, the LED ceramic packaging shell provided by the utility model is used, and because the traditional LED lamp tube packaging shell can not effectively radiate heat, the LED lamp tube adopting the traditional packaging mode can generate heat collection in the long working process, so that the LED lamp tube works at an ambient temperature far higher than the proper working temperature, the service life of the LED lamp tube can be reduced by at least 30% in the continuous heat collection environment, and the heat radiation problem of the LED lamp tube is improved, so that the service life of the LED lamp tube is prolonged.
As shown in fig. 1 to 6, the present invention provides a technical solution: an LED ceramic package shell comprises a ceramic base cover 1, a light intensifying mechanism 2 is fixedly connected to the center of the top of the ceramic base cover 1, heat dissipating mechanisms 3 are fixedly connected to two sides of the top of the ceramic base cover 1 respectively, each heat dissipating mechanism 3 comprises a heat conducting block 301, one side of the bottom of the heat conducting block 301 is positioned inside the ceramic base cover 1 and is provided with heat absorbing fins 302 at equal intervals, heat dissipating holes 303 are arranged on the front side and the rear side of the heat conducting block 301 in a penetrating manner, a heat conducting connection mechanism 4 is fixedly connected to the bottom of the ceramic base cover 1, the ceramic base cover 1 comprises a cover shell 101, corner fixing areas 103 used for fixing the heat dissipating mechanisms 3 are arranged on two sides of the top of the cover shell 101, a center fixing area 102 used for fixing the light intensifying mechanism 2 is arranged at the center of the top of the ceramic base cover 1, a bottom packaging area 104 used for installing the heat conducting connection mechanism 4 is arranged at the bottom of the ceramic base cover 1, the light intensifying mechanism 2 comprises a light transmitting block 201, and a lens 202 is fixedly connected to the top of the light transmitting block 201, lens 202 is convex lens, electrically conductive connection mechanism 4 includes ceramic shrouding 401, ceramic shrouding 401 top is provided with printed circuit 402, embedded fixedly connected with electrode 403 respectively in ceramic shrouding 401's both sides, printed circuit 402 both ends respectively with electrode 403 fixed connection, through-hole 404 has been seted up at ceramic shrouding 401 top center, ceramic shrouding 401 bottom fixedly connected with heat-conducting plate 405, heat-conducting plate 405 top fixedly connected with runs through in the contact piece 406 of through-hole 404, the top of contact piece 406 is higher than ceramic shrouding 401.
It should be noted that the packaging box guides heat generated by the LED lamp during operation from two directions, the heat dissipation mechanisms 3 for absorbing heat emitted from the LED lamp tube during operation are respectively installed at two sides of the top of the ceramic base cover 1, and the conductive connection mechanism 4 absorbs heat emitted from the LED lamp tube during operation through the contact block 406.
It should be noted that the ceramic base cap 1 and the ceramic sealing plate 401 are made of the material of type a473 or AN242, and the electrodes 403, the printed circuit 402, the heat conducting block 301, the heat conducting plate 405 and the contact block 406 are made of copper, so that the ceramic base cap and the ceramic sealing plate have good electrical conductivity and excellent heat conducting performance.
It should be noted that, the printing opacity piece 201 and the lens 202 in the mechanism 2 that increases light are integrative, and printing opacity piece 201 and lens 202 are the glass material, and its raw materials are a monoblock glass board, and its lens 202 is for polishing and making, for avoiding ceramic package shell to block the light of LED fluorescent tube, the mechanism 2 that increases light that sets up not only can also utilize lens 202 through printing opacity piece 201 printing opacity to go out light scattering, increases the observable scope of LED fluorescent tube light.
It should be noted that, when power supply connection of the LED lamp tube is performed, two ends of the LED lamp tube need to be connected to the printed circuit respectively, and the electrodes on two sides of the ceramic sealing plate supply power thereto, wherein the forward voltage of the power supply is 3,1V, the forward current is 20mA, the color is white light, and the wavelength is 470 nm.
It should be noted that, heat dissipation fin 302 relies on its can be abundant with the inside great area of contact of ceramic substrate lid 1 can absorb the heat that the LED fluorescent tube distributes out, the heat that finishes absorbing can be saved in heat conduction piece 301, carry over out the discharge through the louvre 303 of heat conduction piece 301 both sides by the air, thereby can carry out thermal dissipation, need not set up fan lamp heat abstractor on the circuit board of small area installation LED fluorescent tube and assist the heat dissipation, but just need dispel the heat through reasonable wind channel on the circuit board of installing a large amount of heating element.
It should be noted that when the package is mounted, the package can be precisely soldered by infrared reflow soldering and wave soldering, so that the connection integrity of the package can be ensured.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
- LED ceramic package shell, including ceramic base cover (1), its characterized in that: ceramic base lid (1) top center fixedly connected with intensifying mechanism (2), ceramic base lid (1) top both sides fixedly connected with heat dissipation mechanism (3) respectively, heat dissipation mechanism (3) are located ceramic base lid (1) inside and are provided with heat absorption fin (302) at this side equidistance including heat conduction piece (301), heat conduction piece (301) front and back both sides run through and are provided with louvre (303), ceramic base lid (1) bottom fixedly connected with electrically conductive coupling mechanism (4).
- 2. The LED ceramic package of claim 1, wherein: ceramic base lid (1) is including lid shell (101), corner fixed area (103) that are used for fixed heat dissipation mechanism (3) are seted up to lid shell (101) top both sides, and ceramic base lid (1) top center is seted up and is used for fixed central fixed area (102) of intensifying mechanism (2), and ceramic base lid (1) bottom is provided with bottom encapsulation district (104) that are used for installing electrically conductive coupling mechanism (4).
- 3. The LED ceramic package of claim 1, wherein: the intensifying mechanism (2) comprises a light transmitting block (201), a lens (202) is fixedly connected to the top of the light transmitting block (201), and the lens (202) is a convex lens.
- 4. The LED ceramic package of claim 1, wherein: the conductive connection mechanism (4) comprises a ceramic sealing plate (401), a printed circuit (402) is arranged at the top of the ceramic sealing plate (401), electrodes (403) are respectively embedded and fixedly connected to two sides of the ceramic sealing plate (401), and two ends of the printed circuit (402) are respectively fixedly connected with the electrodes (403).
- 5. The LED ceramic package of claim 4, wherein: through-hole (404) have been seted up at ceramic shrouding (401) top center, ceramic shrouding (401) bottom fixedly connected with heat-conducting plate (405), heat-conducting plate (405) top fixedly connected with run through in contact piece (406) of through-hole (404), the top of contact piece (406) is higher than ceramic shrouding (401).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220142375.1U CN216976548U (en) | 2022-01-19 | 2022-01-19 | LED ceramic packaging shell |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202220142375.1U CN216976548U (en) | 2022-01-19 | 2022-01-19 | LED ceramic packaging shell |
Publications (1)
Publication Number | Publication Date |
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CN216976548U true CN216976548U (en) | 2022-07-15 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202220142375.1U Active CN216976548U (en) | 2022-01-19 | 2022-01-19 | LED ceramic packaging shell |
Country Status (1)
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CN (1) | CN216976548U (en) |
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2022
- 2022-01-19 CN CN202220142375.1U patent/CN216976548U/en active Active
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