CN216957982U

CN216957982U - GaN-based chip encapsulation is with range upon range of tool

Info

Publication number: CN216957982U
Application number: CN202220518694.8U
Authority: CN
Inventors: 闫怀宝; 闫发旺
Original assignee: Jiangxi Yuhongjin Material Technology Co ltd
Current assignee: Jiangxi Yuhongjin Material Technology Co ltd
Priority date: 2022-03-09
Filing date: 2022-03-09
Publication date: 2022-07-12
Anticipated expiration: 2032-03-09

Abstract

The utility model discloses a stacking jig for packaging GaN-based chips, which comprises a bottom plate, wherein a group of positioning units are arranged on the upper end surface of the bottom plate, each positioning unit comprises a group of positioning blocks for positioning the chip, the positioning blocks in the positioning units surround a square area, the positioning chips are placed in the square areas, the bottoms of the positioning blocks are provided with mounting seats, the mounting seats are fixedly connected onto the bottom plate through screws, hollow holes are formed in the bottom plate under the square areas, the bottom plate is made of mold steel, and the positioning blocks are made of nylon. The utility model has simple structure, light weight, high precision and good protection.

Description

GaN-based chip encapsulation is with range upon range of tool

Technical Field

The utility model relates to the technical field of semiconductor manufacturing, in particular to a stacking jig for packaging a GaN-based chip.

Background

3D wafer level packaging, abbreviated as English (WLP), includes CIS emitters, MEMS packaging, and standard device packaging. Refers to a packaging technology of stacking more than two chips in the same package in the vertical direction without changing the size of the package, and it is derived from the stack package of flash memory (NOR/NAND) and SDRAM. The main characteristics include: the multifunctional and high-efficiency effect is achieved; high capacity and density, doubled function and application in unit volume and low cost.

In the 3D packaging process of the GaN-based chip, the chip needs to be positioned by utilizing a stacking jig. The existing laminated jig for packaging the GaN-based chip mostly has the defects of heavy weight and easy damage to the chip. Therefore, a new lamination jig for GaN-based chip packaging is needed to improve the above-mentioned defects.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a lamination jig for GaN-based chip packaging to solve the above-mentioned problems of the prior art.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a GaN base chip encapsulation is with range upon range of tool, includes the bottom plate, be provided with a set of positioning unit on the bottom plate up end, positioning unit includes a set of locating piece that is used for positioning the chip, the locating piece among the positioning unit encloses into square region, positioning chip places in square region, the locating piece bottom is provided with the mount pad, the mount pad passes through screw fixed connection on the bottom plate, be provided with the fretwork hole in the bottom plate under lieing in square region, the bottom plate adopts the mould steel material, the locating piece adopts the nylon material.

Preferably, a group of positioning columns is arranged on the upper end face of the bottom plate and located around the hollow hole.

Preferably, the bottom of bottom plate is provided with additional strengthening, additional strengthening includes the horizontal strengthening rib of horizontal setting and the vertical strengthening rib of vertical setting.

Preferably, the inner wall of the upper end of the positioning block is provided with an arc surface.

Preferably, an inclined reinforcing rib is arranged between the positioning block and the mounting seat.

Preferably, a group of positioning bulges are arranged on the upper end face of the bottom plate, and the mounting seat is clamped in the positioning bulges.

Compared with the prior art, the utility model has the beneficial effects that: when the positioning device works, the chip is placed in the area defined by the positioning blocks, and accurate positioning is realized. The hollowed-out holes can reduce the quality of the jig. The locating piece with the contact of chip side adopts the nylon material can promote the protection to the chip, avoids haring the chip. The horizontal reinforcing ribs and the vertical reinforcing ribs are used for improving the rigidity of the bottom plate and avoiding deformation of the bottom plate. The arc surface is convenient for leading the chip into a positioning position. The rigidity of the positioning block is improved by the inclined reinforcing ribs. The utility model has simple structure, light weight, high precision and good protection.

Drawings

FIG. 1 is a schematic structural view of a GaN-based chip package lamination jig;

FIG. 2 is an exploded view of a GaN-based chip package fixture;

fig. 3 is a schematic bottom structure view of a GaN-based chip packaging lamination jig.

In the figure: 1-bottom plate, 2-positioning chip, 3-positioning unit, 4-positioning block, 5-arc surface, 6-mounting seat, 7-oblique reinforcing rib, 8-screw, 9-positioning projection, 10-hollow hole, 11-positioning column, 12-reinforcing structure, 13-vertical reinforcing rib and 14-horizontal reinforcing rib.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1: please refer to fig. 1-2, a stacked jig for packaging a GaN-based chip includes a bottom plate 1, a set of positioning units 3 is disposed on an upper end surface of the bottom plate 1, the positioning units 3 include a set of positioning blocks 4 for positioning the chip 2, the positioning blocks 4 in the positioning units 3 enclose a square region, the positioning chip 2 is disposed in the square region, a mounting seat 6 is disposed at the bottom of the positioning block 4, the mounting seat 6 is fixedly connected to the bottom plate 1 through a screw 8, a hollow hole 10 is disposed in the bottom plate 1 under the square region, the bottom plate 1 is made of mold steel, and the positioning blocks 4 are made of nylon.

A group of positioning columns 11 are arranged on the upper end face of the bottom plate 1, and the positioning columns 11 are located around the hollow holes 10. The positioning columns 11 are used for positioning the bottoms of the chips 2.

The bottom of the bottom plate 1 is provided with a reinforcing structure 12, and the reinforcing structure 12 comprises transverse reinforcing ribs 14 arranged transversely and vertical reinforcing ribs 13 arranged vertically. The transverse reinforcing ribs 14 and the vertical reinforcing ribs 13 are used for improving the rigidity of the bottom plate 1 and avoiding deformation of the bottom plate.

The working principle is as follows: when the positioning device works, the chip 2 is placed in the area surrounded by the positioning blocks 4, and accurate positioning is realized. The hollowed-out holes 10 can reduce the quality of the jig. The positioning block 4 contacted with the side edge of the chip 2 is made of nylon materials, so that the protection of the chip 2 can be improved, and the chip 2 is prevented from being damaged.

Example 2: referring to fig. 2, a difference between the lamination jig for GaN-based chip package and embodiment 1 is that an arc surface 5 is disposed on an inner wall of an upper end of the positioning block 4. The circular arc surface 5 facilitates the introduction of the chip 2 into a positioning position.

An inclined reinforcing rib 7 is arranged between the positioning block 4 and the mounting seat 6. The inclined reinforcing ribs 7 improve the rigidity of the positioning blocks 4.

A set of positioning protrusions 9 are arranged on the upper end face of the bottom plate 1, and the mounting seat 6 is clamped in the positioning protrusions 9. The positioning boss 9 is used for positioning the mounting seat 6.

In the present invention, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only terms of relationships determined for convenience of describing structural relationships of the parts or elements of the present invention, and are not intended to refer to any parts or elements of the present invention, and are not to be construed as limiting the present invention.

Claims

1. The utility model provides a GaN base chip encapsulation is with range upon range of tool, includes bottom plate (1), its characterized in that: be provided with a set of positioning unit (3) on bottom plate (1) up end, positioning unit (3) are including a set of locating piece (4) that are used for positioning chip (2), locating piece (4) in positioning unit (3) enclose into square region, positioning chip (2) are placed in square region, locating piece (4) bottom is provided with mount pad (6), mount pad (6) are through screw (8) fixed connection on bottom plate (1), be provided with fretwork hole (10) in bottom plate (1) in the position under the square region that is located, bottom plate (1) adopt the mould steel material, locating piece (4) adopt the nylon material.

2. The lamination jig for GaN-based chip packaging according to claim 1, wherein: a group of positioning columns (11) are arranged on the upper end face of the bottom plate (1), and the positioning columns (11) are located around the hollow holes (10).

3. The lamination jig for GaN-based chip packaging according to claim 2, wherein: the bottom of bottom plate (1) is provided with additional strengthening (12), additional strengthening (12) are including horizontal strengthening rib (14) and the vertical strengthening rib (13) of vertical setting of horizontal setting.

4. The jig according to claim 3, wherein: and an arc surface (5) is arranged on the inner wall of the upper end of the positioning block (4).

5. The jig according to claim 4, wherein: an inclined reinforcing rib (7) is arranged between the positioning block (4) and the mounting seat (6).

6. The jig according to claim 5, wherein: a set of positioning protrusions (9) are arranged on the upper end face of the bottom plate (1), and the mounting seat (6) is clamped in the positioning protrusions (9).