CN210435252U - Integrated packaging chip pin cuts off frock of bending - Google Patents
Integrated packaging chip pin cuts off frock of bending Download PDFInfo
- Publication number
- CN210435252U CN210435252U CN201921352105.8U CN201921352105U CN210435252U CN 210435252 U CN210435252 U CN 210435252U CN 201921352105 U CN201921352105 U CN 201921352105U CN 210435252 U CN210435252 U CN 210435252U
- Authority
- CN
- China
- Prior art keywords
- supporting part
- chip
- frame
- pin
- supporting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model provides an integrated packaging chip pin cuts off frock of bending, includes a supporting bench to and locate the splenium down of a supporting bench top, a supporting bench includes: the chip supporting part and the pins and the frame supporting part are symmetrically arranged on two sides of the chip supporting part; the lead and frame support portion includes: the first supporting part comprises a horizontal table and a vertical part which are integrally formed, the bottom surface of the horizontal table is connected with a vertical oil cylinder, and the vertical part and the side surface of the chip supporting part are arranged in a clearance mode; the second supporting part is arranged at an interval with the first supporting part and is flush with the horizontal table, and the surface of the second supporting part is provided with a punching rib groove; a hold-down portion comprising: the cutter body is arranged corresponding to the punching rib groove and connected with the upper transverse frame; the positioning plate is respectively arranged corresponding to the edges of the two sides of the chip supporting part and connected with the upper cross frame; the upper transverse frame is connected with a pair of lower pressure oil cylinders. The pin punching or punching can be effectively carried out, so that the packaged chip is separated from the frame, the pin can be bent after the punching is finished, the bending process is stable and effective, and the process time is greatly shortened.
Description
Technical Field
The utility model relates to an integrated circuit encapsulation especially cuts off the frock of bending with an integrated package chip pin and is relevant.
Background
In the integrated circuit packaging process, after plastic packaging is completed, the packaged chip needs to be separated from the lead frame body through a tool, and the modes of punching ribs, cutting ribs and the like are generally adopted. DIP encapsulation chip belongs to integrated encapsulation chip's one kind, and when carrying out the punching muscle/the muscle of cutting of pin to and the pin was bent, current mode adopted two different processes to accomplish, and is inefficient, if can embody the continuity of two processes, shortens the middle link of transporting, will greatly improve technology overall efficiency.
SUMMERY OF THE UTILITY MODEL
To the problem that relevant prior art exists, the utility model provides an integrated packaging chip pin cuts off frock of bending can effectually carry out pin dashing muscle or break, makes packaging chip and frame separation, can carry out bending of pin after the dashing muscle is accomplished simultaneously, and the process of bending is stable effective, levels after bending effectually, the process time who greatly shortens.
In order to achieve the above purpose, the utility model adopts the following technology:
the utility model provides an integrated packaging chip pin cuts off frock of bending, includes a supporting bench, and locates the splenium of propping up supporting bench top, its characterized in that:
the support table includes:
a chip support part for bearing the inversely placed packaged chip; and
pin and frame supporting part, the symmetry is located chip supporting part both sides for bear pin and frame of being connected with the encapsulation chip, pin and frame supporting part includes:
the first supporting part comprises a horizontal table and a vertical part which are integrally formed, the bottom surface of the horizontal table is connected with a vertical oil cylinder, and the vertical part and the side surface of the chip supporting part are arranged in a clearance mode; and
the second supporting parts are arranged at the outer side of the first supporting part at intervals and are flush with the horizontal table, and the surface of the second supporting part is provided with a punching rib groove;
the push-down portion includes:
the cutter body is arranged corresponding to the punching rib groove and connected with the upper transverse frame; and
the positioning plates are respectively arranged corresponding to the edges of the two sides of the chip supporting part and connected with the upper transverse frame;
the upper transverse frame is connected with a pair of downward-pressing oil cylinders.
The base is located through first pillar to the chip supporting part, and the chip supporting part is formed with the load-bearing groove from the top surface undercut, and the load-bearing groove is used for bearing the encapsulation chip main part after the plastic envelope, and the load-bearing groove both sides form the wall protruding, and the locating plate corresponds the setting with the wall protruding, and when the locating plate descends to contradict with the wall protruding, the locating plate lateral surface flushes with chip supporting part surface.
The convex top surface of the wall, the top surface of the first supporting part and the top surface of the second supporting part are flush. Limiting plates are arranged at the front end and the rear end of the chip supporting part. The outside radius angle of locating plate bottom. The vertical oil cylinder is arranged on the base. The second supporting part is arranged on the base through the second support column. The top of the lower pressure oil cylinder is connected with the upper frame. The top of the positioning plate is clamped in the clamping groove of the upper transverse frame and is fastened through a screw.
The utility model discloses beneficial effect:
1. the pin punching or punching can be effectively carried out, so that the packaged chip is separated from the frame, the pin can be bent after the punching is finished, the bending process is stable and effective, the flattening effect after the bending is good, and the process time is greatly shortened;
2. the structural design of the chip supporting part is beneficial to enabling the plastic package body part borne on the chip supporting part to be relatively stably limited in a space, and is beneficial to punching ribs and bending; meanwhile, the cooperation of the wall protrusions and the positioning plate is utilized, so that effective bending supporting points and flat supporting surfaces are provided for bending;
3. the first supporting part, the second supporting part and the chip supporting part are arranged at relatively independent intervals, and the stroke of the second supporting part cannot be influenced.
Drawings
Fig. 1 is a perspective view of an embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of an embodiment of the present invention.
The integrated packaging chip pin of this embodiment cuts off frock of bending, includes the brace table, and locates the splenium of brace table top.
As a specific implementation manner of this embodiment, specifically, the support table includes: the chip support part 2 and the pin and frame support parts symmetrically arranged on two sides of the chip support part 2.
A chip support part 2 for carrying the packaged chip placed upside down; and the pin and frame supporting part is used for bearing the pin and the frame connected with the packaged chip. The chip support part 2 and the lead and frame support part are arranged on the base 1.
More specifically, the lead and frame support part includes: a first support part 31 and a second support part 41 arranged at an interval outside the first support part 31.
First supporting part 31, including integrated into one piece horizontal stand and vertical portion, vertical hydro-cylinder 32 is connected to the horizontal stand bottom surface, and base 1 is located to vertical hydro-cylinder 32, and vertical portion sets up with 2 side clearance of chip supporting part. The specific gap should be slightly larger than the thickness of the pin to be machined.
The second support part 41 is flush with the horizontal platform, and the surface of the second support part is provided with a punching rib groove 42. The second support 41 is provided to the base 1 via a second support column 40.
The top surfaces of the wall protrusions 22, the first supporting part 31 and the second supporting part 41 are flush with each other.
As a specific implementation manner of this embodiment, specifically, the pressing portion includes: the cutter body 61 is arranged corresponding to the punching rib groove 42 and connected with the upper transverse frame 6; and the positioning plates 5 are respectively arranged corresponding to the edges of the two sides of the chip supporting part 2, and the top parts of the positioning plates 5 are clamped in the clamping grooves of the upper cross frames 6 and are fastened through screws. The upper cross frame 6 is connected to a pair of lower pressure cylinders 60. The top of the lower pressure oil cylinder 60 is connected with the upper frame 7.
In a preferred embodiment, the chip support 2 is provided with a stopper plate 23 at the front and rear ends thereof for stopping the mounted packaged chip, the stopper plate 23 is stopped from both ends, and the wall projection 22 is stopped from both sides.
When the operation is carried out: the lead frame main body with the DIP packaging chip needing to be punched and cut is placed on a supporting table, punching and cutting separation is conducted through a pressing portion, and bending processing is conducted through the supporting table.
Specifically, the method comprises the following steps:
the plastic package body part is inversely arranged in the bearing groove 21, correspondingly, because the DIP pin is arranged in the middle position when being led out from the plastic package body, the DIP of the bearing groove 21 is just utilized for matching, and after the plastic package body part is arranged, the pin can just be supported on the first supporting part 31 and the second supporting part 41 at the two sides.
The plastic package body part is limited by the wall protrusions 22 and the limit plates 23 and is relatively stable in the bearing groove 21.
The upper cross frame 6 is pressed down through the operation of the pressing oil cylinder 60, and the cutter body 61 and the positioning plate 5 are driven to press down. Specifically, when setting up locating plate 5 height to push down the back, when cutter body 61 dashes the muscle and accomplishes, locating plate 5 just contradicts with protruding 22 of wall for the standard.
After pressing down, the knife body 61 breaks the connection between the lead and the lead frame, so that the DIP packaged chip is separated from the lead frame.
The vertical cylinder 32 is actuated to jack up the first support 31. The vertical portion of the first supporting portion 31 acts on the designated position of the pin, the specific position is the outer side of the contact position of the positioning plate 5 and the wall protrusion 22, and due to the fact that the positioning plate 5 serves as a support, the vertical portion gradually folds the horizontal pin towards the outer side face direction of the positioning plate 5 in the jacking process. As a preferred embodiment, the bottom of the positioning plate 5 is rounded at the outer side 51, which can provide an arc support for bending the pins, and prevent the pins from being physically damaged by the corners.
With the rising of vertical portion, the pin is folded to locating plate 5 lateral surface to obtain unified level and smooth between locating plate 5 and vertical portion at last, saved and still carried out the process of plastic alone.
Through the implementation of this embodiment, can effectually carry out pin towards the muscle or break, make encapsulation chip and frame separation, can carry out the bending of pin after the muscle is towards the completion simultaneously, the process of bending is stable effective, levels effectually after bending, the process time who greatly shortens.
Claims (9)
1. The utility model provides an integrated packaging chip pin cuts off frock of bending, includes a supporting bench, and locates the splenium of propping up supporting bench top, its characterized in that:
the support table includes:
a chip support part (2) for bearing the packaged chip placed upside down; and
pin and frame supporting part, the symmetry is located chip supporting part (2) both sides for bear pin and frame with encapsulating chip is connected, pin and frame supporting part includes:
the first supporting part (31) comprises an integrally formed horizontal table and a vertical part, the bottom surface of the horizontal table is connected with a vertical oil cylinder (32), and the vertical part and the side surface of the chip supporting part (2) are arranged in a clearance mode; and
the second supporting parts (41) are arranged at the outer side of the first supporting part (31) at intervals, are flush with the horizontal table and are provided with punching rib grooves (42) on the surfaces;
the push-down portion includes:
the cutter body (61) is arranged corresponding to the punching rib groove (42) and is connected with the upper transverse frame (6); and
the positioning plate (5) is arranged corresponding to the edges of the two sides of the chip supporting part (2) respectively and is connected with the upper cross frame (6);
the upper transverse frame (6) is connected with a pair of lower pressure oil cylinders (60).
2. The integrated package chip pin cutting and bending tool according to claim 1, characterized in that: base (1) is located through first pillar (20) in chip supporting part (2), chip supporting part (2) are formed with bearing groove (21) from the top surface undercut, bearing groove (21) are used for bearing the encapsulation chip main part behind the plastic envelope, bearing groove (21) both sides form the protruding (22) of wall, locating plate (5) correspond the setting with protruding (22) of wall, when locating plate (5) down to contradict with protruding (22) of wall, locating plate (5) lateral surface flushes with chip supporting part (2) surface.
3. The integrated package chip pin cutting and bending tool according to claim 1, characterized in that: the top surfaces of the wall protrusions (22), the first supporting part (31) and the second supporting part (41) are flush.
4. The integrated package chip pin cutting and bending tool according to claim 2, characterized in that: limiting plates (23) are arranged at the front end and the rear end of the chip supporting part (2).
5. The integrated package chip pin cutting and bending tool according to claim 1, characterized in that: the outer side of the bottom of the positioning plate (5) is rounded (51).
6. The integrated package chip pin cutting and bending tool according to claim 2, characterized in that: the vertical oil cylinder (32) is arranged on the base (1).
7. The integrated package chip pin cutting and bending tool according to claim 1, characterized in that: the second support part (41) is provided to the base (1) via a second support column (40).
8. The integrated package chip pin cutting and bending tool according to claim 1, characterized in that: the top of the lower pressure oil cylinder (60) is connected with the upper frame (7).
9. The integrated package chip pin cutting and bending tool according to claim 1, characterized in that: the top of the positioning plate (5) is clamped in the clamping groove of the upper transverse frame (6) and is fastened through screws.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921352105.8U CN210435252U (en) | 2019-08-20 | 2019-08-20 | Integrated packaging chip pin cuts off frock of bending |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921352105.8U CN210435252U (en) | 2019-08-20 | 2019-08-20 | Integrated packaging chip pin cuts off frock of bending |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210435252U true CN210435252U (en) | 2020-05-01 |
Family
ID=70409320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921352105.8U Active CN210435252U (en) | 2019-08-20 | 2019-08-20 | Integrated packaging chip pin cuts off frock of bending |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210435252U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111790852A (en) * | 2020-07-21 | 2020-10-20 | 苏州格瑞林达医疗科技有限公司 | Shearing and folding method of plug-in resistor |
| CN112756505A (en) * | 2021-03-11 | 2021-05-07 | 彭错 | Cement well lid is pour and is tailor all-in-one with circular arc reinforcing bar is buckled |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
-
2019
- 2019-08-20 CN CN201921352105.8U patent/CN210435252U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111790852A (en) * | 2020-07-21 | 2020-10-20 | 苏州格瑞林达医疗科技有限公司 | Shearing and folding method of plug-in resistor |
| CN112756505A (en) * | 2021-03-11 | 2021-05-07 | 彭错 | Cement well lid is pour and is tailor all-in-one with circular arc reinforcing bar is buckled |
| CN112974668A (en) * | 2021-04-27 | 2021-06-18 | 四川明泰电子科技有限公司 | Semiconductor device bar cutting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210435252U (en) | Integrated packaging chip pin cuts off frock of bending | |
| CN212070117U (en) | Stamping die is used in panel processing | |
| CN108023126B (en) | Edge folding mechanism | |
| CN210614922U (en) | Stamping die with ejection structure | |
| CN206366599U (en) | Frame concealed curtain wall glass plate installs pressing plate punching, the cut-out progressive die | |
| CN109648005B (en) | Pin bending device of electronic element | |
| CN213591516U (en) | Die punch device of electronic product | |
| CN210614799U (en) | Support side cut mould | |
| CN204564902U (en) | A kind of steel lid rushes four side punch dies | |
| CN112387904A (en) | Single-chip device rib cutting and shaping device | |
| CN216543746U (en) | Positive and negative pressure tool post with top column | |
| CN218486993U (en) | Sheet metal punching device | |
| CN215143886U (en) | Profiling punching die on inclined plane cambered surface | |
| CN216359444U (en) | Cell-phone center tool | |
| CN201262953Y (en) | Leads frame structure of improved integrated circuit | |
| CN211386501U (en) | Stamping and blanking die | |
| CN210909891U (en) | Notebook keyboard shell processing smelting tool | |
| CN216299530U (en) | Cutting die for easily wrinkled material | |
| CN218168339U (en) | Processing equipment for automatic punch forming of metal piece | |
| CN212190799U (en) | Angle steel cut-out press mechanism | |
| CN212760649U (en) | Full-automatic cup reaming and stamping forming integrated machine | |
| CN210849980U (en) | Wheel carrier fixing jig | |
| CN213104053U (en) | Aluminum profile punching die | |
| CN212288838U (en) | Lithium ion battery trilateral encapsulation casing dashes hole device | |
| CN217801852U (en) | Blanking stable form side cut mould |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province Patentee after: Sichuan Mingtai Microelectronics Technology Co.,Ltd. Address before: 629000 No.11, Dequan road Microelectronics Industrial Park, Suining Economic Development Zone, Sichuan Province Patentee before: SICHUAN MOUNTEK ELECTRONIC TECHNOLOGY CO.,LTD. |