CN216928585U

CN216928585U - Laser radar product packaging structure

Info

Publication number: CN216928585U
Application number: CN202122756226.2U
Authority: CN
Inventors: 张江华; 杨先方; 李鹏
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2021-11-11
Filing date: 2021-11-11
Publication date: 2022-07-08
Anticipated expiration: 2031-11-11

Abstract

The utility model relates to a laser radar product packaging structure which comprises a substrate, wherein at least one ASIC (application specific integrated circuit) induction chip module is arranged on the substrate, the ASIC induction chip module comprises an ASIC chip, the front surface of the ASIC chip is provided with an induction chip, the ASIC chip and the induction chip are bonded together through a glue layer, the glue layer overflows the side edge of the induction chip and forms a bevel edge on the side edge of the induction chip, a glass sheet is arranged above the induction chip, and the glass sheet is bonded on the induction chip. According to the laser radar product packaging structure, the glue layer overflows and fills the side edge of the induction chip, the bevel edge is formed on the side edge of the induction chip, the insulation effect is achieved, and the stress on the chip can be buffered.

Description

Laser radar product packaging structure

Technical Field

The utility model relates to a laser radar product packaging structure, and belongs to the technical field of semiconductor packaging.

Background

The development of present laser radar product, the performance requirement to sensor chip and control chip is more and more high, and sensor chip and control chip's area is bigger and bigger, and sensor chip and control chip's electric property connecting wire is also more and more, and the chip is more and more because the chip is more and more to the bonding wire of chip to the tradition method of piling up the chip, and product quality is difficult to guarantee, and the chip is too big, causes the chip back to turn over during the encapsulation easily, the problem that the plastic envelope material is not filled up.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem of providing a laser radar product packaging structure aiming at the prior art, wherein a glue layer overflows and fills the side edge of an induction chip, and a bevel edge is formed on the side edge of the induction chip, so that the insulation effect is achieved, and the stress on the chip can be buffered.

The technical scheme adopted by the utility model for solving the problems is as follows: the utility model provides a laser radar product packaging structure, it includes the base plate, be provided with at least one ASIC response chip module on the base plate, ASIC response chip module includes the ASIC chip, the ASIC chip openly is provided with the response chip, the ASIC chip passes through the glue layer laminating with the response chip and is in the same place, the glue layer overflows the response chip side and forms the hypotenuse at the response chip side, response chip top is provided with a glass piece, the glass piece is laminated on the response chip.

Optionally, the surface of the ASIC chip, the outer ring surface of the induction chip, and the bevel edge are covered with an insulating layer, pads of the ASIC chip and the induction chip are exposed out of the insulating layer, the pads of the ASIC chip and the induction chip are connected through a metal line, and the metal line covers the insulating layer.

Optionally, the glass sheet is attached to the photosensitive chip through a light-transmitting film.

Optionally, the glass sheet is attached to the photosensitive area of the sensing chip, a plastic package material is encapsulated in peripheral areas of the ASIC chip, the sensing chip and the glass sheet, and the upper surface of the glass sheet is exposed out of the plastic package material.

Optionally, a light-transmitting film is encapsulated in the peripheral area of the sensing chip, and the size of the glass sheet is larger than that of the photosensitive chip.

Optionally, the ASIC chip front pad is connected to the substrate through a bonding wire or the ASIC chip front pad is connected to the ASIC chip bottom pad through a side circuit and a bottom circuit, the ASIC chip bottom pad is provided with a solder ball, and the ASIC sensing chip module is connected to the substrate through the solder ball.

Optionally, a cavity is formed between the light sensing area of the light sensing chip and the glass sheet.

Optionally, the size of the glass sheet is at least 200 micrometers larger than the photosensitive area of the sensing chip.

Compared with the prior art, the utility model has the advantages that:

1. the layer overflows to fill the side edge of the induction chip, and the inclined edge is formed on the side edge of the induction chip, so that the insulation effect is achieved, and the stress on the chip can be buffered;

2. the utility model greatly reduces the size of the product, reduces the packaging cost of the product, improves the reliability of the electrical connection between the induction chip and the ASIC chip, and shortens the signal transmission of the induction chip and the ASIC chip.

Drawings

Fig. 1 is a schematic diagram of a package structure of a lidar product according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of another embodiment of the ASIC sensor chip module in fig. 1.

Fig. 3 is a schematic structural diagram of another embodiment of the ASIC sensor chip module in fig. 1.

Wherein:

substrate 1

ASIC inductive chip module 2

ASIC chip 21

Induction chip 22

Adhesive layer 23

Bevel 24

Insulating layer 25

Metal line 26

Glass sheet 27

Light-transmitting film 28

Side circuit 29

Bottom line 210

Plastic package material 3

Bonding wire 4

Solder balls 5.

Detailed Description

The utility model is described in further detail below with reference to the accompanying examples.

As shown in fig. 1 to 3, the package structure of a laser radar product according to the present invention includes a substrate 1, at least one ASIC sensor chip module 2 is disposed on the substrate 1, the ASIC sensor chip module 2 includes an ASIC chip 21, a sensor chip 22 is disposed on a front surface of the ASIC chip 21, the ASIC chip 21 and the sensor chip 22 are bonded together by a glue layer 23, the glue layer 23 overflows a side edge of the sensor chip 22 and forms a bevel edge 24 on a side edge of the sensor chip 22, an insulating layer 25 covers a surface of the ASIC chip 21, a surface of an outer ring of the sensor chip 22 and the bevel edge 24, pads of the ASIC chip 21 and the sensor chip 22 are exposed out of the insulating layer 25, pads of the ASIC chip 21 and the sensor chip 22 are connected by a metal line 26, the metal line 26 covers the insulating layer 25, a glass sheet 27 is disposed above the sensor chip 22, the glass sheet 27 is attached to the sensing chip 22;

the thickness of the ASIC chip 21 is 200-400 microns;

the thickness of the induction chip 22 is 20-50 micrometers;

the thickness of the adhesive layer 23 is 10-30 micrometers;

the thickness of the insulating layer 25 is 5-20 micrometers;

the thickness of the glass sheet 27 is 200-400 micrometers;

the front bonding pad of the ASIC chip 21 is connected with the substrate 1 through a bonding wire 4, the glass sheet 27 is attached to the photosensitive area of the photosensitive chip 22 through a light-transmitting film 28, the plastic package material 3 is encapsulated in the peripheral areas of the ASIC chip 21, the sensing chip 22 and the glass sheet 27, and the upper surface of the glass sheet 27 is exposed out of the plastic package material 3 and used for receiving optical signals;

the size of the glass sheet 27 is at least 200 microns larger than the photosensitive area of the sensing chip 22;

or the front bonding pad of the ASIC chip 21 is connected with the bottom bonding pad of the ASIC chip 21 through the side surface circuit 29 and the bottom circuit 210, the peripheral area of the induction chip 22 is encapsulated with the light-transmitting film 28, the glass sheet 27 is attached to the photosensitive chip 22 through the light-transmitting film 28, the bottom bonding pad of the ASIC chip 21 is provided with the solder ball 5, and the ASIC induction chip module 2 is connected with the substrate 1 through the solder ball 5;

the light-sensitive area of the sensor chip 22 is not covered by the light-transmitting film 28, and a cavity is formed between the light-sensitive area and the glass sheet.

In addition, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the protection scope of the claims of the present invention.

Claims

1. The utility model provides a laser radar product packaging structure which characterized in that: it includes base plate (1), be provided with at least one ASIC response chip module (2) on base plate (1), ASIC response chip module (2) include ASIC chip (21), ASIC chip (21) openly are provided with response chip (22), ASIC chip (21) and response chip (22) are in the same place through glue film (23) laminating, glue film (23) overflow and respond to chip (22) side and form hypotenuse (24) at response chip (22) side, response chip (22) top is provided with a glass piece (27), glass piece (27) laminate on response chip (22).

2. The lidar product package structure of claim 1, wherein: the glass sheet (27) is attached to the photosensitive chip (22) through a light-transmitting film (28).

3. The lidar product package structure of claim 1, wherein: the surface of the ASIC chip (21), the outer ring surface of the induction chip (22) and the bevel edge (24) are covered with a layer of insulating layer (25), bonding pads of the ASIC chip (21) and the induction chip (22) are exposed out of the insulating layer (25), the bonding pads of the ASIC chip (21) and the induction chip (22) are connected through a metal line (26), and the metal line (26) covers the insulating layer (25).

4. The lidar product package structure according to claim 3, wherein: the front bonding pad of the ASIC chip (21) is connected with the substrate (1) through a bonding wire (4), the glass sheet (27) is attached to the photosensitive area of the induction chip (22), the plastic package material (3) is encapsulated in the peripheral areas of the ASIC chip (21), the induction chip (22) and the glass sheet (27), and the upper surface of the glass sheet (27) is exposed out of the plastic package material (3).

5. The lidar product packaging structure according to claim 4, wherein: the size of the glass sheet (27) is at least 200 microns larger than the photosensitive area of the sensing chip (22).

6. The lidar product package structure according to claim 3, wherein: the sensing chip module is characterized in that a light-transmitting film (28) is packaged in the peripheral area of the sensing chip (22), a front bonding pad of the ASIC chip (21) is connected with a bottom bonding pad of the ASIC chip (21) through a side line (29) and a bottom line (210), a solder ball (5) is arranged on the bottom bonding pad of the ASIC chip (21), and the ASIC sensing chip module (2) is connected with the substrate (1) through the solder ball (5).

7. The lidar product package structure according to claim 6, wherein: the light sensing area of the sensing chip (22) is not covered with a light-transmitting film (28), and a cavity is formed between the light sensing area and the glass sheet (27).

8. The lidar product package structure of claim 7, wherein: the size of the glass sheet (27) is larger than that of the sensing chip (22).