CN216917689U - Tin ball material taking mechanism - Google Patents
Tin ball material taking mechanism Download PDFInfo
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- CN216917689U CN216917689U CN202122499958.8U CN202122499958U CN216917689U CN 216917689 U CN216917689 U CN 216917689U CN 202122499958 U CN202122499958 U CN 202122499958U CN 216917689 U CN216917689 U CN 216917689U
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- substrate
- driving
- material taking
- reclaiming
- solder ball
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a solder ball taking mechanism which comprises a substrate, taking mechanisms, a driving mechanism and a vacuum generator, wherein at least one taking mechanism is arranged on the substrate; the driving mechanism is arranged on the substrate and comprises a first driving structure, a second driving structure and an output shaft connected with the second driving structure, the first driving structure is used for driving the material taking part to move along the base, the second driving structure is used for driving the output shaft to rotate, the material taking part is connected with the output shaft, and the output shaft is arranged in a hollow manner and is communicated with a suction hole in the material taking part; the vacuum generator is arranged on the substrate and communicated with the output shaft. The utility model makes the feeding of the solder ball more intelligent, the feeding precision is higher, and the production efficiency is higher.
Description
Technical Field
The utility model relates to the technical field of flexible circuit board processing, in particular to a solder ball taking mechanism.
Background
Flexible circuit boards, referred to as flex boards for short, are printed circuits made of flexible insulating substrates. When the flexible circuit board is welded, a layer of soldering flux is required to be coated on the flexible circuit board, the solder balls are put into the bonding pads of the circuit board to be melted, and then the components are connected with the bonding pads through the melted solder materials.
In the prior art, the solder balls are uniformly poured on the top end of the steel wire mesh, so that the solder balls reach a bonding pad of the flexible circuit board through meshes of the steel wire mesh, and the defects of low production automation degree and low material taking precision exist.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problems, the present invention provides a solder ball feeding mechanism, which aims to solve the problems of low automation degree and inaccurate feeding of solder balls.
In order to achieve the above object, the present invention provides a solder ball reclaiming mechanism, including:
a substrate;
the material taking mechanism is arranged on the substrate, each material taking mechanism comprises a material taking part movably arranged on the substrate, the material taking part can rotate relative to the substrate and can move relative to the substrate, and a suction hole is formed in the material taking part;
the driving mechanism is arranged on the substrate and comprises a first driving structure, a second driving structure and an output shaft connected with the second driving structure, the first driving structure is used for driving the material taking part to move along the base, the second driving structure is used for driving the output shaft to rotate, the material taking part is connected with the output shaft, and the output shaft is arranged in a hollow mode and is communicated with the suction hole in the material taking part; and
and the vacuum generator is arranged on the substrate and communicated with the output shaft.
In one embodiment, the material taking structure further comprises a movable plate, the movable plate has a movable stroke along the up-down direction of the substrate, and the material taking member is arranged on the movable plate; the first drive structure includes:
the driving belt wheel is rotatably arranged on the substrate;
the driven belt wheel is rotatably arranged on the substrate and is arranged at an interval with the driving belt wheel along the vertical direction of the substrate;
the transmission belt is connected with the driving belt wheel and the driven belt wheel, and the part of the transmission belt between the driving belt wheel and the driven belt wheel is connected with the movable plate; and the number of the first and second groups,
the belt wheel driver is arranged on the substrate and used for driving the driving belt wheel to rotate.
In one embodiment, the material taking mechanism is located at a first side of the substrate, the driving mechanism is located at a second side of the substrate, and the first side and the second side are oppositely arranged; the substrate is provided with a guide groove which penetrates through the substrate from the first side to the second side, and the guide groove extends along the vertical direction of the substrate;
the sliding block penetrates through the guide groove in a sliding mode and is connected with the movable plate and the transmission belt.
In an embodiment, the driving mechanism further includes an elastic expansion member, one end of the elastic expansion member is connected to the base plate, and the other end of the elastic expansion member is connected to the slider.
In an embodiment, the material taking part comprises a material taking head and a suction nozzle arranged at the end part of the material taking head, the material taking head is provided with a through hole arranged along the vertical direction of the substrate, the top end of the through hole is communicated with the output shaft, the suction nozzle is covered at the bottom end of the through hole, and the through hole is communicated with the suction hole.
In one embodiment, the suction holes are arranged in a plurality, and the suction holes are annularly arranged at the bottom of the suction nozzle.
In one embodiment, the suction nozzle is provided with a limiting part, and the limiting part is used for limiting and matching with a matching part at a position where the material is to be taken.
In an embodiment, the suction nozzle is the protrusion and locates get the bottom of stub bar, spacing portion is including locating get the spacing draw-in groove of the bottom of stub bar, spacing draw-in groove is used for waiting to get the protruding looks joint of spacing card of material department, in order to restrict it continues to rotate to get the stub bar.
In one embodiment, the plurality of material taking mechanisms are arranged, and the movable plates of the plurality of material taking mechanisms are integrally arranged;
the plurality of driving mechanisms are arranged and correspond to the plurality of material taking mechanisms one by one; alternatively, the first and second electrodes may be,
the driving mechanism is provided with one, and one driving mechanism is connected with a plurality of material taking mechanisms.
In one embodiment, the material taking members of the material taking mechanisms are arranged side by side along the transverse direction of the substrate.
In the technical scheme provided by the utility model, the material taking head is driven to move by the first driving structure, so that the material taking head can move towards the direction close to and away from the solder ball to transfer the solder ball; the material taking head is driven to rotate through the second driving structure, so that the material taking head can be in butt joint with a position to be taken, and the solder balls can be taken accurately; and be linked together the direct output shaft with second drive structure of vacuum generator for form the vacuum in the output shaft, thereby pick up the tin ball through inhaling the hole, pick up and shift more easily to the less tin ball of volume, make the material loading of tin ball more intelligent, make the material loading precision higher, production efficiency is higher.
Drawings
In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of an embodiment of a solder ball reclaiming mechanism according to the present invention;
FIG. 2 is a schematic structural view of the solder ball reclaiming mechanism shown in FIG. 1 from another perspective;
FIG. 3 is a schematic view of the material extracting mechanism shown in FIG. 1;
FIG. 4 is a schematic structural view of the material taking part in FIG. 1;
fig. 5 is a schematic cross-sectional structure view of the material taking part in fig. 4.
The reference numbers illustrate:
the object of the present invention, its functional characteristics and advantageous effects will be further described with reference to the following embodiments and drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indication is involved in the embodiment of the present invention, the directional indication is only used for explaining the relative positional relationship, the motion situation, and the like between the components in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Flexible circuit boards, referred to as flex boards for short, are printed circuits made of flexible insulating substrates. When the flexible circuit board is welded, a layer of soldering flux is required to be coated on the flexible circuit board, the solder balls are put into the bonding pads of the circuit board to be melted, and then the components are connected with the bonding pads through the melted solder materials. In the prior art, the solder balls are uniformly poured on the top end of the steel wire mesh, so that the solder balls reach a bonding pad of the flexible circuit board through meshes of the steel wire mesh, and the defects of low production automation degree and low material taking precision exist.
In view of this, the present invention provides a solder ball reclaiming mechanism, and fig. 1 to 5 are an embodiment of the solder ball reclaiming mechanism provided in the present invention.
Referring to fig. 1 to 3, in the present embodiment, the solder ball reclaiming mechanism 100 includes a substrate 1, a reclaiming mechanism 2, a driving mechanism 3 and a vacuum generator 4, the substrate 1 is used for mounting other structures of the solder ball reclaiming mechanism 100, and is also convenient for fixing the solder ball reclaiming mechanism 100, for example, fixing the solder ball reclaiming mechanism to the ground, the wall or other devices, the substrate 1 may be a flat plate, a supporting frame or a connecting structure, and the arrangement form is not particularly limited; at least one material taking mechanism 2 is arranged on the substrate 1, each material taking mechanism 2 comprises a material taking part 22 movably arranged on the substrate 1, the material taking part 22 can rotate relative to the substrate 1 and can move relative to the substrate 1, and a suction hole 2222 is formed in the material taking part 22; the driving mechanism 3 is installed on the substrate 1, the driving mechanism 3 comprises a first driving structure 31, a second driving structure 32 and an output shaft connected with the second driving structure 32, the first driving structure 31 is used for driving the material taking part 22 to move along the base, the second driving structure 32 is used for driving the output shaft to rotate, the material taking part 22 is connected with the output shaft, and the output shaft is arranged in a hollow mode and is communicated with the suction hole 2222 in the material taking part 22; the vacuum generator 4 is disposed on the substrate 1 and communicates with the output shaft. Form the negative pressure through vacuum generator 4 messenger output shaft, absorb the solder ball and shift through getting the hole 2222 that inhales on material 22, drive the output shaft through second drive structure 32 and rotate to the material 22 rotation is got in the drive, gets the material direction with the regulation, gets material 22 through the drive of first drive structure 31 and removes, thereby shifts the solder ball. The vacuum generator 4 may be a vacuum pump or a suction device, the first driving structure 31 may be a driving motor or a cylinder, and the second driving structure 32 may be a rotating motor.
According to the technical scheme provided by the utility model, the first driving structure 31 drives the material taking head 221 to move, so that the material taking head 221 can move towards the direction close to and away from the solder ball to transfer the solder ball; the material taking head 221 is driven to rotate by the second driving structure 32, so that the material taking head 221 can be butted with a position to be taken, and the solder balls can be taken accurately; and be linked together vacuum generator 4 direct and second drive structure 32's output shaft for form the vacuum in the output shaft, thereby pick up the tin ball through inhaling hole 2222, pick up and shift more easily to less tin ball, make the material loading of tin ball more intelligent, make the material loading precision higher, production efficiency is higher.
In this embodiment, as shown in fig. 1 to fig. 3, the material taking structure further includes a movable plate 21, the movable plate 21 has a movable stroke along the up-down direction of the substrate 1, the material taking member 22 is disposed on the movable plate 21, and the movable plate 21 moves to drive the material taking member 22 to move; specifically, the first driving structure 31 includes a driving pulley 312, a driven pulley 313, a transmission belt 314 and a pulley driver 311, wherein the driving pulley 312 is rotatably disposed on the substrate 1; the driven pulley 313 is rotatably disposed on the substrate 1 and spaced from the driving pulley 312 in the vertical direction of the substrate 1; a transmission belt 314 connecting the driving pulley 312 and the driven pulley 313, a portion of the transmission belt 314 between the driving pulley 312 and the driven pulley 313 being connected to the movable plate 21; the pulley driver 311 is disposed on the substrate 1 for driving the driving pulley 312 to rotate, the driving pulley 312 is driven to rotate by the pulley driver 311, and the driven pulley 313 is driven to rotate by the transmission belt 314, so that the transmission belt 314 can move around the driving pulley 312 and the driven pulley 313. The transmission belt 314 has a first branch section located at the left side of the driving pulley 312 and a second branch section located at the right side of the driving pulley 312, for example, when the movable plate 21 is connected to the second branch section on the transmission belt 314, when the pulley driver 311 drives the driving pulley 312 to rotate clockwise, the second branch section moves upwards along the substrate 1, and drives the movable plate 21 to move upwards along the substrate 1, so that the material taking head 221 also moves upwards along the substrate 1, and moves towards a direction away from the material placing position; on the contrary, when the driving pulley 312 is driven by the pulley driver 311 to rotate counterclockwise, the second branch section moves downward along the substrate 1 to drive the movable plate 21 to move downward along the substrate 1, so that the material taking head 221 also moves downward along the substrate 1 and moves toward the direction of placing the solder balls to suck the solder balls.
Furthermore, the material taking mechanism 2 is positioned on the first side of the substrate 1, the driving mechanism 3 is positioned on the second side of the substrate 1, the first side and the second side are oppositely arranged, when the solder ball material taking mechanism 100 is installed on a production line or other equipment, one side of the material taking mechanism 2 can be exposed outside, and one side of the driving mechanism 3 is arranged towards the installation equipment, so that the appearance is more attractive; the substrate 1 is provided with a guide groove 11 which penetrates through the substrate 1 from the first side to the second side, and the guide groove 11 extends along the vertical direction of the substrate 1; the solder ball material taking mechanism 100 further comprises a sliding block 33, the sliding block 33 is slidably disposed in the guide groove 11 and connected with the movable plate 21 and the transmission belt 314, the transmission belt 314 drives the sliding block 33 to move, so as to drive the movable plate 21 to move, and the sliding block 33 slides along the guide groove 11, so that the movable plate 21 is more stable to move, the material taking member 22 is not easy to shake when taking materials, and the two ends of the guide groove 11 can limit the moving stroke of the movable plate 21, so as to avoid excessive movement and interference with the driving pulley 312 or the driven pulley 313.
The shape of the slider 33 is not particularly limited, the slider 33 is detachably connected to the transmission belt 314, and the slider 33 and the movable plate 21 may be detachably connected or integrally provided. For example, the slider 33 is provided with a first mounting hole and a second mounting hole, the transmission belt 314 and the slider 33 are connected by screws passing through the transmission belt 314 and the first mounting hole, and similarly, the movable plate 21 can be provided with a matching hole, and the movable plate 21 and the slider 33 are connected by screws passing through the second mounting hole and the matching hole. The slider 33 is provided with a flange which overlaps the periphery of the notch of the guide groove 11 and is located on the side of the base plate 1 where the belt 314 is provided, so that the slider 33 is prevented from coming out of the guide groove 11, and the slider 33 can be made more stable during sliding.
Furthermore, referring to fig. 2, the driving mechanism 3 further includes an elastic expansion member 315, the elastic expansion member 315 may be an expansion spring or an elastic rubber member, one end of the elastic expansion member 315 is connected to the base plate 1, and the other end of the elastic expansion member 315 is connected to the slider 33, when the pulley driver 311 stops working, under the action of the gravity of the material taking mechanism 2, the driving belt 314 may be pulled to move so as to drive the material taking member 22 to move, and a certain tensile force may be provided through the elastic expansion member 315 so as to prevent the material taking mechanism 2 from moving under the action of the gravity of the material taking mechanism 2, thereby avoiding the material taking member 22 from being out of control; in addition, when the pulley driver 311 drives the material taking member 22 to move upwards, the elastic expansion member 315 can also provide certain tensile force so as to reduce the driving load of the pulley driver 311 and save energy more.
In this embodiment, as shown in fig. 4 and 5, the material taking member 22 includes a material taking head 221 and a suction nozzle 222 disposed at an end of the material taking head 221, a through hole is disposed on the material taking head 221 along an up-down direction of the substrate 1, a top end of the through hole is communicated with the output shaft, the suction nozzle 222 is covered at a bottom end of the through hole, the through hole is communicated with the suction hole 2222, a negative pressure is formed in the through hole of the material taking head 221 by the vacuum generator 4, and the solder balls are picked up and transferred by the suction nozzle 222.
Further, the plurality of suction holes 2222 are arranged at the bottom of the suction nozzle 222 in an annular shape, so that the plurality of solder balls can be sucked at one time, and the efficiency is higher. The specific shape of the suction hole 2222 is not limited, and may be circular, square, or irregular, and the like, and preferably, the diameter of the suction hole 2222 should be smaller than the diameter of the solder ball, so as to prevent the solder ball from being sucked into the material taking member 22; or, a separation net is arranged at the suction hole 2222 to prevent external impurities from being sucked into the material taking member 22.
Because the solder balls are easy to roll and have small volume, before the solder balls are taken out, a stock preparation fixing part is generally arranged in a material box for storing the solder balls, the stock preparation fixing part can be a stock preparation suction nozzle 222, and part of the solder balls are limited at the stock preparation suction nozzle 222 through the stock preparation suction nozzle 222 to wait for the solder ball taking mechanism 100 to take out and transfer. Specifically, the suction nozzle 222 of the solder ball material taking mechanism 100 is provided with a limiting part 2221, the limiting part 2221 is used for limiting and matching with a matching part at a position to be taken, and limiting the suction nozzle 222, so that the material taking part 22 is aligned more accurately when picking up a solder ball.
Preferably, referring to fig. 4, the suction nozzle 222 is convexly disposed at the bottom of the material taking head 221, the limiting portion 2221 includes a limiting slot 2221a disposed at the bottom of the material taking head 221, and the limiting slot 2221a is used for being engaged with a limiting projection of the material to be taken, so as to limit the material taking head 221 to continuously rotate. The material taking part 22 is driven by the first driving structure 31 to move downwards along the substrate 1 to move towards the direction close to the material preparation suction nozzle 222, meanwhile, the second driving structure 32 drives the material taking part 22 to rotate, after the limiting clamping groove 2221a on the material taking part 22 is clamped on the limiting clamping protrusion, the material taking part 22 stops rotating, at the moment, the vacuum generator 4 starts to work, the solder balls at the position of the material preparation suction nozzle 222 are sucked through the suction holes 2222, then, the second driving structure 32 drives the material taking part 22 to rotate reversely, so that the limiting clamping groove 2221a is separated from the limiting clamping protrusion, the material taking part 22 is driven by the first driving structure 31 to move upwards along the substrate 1 to move towards the direction away from the material preparation suction nozzle 222, the solder balls are placed at the position to be loaded, the material taking and placing of the solder balls are more accurate, and the working efficiency is higher.
Moreover, in order to further improve the production efficiency, a plurality of material taking mechanisms 2 can be arranged, and the movable plates 21 of the plurality of material taking mechanisms 2 can be integrally arranged, so that the plurality of material taking mechanisms 2 can move more synchronously; in an embodiment, the driving mechanisms 3 are provided in plurality, the driving mechanisms 3 and the material taking mechanisms 2 are arranged in a one-to-one correspondence manner, and the material taking mechanisms 3 are driven to move more stably.
Of course, in another embodiment, one driving mechanism 3 may be provided, and one driving mechanism 3 is connected with a plurality of material taking mechanisms 2, so that the cost is saved.
Moreover, the material taking parts 22 of the material taking mechanisms 2 are arranged side by side along the transverse direction of the substrate 1, so that the material taking parts 22 can take materials simultaneously, and the material taking parts 22 can be arranged in different heights according to actual production requirements, so that the solder balls at different heights are picked up flexibly.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the specification and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (10)
1. The utility model provides a tin ball feeding agencies which characterized in that includes:
a substrate;
the material taking mechanism is arranged on the substrate, each material taking mechanism comprises a material taking part movably arranged on the substrate, the material taking part can rotate relative to the substrate and can move relative to the substrate, and a suction hole is formed in the material taking part;
the driving mechanism is arranged on the substrate and comprises a first driving structure, a second driving structure and an output shaft connected with the second driving structure, the first driving structure is used for driving the material taking part to move along the base, the second driving structure is used for driving the output shaft to rotate, the material taking part is connected with the output shaft, and the output shaft is arranged in a hollow mode and is communicated with the suction hole in the material taking part; and
and the vacuum generator is arranged on the substrate and communicated with the output shaft.
2. The solder ball reclaiming mechanism of claim 1 wherein the reclaiming structure further comprises a movable plate having a movable stroke in a vertical direction of the substrate, the reclaiming member being disposed on the movable plate; the first drive structure includes:
the driving belt wheel is rotatably arranged on the substrate;
the driven belt wheel is rotatably arranged on the substrate and is arranged at an interval with the driving belt wheel along the vertical direction of the substrate;
the transmission belt is connected with the driving belt wheel and the driven belt wheel, and the part of the transmission belt between the driving belt wheel and the driven belt wheel is connected with the movable plate; and the number of the first and second groups,
the belt wheel driver is arranged on the substrate and used for driving the driving belt wheel to rotate.
3. The solder ball pick mechanism of claim 2, wherein the pick mechanism is located on a first side of the substrate and the drive mechanism is located on a second side of the substrate, the first side and the second side being in opposing relation; the substrate is provided with a guide groove which penetrates through the substrate from the first side to the second side, and the guide groove extends along the vertical direction of the substrate;
the sliding block penetrates through the guide groove in a sliding mode and is connected with the movable plate and the transmission belt.
4. The solder ball reclaiming mechanism as claimed in claim 3 wherein the driving mechanism further comprises a resilient flexible member, one end of the resilient flexible member is connected to the substrate, and the other end of the resilient flexible member is connected to the slider.
5. The solder ball reclaiming mechanism as claimed in claim 4, wherein the reclaiming member includes a reclaiming head and a suction nozzle disposed at an end of the reclaiming head, the reclaiming head is provided with a through hole disposed along a vertical direction of the substrate, a top end of the through hole is communicated with the output shaft, the suction nozzle is covered at a bottom end of the through hole, and the through hole is communicated with the suction hole.
6. The solder ball reclaiming mechanism as claimed in claim 5 wherein a plurality of suction holes are provided, and a plurality of suction holes are annularly arranged at the bottom of the suction nozzle.
7. The solder ball reclaiming mechanism as claimed in claim 5 wherein the suction nozzle is provided with a position limiting portion for limiting engagement with the engagement portion of the material to be reclaimed.
8. The solder ball reclaiming mechanism as claimed in claim 7 wherein the suction nozzle is protruded from the bottom of the pick head, and the limiting portion includes a limiting slot formed in the bottom of the pick head for engaging with a limiting protrusion at the position to be picked to limit the pick head from further rotation.
9. The solder ball reclaiming mechanism as claimed in claim 7, wherein a plurality of said reclaiming mechanisms are provided, and said movable plates of a plurality of said reclaiming mechanisms are integrally provided;
the plurality of driving mechanisms are arranged, and the plurality of driving mechanisms and the plurality of material taking mechanisms are arranged in a one-to-one correspondence manner; alternatively, the first and second electrodes may be,
the driving mechanism is provided with one, and one driving mechanism is connected with a plurality of material taking mechanisms.
10. The solder ball reclaiming mechanism of claim 9 wherein a plurality of reclaiming members of the reclaiming mechanism are arranged side by side along the lateral direction of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122499958.8U CN216917689U (en) | 2021-10-18 | 2021-10-18 | Tin ball material taking mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122499958.8U CN216917689U (en) | 2021-10-18 | 2021-10-18 | Tin ball material taking mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216917689U true CN216917689U (en) | 2022-07-08 |
Family
ID=82249353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122499958.8U Active CN216917689U (en) | 2021-10-18 | 2021-10-18 | Tin ball material taking mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216917689U (en) |
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2021
- 2021-10-18 CN CN202122499958.8U patent/CN216917689U/en active Active
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