CN216905450U - Flexible circuit board, functional module and electronic equipment - Google Patents
Flexible circuit board, functional module and electronic equipment Download PDFInfo
- Publication number
- CN216905450U CN216905450U CN202220657857.0U CN202220657857U CN216905450U CN 216905450 U CN216905450 U CN 216905450U CN 202220657857 U CN202220657857 U CN 202220657857U CN 216905450 U CN216905450 U CN 216905450U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- circuit board
- flexible circuit
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The flexible circuit board comprises a first solder mask layer, a first heat conduction layer and a substrate layer which are sequentially stacked; the substrate layer comprises a second heat conduction layer and a first conducting layer arranged between the first heat conduction layer and the second heat conduction layer; the first heat conduction layer is a first mixed material layer comprising an insulating material and a heat conduction material; and/or the second heat conducting layer is a second mixed material layer comprising an insulating material and a heat conducting material. This is disclosed through mixing insulating material and heat conduction material physics to form the mixed material layer that coefficient of heat conductivity is high, and regard this mixed material layer as first heat-conducting layer and/or second heat-conducting layer, make the heat that the device that generates heat produced on the first solder mask spread to the low temperature district fast, reduce the temperature of the device that generates heat, promote the life of the device that generates heat.
Description
Technical Field
The present disclosure relates to the field of electronic devices, and in particular, to a flexible printed circuit board, a functional module, and an electronic device.
Background
With the increasing abundance of functions of smart phones, corresponding hardware needs to be added inside the smart phones to realize corresponding functions, so that the space for heat conduction inside the smart phones is gradually compressed.
At present, more and more heating devices such as flash lamps are directly placed on a Flexible Printed Circuit (FPC), the heat conductivity of the flexible printed circuit in the related art is poor, and heat emitted by the heating devices such as flash lamps cannot be rapidly diffused to a low-temperature area, so that local high temperature is formed, and user experience is influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems in the related art, the present disclosure provides a flexible circuit board, a functional module and an electronic device.
According to a first aspect of the embodiments of the present disclosure, a flexible circuit board is provided, where the flexible circuit board includes a first solder resist layer, a first heat conduction layer, and a substrate layer that are sequentially stacked;
the substrate layer comprises a second heat conduction layer and a first conducting layer arranged between the first heat conduction layer and the second heat conduction layer;
wherein the first heat conducting layer is a first mixed material layer comprising an insulating material and a heat conducting material; and/or the presence of a gas in the gas,
the second thermally conductive layer is a second layer of mixed material including an insulating material and a thermally conductive material.
In some exemplary embodiments, the flexible circuit board further comprises a second solder resist layer connected to a side of the second thermally conductive layer remote from the first electrically conductive layer.
In some exemplary embodiments, the flexible circuit board further comprises a second conductive layer and a third conductive layer disposed between the second conductive layer and the second solder resist layer:
the second conducting layer is connected with one side, far away from the first conducting layer, of the second conducting layer;
the third heat conduction layer is connected with the second conductive layer and the second solder resist layer;
wherein the third heat conducting layer is a third mixed material layer comprising an insulating material and a heat conducting material.
In some exemplary embodiments, any one or more of the first mixed material layer, the second mixed material layer, and the third mixed material layer includes:
a layer of material formed by mixing an insulating material and a thermally conductive material.
In some exemplary embodiments, the thermally conductive material comprises ceramic particles.
In some exemplary embodiments, any one or more of the first mixed material layer, the second mixed material layer, and the third mixed material layer includes:
a layer of insulating material and a layer of thermally conductive material.
In some exemplary embodiments, a ratio of a thickness of the layer of thermally conductive material to a thickness of the layer of insulating material is equal to or less than 1/3.
In some exemplary embodiments, a first adhesive layer is disposed between the first thermally conductive layer and the first electrically conductive layer; and/or the presence of a gas in the gas,
a second bonding layer is arranged between the third heat conduction layer and the second conductive layer.
In some exemplary embodiments, the insulating material comprises at least one of: polyimide, polyester, polyesterimide, fluorocarbon ethylene, imide fiber, polybutylene to titanic acid.
According to a second aspect of the embodiments of the present disclosure, there is provided a functional module including the flexible circuit board provided by the exemplary embodiments of the present disclosure.
In some exemplary embodiments, the functional module is one or more of:
circuit board module, battery module, screen module, camera module, button module, antenna module, fingerprint module, speaker module, flash light module and sensor module.
According to a third aspect of the embodiments of the present disclosure, there is provided an electronic device including the flexible circuit board according to the first aspect or including the functional module according to the second aspect.
In some exemplary embodiments, a heat generating device is disposed on the flexible circuit board, and the heat generating device is disposed on the first solder resist layer or the second solder resist layer.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: this is disclosed through mixing insulating material and heat conduction material physics to form the mixed material layer that coefficient of heat conductivity is high, and regard this mixed material layer as first heat-conducting layer and/or second heat-conducting layer, make the heat that the device that generates heat produced on the first solder mask spread to the low temperature district fast, reduce the temperature of the device that generates heat, promote the life of the device that generates heat.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic cross-sectional view of a flexible circuit board shown in accordance with an exemplary embodiment;
FIG. 2 is a schematic cross-sectional view of a flexible circuit board shown in accordance with an exemplary embodiment;
fig. 3 is a battery including a flexible circuit board according to an example embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
With the increasing abundance of functions of smart phones, corresponding hardware needs to be added inside the smart phones to realize corresponding functions, so that the space for heat conduction inside the smart phones is gradually compressed.
At present, the heating devices such as flash lamps are more and more directly placed on a flexible circuit board, the heat conducting performance of the flexible circuit board in the related technology is poor, and heat emitted by the heating devices such as flash lamps cannot be rapidly diffused to a low-temperature area, so that local high temperature is formed, and the user experience is influenced.
In the related art, the insulating material layer of the flexible printed circuit board is made of polyimide, which has a thermal conductivity of only 0.2W/(m · K), and has poor thermal conductivity, and cannot rapidly transfer heat generated by the heat generating device to the low temperature region.
In order to solve the above problem, the present disclosure provides a flexible circuit board, the flexible circuit board includes first solder resist layer, first heat-conducting layer and the substrate layer that stacks gradually and set up, and the substrate layer includes the second heat-conducting layer to and set up the first conducting layer between first heat-conducting layer and second heat-conducting layer, wherein, first heat-conducting layer is the first mixed material layer including insulating material and heat conduction material, and/or, the second heat-conducting layer is the second mixed material layer including insulating material. This is disclosed through mixing insulating material and heat conduction material physics to form the mixed material layer that coefficient of heat conductivity is high, and regard this mixed material layer as first heat-conducting layer and/or second heat-conducting layer, make the heat that the device that generates heat produced on the first solder mask spread to the low temperature district fast, reduce the temperature of the device that generates heat, promote the life of the device that generates heat.
According to an exemplary embodiment, as shown in fig. 1, a schematic cross-sectional view of a flexible circuit board 1 is shown, the flexible circuit board 1 includes a first solder resist layer 11, a first heat conduction layer 12 and a substrate layer 14, which are sequentially stacked, the substrate layer 14 includes a second heat conduction layer 142, and a first conductive layer 141 disposed between the first heat conduction layer 12 and the second heat conduction layer 142. Wherein, referring to fig. 1, the first heat conducting layer 12 is a first mixed material layer comprising an insulating material and a heat conducting material, and/or the second heat conducting layer 142 is a second mixed material layer comprising an insulating material and a heat conducting material.
It should be noted that, in the embodiment of the present disclosure, the insulating material and the heat conductive material are physically mixed, and in the preparation process of the mixed material layer, no chemical reaction occurs between the insulating material and the heat conductive material.
As shown in fig. 1, the first solder resist layer 11 is located on the surface of the flexible circuit board 1, and the heat generating device 2 is disposed on the first solder resist layer 11, which can prevent the conductive solder bridging between various heat generating devices 2, thereby avoiding the short circuit of the heat generating device 2. Referring to fig. 1, the first heat conduction layer 12 is located between the first solder mask layer 11 and the substrate layer 14, and is configured to spread out a plane of heat generated by the heat generating device 2 on the first solder mask layer 11, that is, to disperse local heat generated by the heat generating device 2 to a lower temperature area on the flexible circuit board 1. Referring to fig. 1, the substrate layer 14 includes a first conductive layer 141 and a second conductive layer 142, wherein the second conductive layer 142 includes an insulating material, the second conductive layer 142 is used to form a support layer of an electric circuit, and the first conductive layer 141 serves as an electric conduction structure, and the present embodiment illustrates a structure of the flexible circuit board 1 in which the first conductive layer 141 and the second conductive layer 142 are connected by a predetermined method, such as a plating method, a coating method, or a laminating method. The first conductive layer 141 and the second conductive layer 142 may be connected by an adhesive, for example, a polyester adhesive or an acrylic adhesive.
Here, in the embodiment of the present disclosure, referring to fig. 1, the insulating material may be Polyimide (PI), Polyester (PET), polyester imide, fluorocarbon ethylene, imide fiber, polybutylene terephthalate, or the like, for example, the insulating material may be Polyimide, which has non-flammability, is stable in geometry, has high tensile strength, and has a capability of withstanding a soldering temperature. Referring to fig. 1, a material of the first conductive layer 141 may be, for example, copper (Cuprum), aluminum (Al), or copper-beryllium alloy. For example, the first conductive layer 141 may be made of copper, wherein, in the first conductive layer 141 of the flexible circuit board 1, metal copper exists in the form of copper foil, and the copper foil has flexibility and hardness and smoothness, and is suitable for the occasion requiring dynamic bending, and the copper foil may be prepared by Electrodeposition (ED), electroplating, or physical rolling, and the like.
As shown in fig. 1, for example, the thermal conductivity of the insulating material made of a mixture of polyimide and ceramic particles 121 in the first direction (X direction shown in fig. 1) may be up to 2.2W/(m · K), and the thermal conductivity in the second direction (Y direction shown in fig. 1) may be up to 0.8W/(m · K). Whereas the thermal conductivity of the polyimide in the related art is only 0.2W/(m · K) in both directions. Compared with polyimide, the first mixed material layer provided by the embodiment of the disclosure has more excellent heat conductivity, so that heat of the heat generating device 2 connected with the flexible circuit board 1 can be rapidly diffused to a low-temperature area. The second mixed material layer has the same implementation and principle as the first mixed material layer, and is not described herein again.
In this embodiment, through mixing insulating material and heat conduction material physics to form the mixed material layer that coefficient of heat conductivity is high, and regard this mixed material layer as first heat-conducting layer 12 and second heat-conducting layer 142, make the heat that generates heat device 2 on the first solder mask 11 and produce diffuse to the low temperature district fast, reduce the temperature of the device 2 that generates heat, promoted the life of the device 2 that generates heat.
In an exemplary embodiment, as shown in fig. 1, a schematic cross-sectional view of a flexible circuit board 1 is shown, the flexible circuit board 1 includes a first solder resist layer 11, a first heat conduction layer 12 and a substrate layer 14, which are sequentially stacked, the substrate layer 14 includes a second heat conduction layer 142, and a first conductive layer 141 disposed between the first heat conduction layer 12 and the second heat conduction layer 142. The flexible circuit board 1 further includes a second solder resist layer 17, and the second solder resist layer 17 is connected to a side of the second heat conduction layer 142 away from the first conductive layer 141. Referring to fig. 1, the second solder resist layer 17 is disposed on the side of the second heat conduction layer 142 away from the first heat conduction layer 141, that is, the second solder resist layer 17 is disposed on the lower surface of the second heat conduction layer 142 (in the reverse direction of the Y direction shown in fig. 1), so that the heat generating devices 2 can be disposed on both surfaces of the flexible circuit board 1, and when the flexible circuit board 1 is bent, the arrangement of the plurality of heat generating devices 2 on both surfaces of the flexible circuit board 1 is facilitated.
In one embodiment, as shown in fig. 1, the flexible circuit board 1 further comprises a second conductive layer 143 and a third conductive layer 16, the second conductive layer 143 and the third conductive layer 16 being disposed between the second conductive layer 142 and the second solder resist layer 17. Referring to fig. 1, the second conductive layer 143 is connected to a side of the second conductive layer 142 away from the first conductive layer 141, and the third conductive layer 16 is connected to the second conductive layer 143 and the second solder resist layer 17, wherein the third conductive layer 16 is a third mixed material layer including an insulating material and a heat conductive material. The insulating material and the heat conducting material are already described in the above embodiments, and are not described herein again.
It should be noted that, in the above embodiment, the substrate layer 14 including only the first conductive layer 141 and the second conductive layer 142 is a single-sided substrate, and in this embodiment, the second conductive layer 143 forms a partial structure of the substrate layer 14, so that the formed substrate layer 14 includes the first conductive layer 141, the second conductive layer 142 and the second conductive layer 143, that is, a double-sided substrate is formed, and the double-sided substrate can realize that the heat generating devices 2 are safely mounted on two surfaces of the flexible circuit board 1, and can efficiently conduct heat generated by the heat generating devices 2.
In one embodiment, as shown in fig. 1, the first mixed material layer includes a material layer formed by mixing an insulating material and a heat conductive material. For example, a large amount of insulating material may be selected to be mixed with a small amount of thermally conductive material (e.g., ceramic particles 121), such as by physical agitation, so that the small amount of ceramic particles 121 are embedded in the insulating material. The insulating material and the ceramic particles 121 may be uniformly mixed or non-uniformly mixed, without limitation. It is understood that the implementation and principle of the second mixed material layer and the third mixed material layer are the same as those of the first mixed material layer, and thus, the description thereof is omitted.
In one embodiment, as shown in fig. 2, the first hybrid material layer includes an insulating material layer 123 and a thermally conductive material layer 122. The insulating material layer 123 and the heat conductive material layer 122 are stacked, so that the heating effect of the heating device 2 can be rapidly shared. In one example, referring to fig. 2, the first mixed material layer includes an insulating material layer 123 and a heat conductive material layer 122, and the heat conductive material layer 122 is located above the insulating material layer 123, and after heat generated by the heat generating device 2 passes through the first solder resist layer 11, heat can be rapidly diffused to the low temperature region in the first direction (X direction shown in fig. 2) along the heat conductive material layer 122, and can also be diffused downward to the low temperature region in the second direction (Y direction shown in fig. 2) through the heat conductive material layer 122. Conversely, the insulating material layer 123 may also be located above the thermal conductive material layer 122. When the insulating material layer 123 is located above the heat conducting material layer 122, after heat generated by the heat generating device 2 passes through the first solder resist layer 11, the heat diffuses downward through the insulating material layer 123 to the heat conducting material layer 122 in the second direction (Y direction shown in fig. 2), and diffuses to the low temperature region in the first direction and the second direction through the heat conducting material layer. Above two kinds of setting mode all can realize the quick heat dissipation that device 2 generates heat on the first solder mask 11, has avoided the device 2 that generates heat near high temperature.
The ratio of the thickness of the thermal conductive material layer 122 to the thickness of the insulating material layer 123 does not exceed 1/3, that is, the ratio of the thickness of the thermal conductive material layer 122 to the thickness of the insulating material layer 123 is equal to or less than 1/3. It is understood that the insulating material has an insulating function, and that the insulating material layer 123 is too thin, which may cause leakage to occur; the flexibility of the heat conduction material is poor, if the flexibility of the flexible circuit board is influenced by too thick heat conduction material layer 122 and the thickness ratio of the insulating material layer 123, the flexibility of the flexible circuit board 1 is prevented from being influenced by the too thick heat conduction material layer 122 on the basis of ensuring the heat conduction effect of the heat conduction material layer 122.
In some possible embodiments (not shown in the drawings), the insulating material layer and the heat conducting material layer may be provided in multiple layers, and the insulating material layer and the heat conducting material layer are stacked and spaced apart, as long as the insulating and heat conducting effects of the first mixed material layer, the second mixed material layer and/or the third mixed material layer can be ensured.
Referring to fig. 1, it can be understood that, in the first heat conduction layer 12, the second heat conduction layer 142 and the third heat conduction layer 16, any one of the layers may be formed by an insulating material and a heat conduction material, any two of the layers may be formed, and three of the heat conduction layers may be formed by an insulating material and a heat conduction material, so as to maximally share the heat generation of the heat generation device 2.
In one embodiment, as shown in fig. 1, a first adhesive layer 13 is disposed between the first thermally conductive layer 12 and the first electrically conductive layer 141. The first adhesive layer 13 is used to connect the first heat conduction layer 12 and the first conductive layer 141, and the first adhesive layer 13 may be, for example, a polyester adhesive or an acrylic adhesive. The heat conduction layer and the conductive layer are connected through the adhesive, so that the first heat conduction layer 12 and the first conductive layer 141 are prevented from being separated due to different stresses in the dynamic bending process of the flexible circuit board 1, and the reliability of the structure of the flexible circuit board 1 is improved. A second adhesive layer 15 is disposed between the second conductive layer 143 and the third conductive layer 16, and the function and the structure of the second adhesive layer 15 refer to the first adhesive layer 13, which is not described herein again.
In an exemplary embodiment of the present disclosure, a functional module is provided. The functional module comprises the flexible circuit board 1 provided by the above embodiment. The function module may be one or more of the following: circuit board module, battery module, screen module, camera module, button module, antenna module, fingerprint module, speaker module, flash light module and sensor module. Exemplarily, taking a battery module as an example, as shown in fig. 3, fig. 3 is a battery including a flexible circuit board according to an exemplary embodiment. The battery 300 includes a battery body 301 and a flexible circuit board 303 connected by a flexible connection line 302. The battery body 301 is connected to a main board of the electronic device through the flexible circuit board 303 to supply power to the main board of the electronic device. In the process of supplying power to the motherboard of the electronic device by the battery, heat is generated. The battery body 301 supplies power to the main board through the flexible circuit board 303 provided by the exemplary embodiment of the present disclosure, and can rapidly conduct heat in the power supply process to the low temperature region, thereby avoiding local high temperature generated when the battery supplies power to the main board of the electronic device, and improving user experience.
The embodiment of the present disclosure further provides an electronic device, where the electronic device includes the flexible circuit board 1 provided in the above embodiment, or includes the functional module provided in the above embodiment.
When the electronic device includes the flexible circuit board 1, a heat generating device may be provided on the flexible circuit board, and the heat generating device may be provided on the first solder resist layer or the second solder resist layer. Illustratively, as shown in fig. 2, a part of the heat generating device 2 of the electronic apparatus is mounted on a flexible circuit board 1. The heat generating device 2 is mounted on the first solder mask layer or the second solder mask layer 17 of the flexible circuit board 1 in any manner, such as soldering, that can mount the heat generating device 2 on the flexible circuit board 1. The heat generating device 2 may be, for example, a flash lamp, a battery, an FPC connector, or the like of an electronic apparatus. Exemplarily, a high temperature is generated during the quick charging of the battery, and the flexible circuit board 1 provided by the embodiment of the present disclosure can rapidly spread the heat generated at the connection position of the flexible circuit board 1 and the battery to a low temperature region, thereby avoiding the potential safety hazard caused by the local high temperature during the quick charging. With the electronic equipment with the flexible circuit board 1 provided by the embodiment of the disclosure, the temperature generated by the internal heating device 2 can be quickly spread on the flexible circuit board 1, so that the local high temperature of the shell of the electronic equipment is avoided, and the use experience is improved.
When the electronic device includes the function module, the function module is disposed in or on a housing of the electronic device. When the electronic equipment provided with the functional module is in a use state. If the function module is in operating condition, and produce the heat, because the function module includes the flexible circuit board that this disclosed exemplary embodiment provided, can conduct the heat that the function module produced to the low temperature district rapidly in the course of the work, avoided the local high temperature that the function module produced in the course of the work, promote user experience.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.
Claims (13)
1. The flexible circuit board is characterized by comprising a first solder mask layer, a first heat conduction layer and a substrate layer which are sequentially stacked;
the substrate layer comprises a second heat conduction layer and a first conducting layer arranged between the first heat conduction layer and the second heat conduction layer;
wherein the first heat conducting layer is a first mixed material layer comprising an insulating material and a heat conducting material; and/or the presence of a gas in the atmosphere,
the second thermally conductive layer is a second layer of mixed material including an insulating material and a thermally conductive material.
2. The flexible circuit board of claim 1, further comprising a second solder resist layer connected to a side of the second thermally conductive layer distal from the first electrically conductive layer.
3. The flexible circuit board of claim 2, further comprising a second conductive layer and a third conductive layer disposed between the second conductive layer and the second solder resist layer:
the second conducting layer is connected with one side, far away from the first conducting layer, of the second conducting layer;
the third heat conduction layer is connected with the second conductive layer and the second solder resist layer;
wherein the third heat conducting layer is a third mixed material layer comprising an insulating material and a heat conducting material.
4. The flexible circuit board of claim 3, wherein any one or more of the first hybrid material layer, the second hybrid material layer, and the third hybrid material layer comprises:
a layer of material formed by mixing an insulating material and a thermally conductive material.
5. The flexible circuit board of claim 4, wherein the thermally conductive material comprises ceramic particles.
6. The flexible circuit board of claim 3, wherein any one or more of the first hybrid material layer, the second hybrid material layer, and the third hybrid material layer comprises:
a layer of insulating material and a layer of thermally conductive material.
7. The flexible circuit board of claim 6, wherein a ratio of the thickness of the layer of thermally conductive material to the thickness of the layer of insulating material is equal to or less than 1/3.
8. The flexible circuit board of claim 3, wherein a first adhesive layer is disposed between the first thermally conductive layer and the first electrically conductive layer; and/or the presence of a gas in the gas,
a second bonding layer is arranged between the third heat conduction layer and the second conductive layer.
9. The flexible circuit board of claim 1, wherein the insulating material comprises at least one of: polyimide, polyester, polyesterimide, fluorocarbon ethylene, imide fiber, polybutylene to titanic acid.
10. A functional module, characterized in that the functional module comprises a flexible circuit board according to any one of claims 1-9.
11. The functional module of claim 10, wherein the functional module is one or more of:
circuit board module, battery module, screen module, camera module, button module, antenna module, fingerprint module, speaker module, flash light module and sensor module.
12. An electronic device, characterized in that the electronic device comprises a flexible circuit board according to any one of claims 1-9, or a functional module according to any one of claims 10-11.
13. The electronic device according to claim 12, wherein a heat generating device is provided on the flexible circuit board, the heat generating device being provided on the first solder resist layer or the second solder resist layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220657857.0U CN216905450U (en) | 2022-03-24 | 2022-03-24 | Flexible circuit board, functional module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220657857.0U CN216905450U (en) | 2022-03-24 | 2022-03-24 | Flexible circuit board, functional module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216905450U true CN216905450U (en) | 2022-07-05 |
Family
ID=82194046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220657857.0U Active CN216905450U (en) | 2022-03-24 | 2022-03-24 | Flexible circuit board, functional module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216905450U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116922897A (en) * | 2023-07-21 | 2023-10-24 | 惠州市帕克威乐新材料有限公司 | High-voltage-resistant heat-conducting adhesive film and preparation method thereof |
| WO2024046338A1 (en) * | 2022-08-31 | 2024-03-07 | 华为技术有限公司 | Screen support structure and manufacturing method therefor, display assembly, and electronic device |
-
2022
- 2022-03-24 CN CN202220657857.0U patent/CN216905450U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024046338A1 (en) * | 2022-08-31 | 2024-03-07 | 华为技术有限公司 | Screen support structure and manufacturing method therefor, display assembly, and electronic device |
| CN116922897A (en) * | 2023-07-21 | 2023-10-24 | 惠州市帕克威乐新材料有限公司 | High-voltage-resistant heat-conducting adhesive film and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216905450U (en) | Flexible circuit board, functional module and electronic equipment | |
| TWI245469B (en) | Connecting structure of printed wiring board | |
| JP2007227880A (en) | Heat sink for led operating in repeated manner | |
| CN107529312A (en) | Optical module with double-deck PCBA structures | |
| CN111556597A (en) | Method for preparing graphene heating film for battery on surface of polyimide insulating substrate | |
| JP2004119515A (en) | Light emitting diode display module with high heat radiation and its substrate | |
| CN101365294B (en) | Copper coated substrate material and flexible circuit board having the copper coated substrate material | |
| JP2008218618A (en) | Printed circuit board | |
| CN109699120A (en) | Has the circuit board of high-efficiency heat conduction structure | |
| CN104135816A (en) | Aluminum-based copper-clad plate and manufacturing method thereof, and electronic circuit board | |
| CN100355326C (en) | Composite structure of flexible printed circuit and electronic component | |
| CN103118486B (en) | A kind of aluminum-based circuit board with element spliced eye and preparation method thereof | |
| CN204894663U (en) | Flexible aluminium base copper -clad plate | |
| CN101959376A (en) | The manufacture method of multilayer flexible printed wiring plate and multilayer circuit basis material | |
| CN106793453A (en) | A kind of flexible PCB and mobile terminal | |
| CN101553082A (en) | Printed circuit board and setting method thereof | |
| CN207692149U (en) | A kind of multi-layer PCB board with conductive structure | |
| CN218277263U (en) | PCB heat dissipation device | |
| CN220755132U (en) | Environment-friendly multilayer circuit board | |
| CN211606928U (en) | Controller, automobile electronic water pump and automobile electronic compressor | |
| CN217037538U (en) | Circuit board and electronic equipment | |
| CN207252018U (en) | A kind of composite circuit board | |
| CN212305769U (en) | Mixed circuit board | |
| CN211860653U (en) | Flexible printed circuit board | |
| CN219876625U (en) | Heat abstractor and unmanned aerial vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |