CN216850275U - Signal crossover circuit structure and integrated circuit - Google Patents
Signal crossover circuit structure and integrated circuit Download PDFInfo
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- CN216850275U CN216850275U CN202122602874.2U CN202122602874U CN216850275U CN 216850275 U CN216850275 U CN 216850275U CN 202122602874 U CN202122602874 U CN 202122602874U CN 216850275 U CN216850275 U CN 216850275U
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Abstract
The utility model discloses a signal crossover circuit structure and integrated circuit. A signal crossing circuit structure comprises at least two paths of artificial surface plasmon transmission lines which are different in layer and crossed, wherein the crossed included angle is more than 30 degrees, and a dielectric layer is arranged between the artificial surface plasmon transmission lines of the adjacent layers. The invention skillfully utilizes the characteristic that the constraint force of the artificial surface plasmon on the energy of the electromagnetic field is strong, thereby weakening the signal coupling when the wires are crossed and realizing the purpose that the multichannel signals do not influence the crossing. Meanwhile, the design principle is simple, and professional calculation and design are not needed, so that the method is very favorable for popularization and use. Moreover, because the utility model discloses require very low (more than or equal to 30 °) to crossing signal path contained angle, consequently can hold more signal path's no influence alternately simultaneously, help furthest's promotion integrated circuit design density.
Description
Technical Field
The utility model relates to a signal crossing technical field, more specifically relates to a signal crossing circuit structure and integrated circuit.
Background
With the development of wireless technologies, the multi-channel multi-functional rf front end gradually becomes one of the development directions of the front end architecture of wireless communication technologies. Thereby leading to higher radio frequency integrated circuit design density requirements. In this context, the rf signal traces sometimes have to form a crossing situation. In order to solve the above problems and achieve higher routing density, in recent years, a radio frequency circuit design called crossover has appeared, and along with the development of wireless technology, a multi-channel multi-functional radio frequency front end gradually becomes one of the development directions of the front end architecture of wireless communication technology. Thereby leading to higher radio frequency integrated circuit design density requirements. In this context, the rf signal traces sometimes have to form a crossing situation. In order to solve the above problems and achieve higher routing density, a radio frequency circuit design called crossover has been developed in recent years [ non-patent documents 1 to 3], which can realize crossing of radio frequency signals in two directions without affecting signal integrity in the two directions. However, the design methods and processes are generally complex, and the working bandwidth is small, so that the design methods and structures are difficult to widely popularize and apply.
Artificial Surface Plasmon structures (also known as spoofspp, Designer SPP, SSPPs) are periodic structures with dispersion properties similar to the "Surface Plasmon" phenomenon in the optical and infrared bands. Therefore, compared with the traditional transmission line, the structure can realize stronger constraint force on electric field energy and smaller turning loss. Microwave millimeter wave terahertz devices based on the structure are continuously developed and comprise a filter, a power divider, an antenna and the like. At present, most of artificial surface plasmon designs are designed based on printed circuit boards, and few researches based on integrated circuit processes are available. In the integrated circuit technology, if the advantages of high-density integration of the integrated circuit are fully exerted, a signal crossing circuit is necessarily required to be designed.
But the current research has several problems as follows,
1. the existing signal cross circuits are complex in design, and the integrity of two paths of signals cannot be influenced by a careful professional design;
2. most of the existing cross circuits have limited design working bandwidth, which limits the application and popularization of the cross circuits in future broadband and even ultra-wideband circuits;
3. the performance of some cross circuit designs can be affected by the cross angle, and even the cross angle is strictly required to be 90 degrees, which limits the wide application and popularization of the design.
Non-patent documents 1 to 3 are specifically as follows:
[1]. S. Y. Eom, A. Batgerel and L. Minz, "Compact Broadband Microstrip Crossover With Isolation Improvement and Phase Compensation," in IEEE Microwave and Wireless Components Letters, vol. 24, no. 7, pp. 481-483, July 2014, doi: 10.1109/LMWC.2014.2303163.
[2]. Y. Wang, A. M. Abbosh and B. Henin, "Broadband Microwave Crossover Using Combination of Ring Resonator and Circular Microstrip Patch," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 10, pp. 1771-1777, Oct. 2013, doi: 10.1109/TCPMT.2013.2262110.
[3]. Kongpop U-yen, E. J. Wollack, S. H. Moseley, T. R. Stevenson, W. Hsieh and N. T. Cao, "Via-less microwave crossover using microstrip-CPW transitions in slotline propagation mode," 2009 IEEE MTT-S International Microwave Symposium Digest, 2009, pp. 1029-1032, doi: 10.1109/MWSYM.2009.5165875。
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a signal crossing circuit structure and an integrated circuit.
In order to solve the technical problem, the utility model adopts the following technical scheme:
a signal crossover circuit structure comprises at least two paths of crossed artificial surface plasmon transmission lines in different layers, wherein the crossed included angle is more than 30 degrees, and a dielectric layer is arranged between the artificial surface plasmon transmission lines in adjacent layers.
As a preferred embodiment of the signal crossing circuit structure provided in the present invention, the signal is a radio frequency signal or a digital signal.
As a preferred embodiment of the signal crossover circuit structure provided in the present invention, the thickness of the dielectric layer is 1mm or less.
As the utility model provides a signal crossover circuit structure a preferred implementation, each artifical surface plasmon transmission line includes that the linear type is periodic arranges and the periodic unit that connects gradually.
As a preferred embodiment of the signal crossing circuit structure provided in the present invention, the periodic unit is a convex unit.
As the utility model provides a signal crossover circuit structure a preferred implementation mode, the forming material of artifical surface plasmon transmission line is metal or alloy or graphite alkene.
An integrated circuit having any of the signal crossing circuit structures described above.
As a preferred embodiment of the integrated circuit provided in the present invention, the integrated circuit is an integrated circuit applied to a satellite communication device.
Compared with the prior art, the utility model discloses there is following beneficial effect:
to the comparatively complicated problem of cross circuit design, the utility model provides a direct adoption is based on the cross circuit structure of artifical surface plasmon. Specifically, the utility model provides a signal crossover circuit structure includes that different layers and two at least two routes of artifical surface plasmon transmission lines that intersect, and the intersection contained angle is more than 30, need not like the strict 90 that needs of current crossover circuit, the utility model discloses can hold 360/30=6 signal channel's no influence cross design simultaneously at most; and a dielectric layer is arranged between the artificial surface plasmon transmission lines of adjacent layers so as to respectively establish the multiple paths of artificial surface plasmon transmission lines at different levels.
The invention skillfully utilizes the characteristic that the constraint force of the artificial surface plasmon on the energy of the electromagnetic field is strong, thereby weakening the signal coupling when the wires are crossed and realizing the purpose that the multichannel signals do not influence the crossing. Meanwhile, the design principle is simple, and professional calculation and design are not needed, so that the method is very favorable for popularization and use. Moreover, because the utility model discloses require very low (more than or equal to 30 °) to crossing signal path contained angle, consequently can hold more signal path's no influence alternately simultaneously, help furthest's promotion integrated circuit design density.
Furthermore, because the artificial surface plasmon structure is in low-pass filtering response, the cut-off frequency can be conveniently adjusted through the structure size, and a broadband or even ultra-wideband structure can be easily realized, so that the working bandwidth of the cross circuit design based on the artificial surface plasmon can be very wide.
To sum up, the beneficial effects of the utility model are that, the utility model provides a cross circuit design based on artifical surface plasmon provides new solution for integrated circuit cross design. Compared with the traditional cross circuit design method, the design method of the utility model is simpler and is easier to realize the broadband.
Drawings
In order to illustrate the present application or prior art more clearly, a brief description of the drawings needed for the description of the embodiments or prior art will be given below, it being clear that the drawings in the following description are some embodiments of the present application and that other drawings can be derived from them by a person skilled in the art without inventive effort.
Fig. 1 is a schematic diagram of an embodiment of a signal crossing circuit structure according to the present invention;
fig. 2 is a side view of an embodiment of the signal crossover circuit structure of the present invention;
fig. 3 is a schematic diagram of another embodiment of the signal crossing circuit structure of the present invention;
fig. 4 is a schematic diagram of an artificial surface plasmon transmission line in the signal crossover circuit structure of the present invention;
FIG. 5 is a schematic diagram of the cycle unit of FIG. 4;
FIG. 6 shows the transmission coefficient and isolation coefficient of the crossbar circuit structure under the embodiment of FIG. 3;
fig. 7 is a comparison graph of transmission coefficients of the independent transmission lines and the cross circuit structure of the present invention.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
In the design of the existing signal cross circuit, in order to realize the integrity of each path of signal, the complex and very professional design is needed, and the cross circuit designed in the way has limited working bandwidth, thereby limiting the application and popularization of the cross circuit in future broadband and even ultra-wideband circuits; in order to avoid the influence of the crossing angle, the crossing angle is generally required to be 90 degrees, and the wide application and popularization of the design are limited.
In order to solve the above problems, the present inventors have skillfully applied the artificial surface plasmon structure to a cross circuit design as individual transmission lines. Through a large number of experimental researches, the inventor finds that the constraint force of the artificial surface plasmons on the electromagnetic field energy is strong, so that the signal coupling during routing crossing is weakened, and meanwhile, the crossing included angle a of two adjacent artificial surface plasmons transmission lines 1 is designed to be more than 30 degrees, so that the purpose of crossing and passing of multi-channel signals without influence can be realized. Because artifical surface plasmon itself has the ability of electromagnetic energy restraint, consequently this cross signal route utility model designs, need not to carry out extra isolation design between each way transmission line.
Specifically, referring to fig. 1 to 3, the present embodiment provides a signal crossover circuit structure, which includes at least two intersecting artificial surface plasmon transmission lines 1 in different layers, where an intersection included angle a is greater than 30 °, and a dielectric layer 2 is disposed between the adjacent artificial surface plasmon transmission lines 1.
Referring to fig. 2, the different layers are that each of the artificial surface plasmon transmission lines 1 is not in the same layer, and are separated by the dielectric layer 2, so that each of the artificial surface plasmon transmission lines 1 is respectively established at different level heights. The thickness of the dielectric layer 2 is preferably less than 1mm, such as 1mm, 0.9mm, 0.8mm, 0.7mm, 0.6mm, 0.5mm, 0.4mm, 0.3mm, 0.2mm, 0.1 mm. It will be appreciated that the dielectric layer 2 may also be thicker than 1 mm. In order to further reduce the overall thickness of the integrated circuit, the thickness of the dielectric layer 2 is preferably controlled to be 1mm or less. Compare with traditional signal wiring cross design, the utility model discloses an artificial surface plasmon's restraint ability reinforcing for the medium interval between the different layers of cross signal transmission line can be thinner, more is favorable to integrated circuit's slimming miniaturization.
Referring to fig. 1 and 3, the intersection included angle a is an intersection included angle a between adjacent artificial surface plasmon transmission lines 1, where each artificial surface plasmon transmission line 1 is orthographically projected on the same substrate in a top view. Generally, the coupling interference of the conventional transmission line becomes stronger when the included angle a becomes smaller, so that the intersecting included angle a needs to be designed to be 90 ° in the conventional transmission line intersection design. But in the utility model discloses in, more can the interference suppression than traditional cross signal transmission line design, so this utility model walks under line contained angle a at littleer signal, preferably, will crossing contained angle a sets for more than 30, can realize comparing comparable interference suppression ability even more excellent with traditional cross signal design. In a specific implementation, each of the artificial surface plasmon transmission lines 1 is designed as a signal trace, so that at most 6 signal traces can be accommodated simultaneously without mutual interference, as shown in fig. 4.
As shown in fig. 4 and 5, each of the artificial surface plasmon transmission lines 1 includes periodic units 11 that are linearly and periodically arranged and are sequentially connected. The periodic unit 11 is a convex unit. Wherein the male unit comprises an upper portion 12 and a lower portion 13, the width of the upper portion 12 is narrower than the width of the lower portion 13, so that when the male unit is periodically connected, a groove is formed between the adjacent upper portions 12 for transmitting the SSPP waves. The structural size such as the shape, the size and the like of the convex unit can be designed according to actual needs. Because the artificial surface plasmon structure is in low-pass filtering response, the cut-off frequency can be conveniently adjusted through the structure size, and a broadband or even ultra-wideband structure can be easily realized, so that the working bandwidth of the cross circuit design based on the artificial surface plasmon can be very wide.
The artificial surface plasmon transmission line 1 is made of metal or alloy or graphene, and can be other good conductors.
In the present invention, the signal is a radio frequency signal or a digital signal, and it can be understood that other signals are also possible.
The utility model also provides an integrated circuit, it has arbitrary foretell signal crossover circuit structure. Preferably, the integrated circuit is an integrated circuit applied to a satellite communication device. Under the design scene of satellite communication equipment, the requirement on the size of an integrated circuit is high, the layout density of circuit components is high, and the signal cross probability is high. Adopt the utility model discloses a signal crossover circuit structure compares in traditional crossover circuit design method, the utility model discloses a design method is simpler, need not professional calculation and design, changes in realizing the broadband.
Fig. 3 shows an embodiment of the signal crossing circuit structure of the present invention, but it is understood that the present invention is not limited thereto.
In the embodiment, the signal crossover circuit structure comprises 6 lines of artificial surface plasmon transmission lines 1, which are separated by a dielectric plate, wherein the dielectric plate has a relative dielectric constant of 2.65, a thickness of 0.5mm, and a loss tangent of 0.003. The intersection of two adjacent artificial surface plasmon transmission lines 1 is 30 degrees. The periodic unit 11 of each line of the artificial surface plasmon transmission line 1 is a regular convex unit, the convex unit comprises a rectangular upper part 12 and a rectangular lower part 13, the rectangular upper part 12 is 1.0264mm in width and 3.8305mm in height, and the rectangular lower part 13 is 2.6966mm in width and 7.0905mm in height. The simulation results of the transmission efficiency and the isolation coefficient of this embodiment are shown in fig. 6. As shown in fig. 7, compared with the existing independent transmission line, the transmission efficiency of the cross circuit structure of the present invention is higher.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.
Claims (6)
1. A signal crossing circuit structure is characterized by comprising at least two paths of artificial surface plasmon transmission lines which are different in layer and intersect, wherein the intersection included angle is more than 30 degrees, and a dielectric layer is arranged between the artificial surface plasmon transmission lines of the adjacent layers; each artificial surface plasmon transmission line comprises periodic units which are linearly and periodically arranged and are sequentially connected.
2. The signal crossing circuit structure of claim 1 wherein the signal is a radio frequency signal or a digital signal.
3. The signal crossing circuit structure according to claim 1, wherein the dielectric layer has a thickness of 1mm or less.
4. The signal crossing circuit structure of claim 1 wherein the periodic cells are male cells.
5. The signal crossover circuit structure of claim 1, wherein the artificial surface plasmon transmission line is formed from a metal or graphene.
6. An integrated circuit having a signal crossing circuit structure as claimed in any one of claims 1 to 5.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114221105A (en) * | 2021-10-27 | 2022-03-22 | 重庆幂天通讯设备制造有限责任公司 | A signal crossover circuit structure and integrated circuit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114221105A (en) * | 2021-10-27 | 2022-03-22 | 重庆幂天通讯设备制造有限责任公司 | A signal crossover circuit structure and integrated circuit |
| CN114221105B (en) * | 2021-10-27 | 2024-11-22 | 重庆幂天通讯设备制造有限责任公司 | A signal crossover circuit structure and integrated circuit |
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