CN216849920U

CN216849920U - AC-DC power supply circuit lead frame

Info

Publication number: CN216849920U
Application number: CN202122372202.7U
Authority: CN
Inventors: 袁宏承
Original assignee: Wuxi Honghu Microelectronics Co ltd
Current assignee: Wuxi Honghu Microelectronics Co ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-06-28
Anticipated expiration: 2031-09-28

Abstract

The utility model relates to a AC-DC power supply circuit lead frame, including fin, first slide glass island, second slide glass island and a plurality of outer pin, first slide glass island is connected to the fin, first slide glass island is kept away from fin one side and is set up first outer pin, the outer pin of second, the outer pin of third, the outer pin of fourth and the outer pin of fifth, first outer pin, the outer pin of second, the outer pin of third, the outer pin of fourth and the outer pin of fifth are connected through well muscle, first outer pin is close to first slide glass island one end and connects second slide glass island, first slide glass island is connected to the outer pin of third, AC-DC power supply circuit lead frame, structural distribution is reasonable, and the wiring is reasonable, and big with plastic-sealed body bonding strength, can effectively prevent the moisture infiltration.

Description

AC-DC power supply circuit lead frame

Technical Field

The utility model relates to an integrated circuit field especially relates to an AC-DC power supply circuit lead frame.

Background

The switch power supply can be divided into two categories of AC/DC and DC/DC, AC/DC conversion is to convert alternating current into direct current, the power flow direction can be bidirectional, the DC/DC converter realizes modularization at present, and the design technology and the production process are mature and standardized at home and abroad and are approved by users, but the modularization of AC/DC leads to the more complicated technical and process manufacturing problems in the modularization process due to the characteristics of the AC/DC converter, and the AC-DC power supply circuit lead frame is designed before the company, but the AC-DC power supply circuit lead frame still has the following problems, 1, more wiring, more disorder, troublesome welding operation and low welding efficiency; 2. The distribution is unreasonable, and the problem that one side is heavier and the other side is lighter exists.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings of the prior art, it is an object of the present invention to provide an AC-DC power circuit lead frame to solve one or more problems of the prior art.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the radiating fin is connected with the first chip carrying island, one side, far away from the radiating fin, of the first chip carrying island is provided with a first outer pin, a second outer pin, a third outer pin, a fourth outer pin and a fifth outer pin, the first outer pin, the second outer pin, the third outer pin, the fourth outer pin and the fifth outer pin are connected through a middle rib, one end, close to the first chip carrying island, of the first outer pin is connected with the second chip carrying island, and the third outer pin is connected with the first chip carrying island.

As a further improvement of the above technical solution:

and the ends of the second outer pin, the fourth outer pin and the fifth outer pin, which are close to one end of the first slide glass island, are respectively plated with silver to form a first bonding area, a second bonding area and a third bonding area.

The first bonding region is offset to one side of the second outer lead away from the second slide island.

And the second bonding area and the third bonding area are bent towards one side of the third outer lead.

Open grooves are formed in two sides of the joint of the radiating fin and the first slide glass island.

And a V-shaped groove is formed in the position, between the two open grooves, of the joint of the radiating fin and the first slide glass island.

The other three side surfaces of the back surface of the first slide glass island except the side connected with the radiating fin are provided with concave inner grooves.

The side, far away from the first slide glass island, of the radiating fin is provided with an assembly positioning groove, and the radiating fin is located on two sides of the assembly positioning groove and connected with the first edge rib.

The first outer pin, the second outer pin, the third outer pin, the fourth outer pin and the fifth outer pin are connected through two middle ribs, and the two middle ribs are connected through a second edge rib.

The first outer pin, the second outer pin, the third outer pin, the fourth outer pin and the fifth outer pin are all bent outwards.

Compared with the prior art, the utility model discloses a beneficial technological effect as follows:

1) the middle third pin is connected with the first slide glass island, the first pin, the second pin, the fourth pin and the fifth pin are symmetrically arranged on two sides of the third pin, the structure distribution is reasonable, and the wiring is reasonable;

2) the bonding strength of the lead frame and the plastic package body can be improved through the open grooves and the inner grooves on the back of the V-shaped groove first carrier island, and meanwhile, moisture can be effectively prevented from permeating, so that the functional failure and performance reduction of a product caused by moisture are avoided;

4) the assembly positioning grooves are arranged, so that the positioning precision of the equipment is improved, and the assembly efficiency is improved;

5) the arrangement of the first edge rib and the second edge rib can increase the strength of the lead frame.

Drawings

Fig. 1 shows a front view of the lead frame of the AC-DC power circuit of the present invention.

In the drawings, the reference numbers:

1. a heat sink; 101. assembling a positioning groove; 102. a first edge bead; 2. a first slide island; 21. an inner groove; 3. a second slide glass island; 4. a first outer pin; 5. a second outer pin; 51. a first bonding region; 6. a third outer pin; 7. a fourth outer pin; 71. a second bonding region; 8. a fifth outer pin; 81. a third bonding region; 9. a middle rib; 91. a second edge bead; 10. an open slot; 11. and a V-shaped groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the following detailed description of the device according to the present invention is made with reference to the accompanying drawings and the detailed description of the present invention. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and clearly aiding in the description of the embodiments of the present invention. To make the objects, features and advantages of the present invention more comprehensible, please refer to the attached drawings. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limitation of the implementation of the present invention, so that the present invention does not have the essential significance in technology, and any modification of the structure, change of the ratio relationship or adjustment of the size should fall within the scope of the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention.

As shown in fig. 1, the lead frame of the AC-DC power circuit of this embodiment includes a heat sink 1, a first chip-carrying island 2, a second chip-carrying island 3, and a plurality of outer pins, where the heat sink 1 is connected to the first chip-carrying island 2, one side of the first chip-carrying island 2, which is far away from the heat sink 1, is provided with a first outer pin 4, a second outer pin 5, a third outer pin 6, a fourth outer pin 7, and a fifth outer pin 8, the first outer pin 4, the second outer pin 5, the third outer pin 6, the fourth outer pin 7, and the fifth outer pin 8 are connected through two middle ribs 9, one end of the first outer pin 4, which is close to the first chip-carrying island 2, is connected to the second chip-carrying island 3, and the third outer pin 6 is connected to the first chip-carrying island 2.

The ends of the second outer lead 5, the fourth outer lead 7 and the fifth outer lead 8 near one end of the first chip island are respectively plated with silver to form a first bonding area 51, a second bonding area 71 and a third bonding area 81.

The first bonding region 51 is offset to a side of the second outer lead 5 away from the second chip island 3 for abdicating the second chip island 3.

The second bonding region 71 and the third bonding region 81 are bent towards one side of the third outer lead 6, so that the bonding area of the second bonding region 71 and the third bonding region 81 can be increased, the distance from the second bonding region 71 and the third bonding region 81 to a chip on the first slide island 2 can be shortened, and the use length of a bonding wire can be reduced.

Open slot 10 is all seted up to fin 1 and first slide glass island 2 junction both sides, V-arrangement groove 11 is seted up to the position that fin 1 and first slide glass island 2 junction lie in between two open slots 10, first slide glass island 2 back removes all sets up the inner groovy 21 of indent with other three sides that fin 1 is connected one side, through open slot 10, the inner groovy 21 at the V-arrangement groove 11 and the first slide glass island 2 back can improve the bonding strength of lead frame and plastic-sealed body, also can effectively prevent the moisture infiltration simultaneously, avoid the moisture to arouse product function failure and performance reduction.

The cooling fin 1 is far away from the first slide island 2 one side and is provided with the assembly positioning groove 101, lead frame is positioned through the assembly positioning groove 101, the assembly efficiency can be improved, the cooling fin 1 is positioned on two sides of the assembly positioning groove 101 and is connected with the first edge rib 102, the first outer pin 4, the second outer pin 5, the third outer pin 6, the second edge rib 91 is connected between the two middle ribs 9 of the fourth outer pin 7 and the fifth outer pin 8, and the strength of the lead frame can be increased through the first edge rib 102 and the second edge rib 91.

The first outer pin 4, the second outer pin 5, the third outer pin 6, the fourth outer pin 7 and the fifth outer pin 8 are bent outwards, so that the distances from the first outer pin 4, the second outer pin 5, the third outer pin 6, the fourth outer pin 7 and the fifth outer pin 8 to the first slide glass island 2 and the second slide glass island 3 can be enlarged, and the assembly space is enlarged.

When the lead frame of the AC-DC power circuit of this embodiment is used, the chips are connected to the first chip-carrying island 2 and the second chip-carrying island 3, the second bonding regions 71 and the third bonding regions 81 of the fourth outer lead 7 and the fifth outer lead 8 are bonded to the chip on the first chip-carrying island 2 by the connecting keys, the chips on the first chip-carrying island 2 and the second chip-carrying island 3 are bonded to each other by the connecting keys, and the first bonding regions 51 of the second outer lead 5 are bonded to the chip on the second chip-carrying island 3 by the connecting keys.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes and modifications can be made, which shall all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An AC-DC power supply circuit lead frame characterized in that: the radiating fin is connected with the first glass slide island, one side, far away from the radiating fin, of the first glass slide island is provided with a first outer pin, a second outer pin, a third outer pin, a fourth outer pin and a fifth outer pin, the third outer pin is located in the middle, the first outer pin, the second outer pin, the fourth outer pin and the fifth outer pin are respectively arranged on two sides of the third outer pin, the first outer pin, the second outer pin, the third outer pin, the fourth outer pin and the fifth outer pin are connected through middle ribs, one end, close to the first glass slide island, of the first outer pin is connected with the second glass slide island, and the third outer pin is connected with the first glass slide island.

2. The AC-DC power circuit lead frame of claim 1, wherein: and the ends of the second outer pin, the fourth outer pin and the fifth outer pin, which are close to one end of the first slide glass island, are respectively plated with silver to form a first bonding area, a second bonding area and a third bonding area.

3. The AC-DC power circuit lead frame of claim 2, wherein: the first bonding region is offset to one side of the second outer lead away from the second slide island.

4. The AC-DC power circuit lead frame of claim 2, wherein: and the second bonding area and the third bonding area are bent towards one side of the third outer lead.

5. The AC-DC power circuit lead frame of claim 1, wherein: open grooves are formed in two sides of the joint of the radiating fin and the first slide glass island.

6. The AC-DC power circuit lead frame of claim 5, wherein: and a V-shaped groove is formed in the position, between the two open grooves, of the joint of the radiating fin and the first slide glass island.

7. The AC-DC power circuit lead frame of claim 1, wherein: the other three sides of the back of the first slide glass island except the side connected with the radiating fin are provided with concave inner grooves.

8. The AC-DC power circuit lead frame of claim 1, wherein: the side, far away from the first slide glass island, of the radiating fin is provided with an assembly positioning groove, and the radiating fin is located on two sides of the assembly positioning groove and connected with the first edge rib.

9. The AC-DC power circuit lead frame of claim 1, wherein: the first outer pin, the second outer pin, the third outer pin, the fourth outer pin and the fifth outer pin are connected through two middle ribs, and the two middle ribs are connected through a second edge rib.

10. The AC-DC power circuit lead frame of claim 1, wherein: the first outer pin, the second outer pin, the third outer pin, the fourth outer pin and the fifth outer pin are all bent outwards.