CN216848672U - CPU radiator - Google Patents

Abstract

The utility model relates to the technical field of radiators, in particular to a CPU radiator. The CPU radiator includes a heat-conducting seat, a heat-dissipating fin, a heat-conducting pipe and a heat-conducting base plate; the heat-dissipating fins are provided with several pieces, which are located above the heat-conducting seat, and are arranged in parallel and evenly spaced along the vertical direction, so The heat-dissipating fins are provided with through holes adapted to the heat-conducting pipes; the heat-conducting pipes have an L-shaped structure, the bottom of which is mounted on the heat-conducting seat, and the tops penetrate into the through-holes on the heat-dissipating fins in sequence. , the inner surface of the through hole and the outer surface of the heat-conducting pipe are provided with a graphene coating; the heat-conducting base plate is detachably connected to the bottom of the heat-conducting seat, and the bottom of the heat-conducting base plate is provided with a groove, so The grooves are arranged in four groups and are distributed in a rectangular shape near or directly at the outer edge of the CPU processor. The utility model solves the problem that there is a gap between the heat-conducting device and the heat-dissipating device in the existing CPU radiator, resulting in poor heat-dissipating effect.

Description

a CPU cooler

technical field

The utility model relates to the technical field of radiators, in particular to a CPU radiator.

Background technique

The radiator is used to reduce the heat generated during the operation of the machinery and equipment components, so that the mechanical equipment components dissipate and cool to increase the mechanical operation life. From the perspective of heat dissipation, the most common types of PC heat dissipation are: air cooling, water cooling, and passive cooling.

At present, the CPU radiator on the market is not only complex in structure, but also has a single function. The heat-conducting device and the heat-dissipating device cannot be closely attached, and air is the best heat-insulating material, so the heat will be absorbed between the heat-conducting pipe and the heat-dissipating fins. The gap is blocked, thereby reducing the heat dissipation efficiency, and there are many convex structures on the outer edge of the CPU. During installation, the heat conduction seat with a flat design on the bottom surface cannot make good contact with the CPU, thus affecting the heat dissipation effect.

Utility model content

The utility model provides a CPU radiator, which aims to solve the problem that the existing heat-conducting device of the CPU radiator and the heat-dissipating device cannot be closely attached, so the heat will be blocked by the gap between the heat-conducting pipe and the heat-dissipating fins, thereby reducing the energy consumption. The heat dissipation efficiency is high, and there are many convex structures on the outer edge of the CPU. During installation, the heat conduction base with a flat design on the bottom surface cannot make good contact with the CPU, thus affecting the heat dissipation effect.

In order to achieve the above purpose, the present invention provides a CPU radiator, comprising a heat-conducting seat, a heat-dissipating fin, a heat-conducting pipe and a heat-conducting base plate, wherein:

The radiating fins are provided with a plurality of fins, which are located above the heat-conducting seat, and are arranged in parallel and evenly spaced along the vertical direction, and the radiating fins are provided with through holes adapted to the heat-conducting pipes; The heat conducting pipe has an L-shaped structure, the bottom of which is mounted on the heat conducting seat, and the top part is inserted into the through holes on the heat dissipation fins in sequence, and the inner surface of the through hole and the outer surface of the heat conducting pipe are provided with graphite alkene coating; the thermally conductive bottom plate is detachably connected to the bottom of the thermally conductive base, and the bottom of the thermally conductive bottom plate is provided with grooves, and the grooves are four groups and are distributed in a rectangular shape close to or directly arranged on the CPU processor at the outer edge.

More specifically, graphene silicone grease is provided at the center of the bottom surface of the thermally conductive base plate.

More specifically, the graphene silicone grease is also provided at the center of the bottom surface of the thermally conductive seat.

More specifically, the outer periphery of the heat-conducting seat is provided with a number of mounting holes, the mounting holes are rotatably connected with mounting posts, the interior of the mounting posts are provided with accommodating holes, and the tops of the accommodating holes are plum-shaped. , the bottom of which is a threaded structure.

More specifically, the outer edges of the heat dissipation fins are provided with a plurality of notches formed by indenting inwards.

More specifically, the four groups of the grooves are connected end to end in sequence.

More specifically, the width of the groove is 0.2mm-10mm, and the concave depth thereof is 0.1mm-5mm.

More specifically, there are six heat pipes.

The technical effect of the CPU radiator involved in the utility model is:

1. According to the properties of graphene's high thermal conductivity, the graphene coating is sprayed on the inner surface of the through hole and the outer surface of the heat pipe by electrostatic spraying, which fills the gap between the two and avoids the heat pipe and the heat dissipation fins. They cannot be closely attached, and the heat will be blocked by the air in the gap between the heat pipe and the heat dissipation fin, thereby reducing the problem of heat dissipation efficiency.

2. Through the design of a detachable heat-conducting base plate, when the outer edge of the CPU is provided with a raised structure, a heat-conducting base plate is installed at the bottom of the heat-conducting seat, so that the raised structures on the CPU are correspondingly snapped into the four groups of grooves, The thermal conductive base plate can be in good contact with the CPU, thereby obtaining a better heat dissipation effect.

Description of drawings

1 is a schematic structural diagram of a CPU radiator according to the present invention;

Fig. 2 is the enlarged schematic diagram of A place in Fig. 1;

Fig. 3 is the bottom view of a kind of CPU radiator involved in the utility model;

FIG. 4 is a partial schematic view of the cross-sectional view at B-B in FIG. 3 .

Marked in the figure:

1—thermal base; 2—heat dissipation fins; 3—heat pipe; 4—thermal base plate; 5—graphene silicone grease;

101—installation hole; 102—installation post; 103—accommodating hole;

201—through hole; 202—notch;

401—groove;

Detailed ways

In order to make the purpose, technical solutions and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not intended to limit the present invention.

It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or intervening elements may be present at the same time; when an element is referred to as being "connected to" another element An element, which may be directly connected to another element or intervening elements may also be present.

In order to illustrate the technical solution of the present invention more clearly, a preferred embodiment is provided below, with specific reference to FIG. 1 to FIG. 4 . A CPU radiator includes a heat-conducting seat 1, a heat-dissipating fin 2, a heat-conducting pipe 3 and a heat-conducting base plate 4, wherein:

The heat dissipation fins 2 are provided with a plurality of pieces, which are located above the heat conduction base 1 and arranged in parallel and evenly spaced along the vertical direction. The heat pipe 3 has an L-shaped structure, the bottom of which is mounted on the heat-conducting seat 1, and the top of the heat-dissipating fin 2 is inserted into the through-holes 201 on the heat-dissipating fins 2. The inner surface of the through-hole 201 And the outer surface of described heat-conducting pipe 3 is all provided with graphene coating; described heat-conducting base plate 4 is detachably connected to the bottom of described heat-conducting seat 1, and the bottom of described heat-conducting base plate 4 is provided with groove 401, and the The slots 401 are four groups and are distributed in a rectangular shape near or directly at the outer edge of the CPU processor.

In the present embodiment, the graphene coating is sprayed on the inner surface of the through hole 201 and the outer surface of the heat conduction pipe 3 by electrostatic spraying, that is, the gap between the two is filled. According to the properties of graphene thermal conductivity efficiency , so that the heat transfer pipe 3 and the heat dissipation fins 2 have good thermal conductivity, so that the heat transfer pipe 3 and the heat dissipation fins 2 cannot be closely attached, and the heat will be absorbed by the heat transfer pipe 3 It is blocked by the air in the gaps existing between the heat dissipation fins 2 and the heat dissipation fins 2 , thereby reducing the problem of heat dissipation efficiency. Secondly, when the outer edge of the CPU is provided with a raised structure, the bottom of the heat-conducting seat 1 can be installed with the heat-conducting base plate 4, so that the raised structures on the CPU are correspondingly snapped into the four groups of the grooves 401, Therefore, the heat-conducting base plate 4 can be in good contact with the CPU, thereby obtaining better heat dissipation effect.

As a preferred solution of this embodiment, a graphene silicone grease 5 is provided at the center of the bottom surface of the thermally conductive base plate 4 . By using heat-dissipating silicone grease containing graphene material, the limited thermal conductivity of traditional silicone grease is avoided, so that the heat on the CPU cannot be quickly transferred to the radiator, which is easy to cause the CPU temperature to accumulate, and the heat dissipation energy efficiency of the radiator can be fully utilized. , to reduce the problem of CPU aging.

As a preferred solution of this embodiment, the graphene silicone grease 5 is also provided at the center of the bottom surface of the thermally conductive base 1 . When the outer periphery of the CPU is provided with a raised structure, the bottom surface of the heat-conducting seat 1 can be directly contacted with the CPU, and the two can be directly thermally conducted through the graphene silicone grease 5 .

As a preferred solution of this embodiment, a plurality of mounting holes 1 are formed on the outer periphery of the heat conducting seat 1, and a mounting column 2 is rotatably connected in the mounting hole 1, and an accommodating hole 3 is opened inside the mounting column 2, The top of the accommodating hole 3 is in the shape of a plum blossom, and the bottom thereof is a threaded structure. When the radiator is installed, the internal volume of most cases is limited, so there is a problem that it is difficult to use a screwdriver to rotate the screws. Through the above design of the mounting post 2, the Torx head screw is first turned into the accommodating hole 3, and when the radiator is installed, by rotating the mounting post 2, the accommodating hole 3 drives the Torx head screw to rotate, The radiator can be easily installed in the corresponding case without using a screwdriver.

As a preferred solution of this embodiment, the outer edges of the heat dissipation fins 2 are provided with a plurality of notches 202 formed by indenting inwards. The notch 202 can play a role of disturbing the flow, enhance the air permeability of the heat dissipation fins 2, and further improve the heat dissipation effect.

As a preferred solution of this embodiment, the four groups of the grooves 401 are connected end to end in sequence.

As a preferred solution of this embodiment, the width of the groove 401 is 0.2mm-10mm, and the concave depth thereof is 0.1mm-5mm.

As a preferred solution of this embodiment, six of the heat pipes 3 are provided.

The CPU radiator of the utility model, through reasonable structural arrangement, solves the problem that the existing CPU radiator heat-conducting device and the heat-dissipating device cannot be closely attached, so the heat will be trapped between the heat-conducting pipe and the heat-dissipating fins. Therefore, the heat dissipation efficiency is reduced, and there are many convex structures on the outer edge of the CPU. During installation, the heat conduction seat with a flat design on the bottom surface cannot make good contact with the CPU, thus affecting the heat dissipation effect.

The above are only preferred embodiments of the present invention, and its structure is not limited to the shapes listed above. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall include within the scope of protection of the present invention.

Claims (8)

1. A CPU heat sink, comprising: including heat conduction seat, heat radiation fins, heat pipe and heat conduction bottom plate, wherein:

the heat dissipation fins are arranged above the heat conducting seat and are arranged in parallel at intervals along the vertical direction, and through holes matched with the heat conducting pipes are formed in the heat dissipation fins; the heat conduction pipe is of an L-shaped structure, the bottom of the heat conduction pipe is installed on the heat conduction seat, the top of the heat conduction pipe penetrates into the through holes in the heat dissipation fins in sequence, and graphene coatings are arranged on the inner surface of each through hole and the outer surface of the heat conduction pipe; the heat conducting base plate is detachably connected to the bottom of the heat conducting seat, grooves are formed in the bottom of the heat conducting base plate, and the grooves are distributed in four groups in a rectangular mode and are close to or directly arranged at the outer edge of the CPU processor.

2. The CPU heat sink of claim 1, wherein: and graphene silicone grease is arranged at the center of the bottom surface of the heat conduction bottom plate.

3. The CPU heat sink of claim 2, wherein: the graphene silicone grease is also arranged at the center of the bottom surface of the heat conducting seat.

4. The CPU heat sink of claim 1, wherein: a plurality of mounting hole has been seted up to the periphery of heat conduction seat, the mounting hole internal rotation is connected with the erection column, the holding hole has been seted up to the inside of erection column, holding hole top is plum blossom form, and its bottom is helicitic texture.

5. The CPU heat sink according to claim 1, wherein: the outer edge of the radiating fin is provided with a plurality of notches which are formed by inward sinking.

6. The CPU heat sink according to claim 1, wherein: the four groups of grooves are connected end to end in sequence.

7. The CPU heat sink according to claim 1, wherein: the width of the groove is 0.2mm-10mm, and the concave depth is 0.1mm-5 mm.

8. The CPU heat sink of claim 1, wherein: six heat conduction pipes are arranged.

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