CN216848672U

CN216848672U - CPU radiator

Info

Publication number: CN216848672U
Application number: CN202122647051.1U
Authority: CN
Inventors: 罗新华; 李兵
Original assignee: Dongguan Yuanyang Thermal Energy Technology Co ltd
Current assignee: Dongguan Yuanyang Thermal Energy Technology Co ltd
Priority date: 2021-11-01
Filing date: 2021-11-01
Publication date: 2022-06-28
Anticipated expiration: 2031-11-01

Abstract

The utility model relates to the technical field of radiators, in particular to a CPU radiator. The CPU radiator comprises a heat conducting seat, radiating fins, a heat conducting pipe and a heat conducting bottom plate; the heat dissipation fins are provided with a plurality of fins, are positioned above the heat conducting seat and are uniformly arranged in parallel at intervals along the vertical direction, and are provided with through holes matched with the heat conducting pipes; the heat conduction pipe is of an L-shaped structure, the bottom of the heat conduction pipe is installed on the heat conduction seat, the top of the heat conduction pipe sequentially penetrates into the through holes in the heat dissipation fins, and graphene coatings are arranged on the inner surface of each through hole and the outer surface of the heat conduction pipe; the heat conducting base plate is detachably connected to the bottom of the heat conducting seat, grooves are formed in the bottom of the heat conducting base plate, and the grooves are four groups and distributed in a rectangular mode to be close to or directly arranged at the outer edge of the CPU processor. The utility model solves the problem of poor heat dissipation effect caused by the gap between the heat conduction device and the heat dissipation device in the existing CPU heat sink.

Description

CPU radiator

Technical Field

The utility model relates to the technical field of radiators, in particular to a CPU radiator.

Background

The heat radiator is used for reducing heat generated when the equipment runs when the mechanical equipment part runs, so that the mechanical equipment part radiates heat and refrigerates to prolong the service life of the machine. From the perspective of heat dissipation, PC heat dissipation is still the most common: air cooling, water cooling and passive heat dissipation.

The CPU radiator on the market at present is not only complicated in structure, but also single in function, the heat conduction device and the heat dissipation device can not be tightly attached, and air is the best heat insulation material, so that heat can be blocked by gaps between the heat conduction pipe and the heat dissipation fins, and therefore heat dissipation efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a CPU radiator, aiming at solving the problems that the heat conducting device and the heat radiating device of the existing CPU radiator can not be tightly attached, so that the heat can be blocked by the gap between the heat conducting pipe and the heat radiating fin, thereby reducing the heat radiating efficiency, and the outer edge of the CPU is provided with a plurality of convex structures, when the CPU radiator is installed, the heat conducting seat with the bottom surface in a planar design can not be in good contact with the CPU, thereby affecting the heat radiating effect.

In order to achieve the above object, the present invention provides a CPU heat sink, which comprises a heat conducting base, heat dissipating fins, a heat conducting pipe and a heat conducting bottom plate, wherein:

the heat dissipation fins are provided with a plurality of fins, are positioned above the heat conducting seat and are uniformly arranged in parallel at intervals along the vertical direction, and are provided with through holes matched with the heat conducting pipes; the heat conduction pipe is of an L-shaped structure, the bottom of the heat conduction pipe is installed on the heat conduction seat, the top of the heat conduction pipe sequentially penetrates into the through holes in the heat dissipation fins, and graphene coatings are arranged on the inner surface of each through hole and the outer surface of the heat conduction pipe; the heat conducting base plate is detachably connected to the bottom of the heat conducting seat, grooves are formed in the bottom of the heat conducting base plate, and the grooves are four groups and distributed in a rectangular mode to be close to or directly arranged at the outer edge of the CPU processor.

More specifically, the bottom surface center department of heat conduction bottom plate is provided with graphite alkene silicone grease.

More specifically, the graphene silicone grease is also arranged at the center of the bottom surface of the heat conducting seat.

More specifically, a plurality of mounting hole has been seted up to the periphery of heat conduction seat, the mounting hole internal rotation is connected with the erection column, the holding hole has been seted up to the inside of erection column, holding hole top is the plum blossom form, and its bottom is helicitic texture.

More specifically, the outer edge of the heat dissipation fins is provided with a plurality of notches formed by inward depression.

More specifically, four groups of grooves are connected end to end in sequence.

More specifically, the width of the groove is 0.2mm-10mm, and the depth of the concave groove is 0.1mm-5 mm.

More specifically, the heat conduction pipe is provided with six.

The technical effects of the CPU radiator related by the utility model are as follows:

1. according to the property of high heat conduction efficiency of graphene, the graphene coating is sprayed on the inner surface of the through hole and the outer surface of the heat conduction pipe in an electrostatic spraying mode, so that gaps between the heat conduction pipe and the heat conduction pipe are filled, the problem that the heat conduction pipe and the heat dissipation fins cannot be tightly attached to each other, and heat can be blocked by air in the gaps between the heat conduction pipe and the heat dissipation fins, so that the heat dissipation efficiency is reduced is solved.

2. This application is through the design of detachable heat conduction bottom plate, and when CPU's outer fringe was equipped with protruding structure, at heat conduction seat bottom installation heat conduction bottom plate, in four groups recesses were gone into to the card that makes the protruding structure on the CPU correspond for heat conduction bottom plate can obtain good subsides with CPU and touch, and then obtains better radiating effect.

Drawings

FIG. 1 is a schematic diagram of a CPU heat sink according to the present invention;

FIG. 2 is an enlarged schematic view at A in FIG. 1;

FIG. 3 is a bottom view of a CPU heat sink in accordance with the present invention;

fig. 4 is a partial schematic view of a cross-sectional view at B-B in fig. 3.

The labels in the figure are:

1-a heat conducting base; 2-radiating fins; 3-heat conducting pipe; 4-heat conducting bottom plate; 5-graphene silicone grease;

101-mounting holes; 102-mounting a column; 103-a housing hole;

201-a through hole; 202-a gap;

401-groove;

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

In order to more clearly illustrate the technical solution of the present invention, a preferred embodiment is provided below, with specific reference to fig. 1 to 4. A CPU radiator comprises a heat conducting seat 1, a heat radiating fin 2, a heat conducting pipe 3 and a heat conducting bottom plate 4, wherein:

The heat dissipation fins 2 are arranged above the heat conducting seat 1 and are arranged in parallel at intervals along the vertical direction, and through holes 201 matched with the heat conducting pipes 3 are formed in the heat dissipation fins 2; the heat conduction pipe 3 is of an L-shaped structure, the bottom of the heat conduction pipe is installed on the heat conduction seat 1, the top of the heat conduction pipe penetrates through the through holes 201 in the heat dissipation fins 2 in sequence, and graphene coatings are arranged on the inner surface of each through hole 201 and the outer surface of the heat conduction pipe 3; the heat conducting bottom plate 4 is detachably connected to the bottom of the heat conducting seat 1, grooves 401 are formed in the bottom of the heat conducting bottom plate 4, and the grooves 401 are four groups and are distributed in a rectangular mode to be close to or directly arranged at the outer edge of the CPU processor.

In this embodiment, the graphene coating is sprayed on the inner surface of the through hole 201 and the outer surface of the heat pipe 3 by an electrostatic spraying manner, that is, a gap between the inner surface and the outer surface is filled, so that the heat pipe 3 and the heat dissipation fins 2 have good thermal conductivity according to the property of the graphene heat conduction efficiency, and the problem that the heat pipe 3 and the heat dissipation fins 2 cannot be tightly attached to each other, and heat is blocked by air in the gap between the heat pipe 3 and the heat dissipation fins 2, thereby reducing the heat dissipation efficiency is solved. Secondly, when the outer edge of the CPU is provided with the protruding structure, the heat conducting base plate 4 can be installed at the bottom of the heat conducting base 1, so that the protruding structure on the CPU is correspondingly clamped into the four groups of grooves 401, and the heat conducting base plate 4 can be well attached to and contacted with the CPU, thereby obtaining a better heat dissipation effect.

As a preferable solution of this embodiment, the graphene silicone grease 5 is disposed at the center of the bottom surface of the heat conducting bottom plate 4. Through having used the heat dissipation silicone grease that contains graphite alkene material, avoided traditional silicone grease heat-conducting ability limited, on the heat that makes on the CPU can't conduct the radiator fast, easily make the accumulational problem of CPU temperature, the heat dissipation efficiency of radiator can be fully exerted, the ageing problem of CPU is reduced.

As a preferable solution of this embodiment, the graphene silicone grease 5 is also disposed at the center of the bottom surface of the heat conducting base 1. When the periphery of the CPU is provided with a raised structure, the bottom surface of the heat conducting seat 1 can be directly contacted with the CPU, and the heat conduction between the heat conducting seat and the CPU is directly carried out through the graphene silicone grease 5.

As the preferred scheme of this embodiment, a plurality of mounting hole 1 has been seted up to the periphery of

heat conduction seat

1, 1 internal rotation in mounting hole is connected with erection column 2, holding hole 3 has been seted up to the inside of erection column 2, holding hole 3 top is the plum blossom form, and its bottom is helicitic texture. When the radiator is installed, the internal volume of most machine cases is limited, so that the problem that the screw is difficult to rotate by adopting a screwdriver exists. Through the design of the mounting column 2, the plum-blossom-shaped head screw is firstly turned into the accommodating hole 3, and when the radiator is mounted, the mounting column 2 is rotated to drive the plum-blossom-shaped head screw to rotate the accommodating hole 3, so that the radiator can be conveniently mounted in a corresponding case without using a screwdriver.

As a preferable solution of this embodiment, the outer edge of the heat dissipation fin 2 is provided with a plurality of notches 202 formed by being recessed inwards. The notches 202 can play a role of turbulent flow, so that the air permeability of the radiating fins 2 is enhanced, and the radiating effect is further improved.

As a preferable scheme of this embodiment, four sets of the grooves 401 are connected end to end in sequence.

Preferably, the width of the groove 401 is 0.2mm-10mm, and the concave depth is 0.1mm-5 mm.

In a preferred embodiment of the present invention, six heat transfer pipes 3 are provided.

The utility model relates to a CPU radiator, which solves the problems that the heat conducting device and the heat radiating device of the existing CPU radiator can not be tightly attached, so that heat can be blocked by gaps between heat conducting pipes and heat radiating fins, thereby reducing the heat radiating efficiency, and the outer edge of the CPU is provided with a plurality of convex structures, so that when the CPU radiator is installed, a heat conducting seat with a plane design bottom surface can not be in good contact with the CPU, thereby affecting the heat radiating effect.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention, and the present invention is not limited to the above-mentioned shapes, and any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A CPU heat sink, comprising: including heat conduction seat, heat radiation fins, heat pipe and heat conduction bottom plate, wherein:

the heat dissipation fins are arranged above the heat conducting seat and are arranged in parallel at intervals along the vertical direction, and through holes matched with the heat conducting pipes are formed in the heat dissipation fins; the heat conduction pipe is of an L-shaped structure, the bottom of the heat conduction pipe is installed on the heat conduction seat, the top of the heat conduction pipe penetrates into the through holes in the heat dissipation fins in sequence, and graphene coatings are arranged on the inner surface of each through hole and the outer surface of the heat conduction pipe; the heat conducting base plate is detachably connected to the bottom of the heat conducting seat, grooves are formed in the bottom of the heat conducting base plate, and the grooves are distributed in four groups in a rectangular mode and are close to or directly arranged at the outer edge of the CPU processor.

2. The CPU heat sink of claim 1, wherein: and graphene silicone grease is arranged at the center of the bottom surface of the heat conduction bottom plate.

3. The CPU heat sink of claim 2, wherein: the graphene silicone grease is also arranged at the center of the bottom surface of the heat conducting seat.

4. The CPU heat sink of claim 1, wherein: a plurality of mounting hole has been seted up to the periphery of heat conduction seat, the mounting hole internal rotation is connected with the erection column, the holding hole has been seted up to the inside of erection column, holding hole top is plum blossom form, and its bottom is helicitic texture.

5. The CPU heat sink according to claim 1, wherein: the outer edge of the radiating fin is provided with a plurality of notches which are formed by inward sinking.

6. The CPU heat sink according to claim 1, wherein: the four groups of grooves are connected end to end in sequence.

7. The CPU heat sink according to claim 1, wherein: the width of the groove is 0.2mm-10mm, and the concave depth is 0.1mm-5 mm.

8. The CPU heat sink of claim 1, wherein: six heat conduction pipes are arranged.