CN216848579U - Packaged target current automatic trimming circuit and integrated chip - Google Patents

Abstract

The utility model belongs to the technical field of integrated chips, in particular to an automatic trimming circuit of packaged target current and an integrated chip, wherein the target current automatic trimming circuit comprises a reference circuit, an impedance compensation circuit, a voltage comparison circuit and a logic trimming circuit, the logic trimming circuit automatically outputs a trimming control signal to the impedance compensation circuit according to a test signal, so that the impedance compensation circuit can realize the impedance compensation of the packaging copper wire, the voltage of the second pin is gradually increased to the voltage value of the first pin, when the two are equal, the logic trimming circuit receives the inverted preset level, thereby stopping trimming and locking the current resistance value and the current logic value, which can be stored in a register in the integrated chip, therefore, the integrated chip is repaired to the target current without being influenced by the packaged copper wire, and the repairing precision is improved.

Description

Packaged target current automatic trimming circuit and integrated chip

Technical Field

The utility model belongs to the technical field of the integrated chip, especially, relate to an automatic trimming circuit of target current and integrated chip after the encapsulation.

Background

Due to the rapid development of the semiconductor industry, the wafer price has risen due to the increasingly insufficient capacity of the wafer factory, and the testing cost of the chip becomes important.

The traditional chip trimming technology needs to be tested and burned by the equipment of a wafer test factory, and in the testing process, because the chip is not packaged, packaging influence factors such as copper wire impedance and the like are ignored, the trimming result has deviation with the packaged chip, and the trimming precision is reduced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an automatic circuit of repairing of target current after encapsulation aims at solving traditional repair scheme and repairs when the chip is not encapsulated, leads to repairing the problem that the precision descends.

The embodiment of the utility model provides a first aspect provides an automatic trimming circuit of target current after encapsulation, the automatic trimming circuit of target current sets up in packaging structure's integrated chip, integrated chip is provided with first pin and second pin, first pin and the test pin lug connection on packaging structure's the encapsulation basement, the second pin pass through the encapsulation copper line in the integrated chip with the test pin is connected, the second pin is integrated chip's test contact, the test pin is used for inputing target current, the automatic trimming circuit of target current includes:

a reference circuit for outputting a reference voltage;

the input end of the impedance compensation circuit is connected with the output end of the reference circuit, the output end of the impedance compensation circuit is connected with the second pin, and the impedance compensation circuit is triggered by a trimming control signal to trim the size of an internal compensation resistor so as to compensate the impedance of a packaging copper wire between the second pin and the test pin and output a voltage signal with corresponding size;

a first input end of the voltage comparison circuit is connected with the first pin, and a second input end of the voltage comparison circuit is connected with an output end of the impedance compensation circuit;

the feedback end of the logic trimming circuit is connected with the output end of the voltage comparison circuit, the output end of the logic trimming circuit is connected with the controlled end of the impedance compensation circuit, the logic trimming circuit receives a trimming control signal with the output change of the test signal, and locks the size of the trimming control signal after the output level of the voltage comparison circuit is turned over to the preset level so as to lock the resistance value of the impedance compensation circuit and the logic value of the current trimming control signal.

Optionally, the packaged target current automatic trimming circuit further includes:

the current detection circuit is respectively connected with the test pin, the first pin and the second pin, and is used for detecting the current direction of the target current and outputting voltage signals with corresponding polarities to the first pin and the second pin.

Optionally, the impedance compensation circuit includes a plurality of series resistors and a plurality of switching tubes correspondingly connected to two ends of each resistor;

the two ends of the series resistors form the input end and the output end of the impedance compensation circuit, and the controlled ends of the switch tubes are used for inputting the trimming control signals and are correspondingly switched on or switched off.

Optionally, the voltage comparison circuit includes a comparator, a positive-phase input terminal of the comparator is connected to the second pin, an inverted-phase input terminal of the comparator is connected to the first pin, and an output terminal of the comparator is connected to a feedback terminal of the logic trimming circuit.

Optionally, the logic trimming circuit includes a pre-trimming circuit, a fuse circuit, and a logic gate output circuit;

the input end of the pre-trimming circuit and the input end of the fusing circuit are connected in common and simultaneously receive the test signal and the output level of the voltage comparison circuit, the output end of the pre-trimming circuit and the output end of the fusing circuit are respectively connected with the input end of the logic gate output circuit, and the output end of the logic gate output circuit is connected with the controlled end of the impedance compensation circuit;

the pre-trimming circuit is controlled by the test signal to trigger and output a pre-trimming signal to the logic gate output circuit;

the fusing circuit is controlled by the voltage comparison circuit to trigger and output a locking control signal to the logic gate output circuit when the output level of the voltage comparison circuit is overturned;

the logic gate output circuit is used for outputting the pre-trimming signal to the impedance compensation circuit so as to trim the impedance of the impedance compensation circuit step by step, and outputting the locking control signal to the impedance compensation circuit so as to lock the impedance value of the current impedance compensation circuit.

Optionally, the pre-trim circuit comprises a first shift register.

Optionally, the fusing circuit comprises a fuse;

the fuse is blown out when the output level of the voltage comparison circuit is inverted, and outputs a locking control signal.

Optionally, the logic gate output circuit includes a plurality of sets of logic gates, each set of logic gates including at least one correspondingly connected logic gate.

A second aspect of the embodiments of the present invention provides an integrated chip, including the packaged target current automatic trimming circuit.

Optionally, the integrated chip further includes a general pin, and the test signal is input through the general pin;

or the integrated chip further comprises a signal generation module, the signal generation module is connected with the first pin or the enabling pin, and the signal generation module is triggered by the test current or the enabling signal of the enabling pin to output the test signal.

Compared with the prior art, the embodiment of the utility model beneficial effect who exists is: according to the target current automatic trimming circuit, the reference circuit, the impedance compensation circuit, the voltage comparison circuit and the logic trimming circuit are arranged, the logic trimming circuit automatically outputs the trimming control signal to the impedance compensation circuit according to the test signal, so that the impedance compensation circuit realizes impedance compensation on the packaged copper wire, the voltage of the second pin is gradually increased to the voltage value of the first pin, when the logic trimming circuit and the impedance compensation circuit are equal, the logic trimming circuit receives the overturned preset level, trimming is stopped, the current resistance value and the current logic value are locked, the logic value can be stored in a register in the integrated chip, the integrated chip is trimmed to the target current, the integrated chip is not influenced by the packaged copper wire, and the trimming accuracy is improved.

Drawings

Fig. 1 is a schematic structural diagram of a package structure according to an embodiment of the present invention;

fig. 2 is a schematic view of a first structure of an automatic target current trimming circuit according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a second structure of the target current automatic trimming circuit according to an embodiment of the present invention;

fig. 4 is a schematic circuit diagram of an impedance compensation circuit in the target current automatic trimming circuit provided in the embodiment of fig. 2;

fig. 5 is a schematic diagram of a third structure of an automatic target current trimming circuit according to an embodiment of the present invention;

fig. 6 is a schematic circuit diagram of a pre-trimming circuit according to an embodiment of the present invention;

FIG. 7 is a schematic circuit diagram of a first portion of a fuse circuit according to an embodiment of the present invention;

FIG. 8 is a schematic circuit diagram of a second portion of a fuse circuit according to an embodiment of the present invention;

fig. 9 is a schematic circuit diagram of a logic gate output circuit according to an embodiment of the present invention;

fig. 10 is a schematic circuit diagram of a current detection circuit according to an embodiment of the present invention.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The embodiment of the utility model provides a first aspect provides an automatic circuit 10 of trimming of target current after the encapsulation.

As shown in fig. 1, the target current automatic trimming circuit 10 is disposed in an integrated chip 100 of the package structure 1, the integrated chip 100 is disposed on a package substrate, the package substrate is further provided with a test pin 11, the integrated chip 100 obtains an external input signal through the test pin 11, and is mainly used for inputting a target current, meanwhile, a plurality of pins are disposed in the integrated chip 100, wherein the plurality of pins mainly include a first pin 40 and a second pin 30, the first pin 40 is directly connected to the test pin 11 on the package substrate, the second pin 30 is connected to the test pin 11 through a package copper wire in the integrated chip 100, and meanwhile, when the integrated chip 100 performs a wafer test, the second pin 30 in the integrated chip 100 is a test contact, and a specification actual value is obtained through the trimming contact, and the trimming of the target value is achieved through the internal target current automatic trimming circuit 10.

When the integrated chip 100 obtains the target current through the second pin 30, due to the impedance influence of the packaging copper wire, the voltage at this point is inconsistent with the voltage value input by the test pin 11, so that the obtained actual target current is different from the target current of the test pin 11, and the current is used as a specification current, such as an overcharge protection current threshold or an overdischarge protection current threshold, when the integrated chip 100 works, the integrated chip 100 cannot work at the accurate protection current threshold, so that the current protection fails.

Therefore, on the basis of trimming, in order to avoid the influence of the encapsulated copper wires, and at the same time, reduce trimming cost and improve trimming precision, in this embodiment, a target current automatic trimming circuit 10 is provided, as shown in fig. 2, the target current automatic trimming circuit 10 includes:

a reference circuit 11, the reference circuit 11 being configured to output a reference voltage;

the input end of the impedance compensation circuit 12 is connected with the output end of the reference circuit 11, the output end of the impedance compensation circuit 12 is connected with the second pin 30, and the impedance compensation circuit 12 triggers and adjusts the size of an internal compensation resistor under the action of the adjustment control signal so as to compensate the impedance of the packaging copper wire between the second pin 30 and the test pin 11 and output a voltage signal with corresponding size;

a first input end of the voltage comparison circuit 13 is connected with the first pin 40, and a second input end of the voltage comparison circuit 13 is connected with an output end of the impedance compensation circuit 12;

the feedback end of the logic trimming circuit 14 is connected with the output end of the voltage comparison circuit 13, the output end of the logic trimming circuit 14 is connected with the controlled end of the impedance compensation circuit 12, the logic trimming circuit 14 outputs a variable trimming control signal by the TEST signal TEST, and the magnitude of the trimming control signal is locked after the output level of the voltage comparison circuit 13 is inverted to a preset level, so as to lock the resistance value of the impedance compensation circuit 12 and the logic value of the current trimming control signal.

In this embodiment, a target current is input to the integrated chip 100 through the test pin 11, the first pin 40 is connected to the test pin 11 on the package structure 1, at this time, a voltage value of the first pin 40 is a target voltage, the target current flows into the second pin 30 through the package copper wire, a voltage value of the second pin 30 is an actual target voltage value received in the integrated chip 100, and the actual target current value of the second pin 30 is trimmed to the target current value of the test pin 11 by trimming the voltage value of the second pin 30 to the voltage value of the first pin 40 corresponding to an actual target current value, so that the target current value required by the package structure 1 is obtained in the integrated chip 100, and the integrated chip 100 realizes current protection by using the target current value as an overcurrent protection threshold.

When trimming is performed, a target current is input to the first pin 40 and the second pin 30 through the TEST pin 11, at this time, the voltage of the second pin 30 is smaller than the voltage of the first pin 40, the TEST signal TEST is generated by the integrated chip 100 or input through another multiplexing pin, and the target current automatic trimming circuit 10 automatically enters trimming operation.

Specifically, the logic trimming circuit 14 outputs the trimming control signal to the impedance compensation circuit 12 according to the TEST signal TEST, the trimming control signal changes according to a preset trimming step, for example, sequentially changes from 0000 to 1111, or sequentially changes from 1111 to 0000, the change mode of the specific trimming step is not limited, the impedance of the impedance compensation circuit 12 changes according to the changed trimming control signal, so as to compensate the impedance of the copper package wire, in an initial state, the voltage of the first pin 40 is greater than the voltage of the second pin 30, at this time, the voltage comparison circuit 13 outputs a first level, for example, a low level, when the logic trimming circuit 14 receives the first level, the changed trimming control signal is continuously output, when the impedance of the impedance compensation circuit 12 changes step by step, the voltage value of the second pin 30 rises step by step, when the voltage of the first pin 40 rises, the output level of the voltage comparison circuit 13 turns over, for example, a high level is output, after the logic trimming circuit 14 receives the inverted level, it is determined that trimming is completed, the logic trimming circuit 14 locks the logic value of the current trimming control signal, so as to lock the impedance of the impedance compensation circuit 12 to a preset value, that is, the voltage and the current of the second pin 30 are locked to the voltage and the current of the first pin 40, so that the voltage of the test contact of the integrated chip 100 is trimmed to the voltage of the test pin 11 of the package structure 1, and the integrated chip 100 performs subsequent current protection by using the current value as a protection current threshold.

The logic value can be stored in the register 20 in the integrated chip 100, so that the integrated chip 100 is trimmed to the target current, the trimming result is not affected by the packaged copper wire, and the trimming precision is improved.

Wherein, the impedance compensation circuit 12 can adopt switch structure and resistance structure to constitute jointly, resistance structure can be a plurality of series-parallel connection resistance, switch structure corresponds to resistance structure series-parallel connection, switch structure corresponds according to received maintenance control signal and switches on and off, thereby realize realizing the short circuit to different resistance structure, short circuit control, and then form different resistance value, and finally compensate to the impedance of the encapsulation copper line of second pin 30, make the voltage and the electric current of second pin 30 progressively rise to the voltage and the electric current of the voltage of first pin 40, accomplish maintenance work.

The voltage comparison circuit 13 may employ a comparator U1 and corresponding peripheral components, as shown in fig. 5, and optionally, the voltage comparison circuit 13 includes a comparator U1, a non-inverting input terminal of the comparator U1 is connected to the second pin 30, an inverting input terminal of the comparator U1 is connected to the first pin 40, and an output terminal of the comparator U1 is connected to the feedback terminal of the logic trimming circuit 14.

During initial trimming, the voltage of the first pin 40 is greater than the voltage of the second pin 30, the voltage of the non-inverting input terminal of the comparator U1 is less than the voltage of the inverting input terminal of the comparator U1, the comparator U1 outputs a low level, during the gradual trimming, the voltage of the second pin 30 gradually rises, when the voltage of the first pin 40 is equal to the voltage of the second pin 30, the comparator U1 outputs a high level, and at this time, the logic trimming circuit 14 locks the logic value of the current trimming control signal, thereby locking the impedance of the impedance compensation circuit 12.

The reference circuit 11 may adopt a corresponding reference voltage source, and the reference circuit 11 outputs a voltage signal of a corresponding magnitude to the second pin 30 step by step through the impedance compensation circuit 12 by connecting with a power supply pin in the integrated chip 100 and converting the output reference voltage source, so that the voltage and the current of the second pin 30 are gradually adjusted to the target voltage and the target current.

The logic trimming circuit 14 may adopt corresponding structures such as a shift register, a D flip-flop, a FUSE, etc., and the specific structures are correspondingly arranged according to requirements.

As shown in fig. 3, optionally, the packaged target current automatic trimming circuit 10 further includes:

the current detection circuit 15, the current detection circuit 15 is connected with the test pin 11, the first pin 40 and the second pin 30 respectively, and the current detection circuit 15 is used for detecting the current direction of the target current and outputting a voltage signal with a corresponding polarity to the first pin 40 and the second pin 30.

In this embodiment, after the target current flows into the integrated chip 100 through the test pin 11, the target current first passes through the current detection circuit 15, and the current detection circuit 15 identifies the current direction, that is, identifies whether the current target current is the discharging target threshold current or the charging target current threshold, and determines the positive and negative input states of the voltage comparison circuit 13.

As shown in fig. 10, the current detection circuit 15 may adopt a corresponding detection circuit, and the current detection circuit 15 includes a first comparator COMP, a plurality of inverters and a plurality of switches, and takes the charging current as a positive current and the discharging current as a negative current, when the target current is a positive current or a negative current, the first comparator COMP correspondingly outputs a high level and a low level, and correspondingly controls the plurality of switches to be turned on and off through the inverters, so as to output voltage signals with different polarities to the first pin 40 and the second pin 30 at the rear end, and simultaneously output a corresponding current direction detection signal to the register 20.

As shown in fig. 4, optionally, the impedance compensation circuit 12 includes a plurality of series resistors and a plurality of switching tubes correspondingly connected to two ends of each resistor;

the two ends of the plurality of series resistors form an input end and an output end of the impedance compensation circuit 12, and the controlled ends of the plurality of switching tubes are used for inputting the trimming control signal and are correspondingly switched on or switched off.

In this embodiment, one end of the series resistor is connected to the output end of the reference circuit 11, the other end of the series resistor is connected to the second pin 30, the plurality of switching tubes receive corresponding logic values in the trimming control signal and are respectively turned on or off, so as to form an effective trimming resistor in series, and output corresponding impedance to compensate for the impedance of the packaged copper wire, wherein the number of the switches is correspondingly set according to the bit number or level combination state of the trimming control signal, for example, when the number of the switching tubes and the number of the resistors both include 4, when the number of the switching tubes is 1111, each switching tube is turned on, and when the number of the switching tubes is 1100, the first two or the last two switching tubes are turned on, so as to form different impedances and output different voltage signals to the second pin 30.

With reference to fig. 5, the logic trimming circuit 14 optionally includes a pre-trimming circuit 141, a fuse circuit 142, and a logic gate output circuit 143;

the input end of the pre-trimming circuit 141 and the input end of the fusing circuit 142 are connected in common and receive the TEST signal TEST and the output level of the voltage comparison circuit 13 at the same time, the output end of the pre-trimming circuit 141 and the output end of the fusing circuit 142 are respectively connected with the input end of the logic gate output circuit 143, and the output end of the logic gate output circuit 143 is connected with the controlled end of the impedance compensation circuit 12;

the pre-trimming circuit 141 is triggered by the TEST signal TEST to output a pre-trimming signal to the logic gate output circuit 143;

the fusing circuit 142 is controlled by the voltage comparison circuit 13 to flip the output level and trigger the output locking control signal to the logic gate output circuit 143;

the logic gate output circuit 143 is configured to output the pre-trimming signal to the impedance compensation circuit 12 to perform impedance step trimming on the impedance of the impedance compensation circuit 12, and output the locking control signal to the impedance compensation circuit 12 to lock the impedance value of the impedance compensation circuit 12.

In this embodiment, the pre-trimming circuit 141 and the fuse circuit 142 receive the TEST signal TEST and the fed-back voltage comparison signal at the same time, during the logic trimming, when the second pin 30 is smaller than the voltage of the first pin 40, at this time, the pre-trimming circuit 141 is a main target current automatic trimming circuit, outputs a varying pre-trimming signal to the logic gate output circuit 143, the logic gate output circuit 143 implements an and or nand output, and inputs the pre-trimming signal to the impedance compensation circuit 12 directly or in reverse phase, thereby implementing the impedance adjustment of the impedance compensation circuit 12, further changing the voltage of the second pin 30, when the voltage comparison circuit 13 outputs a flip level, at this time, the fuse circuit 142 switches in and outputs a locking control signal, at this time, the logic gate output circuit 143 only outputs a locking control signal to the impedance compensation circuit 12, and locks and solidifies the states of the switches of the impedance compensation circuit 12, without being disturbed by other signals, and thus locking the corresponding resistance value and the voltage value output by the impedance compensation circuit 12, the register 20 may obtain the logic value of the current lock control signal,

the pre-trimming circuit 141 receives the TEST signal TEST and converts the TEST signal TEST into a pre-trimming signal with a corresponding change logic value, for example, from 0000 to 1111, or the like, optionally, as shown in fig. 6, the pre-trimming circuit 141 includes a shift register U2, the number of the shift registers U2 includes at least one, the output ports of the shift register U2 correspond to the number of resistors and switching tubes in the impedance compensation circuit 12, for example, as shown in fig. 6, includes a shift register U2, and a shift register U2 has 8 output ports, when the number of resistors and switching tubes in the impedance compensation circuit 12 increases, the number of the shift registers U2 or the output ports correspondingly increases.

The blowing circuit 142 may employ a corresponding flip-flop, FUSE, etc., as shown in fig. 8, and optionally, the blowing circuit 142 includes a FUSE;

the FUSE is blown when the output level of the voltage comparison circuit 13 is inverted inversely, and outputs a lock control signal.

In this embodiment, when the flip level, i.e., the high level, is detected, the FUSE circuit 142 blows the FUSE, so that the resistance value and the output voltage of the impedance compensation circuit 12 are fixed to the target resistance value and the target voltage value, the trimming is completed, the whole trimming process is automatically completed inside the integrated chip 100, and the development cycle of the product is greatly shortened.

The FUSE circuit 142 is correspondingly provided with a plurality of FUSE FUSEs and peripheral circuits correspondingly connected to the FUSE FUSEs according to the number of resistors and switching tubes in the impedance compensation circuit 12, and each FUSE and the peripheral circuit correspondingly connected to the FUSE FUSEs output one of the locking control signals to control one of the switching tubes.

Meanwhile, as shown in fig. 7, the blowing circuit 142 further includes a first converter U3 and a second converter U4, and further includes a corresponding switch tube connected to the FUSE and a D flip-flop U5, and the first converter U3 and the second converter U4 are configured to implement conversion output of the one-way test signal and output multiple logic values to a peripheral circuit corresponding to one FUSE, so as to control the corresponding blowing or pause blowing of the FUSE.

Optionally, the logic gate output circuit 143 includes a plurality of sets of logic gate sets, each logic gate set includes at least one logic gate connected correspondingly, as shown in fig. 9, the logic gate output circuit 143 includes an and gate and/or an nand gate, and performs an and gate and nand gate logic conversion output on output signals of the pre-trimming circuit 141 and the fuse circuit 142 by implementing, and meanwhile, according to the number of resistors and switching tubes in the impedance compensation circuit 12, the logic gate output circuit 143 includes a plurality of sets of logic gate sets, each set of logic gate set completes output of one logic value, thereby implementing on-off control on each switching tube, and changing the impedance and output voltage value of the impedance compensation circuit 12.

The utility model discloses still provide an integrated chip 100, this integrated chip 100 is including the automatic circuit 10 of trimming of the target current after the encapsulation, and the specific structure of the automatic circuit 10 of trimming of the target current after this encapsulation refers to above-mentioned embodiment, because this integrated chip 100 has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is not repeated here one by one again.

The utility model discloses from establishing automatic repair circuit 10 of target current in the integrated chip 100, can accomplish automatic repair according to the target current of self port input, survey the step in directly skipping, can test and repair after integrated chip 100 encapsulates, and only need input target current through a pin, can realize automatic repair function, the product development cycle has been shortened, the product yield has been improved, and simultaneously, through internal impedance compensating circuit 12, the compensation of encapsulated copper line impedance has been realized, the precision of repairing has been improved.

Optionally, the integrated chip 100 further includes a general pin, when trimming is performed, a target current is input through the first pin 40 and the second pin 30, and the TEST signal TEST is input through the general pin, so as to implement synchronous trimming control, or the integrated chip 100 further includes a signal generation module, the signal generation module is connected to the first pin 40 or the enable pin, the signal generation module is triggered by the TEST current or the enable signal of the enable pin to output the TEST signal TEST, the trigger output of the TEST signal TEST is directly implemented inside the integrated chip 100, the pin of the integrated chip 100 does not need to be additionally multiplexed, and the TEST reliability is improved. The signal generating module can be a corresponding signal source, a logic conversion circuit and the like.

The above-mentioned embodiments are only used for illustrating the technical solution of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides an automatic trimming circuit of target current after encapsulation, the automatic trimming circuit of target current sets up in packaging structure's integrated chip, integrated chip is provided with first pin and second pin, first pin and the test pin lug connection on packaging structure's the encapsulation basement, the second pin pass through the encapsulation copper line in the integrated chip with the test pin is connected, the second pin is integrated chip's test contact, the test pin is used for inputing target current, its characterized in that, the automatic trimming circuit of target current includes:

a reference circuit for outputting a reference voltage;

the input end of the impedance compensation circuit is connected with the output end of the reference circuit, the output end of the impedance compensation circuit is connected with the second pin, and the impedance compensation circuit is triggered by a trimming control signal to trim the size of an internal compensation resistor so as to compensate the impedance of a packaging copper wire between the second pin and the test pin and output a voltage signal with corresponding size;

a first input end of the voltage comparison circuit is connected with the first pin, and a second input end of the voltage comparison circuit is connected with an output end of the impedance compensation circuit;

the feedback end of the logic trimming circuit is connected with the output end of the voltage comparison circuit, the output end of the logic trimming circuit is connected with the controlled end of the impedance compensation circuit, the logic trimming circuit receives a trimming control signal with the output change of the test signal, and locks the size of the trimming control signal after the output level of the voltage comparison circuit is turned over to the preset level so as to lock the resistance value of the impedance compensation circuit and the logic value of the current trimming control signal.

2. The packaged target current automatic trimming circuit of claim 1, wherein the packaged target current automatic trimming circuit further comprises:

the current detection circuit is respectively connected with the test pin, the first pin and the second pin, and is used for detecting the current direction of the target current and outputting voltage signals with corresponding polarities to the first pin and the second pin.

3. The packaged target current automatic trimming circuit of claim 1, wherein the impedance compensation circuit comprises a plurality of series resistors and a plurality of switching tubes correspondingly connected to two ends of each resistor;

the two ends of the series resistors form the input end and the output end of the impedance compensation circuit, and the controlled ends of the switch tubes are used for inputting the trimming control signals and are correspondingly switched on or switched off.

4. The packaged target current automatic trimming circuit of claim 1, wherein the voltage comparison circuit comprises a comparator, a non-inverting input of the comparator is connected to the second pin, an inverting input of the comparator is connected to the first pin, and an output of the comparator is connected to a feedback terminal of the logic trimming circuit.

5. The packaged target current automatic trimming circuit of claim 1, wherein the logic trimming circuit comprises a pre-trimming circuit, a fuse circuit, and a logic gate output circuit;

the input end of the pre-trimming circuit and the input end of the fusing circuit are connected in common and simultaneously receive the test signal and the output level of the voltage comparison circuit, the output end of the pre-trimming circuit and the output end of the fusing circuit are respectively connected with the input end of the logic gate output circuit, and the output end of the logic gate output circuit is connected with the controlled end of the impedance compensation circuit;

the pre-trimming circuit is controlled by the test signal to trigger and output a pre-trimming signal to the logic gate output circuit;

the fusing circuit is controlled by the voltage comparison circuit to trigger and output a locking control signal to the logic gate output circuit when the output level of the voltage comparison circuit is overturned;

the logic gate output circuit is used for outputting the pre-trimming signal to the impedance compensation circuit so as to trim the impedance of the impedance compensation circuit step by step, and outputting the locking control signal to the impedance compensation circuit so as to lock the impedance value of the current impedance compensation circuit and the logic value of the current trimming control signal.

6. The packaged target current automatic trimming circuit of claim 5, wherein the pre-trimming circuit comprises a first shift register.

7. The packaged target current automatic trimming circuit of claim 5, wherein the blow circuit comprises a fuse;

the fuse is blown out when the output level of the voltage comparison circuit is inverted, and outputs a locking control signal.

8. The packaged target current automatic trimming circuit of claim 5, wherein the logic gate output circuit comprises a plurality of sets of logic gates, each set of logic gates comprising at least one correspondingly connected logic gate.

9. An integrated chip comprising the packaged target current automatic trimming circuit according to any one of claims 1 to 8.

10. The integrated chip of claim 9, wherein the integrated chip further comprises a general purpose pin through which test signals are input;

or the integrated chip further comprises a signal generation module, the signal generation module is connected with the first pin or the enabling pin, and the signal generation module is triggered by the test current or the enabling signal of the enabling pin to output the test signal.

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