CN216820462U - Heat dissipation device for electronic product - Google Patents
Heat dissipation device for electronic product Download PDFInfo
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- CN216820462U CN216820462U CN202123269781.9U CN202123269781U CN216820462U CN 216820462 U CN216820462 U CN 216820462U CN 202123269781 U CN202123269781 U CN 202123269781U CN 216820462 U CN216820462 U CN 216820462U
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Abstract
The utility model discloses a heat dissipation device for an electronic product, relates to the technical field of heat dissipation devices, and solves the technical problems of low heat dissipation efficiency and low cold air utilization rate of the heat dissipation device in the existing electronic product. The device comprises a plurality of first heat dissipation structures and a second heat dissipation structure; the first heat dissipation structure is arranged around the second heat dissipation structure; the first heat dissipation structure and the second heat dissipation structure are fixedly connected through a wind shield; the second heat dissipation structure can assist the first heat dissipation structure in dissipating heat; the combination of the first heat dissipation structure and the second heat dissipation structure can dissipate heat of a plurality of heat source surfaces. The utility model arranges a plurality of first heat dissipation structures which are connected in series at the periphery of the second heat dissipation structure, the wind shield separates the air inlet and the air outlet of the second heat dissipation structure to form a channel, the second heat dissipation structure enables air to enter and exit from the top and applies pressure to overcome the buoyancy generated by the expansion of the heated air, the air flows out from the periphery to accelerate the heat exchange of the air, and the heat dissipation device can dissipate heat of a plurality of heat source surfaces.
Description
Technical Field
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for an electronic product.
Background
At present, electronic products are more and more widely applied, shells of many electronic products are made of PP, PE, PVC and other materials which are poor thermal conductors, and the heat conductivity is low, so that a radiator needs to be arranged in the electronic products to radiate the electronic products, the normal operation of the electronic products is ensured, and the service life of the electronic products is prolonged. For electronic products with low height, the traditional radiator can not achieve higher specification, the traditional radiator adopts the matching of radiating fins and heat conducting pipes, the heat in the electronic product is radiated by using the centrifugal fan to assist in radiating, but is limited by the structure and the air inlet and outlet directions, meanwhile, the centrifugal fan sucks fluid from the axial direction and throws the fluid out from the circumferential direction by using centrifugal force, cold air is scattered to the periphery of the fan, meanwhile, the air flows from the lower part of the device to the upper part of the device and flows upwards out of the device under the action of the buoyancy force of the heated and expanded air, the flow rate is slow, the air in the electronic product is not circulated, the air flow cannot be quickly replaced, the comprehensive heat dissipation effect cannot reach the best effect, the heat dissipation method cannot completely dissipate the heat, therefore, when these electronic products are in operation, heat inside the products is accumulated, which can seriously affect the stability of the product performance and the service life.
The traditional radiator is limited by the height of an electronic product, the structure is single, meanwhile, the heat source coverage of a heat dissipation device is small, heat dissipation of multiple heat sources cannot be achieved, air in the electronic product is not convective, cold air flows in different directions, and ventilation is slow. Electronic products generate a large amount of heat during operation, and better heat dissipation is required. The existing heat dissipation device can not meet the heat dissipation requirement well, so that an effective novel heat dissipation device needs to be arranged.
In the process of implementing the utility model, the utility model people find that at least the following problems exist in the prior art:
the heat dissipation device in the existing electronic product with low height has low heat dissipation efficiency and low utilization rate of cold air.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation device for an electronic product, and aims to solve the technical problems that the heat dissipation device in the existing electronic product with low height has low heat dissipation efficiency and low utilization rate of cold air in the prior art. The technical effects that can be produced by the preferred technical scheme in the technical schemes provided by the utility model are described in detail in the following.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a heat dissipation device for an electronic product, which comprises a plurality of first heat dissipation structures and a second heat dissipation structure, wherein the first heat dissipation structures are arranged on the first heat dissipation structure; the first heat dissipation structure is arranged around the second heat dissipation structure; the first heat dissipation structure and the second heat dissipation structure are fixedly connected through a wind shield; the second heat dissipation structure can assist the first heat dissipation structure in dissipating heat; the combination of the first heat dissipation structure and the second heat dissipation structure can dissipate heat of a plurality of heat source surfaces.
Preferably, a plurality of the first heat dissipation structures are connected in series with each other through a heat conduction pipe; the number of the heat conduction pipes is consistent with that of the first heat dissipation structures; one end of each heat conduction pipe penetrates through one first heat dissipation structure, the middle part of each heat conduction pipe is in compression joint with the lower part of the adjacent first heat dissipation structure, and the other end of each heat conduction pipe is arranged below the second heat dissipation structure.
Preferably, the first heat dissipation structure is a fin heat sink; the radiating fins are provided with through holes matched with the heat conduction pipes.
Preferably, the heat sink further comprises a bottom plate; the bottom plate is fixedly connected with the windshield; the bottom plate is provided with an air outlet.
Preferably, the second heat dissipation structure is an axial fan; the air inlet of the second heat dissipation structure faces away from the bottom plate; the air outlet of the second heat dissipation structure faces the air outlet hole of the bottom plate.
Preferably, the windshield includes a plurality of first connecting portions and a second connecting portion; the first connecting part is used for connecting the first heat dissipation structure; the second connecting part is used for connecting the second heat dissipation structure.
Preferably, the first connecting parts are all higher than the second connecting parts; the first connecting portions are arranged around the second connecting portions, and gaps are formed among the first connecting portions to form channels for heat dissipation of the second heat dissipation structure.
Preferably, the first connecting portion is provided with a vent and a groove structure.
Preferably, a connecting hole is formed in the wind shield; the connecting holes comprise a first connecting hole and a second connecting hole; the first connecting hole is used for connecting the windshield and the bottom plate; the second connecting hole is used for connecting the second connecting part and the second heat dissipation structure.
Preferably, the first connecting portion and the second connecting portion are of an integral structure or fixedly connected.
The implementation of one of the technical schemes of the utility model has the following advantages or beneficial effects:
according to the utility model, a plurality of first heat dissipation structures connected in series are arranged around the second heat dissipation structure, the wind shield separates the air inlet and the air outlet of the second heat dissipation structure to form a channel, the second heat dissipation structure enables air to enter and exit from the upper part and applies pressure to overcome buoyancy generated by the expansion of the air when heated, the air flows out from the periphery to accelerate the heat exchange of the air, and the heat dissipation device can dissipate heat of a plurality of heat source surfaces.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic diagram of an embodiment of a heat dissipation device for electronic products according to the present invention;
FIG. 2 is a schematic diagram of a heat dissipation device for electronic products according to an embodiment of the present invention, with a partially disassembled structure;
fig. 3 is a perspective view of an embodiment of a heat dissipation device for electronic products according to the present invention.
In the figure: 1. a first heat dissipation structure; 11. heat dissipation fins; 111. a through hole; 2. a second heat dissipation structure; 3. a windshield; 31. a first connection portion; 311. a vent; 312. a slot-type structure; 32. a second connecting portion; 33. a gap; 34. connecting holes; 341. a first connection hole; 342. a second connection hole; 4. a heat conducting pipe; 5. a base plate; 51. and (4) an air outlet.
Detailed Description
In order that the objects, aspects and advantages of the present invention will become more apparent, various exemplary embodiments will be described below with reference to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration various exemplary embodiments in which the utility model may be practiced. The same numbers in different drawings identify the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. It is to be understood that they are merely examples of processes, methods, apparatus, etc. consistent with certain aspects of the present disclosure as detailed in the appended claims, and that other embodiments may be used or structural and functional modifications may be made to the embodiments set forth herein without departing from the scope and spirit of the present disclosure.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," and the like are used in the orientations and positional relationships illustrated in the accompanying drawings for the purpose of facilitating the description of the present invention and simplifying the description, and do not indicate or imply that the elements so referred to must have a particular orientation, be constructed in a particular orientation, and be operated. The terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The term "plurality" means two or more. The terms "coupled" and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, integral connections, mechanical connections, electrical connections, communicative connections, direct connections, indirect connections through an intermediary, communications between two elements, or the interaction of two elements. The term "and/or" includes any and all combinations of one or more of the associated listed items. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In order to explain the technical solution of the present invention, the following description is made by way of specific examples, and only the portions related to the examples of the present invention are shown.
The first embodiment is as follows:
as shown in fig. 1-3, the present invention provides a heat dissipation device for electronic products, which includes a plurality of first heat dissipation structures 1 and a second heat dissipation structure 2; the first heat dissipation structure 1 is arranged around the second heat dissipation structure 2; the first heat dissipation structure 1 and the second heat dissipation structure 2 are fixedly connected through a windshield 3; the second heat dissipation structure 2 can assist the first heat dissipation structure 1 in dissipating heat; the combination of the first heat dissipation structure 1 and the second heat dissipation structure 2 can dissipate heat of a plurality of heat source surfaces. Specifically, the first heat dissipation structure 1 and the second heat dissipation structure 2 can both directly dissipate heat, and the second heat dissipation structure 2 can also assist the first heat dissipation structure 1 in dissipating heat, so that the heat dissipation rate is increased. The first heat dissipation structures 1 are disposed around the second heat dissipation structure 2, so that the second heat dissipation structure 2 can assist the plurality of first heat dissipation structures 1 at the same time, and the wind generated by the second heat dissipation structure 2 (an axial fan described below) can act on each first heat dissipation structure 1 through the pressure applied by the second heat dissipation structure 2. The second heat dissipation structure 2 can forcibly change the flow direction of the buoyancy lift force generated by the air heated and expanded during natural heat dissipation. The wind shield 3 is fixedly connected with the first heat dissipation structure 1 and the second heat dissipation structure 2, so that the structure is integrated, and the heat dissipation device is convenient to install in an electronic product. The heat dissipation device can be adjacent to a plurality of heat source surfaces, so that the first heat dissipation structure 1 and the second heat dissipation structure 2 are matched with each other to dissipate heat of the plurality of heat source surfaces, and the heat dissipation rate is improved. According to the utility model, a plurality of first heat dissipation structures 1 which are connected in series are arranged around a second heat dissipation structure 2, a wind shield 3 separates an air inlet and an air outlet of the second heat dissipation structure 2 to form a channel, the second heat dissipation structure 2 enables air to enter and exit from the upper part and applies pressure to overcome buoyancy generated by air thermal expansion, the air flows out from the periphery, air heat exchange is accelerated, and the heat dissipation device can dissipate heat of a plurality of heat source surfaces.
As an alternative embodiment, as shown in fig. 1 to 3, a plurality of first heat dissipation structures 1 are connected in series with each other through heat conductive pipes 4; the number of the heat conduction pipes 4 is consistent with that of the first heat dissipation structures 1; one end of each heat conduction pipe 4 penetrates through one first heat dissipation structure 1, the middle part of each heat conduction pipe is pressed below the adjacent first heat dissipation structure 1, and the other end of each heat conduction pipe is arranged below the second heat dissipation structure 2. Specifically, a plurality of first heat radiation structures 1 are connected in series with each other through the heat pipe 4, so that the heat on each first heat radiation structure 1 is the same, the heat to be radiated is equally distributed on the plurality of first heat radiation structures 1, the heat radiation stability of the first heat radiation structures 1 is ensured, and the heat radiation efficiency of the heat radiation device is accelerated. The number of the heat conduction pipes 4 is the same as that of the first heat dissipation structures 1, so that each first heat dissipation structure 1 can be ensured to be connected in series, and meanwhile, a complete closed loop is formed. One end of the heat conduction pipe 4 penetrates through one first heat dissipation structure 1, the middle part of the heat conduction pipe 4 is in compression joint with the lower part of an adjacent first heat dissipation structure 1, a plurality of first heat conduction pipes 4 can be connected in series, heat absorbed by one first heat dissipation structure 1 is guided to an adjacent first heat dissipation structure 1 through the heat conduction pipe 4, and heat absorbed by the first heat dissipation structure 1 is evenly distributed on each first heat dissipation structure 1. The other end of the heat conducting pipe 4 is arranged below the second heat radiating structure 2, namely at the air outlet of the axial flow fan described below, and a part of heat absorbed by the first heat radiating structure 1 is transferred to the air outlet of the axial flow fan through the heat conducting pipe 4 to be radiated, so that the heat radiating effect and the heat radiating rate of the heat radiating device are improved, and meanwhile, the utilization rate of cold air is also improved.
As an alternative embodiment, as shown in fig. 2, the first heat dissipation structure 1 is a fin heat sink; the heat dissipation fins 11 are provided with through holes 111 matching with the heat conduction pipes 4. Specifically, the fin radiator has high heat dissipation efficiency, and meanwhile, a certain gap 33 is formed between the heat dissipation fins 11 of the fin radiator, so that the fin radiator can be well matched with a second radiator for heat dissipation. The through holes 111 on the heat dissipation fins 11 are matched with the heat conduction pipes 4, so that the installation stability of the heat dissipation device is ensured, the heat conduction pipes 4 are not easy to loosen and are installed tightly, the contact surface between the heat dissipation fins 11 and the heat conduction pipes 4 is the largest, heat conduction can be carried out to the greatest extent, and the heat dissipation rate of the heat dissipation device is improved. The first heat dissipation structure 1 is connected, preferably welded, to the heat conductive pipes 4.
As an alternative embodiment, as shown in fig. 1-3, the heat sink further comprises a base plate 5; the bottom plate 5 and the wind shield 3 are fixedly connected; the bottom plate 5 is provided with an air outlet 51. Specifically, the bottom plate 5 is fixedly connected with the windshield 3, and the bottom plate 5 is used for bearing the windshield 3, the first heat dissipation structure 1 and the second heat dissipation structure 2. The air outlet holes 51 on the bottom plate 5 correspond to the groove-shaped structures 312 on the first connecting portion 31, so that hot air can flow out, and the number of the air outlet holes 51 can be set according to actual requirements.
As an alternative embodiment, as shown in fig. 1 to 3, the second heat dissipation structure 2 is an axial fan; the air inlet of the second heat dissipation structure 2 faces back to the bottom plate 5; the air outlet of the second heat dissipation structure 2 faces the air outlet 51 of the bottom plate 5. Specifically, axial fan's blade promotes the air and flows with the same direction with the axle, makes the flow direction of air current parallel with the axle, makes axial fan's air intake and air outlet at second heat radiation structure 2's upper and lower both ends, and the air intake is back to bottom plate 5, the air outlet is convenient for set up the circulation channel of cold air towards bottom plate 5, guarantees that the cold and hot air of business turn over does not contact, improves heat exchange efficiency. The axial fan enables air to enter the heat dissipation device from the upper part, the wind shield 3 is additionally arranged around the first heat dissipation structure 1 and the second heat dissipation structure 2, the air flow direction is arranged in a planning mode, the air outlet of the axial fan can flow through the first heat dissipation structure 1 more frequently due to the fact that the fan blades rotate to the air scattered around, and then the air flows out of the air outlet (namely the side face of the wind shield 3 in the drawing) of the wind shield 3, and air heat exchange circulation is formed. The axial fan can overcome the buoyancy force of the air expanding when heated, change the flowing direction of the air, enable the air to flow downwards from the upper part, and meanwhile, apply pressure to the air, so that the air can flow through the first heat dissipation structure 1 and flow out from the periphery of the heat dissipation device. The axial flow fan has a compact structure, can save a lot of space, is convenient to install and is suitable for electronic products with low height.
As an alternative embodiment, as shown in fig. 1 to 3, the windshield 3 includes a plurality of first connection portions 31 and one second connection portion 32; the first connecting portion 31 is used for connecting the first heat dissipation structure 1; the second connection portion 32 is used to connect the second heat dissipation structure 2. Specifically, the number and the structure of the first connecting portions 31 and the first heat dissipation structures 1 are matched with each other, so that the installation stability is ensured, the heights of the first connecting portions 31 and the first heat dissipation structures 1 are set according to the heights of electronic products, and the number of the first connecting portions 31 and the number of the first heat dissipation structures 1 can be selected according to actual requirements. First connecting portion 31 encircles the setting of second connecting portion 32, and first heat radiation structure 1 is connected to first connecting portion 31, fixes first heat radiation structure 1, and first connecting portion 31 can prevent the inside chaotic circulation of wind at heat abstractor simultaneously. The top of first connecting portion 31 and the side region that is located whole heat abstractor set up to the opening, and the air of being convenient for get into first heat radiation structure 1 inside can flow out, realizes air heat transfer circulation. The second connecting portion 32 is connected to the second heat dissipation structure 2, and provides a mounting platform for the second heat dissipation structure 2.
As an alternative embodiment, as shown in fig. 1-2, the first connection portions 31 are all higher than the second connection portions 32; the first connecting portions 31 are disposed around the second connecting portions 32, and a gap 33 is disposed between each first connecting portion 31 to form a channel for dissipating heat from the second heat dissipation structure 2. Specifically, the first connecting portions 31 are higher than the second connecting portions 32, so that a cold air circulation channel is conveniently arranged above the second connecting portions 32, the gaps 33 arranged between every two first connecting portions 31 are air openings of the cold air circulation channel, the gaps 33 are arranged at the positions, higher than the second connecting portions 32, of the first connecting portions 31, the structure is compact, the arrangement is orderly, the parts, higher than the second connecting portions 32, of the first connecting portions 31 serve as barriers of the cold air circulation channel, the first connecting portions 31 are arranged around the second connecting portions 32, the first connecting portions 31 surround the second connecting portions 32 to form the barriers of the heat dissipation channel, wind shielding and wind guiding can be performed. Meanwhile, the wind shields 3 are symmetrically arranged, namely, the air openings of the cold air circulation channels are symmetrically arranged, so that the convection of cold air can be realized.
As an alternative embodiment, as shown in fig. 1-2, the first connection portion 31 is provided with a vent 311 and a channel structure 312. Specifically, the vent 311 provided in the first connection portion 31 is disposed below the abutting surface of the first connection portion 31 abutting against the second connection portion 32, and the bottom surface of the second connection portion 32 is higher than the bottom surface of the first connection portion 31, so that wind blown from the second heat dissipation structure 2 can enter the lower end of the first heat dissipation structure 1 in the first connection portion 31 from the vent 311, thereby assisting the first heat dissipation structure 1 in dissipating heat, and accelerating the heat dissipation rate. Meanwhile, the bottom surface of the second connecting portion 32 is higher than the bottom surface of the first connecting portion 31, so that an air outlet channel is conveniently arranged below the second connecting portion 32, a channel is provided for the air blown out by the second heat dissipation structure 2, and the air blown out by the second heat dissipation structure 2 can enter the vent 311 through the channel. The groove-shaped structure 312 arranged on the first connecting portion 31 is arranged on the abutting surface of the first connecting portion 31 abutting against the second connecting portion 32, the groove-shaped structure 312 corresponds to the air outlet 51 on the bottom plate 5 to form a communicated channel, so that part of air entering the first connecting portion 31 can pass through the channel, the part of air is divided, one part of air flows out downwards through the air outlet 51 of the bottom plate 5, one part of air flows out upwards through the groove-shaped structure 312, the part of air passing through the groove-shaped structure 312 can pass through the part of the area of the first heat dissipation structure 1 to assist the heat dissipation of the first heat dissipation structure 1, the heat dissipation rate is increased, and cold air is fully utilized. The wind shield 3 can separate the air inlet and the air outlet of the second heat dissipation structure 2, so that the hot and cold air entering and exiting are prevented from contacting, and the heat exchange efficiency is improved.
As an alternative embodiment, as shown in fig. 1 to 3, the windshield 3 is provided with a connecting hole 34; the connection hole 34 includes a first connection hole 341 and a second connection hole 342; the first connection hole 341 is used for connecting the windshield 3 and the bottom plate 5; the second connection hole 342 is used for connecting the second connection portion 32 and the second heat dissipation structure 2. Specifically, the number of the connection holes 34 may be set according to the shape of the windshield 3, so as to ensure stable fixation of the windshield 3 and the second heat dissipation structure 2. The first connection holes 341 connect the windshield 3 and the bottom plate 5, and the first connection holes 341 are disposed between two adjacent first connection portions 31; the second connection hole 342 connects the second connection portion 32 and the second heat dissipation structure 2, and the second connection hole 342 is disposed on a stage on which the second connection portion 32 carries the second heat dissipation structure 2. The attachment holes 34 generally mate with screws or attachment shafts.
As an alternative embodiment, as shown in fig. 1 to 3, the first connecting portion 31 and the second connecting portion 32 are an integral structure or fixedly connected. Specifically, the first connecting portion 31 and the second connecting portion 32 are integrated, so that the structure is simpler and the installation is more convenient. The first connecting portion 31 and the second connecting portion 32 are fixedly connected, so that the installation is flexible, the position of the first connecting portion 31 can be conveniently adjusted, the first connecting portion 31 or the second connecting portion 32 can be conveniently replaced, and the service life of the windshield 3 can be prolonged.
The embodiment is merely a specific example and does not indicate an implementation of the present invention as such.
While the utility model has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the utility model. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the utility model without departing from the essential scope thereof. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.
Claims (10)
1. A heat sink for electronic products, comprising a plurality of first heat-dissipating structures (1) and a second heat-dissipating structure (2); the first heat dissipation structure (1) is arranged around the second heat dissipation structure (2); the first heat dissipation structure (1) and the second heat dissipation structure (2) are fixedly connected through a wind shield (3); the second heat dissipation structure (2) can assist the first heat dissipation structure (1) in dissipating heat; the combination of the first heat dissipation structure (1) and the second heat dissipation structure (2) can dissipate heat of a plurality of heat source surfaces.
2. A heat sink for electronic products according to claim 1, wherein a plurality of said first heat dissipation structures (1) are connected in series with each other through a heat pipe (4); the number of the heat conduction pipes (4) is consistent with that of the first heat dissipation structures (1); one end of each heat conduction pipe (4) penetrates through one first heat dissipation structure (1), the middle part of each heat conduction pipe is pressed below the adjacent first heat dissipation structure (1), and the other end of each heat conduction pipe is arranged below the second heat dissipation structure (2).
3. The heat dissipation device for electronic products according to claim 2, wherein the first heat dissipation structure (1) is a fin heat sink; through holes (111) matched with the heat conduction pipes (4) are formed in the radiating fins (11).
4. The heat sink for electronic products according to claim 1, wherein the heat sink further comprises a bottom plate (5); the bottom plate (5) and the wind shield (3) are fixedly connected; the bottom plate (5) is provided with an air outlet (51).
5. The heat dissipation device for electronic products according to claim 4, wherein the second heat dissipation structure (2) is an axial fan; the air inlet of the second heat dissipation structure (2) is back to the bottom plate (5); and the air outlet of the second heat dissipation structure (2) faces the air outlet (51) of the bottom plate (5).
6. A heat sink for electronic products according to claim 1, wherein the windshield (3) comprises a plurality of first connecting portions (31) and a second connecting portion (32); the first connecting part (31) is used for connecting the first heat dissipation structure (1); the second connecting portion (32) is used for connecting the second heat dissipation structure (2).
7. The heat sink for electronic products according to claim 6, wherein the first connecting portions (31) are higher than the second connecting portions (32); the first connecting portions (31) are arranged around the second connecting portions (32), and gaps (33) are formed between every two adjacent first connecting portions (31) to form channels for heat dissipation of the second heat dissipation structure (2).
8. The heat sink for electronic products according to claim 7, wherein the first connecting portion (31) is provided with a ventilation opening (311) and a groove structure (312).
9. The heat dissipation device for electronic products as claimed in claim 8, wherein the windshield (3) is provided with a connection hole (34); the connection hole (34) includes a first connection hole (341) and a second connection hole (342); the first connecting hole (341) is used for connecting the windshield (3) and the bottom plate (5); the second connecting hole (342) is used for connecting the second connecting part (32) and the second heat dissipation structure (2).
10. The heat dissipation device for electronic products as claimed in claim 9, wherein the first connection portion (31) and the second connection portion (32) are integrally formed or fixedly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123269781.9U CN216820462U (en) | 2021-12-23 | 2021-12-23 | Heat dissipation device for electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123269781.9U CN216820462U (en) | 2021-12-23 | 2021-12-23 | Heat dissipation device for electronic product |
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| Publication Number | Publication Date |
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| CN216820462U true CN216820462U (en) | 2022-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202123269781.9U Active CN216820462U (en) | 2021-12-23 | 2021-12-23 | Heat dissipation device for electronic product |
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| CN (1) | CN216820462U (en) |
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- 2021-12-23 CN CN202123269781.9U patent/CN216820462U/en active Active
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Address after: 7a, Seaview Plaza, 18 Taizi Road, Shekou, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Aixin Environmental Protection Materials (Shenzhen) Co.,Ltd. Address before: 7a, Seaview Plaza, 18 Taizi Road, Shekou, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: PROVENCE TECHNOLOGY (SHENZHEN) Co.,Ltd. |