CN216818319U - Sealed cavity for welding semiconductor chip and vacuum eutectic furnace - Google Patents

Abstract

The utility model relates to the technical field of semiconductor chip welding, in particular to a sealed cavity and a vacuum eutectic furnace for welding a semiconductor chip, which comprise: an upper cavity; the lower cavity is arranged opposite to the upper cavity, and a sealed cavity is formed between the upper cavity and the lower cavity when the upper cavity and the lower cavity are closed; the carrier plate assembly is arranged in the sealing cavity and used for placing the chip, and heating assemblies for heating the carrier plate assembly in a radiation mode are arranged above and below the carrier plate assembly; the utility model adopts the heating components respectively arranged above and below the carrier plate component to carry out non-contact radiation heating, thereby providing efficient and rapid heating and uniform temperature distribution for the chip and the carrier plate, and simultaneously adopts the cooling pipe embedded into the carrier plate component to carry out direct contact cooling, thereby greatly improving the cooling speed of the chip and simultaneously considering the heating and cooling performances on the premise of certain power.

Description

Sealed cavity for welding semiconductor chip and vacuum eutectic furnace

Technical Field

The utility model relates to the technical field of semiconductor chip welding, in particular to a sealed cavity for semiconductor chip welding.

Background

Vacuum eutectic soldering is an important soldering process for microelectronic assembly, also known as low melting point alloy soldering. And placing an eutectic alloy solder sheet between the chip and the carrier, heating to an alloy melting point in a certain protective atmosphere to melt the eutectic alloy, and cooling to form the eutectic alloy, thereby completing the welding of the chip and the carrier. Compared with the traditional epoxy conductive adhesive bonding, the eutectic bonding has the advantages of high heat conductivity, small resistance, fast heat transfer, uniform heat dissipation, strong reliability, good process consistency, large shearing force after bonding and the like, and is suitable for welding application scenes of high-frequency and high-power devices and elements with reliable requirements, such as welding of power devices, hybrid integrated circuits, microwave radio-frequency devices and MEMS devices.

The vacuum eutectic furnace mainly comprises: the device comprises a vacuum pumping system, a sealed cavity, a reducing atmosphere system, a gas flow control system, a safety system, a control system and the like. The sealing cavity comprises a heating module, a cooling module, a carrier plate, a process gas module and the like, and the whole chip welding process is completed in the vacuum cavity, so that the welding quality is ensured, and the design of the vacuum cavity is very important.

The vacuum eutectic stove that discloses at present, its sealed cavity has certain bottleneck in the design, often can't compromise heating and cooling simultaneously, and the leading reason is as follows:

in the prior art, the heating and cooling design of a vacuum eutectic furnace cavity mainly has two modes: the first is to heat the carrier plate by non-contact radiation heating, heat the welding element by the carrier plate, and then cool the carrier plate by air cooling; the second is to adopt a contact heating mode, a heating pipe and a cooling water pipe are embedded into the carrier plate at the same time, the carrier plate is heated by directly contacting the heating pipe with the carrier plate, and then the carrier plate is cooled by introducing cooling liquid. Both of the two methods have certain problems, namely the heating speed is high, but the cooling speed is slow due to air cooling; in the latter, because a heating pipe and a water pipe need to be embedded into a carrier plate at the same time, the carrier plate has a large size, a large heat load and a high requirement on the power of the heating pipe, and a problem is that cooling liquid in a contact type water cooling mode can remain in a cooling pipeline of the carrier plate, which affects the heating efficiency.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is as follows: in order to solve the problems that the heating and cooling of the vacuum eutectic furnace cavity in the prior art are not high in cooling efficiency or large in occupied volume and large in heat load, a sealed cavity for welding a semiconductor chip and a vacuum eutectic furnace comprising the sealed cavity for welding the semiconductor chip are provided.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a sealed cavity for semiconductor die bonding, comprising:

an upper cavity;

the lower cavity is arranged opposite to the upper cavity, and a sealed cavity is formed between the upper cavity and the lower cavity when the upper cavity and the lower cavity are closed;

the carrier plate assembly is arranged in the sealing cavity and used for placing a chip, and heating assemblies for heating the carrier plate assembly in a radiation mode are arranged above and below the carrier plate assembly;

and the cooling assembly is provided with a cooling pipe which penetrates through and is embedded and fixed in the carrier plate assembly and is used for introducing cooling liquid to cool the carrier plate assembly.

Adopt in this scheme to set up heating element respectively about the carrier plate subassembly, carry out non-contact radiant heating to it, provide high-efficient swift heating and even temperature distribution for chip and carrier plate, adopt cooling tube embedding carrier plate subassembly simultaneously, the direct contact cooling makes chip cooling rate improve greatly, under the certain prerequisite of power, has compromise heating and cooling performance simultaneously.

In order to prevent the problem that the cooling pipes are not tightly attached to the upper carrier plate and the lower carrier plate due to cold and hot deformation, the carrier plate assembly further comprises an upper carrier plate and a lower carrier plate positioned below the upper carrier plate, and the cooling pipes are distributed between the upper carrier plate and the lower carrier plate;

a plurality of elastic pressing and buckling assemblies are arranged between the upper carrier plate and the lower carrier plate and are used for elastically pressing the cooling pipe between the upper carrier plate and the lower carrier plate; therefore, the upper support plate and the lower support plate can be adjusted in a self-adaptive manner along with the cold and hot deformation of the cooling pipe under the action of elasticity, the cooling pipe is ensured to be tightly attached to the upper support plate and the lower support plate, the cooling efficiency is improved, and the service life is prolonged.

In order to realize the elastic compression of the cooling pipe, further, the elastic pressing and buckling assembly comprises an elastic expansion sleeve, a compression guide shaft and a fastener;

one of the upper support plate and the lower support plate is provided with a connecting hole, the other one of the upper support plate and the lower support plate is connected with a fastener, the elastic expansion sleeve is arranged in the connecting hole, one end of the compression guide shaft is provided with a pressure part, the other end of the compression guide shaft is inserted in the elastic expansion sleeve and connected with the fastener, and the fastener is used for driving the compression guide shaft to move along the direction far away from the connecting hole so that the pressure part compresses the elastic expansion sleeve to expand outwards along the radial direction, so that the elastic expansion sleeve is tensioned in the connecting hole.

In order to facilitate the pressing part to drive the elastic expansion sleeve to expand outwards along the radial direction, the cross-sectional area of the pressing part is further gradually reduced along the direction from the connecting hole to the fastening piece.

In order to improve the cooling rate, further, grooves matched with the cooling pipes are formed in the lower surface of the upper carrier plate and the upper surface of the lower carrier plate, and the cooling pipes are embedded in the grooves of the upper carrier plate and the lower carrier plate at the same time.

In order to improve the cooling rate, further, the cooling pipe has a plurality ofly, and the interval is arranged between last support plate and the lower support plate, the import and the feed liquor of cooling pipe are responsible for and are connected, the export of cooling pipe all is responsible for with going out the liquid and is connected.

Further, the both ends of cooling tube all extend to the outside of carrier plate subassembly to all downwarping forms the linkage segment, the linkage segment and the feed liquor of the entrance point of cooling tube are responsible for and are connected, the linkage segment and the play liquid of the exit end of cooling tube are responsible for and are connected.

In order to solve the problem that the cooling liquid in the cooling pipe influences the heating efficiency, furtherly, still including the feed liquor subassembly of blowing, the feed liquor subassembly of blowing includes the feed liquor pipe, the one end and the feed liquor of feed liquor pipe are responsible for the intercommunication, and the one-way intercommunication of the other end has blowing joint and feed liquor joint.

In order to facilitate assembly and improve heating uniformity, the heating assembly further comprises a plurality of heating pipes which are arranged at intervals, and the heating pipes of the heating assembly in the upper cavity and the heating pipes of the heating assembly in the lower cavity are distributed in a crossed manner;

the upper cavity is provided with an upper inner cavity with a downward opening, a heating pipe of the heating component in the upper cavity penetrates through the upper inner cavity, and two ends of the heating pipe are fixedly connected with the upper cavity in a sealing manner;

the lower cavity is provided with a lower inner cavity with an upward opening, a heating pipe of the heating component in the lower cavity penetrates through the upper inner cavity, two ends of the heating pipe are fixedly connected with the lower cavity in a sealing mode, and the support plate component is fixed in the lower inner cavity.

In order to facilitate later maintenance of the heating pipe and prolong the service life of the heating pipe, further, the heating pipe is provided with a heating area and non-heating areas positioned at two ends of the heating area;

the heating area of the heating pipe in the upper cavity is positioned in the upper inner cavity, and the non-heating area of the heating pipe in the upper cavity is positioned outside the upper inner cavity; the heating zone of the heating pipe in the lower cavity body is positioned in the lower inner cavity, and the non-heating zone of the heating pipe in the lower cavity body is positioned outside the lower inner cavity.

In order to improve the heating efficiency and the safety, an upper heat insulation assembly is further arranged above the heating assembly in the upper cavity, the upper heat insulation assembly comprises an upper heat insulation seat fixedly connected with the upper cavity and an upper light reflecting plate fixedly connected with the upper heat insulation seat, and the upper light reflecting plate is positioned between the upper heat insulation seat and the heating assembly of the upper cavity;

the lower cavity is provided with a lower heat insulation assembly below the heating assembly, the lower heat insulation assembly comprises a lower heat insulation seat fixedly connected with the lower cavity and a lower light reflecting plate fixedly connected with the lower heat insulation seat, and the lower light reflecting plate is located between the lower heat insulation seat and the heating assembly of the lower cavity.

In order to improve the welding efficiency, a process air inlet assembly is arranged in the sealing cavity, a plurality of air distribution holes used for introducing process atmosphere into the sealing cavity are formed in the process air inlet assembly, and the air distribution holes are located above the carrier plate assembly.

In order to realize automatic opening and closing, the automatic opening and closing device further comprises a driving device, the upper cavity is hinged with the lower cavity, and the driving device is used for driving the upper cavity and the lower cavity to rotate to open and close.

The utility model also provides a vacuum eutectic furnace which comprises the sealed cavity for welding the semiconductor chip.

The utility model has the beneficial effects that: the sealed cavity for welding the semiconductor chip is provided with the heating assemblies respectively arranged above and below the carrier plate assembly, non-contact radiation heating is carried out on the heating assemblies, efficient and rapid heating and uniform temperature distribution are provided for the chip and the carrier plate, meanwhile, the cooling pipe is embedded into the carrier plate assembly and is directly contacted for cooling, the cooling speed of the chip is greatly improved, and the heating and cooling performances are considered on the premise of certain power.

Drawings

The utility model is further illustrated with reference to the following figures and examples.

FIG. 1 is a three-dimensional view of a sealed cavity for semiconductor die bonding of the present invention in an open state;

FIG. 2 is a cross-sectional view of the sealed housing for semiconductor die bonding of the present invention in an open state;

FIG. 3 is a cross-sectional view of the sealed housing for semiconductor die bonding of the present invention in a closed state;

FIG. 4 is an exploded view of the carrier plate assembly of the present invention mated with a cooling assembly;

FIG. 5 is a three-dimensional schematic view of a carrier plate assembly of the present invention mated with a cooling assembly;

FIG. 6 is a schematic cross-sectional view of a carrier plate assembly of the present invention mated with a cooling assembly;

FIG. 7 is an enlarged partial view of A in FIG. 6;

FIG. 8 is a three-dimensional view of the compression guide shaft of the present invention in cooperation with the resilient sleeve;

FIG. 9 is a three-dimensional view of the elastic expansion sleeve of the present invention;

FIG. 10 is a three-dimensional schematic view of the liquid inlet aeration assembly of the present invention;

FIG. 11 is a schematic view of a heating tube of the present invention;

FIG. 12 is a three-dimensional schematic view of a heating tube of the present invention installed in an upper chamber;

FIG. 13 is a schematic view of a viewing window assembly of the present invention;

FIG. 14 is a schematic bottom view of the heating tube of the present invention installed in the upper chamber;

FIG. 15 is a schematic sectional view taken along line B-B in FIG. 14;

FIG. 16 is an enlarged partial view of C of FIG. 15;

FIG. 17 is a three-dimensional schematic view of a heating tube of the present invention installed in a lower chamber;

FIG. 18 is a schematic top view of a heating tube of the present invention installed in a lower chamber;

FIG. 19 is a schematic sectional view taken along line D-D in FIG. 18;

FIG. 20 is an enlarged partial schematic view of E in FIG. 19;

fig. 21 is a three-dimensional schematic view of a vacuum control assembly of the present invention.

In the figure: 1. 1-1 parts of an upper cavity, 1-2 parts of an upper inner cavity, 1-3 parts of an upper heat insulation seat and an upper reflector;

2. the light source comprises a lower cavity, 2-1, a lower inner cavity, 2-2, a lower heat insulation seat, 2-3, a lower reflector, 2-4 and a cavity sealing ring;

3. a carrier plate assembly; 3-1, an upper carrier plate, 3-2, a lower carrier plate, 3-3 and a groove;

4. heating pipe 4-1, heating zone 4-2, non-heating zone;

5. 5-1 parts of a cooling component, 5-11 parts of a cooling pipe, 5-2 parts of a connecting section, 5-3 parts of a liquid inlet main pipe and 5-3 parts of a liquid outlet main pipe;

6. 6-1 parts of an elastic pressing and buckling component, 6-11 parts of an elastic expansion sleeve, 6-2 parts of a notch, 6-21 parts of a pressing guide shaft, 6-22 parts of a pressing part, 6-3 parts of a threaded hole, 6-4 parts of a fastening piece and a connecting hole;

7. the liquid inlet and air blowing assembly comprises 7-1 parts of a liquid inlet pipe, 7-2 parts of an air blowing joint, 7-3 parts of a liquid inlet joint, 7-4 parts of a one-way valve, 7-5 parts of a three-way pipe;

8. 8-1 parts of a process air inlet assembly and air distribution holes;

9. 9-1 parts of a sealing assembly, 9-11 parts of a first sealing seat, 9-2 parts of a sealing groove, 9-3 parts of a first sealing ring, 9-4 parts of a second sealing seat and a second sealing ring;

10. the device comprises an observation window assembly 10-1, a window base 10-2, a buffer gasket 10-3, window glass 10-4 and a third sealing ring;

11. the vacuum control assembly comprises 11-1 parts of a vacuum pipeline 11-2 parts of a vacuum pressure sensor 11-3 parts of a vacuum baffle valve;

12. sealing the cavity;

13. a drive device.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic diagrams illustrating the basic structure of the present invention only in a schematic manner, and thus show only the constitution related to the present invention, and directions and references (e.g., upper, lower, left, right, etc.) may be used only to help the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.

As shown in fig. 1-21, a sealed housing for semiconductor die bonding, comprising:

an upper cavity 1;

a lower cavity 2 arranged opposite to the upper cavity 1, the upper cavity 1 and the lower cavity 2 forming a sealed cavity 12 when closed, as shown in fig. 3;

a carrier plate assembly 3 arranged in the sealed cavity 12 for placing a chip, wherein heating assemblies for radiation heating are arranged above and below the carrier plate assembly 3;

and a cooling assembly 5 which is provided with a cooling pipe 5-1 which penetrates through and is embedded and fixed in the carrier plate assembly 3 and is used for introducing cooling liquid to cool the carrier plate assembly 3.

Regarding the specific structure of the carrier board assembly 3:

as shown in fig. 4-6, the carrier plate assembly 3 includes an upper carrier plate 3-1 and a lower carrier plate 3-2 thereunder, and cooling pipes 5-1 are distributed between the upper carrier plate 3-1 and the lower carrier plate 3-2, thereby facilitating manufacturing and assembly; on the basis, in order to prevent the problem that the cooling pipe 5-1 is not tightly attached to the upper carrier plate 3-1 and the lower carrier plate 3-2 due to cold and hot deformation, in the embodiment, a plurality of elastic pressing and buckling assemblies 6 are arranged between the upper carrier plate 3-1 and the lower carrier plate 3-2, and the elastic pressing and buckling assemblies 6 are used for elastically pressing the cooling pipe 5-1 between the upper carrier plate 3-1 and the lower carrier plate 3-2; therefore, the upper carrier plate 3-1 and the lower carrier plate 3-2 can be adjusted in a self-adaptive manner along with the cold and hot deformation of the cooling pipe 5-1 under the action of elasticity, the cooling pipe 5-1 is ensured to be tightly attached to the upper carrier plate 3-1 and the lower carrier plate 3-2, the cooling efficiency is improved, and the service life is prolonged.

As shown in fig. 7-8, the elastic press-fastening component 6 comprises an elastic expansion sleeve 6-1, a pressing guide shaft 6-2 and a fastener 6-3; one of the upper carrier plate 3-1 and the lower carrier plate 3-2 is provided with a connecting hole 6-4, the other is connected with a fastening piece 6-3, the elastic expansion sleeve 6-1 is arranged in the connecting hole 6-4, one end of the pressing guide shaft 6-2 is provided with a pressing part 6-21, the other end is inserted in the elastic expansion sleeve 6-1 and is connected with the fastening piece 6-3, and the fastening piece 6-3 is used for driving the pressing guide shaft 6-2 to move along the direction far away from the connecting hole 6-4 so that the pressing part 6-21 presses the elastic expansion sleeve 6-1 to expand outwards along the radial direction, so that the elastic expansion sleeve 6-1 is tensioned in the connecting hole 6-4;

that is to say, the connecting hole 6-4 can be arranged on the lower surface of the upper carrier plate 3-1, and the fastener 6-3 is connected on the lower carrier plate 3-2; or the connecting hole 6-4 can be arranged on the upper surface of the lower carrier plate 3-2, the fastening piece 6-3 is connected on the upper carrier plate 3-1, taking the connecting hole 6-4 arranged on the lower carrier plate 3-2 as an example, the pressing part 6-21 is arranged at the upper end of the pressing guide shaft 6-2, the lower end of the pressing guide shaft 6-2 is inserted in the elastic expansion sleeve 6-1 and is connected with one end of the fastening piece 6-3, the other end of the fastening piece 6-3 is connected with the lower carrier plate 3-2, when the fastening piece 6-3 drives the pressing guide shaft 6-2 to move downwards, the pressing part 6-21 presses the elastic expansion sleeve 6-1 to expand outwards along the radial direction, so as to tightly tension the elastic expansion sleeve 6-1 in the connecting hole 6-4; in the embodiment, the fastening piece 6-3 can be a screw, a threaded hole 6-22 is formed in the pressing guide shaft 6-2, a threaded end of the screw is in threaded connection with the threaded hole 6-22, a nut of the screw abuts against the lower surface of the lower carrier plate 3-2, the pressing guide shaft 6-2 gradually moves downwards when the screw is screwed, and the outer diameter of the elastic expansion sleeve 6-1 is gradually enlarged in the process, so that the upper carrier plate 3-1 and the lower carrier plate 3-2 are fixedly connected, and cold and hot deformation of the cooling pipe 5-1 can be counteracted;

in this embodiment, the cross-sectional area of the pressing portion 6-21 is gradually reduced along the direction from the connecting hole 6-4 to the fastening member 6-3, which is beneficial for the pressing portion 6-21 to drive the elastic expansion sleeve 6-1 to expand outward along the radial direction, the pressing portion 6-21 may be a revolving body, a generatrix of the revolving body is inclined inward from top to bottom, for example, as shown in fig. 8, when the generatrix is an oblique line, the pressing portion 6-21 is in a conical shape; in order to further facilitate the outward expansion of the elastic expansion sleeve 6-1, as shown in fig. 8, a plurality of notches 6-11 are distributed at intervals at one end part of the elastic expansion sleeve 6-1 close to the pressing part 6-21.

As shown in fig. 4 and 7, in the present embodiment, grooves 3-3 matching with the cooling pipes 5-1 are formed on both the lower surface of the upper carrier plate 3-1 and the upper surface of the lower carrier plate 3-2, and the cooling pipes 5-1 are embedded in the grooves 3-3 of the upper carrier plate 3-1 and the lower carrier plate 3-2, so as to increase the contact area between the cooling pipes 5-1 and the carrier plate assembly 3, thereby improving the cooling efficiency.

Regarding the specific structure of the cooling module 5:

as shown in fig. 4, a plurality of cooling pipes 5-1 are arranged between the upper carrier plate 3-1 and the lower carrier plate 3-2 at intervals, the inlets of the cooling pipes 5-1 are connected with the liquid inlet main pipe 5-2, and the outlets of the cooling pipes 5-1 are connected with the liquid outlet main pipe 5-3; the advantages of this structure are: the cooling liquid is divided into a plurality of paths which are simultaneously fed in and discharged out, and the part of the cooling pipe 5-1 between the upper carrier plate 3-1 and the lower carrier plate 3-2 is preferably in a straight pipe shape; compared with the design of one or two snakelike cooling pipes 5-1 in the prior art, the scheme has the advantages that the on-way resistance of the pipeline is small, the flow is large, and the cooling speed is higher and more uniform; in this embodiment, the cooling tubes 5-1 may be arranged in parallel and equally spaced between the upper carrier plate 3-1 and the lower carrier plate 3-2.

As shown in fig. 5, both ends of the cooling pipe 5-1 extend to the outside of the carrier plate assembly 3 and are bent downward to form a connecting section 5-11, the connecting section 5-11 at the inlet end of the cooling pipe 5-1 is connected with the liquid inlet main pipe 5-2, and the connecting section 5-11 at the outlet end of the cooling pipe 5-1 is connected with the liquid outlet main pipe 5-3.

As shown in the figures 3 and 10, the device also comprises a liquid inlet and air blowing assembly 7, wherein the liquid inlet and air blowing assembly 7 comprises a liquid inlet pipe 7-1, one end of the liquid inlet pipe 7-1 is communicated with a liquid inlet main pipe 5-2, and the other end is communicated with an air blowing joint 7-2 and a liquid inlet joint 7-3 in a one-way manner; the liquid inlet and air blowing assembly 7 can feed cooling liquid into the cooling pipe 5-1 on one hand, and can empty the cooling liquid in the cooling pipe 5-1 on the other hand, so that the heating efficiency of the carrier plate assembly 3 is not influenced; in this embodiment, the liquid inlet pipe 7-1 may specifically adopt a three-way pipe 7-5 connecting the air blowing joint 7-2 and the liquid inlet joint 7-3, a first end of the three-way pipe 7-5 is connected with the liquid inlet pipe 7-1, a second end of the three-way pipe 7-5 is connected with the air blowing joint 7-2 through a one-way valve 7-4 to prevent the fluid in the liquid inlet pipe 7-1 from flowing out of the liquid inlet joint 7-3, and a third end of the three-way pipe 7-5 is connected with the air blowing joint 7-2 through the one-way valve 7-4 to prevent the fluid in the liquid inlet pipe 7-1 from flowing out of the air blowing joint 7-2, so as to ensure that the cooling liquid or gas flows in a designated direction and path during respective operations.

Regarding the structure of the heating assembly:

as shown in fig. 2, the heating assembly includes a plurality of heating pipes 4 arranged at intervals, and the heating pipes 4 of the heating assembly in the upper cavity 1 and the heating pipes 4 of the heating assembly in the lower cavity 2 are distributed in a cross manner, preferably in a vertical manner, so as to improve the uniformity of heating;

as shown in fig. 12-16, the upper chamber 1 has an upper inner chamber 1-1 with a downward opening, the heating tube 4 of the heating assembly in the upper chamber 1 passes through the upper inner chamber 1-1, and both ends of the heating tube 4 are fixedly connected with the upper chamber 1 through the sealing assemblies 9;

as shown in fig. 17-20, the lower cavity 2 has a lower inner cavity 2-1 with an upward opening, the heating tube 4 of the heating assembly in the lower cavity 2 passes through the lower inner cavity 2-1, and both ends of the heating tube 4 are respectively fixedly connected with the lower cavity 2 in a sealing manner through a sealing assembly 9, and the carrier plate assembly 3 is fixed in the lower inner cavity 2-1; the sealing assembly 9 may specifically comprise; a first sealing seat 9-1, a first sealing ring 9-2, a second sealing seat 9-3 and a second sealing ring 9-4, the end part of the heating pipe 4 passes through the first sealing seat 9-1 and the second sealing seat 9-3, the second sealing seat 9-3 is positioned at the outer side of the first sealing seat 9-1, and detachably fixed on the first sealing seat 9-1, a sealing groove 9-11 for embedding the second sealing ring 9-4 is arranged on the second sealing seat 9-3, the second sealing ring 9-4 is pressed between the first sealing seat 9-1 and the second sealing seat 9-3, and the second sealing ring 9-4 embraces the heating pipe 4 tightly, and the second sealing seat 9-3 is fixed at the outer side of the corresponding upper cavity 1 or lower cavity 2 and is pressed on the outer side wall of the corresponding upper cavity 1 or lower cavity 2.

As shown in FIG. 11, the heating tube 4 has a heating zone 4-1 and non-heating zones 4-2 at both ends of the heating zone 4-1; a heating zone 4-1 of the heating pipe 4 in the upper cavity 1 is positioned in the upper inner cavity 1-1, and a non-heating zone 4-2 of the heating pipe 4 in the upper cavity 1 passes through the corresponding sealing component 9 and extends out of the upper inner cavity 1-1; a heating area 4-1 of the heating pipe 4 in the lower cavity 2 is positioned in the lower inner cavity 2-1, and a non-heating area 4-2 of the heating pipe 4 in the lower cavity 2 penetrates through the corresponding sealing assembly 9 and extends out of the upper inner cavity 1-1; according to the structure, on one hand, when the heating pipe 4 is installed and replaced, sealing fixation and wiring are carried out outside the upper cavity 1 and the lower cavity 2, operation is very convenient, on the other hand, the non-heating area 4-2 is arranged at the sealing connection position of the upper cavity 1 or the lower cavity 2 and is positioned at the outer sides of the upper cavity 1 and the lower cavity 2, temperature is low, oxide corrosion does not exist, and the service life of the heating pipe 4 is prolonged;

regarding the structure of the upper and lower chambers 1 and 2:

in order to improve the heating efficiency and the safety, an upper heat insulation assembly is arranged above the heating assembly in the upper cavity 1, the upper heat insulation assembly comprises an upper heat insulation seat 1-2 fixedly connected with the upper cavity 1 and an upper light reflecting plate 1-3 fixedly connected on the upper heat insulation seat 1-2, and the upper light reflecting plate 1-3 is positioned between the upper heat insulation seat 1-2 and the heating assembly of the upper cavity 1; specifically, the lower end of the upper heat insulation seat 1-2 can be of an upward concave groove structure, corresponding upper reflecting plates 1-3 are laid at the bottom of the groove and the peripheral side walls of the lower end of the upper heat insulation seat 1-2, and the upper reflecting plates 1-3 are used for blocking and reflecting light rays of the heating pipe 4, so that the heat of the heating pipe 4 is more concentrated, and the heating efficiency of the heating component in the upper cavity 1 to the support plate component 3 is improved;

as shown in fig. 13, an observation window assembly 10 is arranged on the outer side of the top of the upper cavity 1, observation holes are formed in the upper cavity 1, the upper heat insulation seat 1-2 and the upper reflector 1-3, the observation holes of the upper cavity 1, the observation holes of the upper heat insulation seat 1-2 and the observation holes of the upper reflector 1-3 are coaxially arranged, the observation window assembly 10 comprises a window base 10-1, a buffer gasket 10-2, window glass 10-3 and a third seal ring 10-4, the window base 10-1 compresses the window glass 10-3, and the third seal ring 10-4 is compressed on the top of the upper cavity 1 to realize sealing, the window glass 10-3 is opposite to the observation holes, and the buffer gasket 10-2 is arranged between the window base 10-1 and the window glass 10-3 to play a role in buffering;

a lower heat insulation assembly is arranged below the heating assembly in the lower cavity 2, the lower heat insulation assembly comprises a lower heat insulation seat 2-2 fixedly connected with the lower cavity 2 and a lower reflector 2-3 fixedly connected on the lower heat insulation seat 2-2, and the lower reflector 2-3 is positioned between the lower heat insulation seat 2-2 and the heating assembly of the lower cavity 2; specifically, the upper end of the lower heat insulation seat 2-2 can be of a downward-sunken groove structure, corresponding lower reflecting plates 2-3 are laid at the bottom and the peripheral side walls of the groove at the upper end of the upper heat insulation seat 1-2, and the lower reflecting plates 2-3 are used for blocking and reflecting light rays of the heating pipe 4, so that the heat of the heating pipe 4 is more concentrated, and the heating efficiency of the heating component in the lower cavity 2 to the support plate component 3 is improved; the upper heat insulation seat 1-2, the upper reflector 1-3, the lower heat insulation seat 2-2 and the lower reflector 2-3 are correspondingly provided with hole or groove structures for the heating pipe 4 to pass through.

The lower cavity 2 is provided with a liquid inlet, a liquid outlet, a process gas interface and a vacuum-pumping port;

the liquid inlet is connected with the liquid inlet structure, and the liquid outlet is connected with the liquid outlet header pipe;

as shown in fig. 1, the process gas interface is connected to an inlet of the process gas inlet assembly 8, the process gas inlet assembly 8 is disposed in the sealed cavity 12, the inlet of the process gas inlet assembly 8 is connected to the process gas interface, the process gas inlet assembly 8 is provided with a plurality of gas distribution holes 8-1 for introducing process atmosphere into the sealed cavity 12, and the gas distribution holes 8-1 are located above the carrier plate assembly 3; the process gas inlet components 8 are not less than two groups, one group is used for introducing mixed gas containing formic acid, and the other group is used for introducing other process gases; compared with the technical scheme that the air distribution holes 8-1 of the process air inlet assembly 8 are positioned below the carrier plate in the prior art, the scheme that the air distribution holes 8-1 of the process air inlet assembly 8 are positioned above the carrier plate assembly 3 has good diffusion speed and distribution effect of process atmosphere, and the reason is that: the chip is placed on the upper surface of the carrier plate assembly 3 for welding, the process gas inlet assembly 8 is arranged above the carrier plate assembly 3, and gas can directly act on the welding part of the chip after entering the sealing cavity 12 from the gas distribution hole 8-1 without completely distributing the sealing cavity 12 around the bottom of the carrier plate assembly 3 and the like for further acting;

as shown in fig. 21, the vacuum pumping port is communicated with the sealed cavity 12 and is hermetically connected with the vacuum control assembly 11, the vacuum control assembly 11 comprises a vacuum pipeline 11-1, a vacuum pressure sensor 11-2 and a vacuum flapper valve 11-3 which are arranged in series, the vacuum pumping port is connected with a vacuum pump, the vacuum pressure sensor 11-2 is used for detecting the pressure of the sealed cavity 12, and the vacuum flapper valve 11-3 is used for controlling the on-off of the sealed cavity 12;

as shown in fig. 1-3, the present embodiment further includes a driving device 13, the upper cavity 1 is hinged to the lower cavity 2, the driving device 13 is configured to drive the upper cavity 1 and the lower cavity 2 to rotate to open and close, when the upper cavity 1 and the lower cavity 2 are closed, a sealing cavity 12 is formed between the upper cavity 1-1 and the lower cavity 2-1, in order to improve the sealing effect, a sealing groove 3-3 is provided on the upper end surface of the lower cavity 2, a cavity sealing ring 2-4 is installed in the sealing groove 3-3, and when the upper cavity 1 and the lower cavity 2 are closed, the cavity sealing ring 2-4 is pressed to ensure the sealing performance of the sealing cavity 12; the sealing groove 3-3 can be a trapezoid sealing groove, and the fixing and sealing effects on the cavity sealing ring 2-4 are better than those of the trapezoid sealing groove; in this embodiment, the driving device 13 may specifically adopt a linear reciprocating mechanism such as an air cylinder and an electric push rod, taking the electric push rod as an example, one end of the electric push rod is hinged to the upper cavity 1, and the other end is hinged to the lower cavity 2, and a sensor may be installed on a side surface of the upper cavity 1 or the lower cavity 2 to detect whether the upper cavity 1 and the lower cavity 2 are closed in place;

when the sealed cavity for welding the semiconductor chip in the embodiment works, the chip to be welded is firstly placed on the upper end surface of an upper support plate 3-1, an electric push rod drives the upper cavity 1 and a lower cavity 2 to be automatically closed and sealed, then the vacuum pumping is carried out, a heating pipe 4 is opened, different process atmospheres, heating temperature parameters and action flows are set according to different process requirements in the process until the welding is finished, the heating pipe 4 stops heating, cooling liquid is introduced into a cooling pipe 5-1 to rapidly cool a support plate component 3, so that the chip is rapidly cooled, compressed air is introduced from an air blowing connector 7-2 after the cooling is finished, residual cooling liquid in the cooling pipe 5-1 is discharged, and the flow is finished, so that the sealed cavity for welding the semiconductor chip, provided by the utility model, has the advantages of simple heating and cooling structure, convenience in installation and non-contact radiation heating, the chip and the carrier plate component 3 are efficiently and quickly heated and uniformly distributed, and meanwhile, a plurality of groups of cooling pipes 5-1 connected in parallel are embedded into the carrier plate component 3 to be directly contacted and cooled, so that the cooling speed of the chip is greatly improved, and the heating and cooling performances are considered on the premise of certain power.

Example 2

The utility model also provides a vacuum eutectic furnace, which comprises the sealed cavity for welding the semiconductor chip in the embodiment 1.

In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the utility model. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (14)

1. A sealed cavity for semiconductor chip welding is characterized in that: the method comprises the following steps:

an upper chamber (1);

the lower cavity (2) is arranged opposite to the upper cavity (1), and a sealing cavity (12) is formed between the upper cavity (1) and the lower cavity (2) when the upper cavity and the lower cavity are closed;

the carrier plate assembly (3) is arranged in the sealed cavity (12) and used for placing a chip, and heating assemblies for heating the carrier plate assembly in a radiation mode are arranged above and below the carrier plate assembly (3);

and the cooling assembly (5) is provided with a cooling pipe (5-1) which penetrates through and is embedded and fixed in the carrier plate assembly (3) and is used for introducing cooling liquid to cool the carrier plate assembly (3).

2. The sealed cavity for semiconductor die bonding according to claim 1, wherein: the carrier plate assembly (3) comprises an upper carrier plate (3-1) and a lower carrier plate (3-2) positioned below the upper carrier plate, and the cooling pipes (5-1) are distributed between the upper carrier plate (3-1) and the lower carrier plate (3-2);

a plurality of elastic pressing and buckling assemblies (6) are arranged between the upper carrier plate (3-1) and the lower carrier plate (3-2), and the elastic pressing and buckling assemblies (6) are used for elastically pressing the cooling pipe (5-1) between the upper carrier plate (3-1) and the lower carrier plate (3-2).

3. The sealed cavity for semiconductor die bonding as claimed in claim 2, wherein: the elastic pressing and buckling component (6) comprises an elastic expansion sleeve (6-1), a pressing guide shaft (6-2) and a fastening piece (6-3);

one of the upper support plate (3-1) and the lower support plate (3-2) is provided with a connecting hole (6-4), the other one of the upper support plate and the lower support plate is connected with a fastening piece (6-3), the elastic expansion sleeve (6-1) is arranged in the connecting hole (6-4), one end of the pressing guide shaft (6-2) is provided with a pressing part (6-21), the other end of the pressing guide shaft is inserted in the elastic expansion sleeve (6-1) and connected with the fastening piece (6-3), and the fastening piece (6-3) is used for driving the pressing guide shaft (6-2) to move along the direction far away from the connecting hole (6-4) so that the pressing part (6-21) presses the elastic expansion sleeve (6-1) to expand outwards along the radial direction, so that the elastic expansion sleeve (6-1) is tensioned in the connecting hole (6-4).

4. The sealed cavity for semiconductor die bonding according to claim 3, wherein: the cross section area of the pressing part (6-21) is gradually reduced along the direction from the connecting hole (6-4) to the fastening piece (6-3).

5. The sealed cavity for semiconductor die bonding according to claim 2, wherein: grooves (3-3) matched with the cooling pipes (5-1) are formed in the lower surface of the upper carrier plate (3-1) and the upper surface of the lower carrier plate (3-2), and the cooling pipes (5-1) are embedded into the grooves (3-3) of the upper carrier plate (3-1) and the grooves (3-3) of the lower carrier plate (3-2) at the same time.

6. The sealed cavity for semiconductor die bonding according to claim 1, wherein: the cooling pipes (5-1) are arranged between the upper carrier plate (3-1) and the lower carrier plate (3-2) at intervals, inlets of the cooling pipes (5-1) are connected with the liquid inlet main pipe (5-2), and outlets of the cooling pipes (5-1) are connected with the liquid outlet main pipe (5-3).

7. The sealed cavity for semiconductor die bonding according to claim 6, wherein: the two ends of the cooling pipe (5-1) extend to the outside of the plate loading component (3) and are bent downwards to form connecting sections (5-11), the connecting section (5-11) at the inlet end of the cooling pipe (5-1) is connected with the liquid inlet main pipe (5-2), and the connecting section (5-11) at the outlet end of the cooling pipe (5-1) is connected with the liquid outlet main pipe (5-3).

8. The sealed cavity for semiconductor die bonding according to claim 6, wherein: the liquid inlet blowing device is characterized by further comprising a liquid inlet blowing assembly (7), wherein the liquid inlet blowing assembly (7) comprises a liquid inlet pipe (7-1), one end of the liquid inlet pipe (7-1) is communicated with the liquid inlet main pipe (5-2), and the other end of the liquid inlet pipe is communicated with a blowing connector (7-2) and a liquid inlet connector (7-3) in a one-way mode.

9. The sealed cavity for semiconductor die bonding according to claim 1, wherein: the heating assembly comprises a plurality of heating pipes (4) which are arranged at intervals, and the heating pipes (4) of the heating assembly in the upper cavity (1) and the heating pipes (4) of the heating assembly in the lower cavity (2) are distributed in a crossed manner;

the upper cavity (1) is provided with an upper inner cavity (1-1) with a downward opening, a heating pipe (4) of a heating component in the upper cavity (1) penetrates through the upper inner cavity (1-1), and two ends of the heating pipe (4) are fixedly connected with the upper cavity (1) in a sealing manner;

the lower cavity (2) is provided with a lower inner cavity (2-1) with an upward opening, a heating pipe (4) of the heating component in the lower cavity (2) penetrates through the lower inner cavity (2-1), two ends of the heating pipe (4) are fixedly connected with the lower cavity (2) in a sealing manner, and the support plate component (3) is fixed in the lower inner cavity (2-1).

10. The sealed cavity for semiconductor die bonding according to claim 9, wherein: the heating pipe (4) is provided with a heating area (4-1) and non-heating areas (4-2) positioned at two ends of the heating area (4-1);

the heating area (4-1) of the heating pipe (4) in the upper cavity (1) is positioned in the upper inner cavity (1-1), and the non-heating area (4-2) of the heating pipe (4) in the upper cavity (1) is positioned outside the upper inner cavity (1-1); the heating area (4-1) of the heating pipe (4) in the lower cavity (2) is positioned in the lower inner cavity (2-1), and the non-heating area (4-2) of the heating pipe (4) in the lower cavity (2) is positioned outside the lower inner cavity (2-1).

11. The sealed cavity for semiconductor die bonding as claimed in claim 9, wherein: an upper heat insulation assembly is arranged above the heating assembly in the upper cavity (1), the upper heat insulation assembly comprises an upper heat insulation seat (1-2) fixedly connected with the upper cavity (1) and an upper light reflecting plate (1-3) fixedly connected on the upper heat insulation seat (1-2), and the upper light reflecting plate (1-3) is positioned between the upper heat insulation seat (1-2) and the heating assembly of the upper cavity (1);

the lower heat insulation assembly is arranged below the heating assembly in the lower cavity (2), the lower heat insulation assembly comprises a lower heat insulation seat (2-2) fixedly connected with the lower cavity (2) and a lower light reflecting plate (2-3) fixedly connected to the lower heat insulation seat (2-2), and the lower light reflecting plate (2-3) is located between the lower heat insulation seat (2-2) and the heating assembly of the lower cavity (2).

12. The sealed cavity for semiconductor die bonding according to claim 1, wherein: a process air inlet assembly (8) is arranged in the sealed cavity (12), a plurality of air distribution holes (8-1) used for introducing process atmosphere into the sealed cavity (12) are formed in the process air inlet assembly (8), and the air distribution holes (8-1) are located above the carrier plate assembly (3).

13. The sealed cavity for semiconductor die bonding according to claim 1, wherein: still include drive arrangement (13), it is articulated with lower cavity (2) to go up cavity (1), drive arrangement (13) are used for driving cavity (1) and lower cavity (2) rotatory opening and shutting down.

14. A vacuum eutectic furnace is characterized in that; comprising a sealed cavity for semiconductor chip bonding as claimed in any one of claims 1 to 13.

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