CN113099706B - Loop heat pipe suitable for heat dissipation of flexible device, working method and heat dissipation device - Google Patents
Loop heat pipe suitable for heat dissipation of flexible device, working method and heat dissipation device Download PDFInfo
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Abstract
The invention discloses a loop heat pipe suitable for heat dissipation of a flexible device, a working method and a heat dissipation device, which solve the problem of poor heat dissipation effect of the flexible device in the prior art and have the beneficial effect of effectively ensuring the heat dissipation of the flexible device, and the specific scheme is as follows: a loop heat pipe suitable for heat dissipation of a flexible device comprises a loop heat pipe module, a heat pipe module and a heat pipe module, wherein the loop heat pipe module comprises a condensing plate and a bottom plate, the condensing plate and the bottom plate are arranged oppositely, an evaporation collecting pipe is supported by the bottom plate, working liquid flows in the evaporation collecting pipe, the evaporation collecting pipe comprises a plurality of circles, two adjacent circles of evaporation collecting pipes are communicated through a working liquid pipeline, and the condensing plate and the evaporation collecting pipe are communicated through a working liquid steam pipeline and a return pipe; the cooling module is internally provided with cooling water, the cooling module is arranged on one side of the loop heat pipe and is in contact with the condensing plate, the steam pipeline is used for steam to flow, and the return pipe is used for returning the steam to the evaporation collecting pipe after the steam is converted into liquid by the condensing plate.
Description
Technical Field
The invention relates to the field of heat dissipation of flexible devices, in particular to a loop heat pipe suitable for heat dissipation of a flexible device, a working method and a heat dissipation device.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
After hundreds of years of development, rigid electronic devices become the basis of the electronic information and communication industry, however, the limitation of rigid electronic devices is increasingly influenced by moore's law, and the rise of flexible electronic technology provides a new direction for the revolution of classical electronics. Professor Baozhinun, academy of American national institute of engineering, Baozhini, states that flexible electronic equipment will change the future of the electronic field and completely subvert human life style, and flexible devices are the main embodiment of flexible electronic technology. The flexible device is an organic or inorganic electronic device manufactured on the flexible substrate, has a wider application prospect compared with the traditional rigid device, can fully meet the curved surface deformation requirement of equipment or application environment, is partially commercialized and revolutionarily changes the life style of people. The electronic skin integrated with various flexible sensors can realize the skin-like touch function and help the artificial limb to realize the sensing capability; the flexible wearable device can realize remote health monitoring, and provides a new treatment recovery means for complex diseases such as heart diseases, epilepsy and the like; the flexible artificial nerve form chip can simulate the learning and calculating activities of human brains, thereby meeting the hardware requirements of artificial intelligence algorithms.
However, the characteristics of stretchability and bendability have also restricted the development of flexible devices. In the last decade, the size of the flexible device is continuously reduced, the power density is rapidly increased, a large amount of heat accumulation adversely affects the reliable operation of the flexible device, especially, the application of an organic semiconductor in the flexible device occupies a certain proportion, due to the intrinsic sensitivity of the organic semiconductor to temperature, the smaller temperature rise can cause the great reduction of the carrier transport capacity, the timely transfer of the heat of the flexible device is very important, and the heat dissipation becomes one of the key problems restricting the future miniaturization and integration of the flexible device.
The loop heat pipe technology is an efficient heat dissipation means, and is widely applied to heat dissipation of various types of equipment in various fields. At present, the heat dissipation of the miniature electronic equipment mainly transfers heat at a heat production position through a metal heat pipe, when the miniature electronic equipment is applied to the field of flexible devices, particularly wearable equipment, an application place possibly bears pressure from all places and generates different curved surfaces at the same time, and at the moment, the traditional rigid loop heat pipe can be bent to reduce the heat dissipation efficiency or damage and damage the flexible equipment, so that the failure of the devices or fire is caused.
The inventor finds that the heat dissipation of the conventional flexible device equipment is realized by adding an insulating high-heat-conduction material to conduct generated joule heat to the flexible substrate, however, the gradual increase of the ambient temperature still reduces the operational reliability of the flexible device, and the heat dissipation effect of the flexible device is poor.
And some flexible devices that have special effect usually distribute comparatively loosely, for example some flexible induction elements for health detection distribute to accord with concrete monitoring position, and it is loaded down with trivial details not only the process of additional a plurality of cooling device, also can greatly increase the energy consumption.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide the loop heat pipe suitable for heat dissipation of the flexible device, which can effectively ensure the heat exchange area of the loop heat pipe and is beneficial to improving the heat dissipation effect of the flexible device.
In order to achieve the purpose, the invention is realized by the following technical scheme:
a loop heat pipe adapted to dissipate heat from a flexible device, comprising:
the loop heat pipe module comprises a condensing plate and a bottom plate, wherein the condensing plate and the bottom plate are arranged oppositely, evaporation collecting pipes are supported by the bottom plate, working liquid flows in the evaporation collecting pipes, each evaporation collecting pipe comprises a plurality of circles, two adjacent circles of evaporation collecting pipes are communicated through a working liquid pipeline, the condensing plate is communicated with the evaporation collecting pipes through working liquid steam pipelines and return pipes, the steam pipelines are used for steam to flow, and the return pipes are used for returning the steam to the evaporation collecting pipes after the steam is converted into liquid when meeting the condensing plate; the return pipe is used for converting the steam into liquid working fluid after meeting the condensing plate, so that the working fluid flows back through the return pipe, and the working fluid steam pipeline is used for flowing the working fluid to the condensing plate after the working fluid absorbs heat and is converted into working fluid steam so as to facilitate heat transfer;
and the cooling module can be internally filled with cooling water, is arranged on one side of the loop heat pipe and is in contact with the condensing plate.
The loop heat pipe has the advantages that the loop heat pipe is provided with the multiple circles of evaporation collecting pipes, flexibility of the loop heat pipe module is improved, the loop heat pipe module is convenient to be attached to a flexible device, heat dissipation of the flexible device is facilitated, the loop heat pipe module is used for absorbing heat generated by the flexible device through the loop heat pipe module and the cooling module, the cooling module transmits the heat absorbed by the loop heat pipe to the outside, and therefore heat generated by the flexible device is rapidly transmitted to the outside, and heat dissipation of the flexible device is guaranteed.
The loop heat pipe suitable for heat dissipation of the flexible device is characterized in that each circle of evaporation header is provided with the working fluid vapor pipe and the return pipe which are communicated with the evaporation header, and the working fluid vapor pipe and the return pipe which are arranged in each circle of evaporation header are alternately arranged along the circumferential direction of the evaporation header, so that the flow channels of vapor and cooling return working fluid are separated, the flow resistance is reduced, and meanwhile, a plurality of small cycles can be formed to enhance the heat exchange capacity.
The loop heat pipe suitable for heat dissipation of the flexible device is characterized in that the shape of the cooling module is matched with the shape of the loop heat pipe module;
set up a plurality of channels in the cooling module, thereby through the setting of many channels, can effectively reduce the cooling water and reduce the flow resistance at cooling module internal reflux, the evenly distributed of the cooling water of being convenient for increases the samming ability, increases the heat transfer area of convection current simultaneously, reinforcing heat transfer effect.
The loop heat pipe suitable for heat dissipation of the flexible device is characterized in that the length of the evaporation header is gradually reduced from the outer side to the inner side of the bottom plate;
the working liquid steam pipelines and the return pipes arranged along the radial direction of the evaporation collecting pipes are radially and alternately arranged, so that the working liquid steam is effectively ensured to move to the condensing plate, and the flow resistance of the working liquid return can be further reduced;
the working liquid steam pipeline and the return pipe are both perpendicular to the condensing plate.
According to the loop heat pipe suitable for heat dissipation of the flexible device, the capillary core is arranged in the axial direction inside the return pipe, the sawtooth-shaped structure is fixed on the side part of the capillary core on the inner wall of the return pipe, and the one-way flow of the working fluid is ensured while the capillary force of the return pipe is effectively ensured through the arrangement of the sawtooth-shaped structure;
the sawtooth structure comprises continuous multiple sections of sawteeth arranged towards the direction of the evaporation header, one end of each sawtooth is fixedly connected with the inner wall of the return pipe, and a set distance is reserved between the other end of each sawtooth and the capillary core.
According to the loop heat pipe suitable for heat dissipation of the flexible device, each circle of the evaporation header comprises the plurality of evaporation pipe bundles connected end to end, so that a net structure is formed, and the flexibility of the loop heat pipe is improved;
the evaporation header is in a ring shape or a polygonal ring shape.
The loop heat pipe suitable for heat dissipation of the flexible device is provided with the working liquid pipeline along the diameter of the evaporation header, or the working liquid pipeline along the diagonal of the evaporation header.
The loop heat pipe suitable for heat dissipation of the flexible device comprises a cooling plate, wherein a cooling water flow channel is formed in the cooling plate, one side of the cooling plate is provided with a cooling water inlet, and the other side of the cooling plate is provided with a cooling water outlet;
the condensing plate and the cooling plate are arranged in a bonding manner;
the condensing plate, the cooling plate and the bottom plate are all flexible pieces.
In a second aspect, the present invention further provides a working method of a loop heat pipe suitable for heat dissipation of a flexible device, including the following steps:
the flexible device is fixedly connected with a bottom plate of the loop heat pipe module, working liquid in the evaporation collecting pipe absorbs heat generated by the flexible device, the working liquid absorbs heat and is changed into working liquid steam, the working liquid steam reaches the condensing plate through a working liquid steam pipeline, and the condensing plate transfers the heat to the outside through cooling water in the cooling module;
the working fluid vapor in the loop heat pipe module is condensed into liquid state again and returns to the evaporation header through the return pipe.
In a third aspect, the present invention further provides a heat dissipation apparatus suitable for a flexible device, including a plurality of loop heat pipes suitable for heat dissipation of the flexible device;
the side part of the cooling module is provided with a reserved opening, the reserved opening of the cooling module is connected with the adjacent cooling module through a connecting pipeline, and the heat dissipation device is made into a splicing structure through the reserved opening and the connecting pipeline, so that loop heat pipes with proper quantity can be arranged according to the flexible device, and the heat dissipation effect on the flexible device is fully guaranteed.
The beneficial effects of the invention are as follows:
1) according to the invention, the cooling module is arranged on one side of the loop heat pipe module, and the loop heat pipe module is arranged through the multi-circle evaporation pipe bundle, so that heat generated by the flexible device can be effectively transferred to the cooling module, and the heat exchange effect is effectively ensured;
the invention has uniform and reasonable whole structure arrangement, can quickly lead heat to the condensing plate after being heated, can quickly supplement working liquid to the heated part, has excellent temperature equalizing effect and stronger heat exchange capability, does not need to add a plurality of cooling devices on the flexible device, is convenient for installation and greatly reduces energy consumption.
2) The reflux pipe, the working liquid pipeline and the working liquid steam pipeline are alternately arranged at intervals, and the steam and the working liquid channel are separated, so that the mixing of the steam and the liquid is avoided, the flowing efficiency is greatly improved, the reflux of cooling water in the cooling module is effectively reduced, the flowing resistance is reduced, the uniform distribution of the cooling water is facilitated, the temperature equalizing capacity is increased, the convection heat exchange area is increased, and the heat exchange effect is enhanced.
3) According to the invention, each structural part of the loop heat pipe is set as a flexible structural part, so that the flexibility of the whole structure is better, and the loop heat pipe can be better suitable for flexible devices.
4) According to the invention, the capillary core is arranged in the center of the return pipe, the working fluid can quickly return along the return pipe through the arrangement of the capillary core, and the sawtooth-shaped structure is arranged on the side wall of the return pipe, so that the capillary force can be ensured and the unidirectional flow of the liquid working fluid can be ensured.
5) According to the invention, through the heat dissipation device suitable for the flexible device, the loop heat pipes which can be spliced are provided with the connecting pipelines according to actual needs in the cooling module to realize the flow of cooling water in the adjacent loop heat pipes, so that the integral heat dissipation cooling device is formed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic view of an overall structure of a loop heat pipe suitable for heat dissipation of a flexible device according to the present invention;
FIG. 2 is a detailed internal structural diagram of a loop heat pipe suitable for heat dissipation by a flexible device according to the present invention;
FIG. 3 is a schematic diagram of the arrangement of the loop heat pipe return pipe and the working fluid vapor pipe at intervals, which is suitable for heat dissipation of the flexible device according to the present invention;
FIG. 4 is a schematic view of a return tube having a directional sawtooth structure;
FIG. 5 is a schematic diagram of a splicing micro-element structure;
reference numerals: A. the cooling system comprises a cooling module, a loop heat pipe module B, a loop heat pipe module A1, a cooling water inlet, a2, a cooling water outlet, A3, a cooling plate, a B4, a condensing plate, a B5, a return pipe, a B6, an operating liquid steam pipeline, a B7, an evaporation header, a B8, a bottom plate, a B9, a flexible device, a B10, an operating liquid pipeline, a B11, a capillary core, a B12 and a sawtooth structure.
Detailed Description
It is to be understood that the following detailed description is exemplary and is intended to provide further explanation of the invention as claimed. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof;
for convenience of description, the words "up" and "down" in the present application, if any, are used merely to indicate correspondence with the directions of the upper and lower portions of the drawings, and are not intended to limit the structure, but merely to facilitate the description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or components so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
Term interpretation section: the terms "mounting", "connecting", "fixing" and the like in the present invention should be understood broadly, for example, they may be fixed connection, detachable connection, or integrated; the two components can be connected mechanically or electrically, directly or indirectly through an intermediate medium, or connected internally or in an interaction relationship, and the terms used in the present invention should be understood as having specific meanings to those skilled in the art.
As described in the background art, in order to solve the above technical problems, the present invention provides a loop heat pipe, a working method and a heat dissipation apparatus suitable for heat dissipation of a flexible device.
Example one
In an exemplary embodiment of the present invention, referring to fig. 1 and 2, a loop heat pipe for dissipating heat from a flexible device includes a cooling module a and a loop heat pipe module B. Cooling module A locates loop heat pipe module B's one side, and the two contact sets up the thermal timely transfer of being convenient for, improves the heat-sinking capability of whole flexible loop heat pipe equipment, be used for letting in the cooling water among the cooling module A and be used for cooling, flexible device can be fixed in the below of loop heat pipe module, there is the working solution in the loop heat pipe module, loop heat pipe module is used for absorbing the heat that flexible device produced, then the transmission of rethread cooling module to the external world.
The cooling module A comprises a cooling plate A3, the cooling plate is provided with a cooling water inlet A1 and a cooling water outlet A2, the cooling water inlet A1 and the cooling water outlet A2 are positioned on two sides of the cooling plate, cooling water flows in from the cooling water inlet A1, and flows out from the cooling water outlet A2 after absorbing heat.
In order to ensure good heat exchange capacity, cooling water is circulated to return to a cooling water inlet A1 after heat is released by the cooling water, specifically, a cooling water outlet is provided with a pipeline which is connected with a water storage tank, the water storage tank is provided with a pump, the cooling water is sent into the cooling water inlet again through the pump, the water storage tank is provided with a temperature sensor, the temperature sensor and the pump are respectively connected with a controller, the controller can be a PLC (programmable logic controller), and after the cooling water in the water storage tank is reduced to a set temperature, the cooling water can be supplied to a cooling water inlet A1.
The inside passageway that forms the cooling water flow of cooling plate of cooling module, the cooling plate has the thickness of settlement, can arrange a plurality of channels in the cooling plate, the both ends of each channel respectively with cooling water entry, cooling water export intercommunication, thereby setting through many channels can effectively reduce the cooling water and flow resistance in the cooling plate space backward flow, the evenly distributed of the cooling water of being convenient for increases the samming ability, increase heat convection area simultaneously, reinforcing heat transfer effect.
Specifically, in some examples, the cooling plate is provided with a plurality of partition plates inside along the flow direction of the cooling water, and a channel for flowing the cooling water is formed between two adjacent partition plates.
Of course, in other examples, two adjacent channels may be spaced apart by a set distance, and the channel may be a straight line segment, multiple continuous straight line segments, or a curved line segment.
The loop heat pipe module B comprises a condensing plate B4, a return pipe B5, an operating liquid steam pipeline B6, an evaporation header B7, a bottom plate B8 and an operating liquid pipeline B10, wherein the condensing plate is arranged opposite to the bottom plate, the evaporation header B7 is supported by the bottom plate, the evaporation header comprises a plurality of circles, two adjacent circles of evaporation headers are communicated through the operating liquid pipeline B10, and the condensing plate is communicated with the evaporation header through the operating liquid steam pipeline and the operating liquid pipeline.
Specifically, in this embodiment, the evaporation header of every round all includes many end to end's evaporation tube bank, and the evaporation header is quadrangle or hexagon or other shapes and arranges, from outside to inside, the length of evaporation header diminishes gradually, overlaps mutually layer by layer, and the distance of adjacent two circles evaporation header is equal, uses the evaporation header to be the hexagon as an example, and adjacent two circles evaporation header communicates through the working solution pipeline B10 of evenly arranging, from this the working solution can flow with between all evaporation headers, has increased heat exchange efficiency and temperature uniformity nature.
It can be understood that, the two adjacent evaporator tube bundles are in arc transition, and the joint of the two adjacent evaporator tube bundles is provided with an opening, and the working fluid pipeline B10 is installed by means of welding or bonding of the opening.
A return pipe B5 and a working liquid steam channel B6 are fixed between the condensing plate and the evaporation collecting pipe, the return pipe and the working liquid steam channel are arranged at intervals on each circle of the evaporation collecting pipe, the return pipe and the working liquid steam channel are perpendicular to the plane direction of the evaporation collecting pipe and are alternately arranged, working liquid steam pipelines and return pipes are alternately arranged along the circumferential direction of the evaporation collecting pipe, the flow channels of the steam and the cooling reflux working liquid are separated, the flow resistance is reduced, and meanwhile, a plurality of small cycles can be formed to enhance the heat exchange capacity.
Specifically, the plane of the evaporation header is parallel to the condensing plate, and the return pipe and the working liquid steam pipeline are perpendicular to the condensing plate; if the evaporation collecting pipe is hexagonal, three return pipes and three working liquid steam pipelines are arranged in the evaporation collecting pipe in a circle, and the return pipes and the working liquid steam pipelines are arranged at set intervals.
Referring to fig. 3, taking the evaporation header as a hexagon as an example, on each diagonal line of the hexagon (in the radial direction of the evaporation header), the plane where the return pipe and the working fluid vapor channel are arranged and the working fluid pipeline are arranged on the same plane, and the return pipe and the working fluid vapor channel are arranged at intervals in the plane, that is, if the return pipe is arranged on the plane where the diagonal line of the hexagon is arranged on the evaporation header of the outer ring, the inner evaporation header adjacent to the return pipe is provided with the working fluid vapor pipeline adjacent to the return pipe, so that the working fluid vapor pipeline and the return pipe are alternately arranged along the radial direction of the evaporation header, and a plurality of micro-circulation paths can be formed among the condensation plate, the return pipe, the evaporation header, the working fluid pipeline and the working fluid vapor pipeline.
It will be appreciated that when the evaporation headers are hexagonal, the evaporation headers and the working fluid conduits are caused to form a spider-web like structure.
In summary, the return pipes B5 and the working fluid vapor pipes B6 are alternately arranged in the circumferential direction and the radial direction of the evaporation header B7, and when locally heated, the working fluid absorbs heat and becomes working fluid vapor, reaches the condensation plate B4 through the plurality of working fluid vapor pipes B6 arranged nearby, where the heat is transferred to the cooling water to be re-condensed into the working fluid, and rapidly returns to the heat receiving position through the plurality of return pipes B5. The working fluid steam has more flow paths due to reasonable interval arrangement, and meanwhile, the working fluid backflow has a plurality of backflow channels, so that the flow resistance is greatly reduced, and the heat exchange capacity is improved.
The bottom plate is a flexible bottom plate, the condensation plate is a flexible condensation plate, and the bottom plate and the condensation plate are both made of flexible materials.
It should be explained that the temperature of the condensation plate is lower than the temperature of the steam of the working fluid to ensure that the working fluid is smoothly condensed from a gaseous state to a liquid state, assuming that the working fluid is deionized water, the deionized water absorbs heat generated by the operation of the flexible device and turns into steam, and the temperature of the steam is higher than the temperature (10-20 ℃) of the condensation plate, so that the steam can be condensed into a liquid state when encountering the condensation plate and then returns to the evaporation header through the return pipe.
Furthermore, the shape of the cooling module is adapted to the shape of the loop heat pipe module, and if the evaporation header is hexagonal in shape, the corresponding condensation plate and cooling plate may both be hexagonal.
Accordingly, it will be appreciated that one side of the base plate is used to support the evaporation headers, which may be snapped onto the side of the base plate or secured thereto by an adhesive; the other side surface is used for fixing a flexible device to be radiated, and the flexible device can be adhered to the side surface of the bottom plate through an adhesive, so that the high-efficiency heat transfer is carried out, the working temperature of the device is reduced, and the reliable work of the flexible device is ensured.
It should be explained that, in order to realize that the evaporation header is clamped on the bottom plate, the side surface of the bottom plate is convexly provided with a clamping groove, and the evaporation header is fixed through the clamping groove.
The cooling plate a3 and the condensation plate B4 are bonded by an adhesive, thereby coupling the cooling module a and the loop heat pipe module B together. The adhesive should ensure a close fit between the cold plate a3 and the cold plate B4 to facilitate a timely transfer of heat.
In addition, in order to ensure good contact and reduce contact thermal resistance between the cooling plate a3 and the condensation plate B4, the same material, flexible metal material or modified polymer material with good thermal conductivity should be used.
Specifically, the return pipe B5, the working fluid vapor pipe B6, the evaporation header B7, the bottom plate B8, and the working fluid pipe B10 are made of flexible metals with good axial flexibility and certain radial stress strength, such as copper and aluminum, or doped and modified polyvinyl alcohol (PVA), Polyester (PET), Polyimide (PI), and the like with good thermal conductivity. The whole flexibility is ensured, and simultaneously, the suction force during the vacuum pumping can be borne, and the channel cannot be shriveled and blocked.
Referring to fig. 4, a zigzag structure is fixed on the inner wall of the return pipe, and the zigzag structure includes a plurality of continuous sections of sawteeth arranged toward the direction of the evaporation header, so that a microchannel is formed on the inner wall of the return pipe, and the capillary force can be ensured and the unidirectional flow of the working fluid can be ensured by the arrangement of the microchannel.
In order to further enhance the capillary force, a capillary wick B11 is further disposed in the return pipe B5, the capillary wick may be located in the middle of the return pipe and arranged along the axis of the return pipe, and the capillary wick may be made of fiber, and may enable the working fluid to rapidly flow back along the return pipe B5.
It should be noted that if the structural members are made of metal materials, the interfaces can be connected by welding, and the welding manner includes, but is not limited to, laser welding, argon arc welding, brazing, and the like; if a flexible polymer material is adopted, all the interfaces can be bonded through an adhesive; the types of the materials are not limited to a single form, the connection mode is not limited to one, the reliability and the air tightness are taken as judgment standards, and the comprehensive performance is excellent.
In addition, when the loop heat pipe is used, the loop heat pipe module B needs to be vacuumized, then working liquid is injected, and after the injection is finished, the liquid injection port is sealed, wherein the working liquid can be deionized water, ammonia, Freon, hexane, acetone, ethanol and the like.
A working method of a loop heat pipe suitable for heat dissipation of a flexible device comprises the following steps:
the flexible device B9 releases heat in normal work, and in the working solution that passes through the bottom plate B8 that the heat conductivility is good transmitted to evaporation header B7, the working solution heat absorption becomes steam accessible a plurality of working solution steam conduit B6 of rationally arranging and reaches condensation plate B4, gives the cooling water and takes to the external world with the heat transfer. The working fluid vapor recondenses back to a liquid state through return conduit B5 and returns to evaporation header B7 under capillary force.
Furthermore, in the process that the working fluid absorbs heat in the evaporation header B7 and is changed into steam, a plurality of return pipes B5 are reasonably arranged around the evaporation header, and the evaporation headers are communicated with one another to replenish the consumed working fluid in time, so that the heat dissipation efficiency is high.
It should be noted that the loop heat pipe suitable for heat dissipation of the flexible device provided in this embodiment may be used for heat dissipation of the flexible device, where the flexible device may be a flexible sensing device, and may also be another flexible device that needs heat dissipation.
Example two
For a relatively large flexible device, this embodiment provides a heat dissipation apparatus suitable for a flexible device, and as shown in fig. 5, the heat dissipation apparatus includes a plurality of loop heat pipes suitable for heat dissipation of a flexible device according to the first embodiment, two adjacent loop heat pipes are connected to each other, specifically, a connection pipeline is disposed on a side portion of a cooling module a, the connection pipeline realizes connection of the two cooling modules a, and by disposing the plurality of loop heat pipes, heat exchange efficiency is ensured, and meanwhile, the heat dissipation apparatus can also be suitable for a flexible device array which is freely distributed.
In some examples, the plurality of loop heat pipes are arranged in a plurality of rows and columns, or in other shapes.
Specifically, the connecting pipeline of the cooling module A is perpendicular to the cooling water inlet or intersected with the cooling water inlet, for this reason, a reserved opening is formed in the side portion of the cooling module A, the reserved opening is connected with the connecting pipeline of the side portion of the adjacent cooling module A through the reserved opening, and the reserved opening of the cooling module A is not connected in a plugging mode.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A loop heat pipe suitable for heat dissipation of a flexible device, comprising:
the loop heat pipe module comprises a condensing plate and a bottom plate, wherein the condensing plate and the bottom plate are arranged oppositely, evaporation collecting pipes are supported by the bottom plate, working liquid flows in the evaporation collecting pipes, the evaporation collecting pipes comprise a plurality of circles, two adjacent circles of evaporation collecting pipes are communicated through working liquid pipelines, the condensing plate and the evaporation collecting pipes are communicated through working liquid steam pipelines and return pipes, the steam pipelines are used for steam to flow, and the return pipes are used for returning the steam to the evaporation collecting pipes after the steam is converted into liquid when meeting the condensing plate;
and the cooling module can be internally filled with cooling water, is arranged on one side of the loop heat pipe module and is in contact with the condensing plate.
2. A loop heat pipe suitable for dissipating heat of a flexible device as recited in claim 1, wherein each circle of said evaporation header is provided with an operating fluid vapor pipe and a return pipe communicating with the evaporation header, and the operating fluid vapor pipe and the return pipe provided in each circle of the evaporation header are alternately arranged along a circumferential direction of the evaporation header.
3. A loop heat pipe suitable for dissipating heat from a flexible device according to claim 1, wherein the shape of the cooling module is adapted to the shape of the loop heat pipe module;
a plurality of channels are arranged in the cooling module.
4. A loop heat pipe adapted for dissipating heat from a flexible device as recited in claim 1 wherein said evaporator header has a length that decreases from an outer side to an inner side of said base plate;
the working liquid steam pipeline and the return pipe which are arranged through the evaporation header are arranged in a radial direction of the evaporation header in an alternating mode;
the working liquid steam pipeline and the return pipe are both perpendicular to the condensing plate.
5. A loop heat pipe suitable for dissipating heat of a flexible device as claimed in claim 1, wherein a capillary wick is disposed in the axial direction inside the return pipe, and a sawtooth structure is fixed on the inner wall of the return pipe at the side of the capillary wick;
sawtooth structure includes the sawtooth that continuous multistage orientation evaporation header place direction set up, and sawtooth one end links firmly with the back flow pipe inner wall, has the distance of setting for between the other end and the capillary core.
6. A loop heat pipe adapted for dissipating heat from a flexible device as recited in claim 1 wherein said evaporator headers of each turn comprise a plurality of evaporator tube bundles connected end to end;
the evaporation header is in a ring shape or a polygonal ring shape.
7. A loop heat pipe adapted for dissipating heat from a flexible device as claimed in claim 1, wherein the working fluid conduit is disposed along a diameter of the evaporation header or along a diagonal of the evaporation header.
8. The loop heat pipe suitable for dissipating heat of the flexible device as claimed in claim 1, wherein the cooling module comprises a cooling plate, a flow channel of cooling water is formed inside the cooling plate, one side of the cooling plate is provided with a cooling water inlet, and the other side of the cooling plate is provided with a cooling water outlet;
the condensing plate and the cooling plate are arranged in a bonding manner;
the condensing plate, the cooling plate and the bottom plate are all flexible parts.
9. The working method of the loop heat pipe suitable for heat dissipation of the flexible device according to any one of claims 1-8, comprising the following steps:
the flexible device is fixedly connected with a bottom plate of the loop heat pipe module, working liquid in the evaporation collecting pipe absorbs heat generated by the flexible device, the working liquid absorbs heat and is changed into working liquid steam, the working liquid steam reaches the condensing plate through a working liquid steam pipeline, and the condensing plate transfers the heat to the outside through cooling water in the cooling module;
the working fluid vapor in the loop heat pipe module is condensed into liquid state again and returns to the evaporation header through the return pipe.
10. A heat dissipating device suitable for a flexible device, comprising a plurality of loop heat pipes suitable for dissipating heat of the flexible device as claimed in any one of claims 1 to 8;
and the side part of the cooling module is provided with a reserved opening, and the reserved opening of the cooling module is connected with the adjacent cooling module through a connecting pipeline.
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| CN104634139A (en) * | 2013-11-13 | 2015-05-20 | 李静 | Steam-water heat exchange sleeve |
| CN106288530A (en) * | 2016-08-19 | 2017-01-04 | 中国航天空气动力技术研究院 | A kind of vaporizer of loop circuit heat pipe and preparation method thereof |
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| CN109890177A (en) * | 2019-03-07 | 2019-06-14 | 东南大学 | A kind of electronic equipment heat management micro-structure |
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| GB201006620D0 (en) * | 2010-04-21 | 2010-06-02 | Qinetiq Ltd | Evaporative structures, particularly for body cooling |
| EP3285036B1 (en) * | 2016-08-14 | 2020-11-18 | Dallmann engineering & Service | Heat exchanger modul for bulk material |
| US10934936B2 (en) * | 2017-07-10 | 2021-03-02 | Rolls-Royce North American Technologies, Inc. | Cooling system in a hybrid electric propulsion gas turbine engine for cooling electrical components therein |
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|---|---|---|---|---|
| CN104634139A (en) * | 2013-11-13 | 2015-05-20 | 李静 | Steam-water heat exchange sleeve |
| CN106288530A (en) * | 2016-08-19 | 2017-01-04 | 中国航天空气动力技术研究院 | A kind of vaporizer of loop circuit heat pipe and preparation method thereof |
| CN107167010A (en) * | 2017-04-28 | 2017-09-15 | 山东大学 | A kind of loop circuit heat pipe |
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