CN108519009B - Heat pipe device - Google Patents

Heat pipe device Download PDF

Info

Publication number
CN108519009B
CN108519009B CN201810330614.4A CN201810330614A CN108519009B CN 108519009 B CN108519009 B CN 108519009B CN 201810330614 A CN201810330614 A CN 201810330614A CN 108519009 B CN108519009 B CN 108519009B
Authority
CN
China
Prior art keywords
channel
evaporator
liquid
condenser
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810330614.4A
Other languages
Chinese (zh)
Other versions
CN108519009A (en
Inventor
赵雅楠
梁惊涛
蔡京辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technical Institute of Physics and Chemistry of CAS
Original Assignee
Technical Institute of Physics and Chemistry of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technical Institute of Physics and Chemistry of CAS filed Critical Technical Institute of Physics and Chemistry of CAS
Priority to CN201810330614.4A priority Critical patent/CN108519009B/en
Publication of CN108519009A publication Critical patent/CN108519009A/en
Application granted granted Critical
Publication of CN108519009B publication Critical patent/CN108519009B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Abstract

The invention relates to the field of thermal control and discloses a heat pipe device which comprises a condenser, a first evaporator, a second evaporator and a connecting pipe, wherein a plurality of channels are formed in the connecting pipe, each channel comprises at least one liquid channel, at least one gas channel and at least one backflow channel, the condenser, the at least one liquid channel, the first evaporator, the at least one gas channel and the condenser are sequentially connected to form a first loop, and the condenser, the at least one liquid channel, the first evaporator, the at least one backflow channel, the second evaporator and the condenser are sequentially connected to form a second loop. By providing a second circuit, the heat pipe device can be reliably started and operated in a horizontal state or an antigravity state. The channels in the connecting pipe can be integrally formed, and the processing is convenient. The connecting pipe enables the appearance of the heat pipe device to be simpler, the structure to be compact, the occupied space to be small, the flexible connection function to be better, the bending and the fixing to be easier, and the flexible layout of the system to be convenient.

Description

Heat pipe device
Technical Field
The invention relates to the field of thermal control, in particular to a heat pipe device.
Background
A heat pipe is a highly efficient heat transfer device with a heat transfer capacity one or two orders of magnitude higher than that of metal, known as a hot superconductor. The traditional heat pipe mainly comprises a metal shell, a capillary structure and a working medium, wherein the capillary structure is generally formed by a channel or a sintered porous structure and is distributed in the length direction of the whole heat pipe, and the heat pipe has simple structure but poor flexibility.
The loop heat pipe is also heat control equipment for carrying out high-efficiency heat transfer by utilizing gas-liquid phase change of a working medium, and mainly comprises an evaporator, a condenser, a gas pipeline and a liquid pipeline, wherein the evaporator and the condenser are connected through the gas pipeline and the liquid pipeline to form a closed loop.
The evaporator and the condenser of the existing loop heat pipe are generally provided with two, three or even more transmission pipelines, the structure is complicated, more system space is occupied when the evaporator and the condenser are coupled with a heat radiating device, more fixing structures are required to be arranged when the pipelines are arranged in many application occasions, and particularly for the heat pipe working in a low-temperature environment, the heat pipe can normally operate only by virtue of the protection of a huge vacuum heat insulation system, so that larger system space is necessarily occupied, and many loop heat pipes can normally operate only by virtue of the gravity auxiliary effect, so that the heat pipe cannot reliably operate in a horizontal state or an antigravity state, and the factors bring much inconvenience to the lightweight application of the loop heat pipe.
Disclosure of Invention
First, the technical problem to be solved
The invention aims to provide a heat pipe device which normally operates in a horizontal state or an antigravity state and solves the problems of large space occupation and complex pipe arrangement during long-distance heat transfer.
(II) technical scheme
In order to solve the technical problems, the invention provides a heat pipe device, which comprises a condenser, a first evaporator, a second evaporator and a connecting pipe, wherein a plurality of channels are arranged in the connecting pipe, the channels comprise at least one liquid channel, at least one gas channel and at least one backflow channel, the condenser, the at least one liquid channel, the first evaporator, the at least one gas channel and the condenser are sequentially connected to form a first loop, and the condenser, the at least one liquid channel, the first evaporator, the at least one backflow channel, the second evaporator and the condenser are sequentially connected to form a second loop.
Preferably, the condenser comprises a first condensation pipeline, and the first condensation pipeline, the at least one liquid channel, the first evaporator, the at least one gas channel and the first condensation pipeline are sequentially connected to form a first loop.
Preferably, the condenser further comprises a second condensation line, through which the at least one return channel of the connection tube is connected with the second evaporator.
Preferably, the first condensing duct is further provided with a liquid outlet for connection with the at least one liquid channel and a gas inlet for connection with the at least one gas channel, the second condensing duct is provided with a fluid inlet for connection with the at least one return channel, the liquid outlet of the first condensing duct, the gas inlet and the array of fluid inlets of the second condensing duct are arranged on the same side of the condenser.
Preferably, at one end of the connection pipe for connection with the condenser, any at least two of the at least one liquid channel, the at least one gas channel, and the at least one return channel have different epitaxial lengths, so that one end of the connection pipe for connection with the condenser is stepped.
Preferably, the first condensation pipeline, the at least one liquid channel, the first evaporator, the at least one reflux channel, the second evaporator and the first condensation pipeline are sequentially connected to form a second loop, wherein the first loop and the second loop share the same liquid channel.
Preferably, the first condensing duct is provided with a gas inlet for connection with the at least one gas channel, and the second evaporator is connected to the gas inlet of the first condensing duct.
Preferably, the condenser further comprises a third condensing pipeline, the at least one liquid channel comprises at least one first sub-channel and at least one second sub-channel, the first condensing pipeline, the at least one first sub-channel, the first evaporator, the at least one gas channel and the first condensing pipeline are sequentially connected to form a first loop, and the third condensing pipeline, the at least one second sub-channel, the first evaporator, the at least one reflux channel, the second evaporator and the third condensing pipeline are sequentially connected to form a second loop.
Preferably, the total area of the cross-sections of the at least one gas channel is equal to or larger than the total area of the cross-sections of the at least one liquid channel.
Preferably, the cross-sectional shape of the liquid channel is any one of a circle, a semicircle, an ellipse, a polygon, a fan shape or a combination shape of any at least two of them; the cross section of the gas channel is any one or a combination of at least two of a circle, a semicircle, an ellipse, a polygon and a fan; the cross section of the backflow channel is any one or a combination of at least two of round, semicircular, elliptic, polygonal and fan-shaped.
(III) beneficial effects
According to the heat pipe device provided by the invention, the condenser, the at least one liquid channel, the first evaporator, the at least one gas channel and the condenser are sequentially connected to form a first loop, and the condenser, the at least one liquid channel, the first evaporator, the at least one backflow channel, the second evaporator and the condenser are sequentially connected to form a second loop. At least one liquid channel, at least one gas channel and at least one backflow channel which are included in a single connecting pipe are adopted to replace a liquid pipeline, a gas pipeline and a secondary pipeline which are distributed in the prior art, and a plurality of channels in the connecting pipe can be integrally formed, so that the processing is convenient. The array channel type connecting pipe enables the shape of the loop heat pipe to be simpler, the structure to be compact, the occupied space in the heat radiation system to be small, the flexible connection function to be better, the bending and the fixing to be easier, and the flexible layout of the system to be convenient. Through setting up the second return circuit for the heat pipe device can reliably start and operate under horizontal state or antigravity state, to the heat pipe device that works in low temperature environment, can make first evaporimeter cool down smoothly through the second return circuit, the start and the operation of auxiliary heat pipe device first return circuit. The array channel type connecting pipe is long and compact in structure, and is easier to realize heat insulation protection, so that environment heat leakage of the connecting pipe to the outside is reduced conveniently, and the working stability and reliability of the heat pipe device are improved.
In a preferred embodiment, the condenser comprises a first condensation pipeline and a second condensation pipeline, wherein at least one reflux channel serving as the secondary circuit is connected with the second evaporator serving as the secondary evaporator after passing through the second condensation pipeline, so that the interfaces of the condenser, the first evaporator and the second evaporator are uniformly arranged on the condenser, the connection structure of the heat pipe device is further simplified, and the reliability of the pipeline connection is improved.
In a preferred embodiment, at the end of the connection pipe for connection with the condenser, any at least two of the at least one liquid channel, the at least one gas channel, and the at least one return channel have different epitaxial lengths, so that the end of the connection pipe for connection with the condenser is stepped, preventing mutual leakage between the at least one liquid channel, the at least one gas channel, and the at least one return channel.
In a preferred embodiment, the at least one liquid channel, the at least one gas channel and the at least one backflow channel are arranged side by side, wherein the at least one gas channel and the at least one backflow channel are respectively arranged at two sides of the at least one liquid channel, and the gas and/or the liquid in the at least one gas channel and the gas and/or the liquid in the at least one backflow channel which are arranged at the opposite outer sides can play a role in insulating heat and protecting the liquid in the at least one liquid channel which is arranged at the opposite inner sides, which is equivalent to arranging a low-temperature cold screen outside the at least one liquid channel which is used as the liquid channel, so that heat leakage from the external environment to the inside of the at least one liquid channel can be reduced, and the liquid working medium in the condenser can be ensured to smoothly enter the evaporator through the at least one liquid channel.
In a preferred embodiment, the condenser further comprises a third condensing duct, the at least one liquid channel comprising at least one first sub-channel and at least one second sub-channel. The first condensing pipeline of the condenser, the at least one first sub-channel, the first evaporator, the at least one gas channel and the first condensing pipeline of the condenser are sequentially connected to form a first loop; the third condensing pipeline of the condenser, the at least one second sub-channel, the first evaporator, the at least one reflux channel, the second condensing pipeline, the second evaporator and the third condensing pipeline of the condenser are sequentially connected to form a second loop. The second loop is communicated with the first loop only in the first evaporator, and the second loop and the connecting pipe are not communicated with each other in the condenser, so that the unidirectional flow of the flowing working medium in the first loop and the second loop along the respective preset directions is facilitated.
Drawings
FIG. 1 is a schematic diagram of a heat pipe device according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view of a connection pipe of a heat pipe apparatus according to a first embodiment of the present invention;
FIG. 3 is a cross-sectional view of a connection pipe of a heat pipe apparatus according to a second embodiment of the present invention;
FIG. 4 is a cross-sectional view of a connection pipe of a heat pipe apparatus according to a third embodiment of the present invention;
FIG. 5 is a schematic view showing a heat pipe apparatus according to a fourth embodiment of the present invention;
fig. 6 shows a cross-sectional view of a connection pipe of a heat pipe apparatus according to a fourth embodiment of the present invention.
Detailed Description
The following describes in further detail the embodiments of the present invention with reference to the drawings and examples. The following examples are illustrative of the invention and are not intended to limit the scope of the invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Fig. 1 shows a schematic structure of a heat pipe apparatus according to a first embodiment of the present invention, which includes a condenser 110, a first evaporator 120, a second evaporator 130, and a connection pipe 140, wherein the connection pipe 140 includes a plurality of passages therein, which may be integrally formed, wherein the plurality of passages includes at least one liquid passage 141, at least one gas passage 142, and at least one return passage 143. The condenser 110, the at least one liquid passage 141, the first evaporator 120, the at least one gas passage 142, and the condenser 110 are sequentially connected to form a first loop, and the condenser 110, the at least one liquid passage 141, the first evaporator 120, the at least one return passage 143, the second evaporator 130, and the condenser 110 are sequentially connected to form a second loop.
In this embodiment, the condenser 110 is used for condensing gas into liquid, the first evaporator 120 and the second evaporator 130 are used for converting liquid into gas, the first evaporator 120 is a main evaporator, at least one liquid channel 141 sends the liquid in the condenser 110 to the first evaporator 120, at least one gas channel 142 sends the gas in the first evaporator 120 to the condenser 110, and the condenser 110 is communicated with the first evaporator 120 through the liquid channel 141 and the gas channel 142, so as to form a main loop of the heat pipe device. The second evaporator 130 is a secondary evaporator, and at least one return channel 143 is used for transferring the gas-liquid and/or liquid flowing into the first evaporator 120 to the second evaporator 130, and the second evaporator 130 and the at least one return channel 143 are used for reconnecting the first evaporator 120 and the condenser 110 to form a secondary circuit of the heat pipe device. Through setting up the second return circuit for the heat pipe device can reliably start and operate under the horizontality or antigravity state, to the heat pipe device that works in low temperature environment, can make first evaporimeter 120 cool down smoothly through the second return circuit, supplementary heat pipe device first return circuit's start-up and operation.
The liquid channel 141, the gas channel 142 and the reflux channel 143 are at least one included in the single connecting pipe 140 instead of the liquid pipeline, the gas pipeline and the secondary pipeline which are distributed in the prior art, and a plurality of channels in the connecting pipe 140 can be integrally formed, so that the processing is convenient. The array channel type connecting pipe enables the loop heat pipe device to be simpler in appearance and compact in structure, occupies small space in a heat dissipation system, has a better flexible connection function, is easier to bend and fix, and is convenient for flexible layout of the system. The array channel type connecting pipe is long and compact in structure, and is easier to realize heat insulation protection, so that environment heat leakage of the connecting pipe to the outside is reduced conveniently, and the working stability and reliability of the heat pipe device are improved.
Specifically, the condenser 110 includes a plate 114 and a first condensing duct 111 disposed within the plate 114, and the first condensing duct 111 may be provided with a liquid outlet for connection with at least one liquid channel 141 and a gas inlet for connection with at least one gas channel 142. The first condensing duct 111, the at least one liquid passage 141, the first evaporator 120, the at least one gas passage 142, and the first condensing duct 111 are sequentially connected to form a first circuit.
In this embodiment, the first circuit and the second circuit of the heat pipe device may share the same liquid channel 141, in particular, the second evaporator 130 is connected to the first condensation line 111 of the condenser 110, wherein the second evaporator 130 may be connected to the gas inlet of the first condensation line 111, the first evaporator 120 and the second evaporator 130 may both deliver gas to the gas inlet of the first condensation line 111, and the first condensation line 111, the at least one liquid channel 141, the first evaporator 120, the at least one return channel 143, the second evaporator 130, and the first condensation line 111 are sequentially connected to form the second circuit, such that the first circuit and the second circuit of the heat pipe device share the same liquid channel 141.
Further, the condenser 110 of the present embodiment further includes a second condensation pipeline 112, and at least one return channel 143 of the connection pipe 140 is connected to the second evaporator 130 through the second condensation pipeline 112, that is, the first condensation pipeline 111, the at least one liquid channel 141, the first evaporator 120, the at least one return channel 143, the second condensation pipeline 112, the second evaporator 130, and the first condensation pipeline 111 are sequentially connected to form a second loop. The second condensation duct 112 is provided with a fluid inlet for connection with at least one return channel 143, in this embodiment the liquid outlet of the first condensation duct 111, the gas inlet and the array of fluid inlets of the second condensation duct 112 are arranged on the same side of the condenser 110. In addition, the condenser 110 may further include a switching structure (not shown) disposed inside the condenser 110 or outside the condenser 110, through which the liquid outlet, the gas inlet, and the fluid inlet of the first condensation pipe 111 and the second condensation pipe 112 are respectively connected to the at least one liquid channel 141, the at least one gas channel 142, and the at least one return channel 143 of the connection pipe 140, and form gas-liquid isolation at a plurality of connection positions. The first condensation pipeline 111 and the second condensation pipeline 112 can be made of copper, aluminum, steel, titanium alloy and the like, or made of other materials with good heat transfer effects, and the first condensation pipeline 111 and the second condensation pipeline 112 can be of a serpentine pipe structure or a side-by-side pipeline structure. The condenser 110 may not be limited to the above-mentioned structure, and may include fins directly provided at a certain area of the outer surface of the end portion of the connection pipe 140, or may include condensation pipes and fins, or may include other structures capable of condensing a gaseous working medium into a liquid.
The first evaporator 120 may be in a flat plate shape, or may be in a shape of a disc, a cylinder, a saddle, etc., and the inside of the first evaporator 120 may be in a pipe form, or may be a cavity, or may be provided with a micro-groove structure, or may be provided with a wick 121 or other capillary structures, and the first evaporator 120 may further include other structural forms capable of evaporating a liquid working medium into a gas. The first evaporator 120 in this embodiment is cylindrical, and a liquid suction core 121 is disposed in the first evaporator, the liquid suction core 121 is cup-shaped, the end of the liquid suction core 121, which is close to the connecting pipe 140 and is open at one side, is provided with a baffle 122 at the end of the liquid suction core 121, so that the inner space of the liquid suction core 121 is isolated from the outside, at least one liquid channel 141 and at least one backflow channel 143 penetrate through the baffle 122 and extend into the liquid suction core 121, so that the liquid working medium in the at least one liquid channel 141 can directly flow into the liquid suction core 121, and the gas working medium or the redundant liquid working medium in the liquid suction core 121 can also flow back into the second evaporator 130 through the at least one backflow channel 143. The outer surface of the liquid suction core 121 is in close fit contact with the inner surface of the shell 123 of the first evaporator 120, so as to reduce the contact thermal resistance of radial heat transfer of the first evaporator 120, and a channel 124 is arranged between the outer surface of the liquid suction core 121 and the inner surface of the shell 123 of the first evaporator 120, so that a gas working medium flow channel is formed, and the gas working medium evaporated from the surface of the liquid suction core 121 is discharged outwards in time. The channels 124 may open to the outer surface of the wick 121 or to the inner surface of the housing 123. The first evaporator 120 may further include a liquid reservoir (not shown in the figure), which is in communication with the wick 121, for storing excess liquid working medium, and the liquid supply of the wick 121 is adjusted by the liquid reservoir, so as to improve the operation stability of the loop heat pipe device.
The second evaporator 130 includes a capillary structure 131 inside, and the capillary structure 131 may include micro grooves, sintered powder, fibers, foam metal, or a mesh-like or bundle-like structure made of a plurality of wires or fibers, or at least two of the above structures. The second evaporator 130 may further include a secondary reservoir (not shown in the figure), which is in communication with the capillary structure 131 for storing excess liquid working medium, and the secondary reservoir may replace the second condensation line 112 by adjusting the liquid replenishment of the capillary structure 131 by the secondary reservoir, and the reflux passage 143 may be connected to the second evaporator 130, and the secondary reservoir and the second condensation line 112 may also exist simultaneously, i.e., the second condensation line 112, the secondary reservoir and the second evaporator 130 are sequentially connected.
The internal channels of the connecting pipe 140 can be integrally formed, for example, extrusion, stamping, wire cutting, casting and the like can be adopted, and the processing technology is simple. The connection pipe 140 may be made of metal or non-metal. One end of the connection pipe 140 is connected with the condenser 110, the other end is connected with the first evaporator 120, the connection fixing mode is at least one of welding, gluing, clamping connection, tight fitting, expansion pipe or threaded connection, and the sealing mode between the connection pipe 140 and the condenser 110 or the first evaporator 120 is at least one of welding, gluing, tight fitting, metal sealing or O-ring sealing.
When the heat pipe device works, the gas working medium condenses into liquid in the first condensation pipeline 111 and the second condensation pipeline 112, because the inlet of the second evaporator 130 is very close to the condenser 110, the liquid working medium easily flows into the second evaporator 130 to infiltrate the capillary structure 131, when the second evaporator 130 is heated, the liquid working medium in the condenser 110 flows to at least one liquid channel 141 under the driving of the capillary action of the capillary structure 131, then gradually flows to the first evaporator 120 and cools the along-path pipeline, at the same time, the generated gas working medium or excessive liquid working medium flows back to the second evaporator 130 along at least one reflux channel 143 and the second condensation pipeline 112, the working medium circulates in the second loop, as time goes into the first evaporator 120, the liquid working medium 121 is fully infiltrated by the liquid, after the outer surface of the first evaporator 120 is heated by a heat dissipation device, the heat is transferred to the inner part of the first evaporator 120, the generated gas working medium flows into a nearby channel 124, then flows to at least one reflux channel 143 and finally flows into the first evaporator 120 to the liquid working medium, at least one liquid working medium is continuously circulated in the first evaporator 120, the liquid working medium is continuously in the first evaporator, the liquid working medium is continuously circulated in the second evaporator, and the liquid working medium is continuously condensed in the first evaporator 120, and the liquid working medium is continuously circulated in the second evaporator is continuously, and the liquid working medium is continuously condensed in the first evaporator is circulated in the first evaporator, and the liquid working medium is continuously in the first evaporator is continuously, and the liquid working medium is continuously in the liquid circulation state is continuously in the liquid state, and the liquid medium is heated.
When the loop heat pipe device works in a low-temperature environment, the loop heat pipe device can further comprise a gas reservoir, the gas reservoir is communicated with at least one gas channel 142, the problem that the internal pressure of the low-temperature loop heat pipe device exceeds a safety range under the room temperature condition can be effectively solved, meanwhile, gas working substances in the gas reservoir can be continuously supplemented into the loop heat pipe device when the low-temperature loop heat pipe device operates at the low temperature, and therefore sufficient gas-liquid two-phase working substances are guaranteed to be contained in the loop heat pipe device.
When the heat pipe device works at a low temperature region, because a large temperature difference exists between the heat pipe device and the external environment, heat leakage inevitably exists, so that the heat transfer burden of the heat pipe device and the energy consumption of a cold source are increased, when the environment heat leakage is large, the liquid in the first pipeline 141 is likely to be heated to be partially burnt out, so that the heat pipe device is unstable in work and even fails, and a plurality of heat insulation measures are usually needed, for example, a radiation-proof material is wrapped outside the heat pipe device, and the heat pipe device can be normally operated only when being placed in a large vacuum system. The invention adopts the form of the connecting pipe 140, only one slender transmission pipeline is arranged between the first evaporator 120 and the condenser 110, the structure is compact, the occupied space is small, the radiation-proof material is more convenient to wrap, and the low-temperature heat transfer work can be carried out only by a small vacuum system, thereby greatly reducing the volume of the system and improving the working reliability and the running stability of the heat pipe device.
Fig. 2 is a cross-sectional view of a connection pipe of a heat pipe apparatus according to a first embodiment of the present invention, showing a cross-section of the connection pipe, please refer to fig. 1 and 2 simultaneously. The cross-section of the connecting pipe 140 of the present embodiment is substantially in a shape of a waist, and the liquid channel 141, the gas channel 142 and the return channel 143 are disposed in the connecting pipe 140 in parallel, and it should be noted that the liquid channel 141, the gas channel 142 and the return channel 143 may be one or two or more, and in the present embodiment, the liquid channel 141, the gas channel 142 and the return channel 143 are all exemplified. Wherein the gas passage 142 and the return passage 143 are provided on both sides of the liquid passage 141, respectively. The cross-sectional shape of the liquid passage 141 is any one or a combination of any at least two of a circle, a semicircle, an ellipse, a polygon, and a fan; the cross-sectional shape of the gas passage 142 is any one of a circle, a semicircle, an ellipse, a polygon, a fan shape or a combination of any at least two thereof; the cross-sectional shape of the return passage 143 is any one of a circle, a semicircle, an ellipse, a polygon, a fan shape, or a combination of any at least two thereof. The cross-sections of the liquid channel 141, the gas channel 142, and the return channel 143 may be the same or different in shape and/or area, and in some preferred embodiments, the total area of the cross-sections of at least one gas channel 142 is greater than or equal to the total area of the cross-sections of the at least one liquid channel 141 to further balance and coordinate the flow resistances of the gas phase working fluid and the liquid phase working fluid in the circuit. In the present embodiment, the cross section of the liquid passage 141 is substantially rectangular, the cross sections of the gas passage 142 and the return passage 143 are substantially rectangular and semicircular in combination, and the two are symmetrically arranged.
Further, in the present embodiment, at one end of the connection pipe 140 for connection with the condenser 110, any at least two of the at least one liquid passage 141, the at least one gas passage 142, and the at least one return passage 143 are different in an extension length such that one end of the connection pipe 140 for connection with the condenser 110 is stepped. At one end of the connection pipe 140 for connection with the condenser 110 in this embodiment, the liquid passage 141 extends outwardly longer than the gas passage 142 and the return passage 143. It is of course understood that the arrangement of the stepped ports of the connection pipe 140 may not be limited to the above example case, different parameters may be set for the extension lengths of the plurality of channels as needed, and the arrangement of the stepped ports may not be limited to the end of the connection pipe 140 for connection with the condenser 110, which may be equally set for the end for connection with the first evaporator 120.
According to the heat pipe device provided by the invention, the condenser 110, the at least one liquid channel 141, the first evaporator 120, the at least one gas channel 142 and the condenser 110 are sequentially connected to form a first loop, and the condenser 110, the at least one liquid channel 141, the first evaporator 120, the at least one return channel 143, the second evaporator 130 and the condenser 110 are sequentially connected to form a second loop. The liquid channel 141, the gas channel 142 and the reflux channel 143 are arranged in the single connecting pipe 140 to replace the liquid pipeline, the gas pipeline and the secondary pipeline which are distributed in the prior art, and a plurality of channels in the connecting pipe 140 can be integrally formed, so that the processing is convenient. The array channel type connecting pipe enables the heat pipe device to be simpler in appearance and compact in structure, occupies small space in a heat radiation system, has better flexible connection function, is easier to bend and fix, and is convenient for flexible layout of the system. Through setting up the second return circuit for the heat pipe device can reliably start and operate under the horizontality or antigravity state, to the heat pipe device that works in low temperature environment, can make first evaporimeter 120 cool down smoothly through the second return circuit, supplementary heat pipe device first return circuit's start-up and operation. The array channel type connecting pipe is long and compact in structure, and is easier to realize heat insulation protection, so that environment heat leakage of the connecting pipe to the outside is reduced conveniently, and the working stability and reliability of the heat pipe device are improved.
The condenser 110 of the present embodiment includes a first condensation pipeline 111 and a second condensation pipeline 112, where at least one return channel 143 serving as a secondary circuit is connected to a second evaporator 130 serving as a secondary evaporator after passing through the second condensation pipeline 112, so that interfaces of the condenser 110 and the first evaporator 120, and interfaces of the second evaporator 130 and the first evaporator 120 are uniformly arranged on the condenser 110, further simplifying a connection structure of the heat pipe device, and improving reliability of pipeline connection.
At one end of the connection pipe 140 for connection with the condenser 110, any at least two of the at least one liquid passage 141, the at least one gas passage 142, and the at least one return passage 143 have different epitaxial lengths, so that one end of the connection pipe 140 for connection with the condenser 110 is stepped, preventing leakage between the liquid passage 141, the gas passage 142, and the return passage 143. The liquid channel 141, the gas channel 142 and the reflux channel 143 are arranged side by side, wherein the gas channel 142 and the reflux channel 143 are respectively arranged at two sides of the liquid channel 141, the gas in the gas channel 142 at the opposite outer side and the gas and/or liquid in the reflux channel 143 can play a role in heat insulation protection on the liquid in the liquid channel 141 at the opposite inner side, which is equivalent to arranging a low-temperature cold screen outside the liquid channel 141 serving as the liquid channel, thereby reducing heat leakage from the external environment to the inside of the liquid channel 141 and ensuring that the liquid working medium in the condenser 110 smoothly enters the evaporator through the liquid channel 141.
It should be noted that the cross-sectional shape of the connection pipe 140 is not limited to the above embodiment, and for example, in the following alternative second and third embodiments, the cross-sectional shape of the connection pipe 140 may be other types.
Fig. 3 and 4 are sectional views showing connection pipes of a heat pipe device according to a second embodiment and a third embodiment of the present invention, and most structures of the heat pipe device according to the second embodiment and the third embodiment may be the same as those of the heat pipe device according to the first embodiment, and not described in detail herein, the liquid channel, the gas channel, and the return channel may be one or two or more, respectively, and the second embodiment and the third embodiment are described by taking one liquid channel, gas channel, and return channel as examples. Unlike the first embodiment, the cross-sectional shapes of the connection pipe 240 of the second embodiment and the connection pipe 340 of the third embodiment are different from those of the connection pipe 140 of the first embodiment.
The cross-sectional outer profile of the connection pipe 240 of the second embodiment is substantially triangular or a combination of triangular and fan-shaped. The liquid channel 241, the gas channel 242, and the return channel 243 are circular in cross section, and are disposed in the connection pipe 240 rotationally symmetrically about the central axis of the connection pipe 240.
The cross-sectional outer profile of the connection pipe 340 of the third embodiment is substantially circular. The liquid passage 341, the gas passage 342, and the return passage 343 are all fan-shaped in cross section and are rotationally symmetrically disposed within the connection pipe 340 about the central axis of the connection pipe 340.
In the second and third embodiments, the cross-sectional shapes and the sizes of the areas of the liquid channel, the gas channel, and the return channel are substantially the same, and it is understood that in other embodiments, the cross-sectional shapes and/or the sizes of the areas of the liquid channel, the gas channel, and the return channel may be different.
In the above embodiments, the first circuit and the second circuit of the heat pipe device share the same liquid channel, and it is understood that in other embodiments, the first circuit and the second circuit of the heat pipe device may each use a separate liquid channel.
Fig. 5 shows a schematic structural diagram of a heat pipe device according to a fourth embodiment of the present invention. The heat pipe apparatus still includes the condenser 410, the first evaporator 420, the second evaporator 430, and the connection pipe 440 includes a plurality of channels inside, which may be integrally formed, wherein the plurality of channels includes at least one liquid channel 441, at least one gas channel 442, and at least one return channel 443. The condenser 410 includes a plate 414 and a first condensing pipe 411 disposed in the plate 414, where the first condensing pipe 411, the at least one liquid channel 441, the first evaporator 420, the at least one gas channel 442, and the first condensing pipe 411 are sequentially connected to form a first loop. The condenser 410 further includes a second condensing duct 412, and the at least one return passage 443 of the connection pipe 440 is connected to the second evaporator 430 through the second condensing duct 412.
The first condensing duct 411, the at least one liquid channel 441, the first evaporator 420, the at least one gas channel 442, and the condenser 410 are sequentially connected to form a first loop, and the condenser 410, the at least one liquid channel 441, the first evaporator 420, the at least one return channel 443, the second evaporator 430, and the condenser 410 are sequentially connected to form a second loop.
Unlike the previous embodiments, the condenser 410 further comprises a third condensing conduit 413, the at least one liquid channel 441 comprising at least one first sub-channel 4411 and at least one second sub-channel 4412. In the present embodiment, the first condensation line 411 of the condenser 410, the at least one first sub-channel 4411, the first evaporator 420, the at least one gas channel 442, and the first condensation line 411 of the condenser 410 are sequentially connected to form a first loop; the third condensing line 413 of the condenser 410, the at least one second sub-channel 4412, the first evaporator 420, the at least one return channel 443, the second condensing line 412, the second evaporator 430, and the third condensing line 413 of the condenser 410 are sequentially connected to form a second loop. The second circuit of the present embodiment is only communicated with the first circuit in the first evaporator 420, but not communicated with each other in the condenser 410 and the connection pipe 440, which is more beneficial to unidirectional flow of the flowing working media in the first circuit and the second circuit along respective preset directions.
Fig. 6 shows a cross-sectional view of a connection pipe of a heat pipe apparatus according to a fourth embodiment of the present invention, which shows a cross-section of the connection pipe. The liquid channel 441 may include one or two or more of the first sub-channel 4411, the second sub-channel 4412, the gas channel 442 and the backflow channel 443, and in this embodiment, the first sub-channel 4411, the second sub-channel 4412, the gas channel 442 and the backflow channel 443 are all exemplified. The cross-sectional outer profile of the connection pipe 440 may be substantially in a waist shape, the first sub-channel 4411, the second sub-channel 4412, the gas channel 442, and the return channel 443 are disposed in the connection pipe 440 side by side, the first sub-channel 4411 and the second sub-channel 4412 may be disposed at intermediate positions, and the gas channel 442 and the return channel 443 are disposed at both sides of the first sub-channel 4411 and the second sub-channel 4412, respectively. The first sub-passage 4411 and the second sub-passage 4412 have substantially rectangular cross sections, and the gas passage 442 and the return passage 443 have substantially rectangular and semicircular combined cross sections, and are symmetrically arranged. Similar to the first embodiment, the cross-sectional outer profile of the connection pipe 440 may not be limited to the exemplary shape in the present embodiment, and the cross-sectional shape of the plurality of passages included in the connection pipe 440 is not limited to the above-described shape, and the cross-sectional dimensions of the respective passages may be the same or different, and the respective passage cross-sectional dimensions and numbers may be set according to the flow resistance.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.

Claims (7)

1. The heat pipe device is characterized by comprising a condenser, a first evaporator, a second evaporator and a connecting pipe, wherein a liquid suction core is arranged in the first evaporator, a plurality of channels are arranged in the connecting pipe, each channel comprises at least one liquid channel, at least one gas channel and at least one backflow channel, the condenser, the at least one liquid channel, the first evaporator, the at least one gas channel and the condenser are sequentially connected to form a first loop, and the condenser, the at least one liquid channel, the first evaporator, the at least one backflow channel, the second evaporator and the condenser are sequentially connected to form a second loop;
the condenser comprises a first condensing pipeline, and the first condensing pipeline, the at least one liquid channel, the first evaporator, the at least one gas channel and the first condensing pipeline are sequentially connected to form a first loop;
the condenser further comprises a second condensation pipeline, and the at least one reflux channel of the connecting pipe is connected with the second evaporator through the second condensation pipeline;
the condenser further comprises a third condensing pipeline, the at least one liquid channel comprises at least one first sub-channel and at least one second sub-channel, the first condensing pipeline, the at least one first sub-channel, the first evaporator, the at least one gas channel and the first condensing pipeline are sequentially connected to form a first loop, and the third condensing pipeline, the at least one second sub-channel, the first evaporator, the at least one backflow channel, the second evaporator and the third condensing pipeline are sequentially connected to form a second loop.
2. The heat pipe apparatus of claim 1, wherein the first condensing duct is further provided with a liquid outlet for connection with the at least one liquid channel and a gas inlet for connection with the at least one gas channel, the second condensing duct is provided with a fluid inlet for connection with the at least one return channel, and the liquid outlet of the first condensing duct, the gas inlet, and the array of fluid inlets of the second condensing duct are disposed on the same side of the condenser.
3. The heat pipe apparatus as claimed in claim 2, wherein at one end of the connection pipe for connection with the condenser, any at least two of the at least one liquid passage, the at least one gas passage, and the at least one return passage have different extension lengths such that the one end of the connection pipe for connection with the condenser is stepped.
4. The heat pipe apparatus of claim 1, wherein the first condensing circuit, the at least one liquid channel, the first evaporator, the at least one return channel, the second evaporator, and the first condensing circuit are sequentially connected to form a second circuit, wherein the first circuit and the second circuit share the same liquid channel.
5. The heat pipe apparatus as defined in claim 4, wherein the first condensing duct is provided with a gas inlet for connection with the at least one gas passage, and the second evaporator is connected to the gas inlet of the first condensing duct.
6. The heat pipe apparatus of claim 1, wherein a total area of the cross-sections of the at least one gas channel is greater than or equal to a total area of the cross-sections of the at least one liquid channel.
7. The heat pipe apparatus as defined in claim 1, wherein the cross-sectional shape of the liquid passage is any one of a circle, a semicircle, an ellipse, a polygon, a fan shape or a combination of any at least two of them; the cross section of the gas channel is any one or a combination of at least two of a circle, a semicircle, an ellipse, a polygon and a fan; the cross section of the backflow channel is any one or a combination of at least two of round, semicircular, elliptic, polygonal and fan-shaped.
CN201810330614.4A 2018-04-13 2018-04-13 Heat pipe device Active CN108519009B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810330614.4A CN108519009B (en) 2018-04-13 2018-04-13 Heat pipe device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810330614.4A CN108519009B (en) 2018-04-13 2018-04-13 Heat pipe device

Publications (2)

Publication Number Publication Date
CN108519009A CN108519009A (en) 2018-09-11
CN108519009B true CN108519009B (en) 2023-06-27

Family

ID=63432575

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810330614.4A Active CN108519009B (en) 2018-04-13 2018-04-13 Heat pipe device

Country Status (1)

Country Link
CN (1) CN108519009B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2754624C2 (en) * 2019-02-12 2021-09-06 Общество С Ограниченной Ответственностью "Аквафор" (Ооо "Аквафор") Liquid purifying system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
CN1771421A (en) * 2002-10-28 2006-05-10 斯沃勒斯联合公司 Heat transfer system
CN102109258A (en) * 2010-08-05 2011-06-29 中国科学院理化技术研究所 Cryogenic loop heat pipe device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012132661A (en) * 2010-12-01 2012-07-12 Fujitsu Ltd Cooling device and electronic device
EP2940416B1 (en) * 2012-12-28 2017-09-27 Ibérica del Espacio, S.A. Loop heat pipe apparatus for heat transfer and thermal control
CN208075639U (en) * 2018-04-13 2018-11-09 中国科学院理化技术研究所 Heat-pipe apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
CN1771421A (en) * 2002-10-28 2006-05-10 斯沃勒斯联合公司 Heat transfer system
CN102109258A (en) * 2010-08-05 2011-06-29 中国科学院理化技术研究所 Cryogenic loop heat pipe device

Also Published As

Publication number Publication date
CN108519009A (en) 2018-09-11

Similar Documents

Publication Publication Date Title
US7661464B2 (en) Evaporator for use in a heat transfer system
CN102034773B (en) Configurational tree-shaped heat pipe radiator
CN101137881A (en) A multi-orientational cooling system with a bubble pump
US20030037907A1 (en) Solar energy heater with heat pipe and heat exchanger
EP1859219A2 (en) Capillary condenser/evaporator
JP2004177041A (en) Heat exchanger
CN108253830B (en) Loop heat pipe with auxiliary infusion pipeline
CN100468707C (en) Heat radiator fin and circular heat tube radiator
WO2017166394A1 (en) Thermoelectric heat pump type air conditioner
CN108267036A (en) The loop heat pipe of micro-channel structure auxiliary drive
CN108286911B (en) Low-temperature loop heat pipe
CN108426475A (en) A kind of close-coupled loop heat pipe
CN108519009B (en) Heat pipe device
CN208075641U (en) A kind of close-coupled loop heat pipe
CN205783400U (en) The radiating subassembly of air-conditioner outdoor unit and air-conditioner outdoor unit
CN102646651A (en) Thin hot plate structure
JP2008060400A (en) Heat transfer cable, heat transfer cable unit, heat transfer system and heat transfer system construction method
CN106051955A (en) Heat dissipation assembly of air conditioner outdoor unit and air conditioner outdoor unit
CN111397413B (en) Loop heat pipe heat accumulator
CN108426476A (en) A kind of microwell array loop heat pipe
CN208075639U (en) Heat-pipe apparatus
CN101603791B (en) Capillary cooler
CN108458614A (en) A kind of loop heat pipe
JP3168202U (en) Structure of thin plate heat pipe
CN208171078U (en) A kind of microwell array loop heat pipe

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant