CN113485045A - Temperature measurement and heat dissipation device for lighting-out of mini backlight module and working method thereof - Google Patents
Temperature measurement and heat dissipation device for lighting-out of mini backlight module and working method thereof Download PDFInfo
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- CN113485045A CN113485045A CN202110941858.8A CN202110941858A CN113485045A CN 113485045 A CN113485045 A CN 113485045A CN 202110941858 A CN202110941858 A CN 202110941858A CN 113485045 A CN113485045 A CN 113485045A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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Abstract
The temperature measurement heat dissipation device for the mini backlight module to turn off the lamp comprises an LED substrate, an LED array, a heat conduction layer and a jet flow cavity; the jet flow cavity is provided with a mounting hole, and the LED array is mounted on the mounting hole; a liquid inlet and a liquid outlet are respectively arranged on the jet flow cavity; the liquid inlet is communicated with an inlet of the micro-pump system through a liquid inlet pipeline, and the liquid outlet is communicated with an outlet of the micro-pump system through a liquid outlet pipeline; the LED array is arranged on the LED array, and the bottom of the LED array is provided with a heat conduction layer; thermocouple elements are uniformly arranged on the heat conducting layer, a micro-spray array is arranged in the jet flow cavity and is positioned below the LED array, and the micro-spray array is aligned with the thermocouple elements; the liquid outlet pipeline is provided with a heat exchange port, and the heat exchange port is provided with a heat exchange device. Through the work of miniature spraying system, bring out the heat, reduce heat transmission and glue the lamp plate, reduce the thermal expansion rate difference of gluing the lamp plate and the thermal expansion rate of base plate, and then reduce the lamp plate and glue the thrust to mini-LED granule, improve the phenomenon of turning off the light.
Description
Technical Field
The invention relates to the field of liquid crystal display, in particular to a temperature measurement and heat dissipation device for turning off a lamp of a mini backlight module.
Background
The Mini-LED is a hot spot of research in the current display industry, the chip size of the Mini-LED is 100-500 um, and the Mini-LED backlight can provide hundreds to tens of thousands of partitions for the local dimming technology of the LCD display, so that the local dimming technology can control the LCD display more accurately. With the further improvement of the HDR standard, higher requirements are put forward on the Mini-LED brightness, the power is improved along with the brightness improvement, the heating value is increased, and the temperature is increased. Because temperature rises rapidly on the lamp plate and can't in time scatter, the lamp plate is in high temperature state, and the lamp plate is heated the inflation. Because the thermal expansion rate that the protection of encapsulation on the chip was glued is greater than the thermal expansion rate of lamp plate base plate, can produce slight displacement between lamp plate base plate and the protection glue, lead to the chip to receive the thrust that the protection was glued, after the thrust that the chip received reached certain intensity, can make the soldering tin between chip and the base plate break, and electric connection between chip and the pad became invalid, took place to turn out the light phenomenon.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a temperature measurement and heat dissipation device for the light-out of a mini backlight module, and the specific technical scheme is as follows:
temperature measurement heat abstractor that mini backlight unit goes out lamp, its characterized in that: the LED heat dissipation device comprises an LED substrate (1), an LED array (2), a heat conduction layer (3) and a jet flow cavity (4);
a mounting hole is formed in the jet flow cavity (4), and the LED array (2) is mounted on the mounting hole;
a liquid inlet and a liquid outlet are respectively arranged on the jet flow cavity (4);
the liquid inlet is communicated with the inlet of the micro-pump system through a liquid inlet pipeline (5), and the liquid outlet is communicated with the outlet of the micro-pump system through a liquid outlet pipeline (6);
the LED array (2) is arranged on the LED array (2), and a heat conduction layer (3) is arranged at the bottom of the LED array (2);
thermocouple elements (8) are uniformly arranged on the heat conducting layer (3), a micro-spray array (9) is installed in the jet flow cavity (4), the micro-spray array (9) is located below the LED array (2), and the micro-spray array (9) is aligned to the thermocouple elements (8);
the liquid outlet pipeline (6) is provided with a heat exchange port, and a heat exchange device is arranged on the heat exchange port.
To better implement the invention, the following steps can be further carried out: the micropump is a valveless pump body.
Further: the micropump comprises a pump body (16), a vertical chamber (17), a horizontal channel (18), a left valve flap (19) and a right valve flap (18), wherein the horizontal channel (18) and the vertical chamber (17) are positioned at an angle of 45 degrees between the left valve flap (19) and the horizontal channel (18), the right valve flap (18) and the horizontal channel form an angle of 45 degrees, and the distance between the left valve flap (18) and the right valve flap (19) is half of the length of the horizontal channel.
Further: the heat conducting layer (3) adopts a heat conducting adhesive tape (7).
Further: the heat exchange device comprises a heat exchanger (10) and an air cooling device (11), wherein the heat exchanger (10) comprises a connecting rivet (12), an exchange tube (13) and two contact bottom plates (14);
the exchange tubes (13) are uniformly arranged between the two contact bottom plates (14) through connecting rivets (12), and partition plates (15) are uniformly arranged along the exchange tubes (13).
Further: the air cooling device (11) adopts a cooling fan.
The working method of the temperature measurement and heat dissipation device for the mini backlight module to turn off the lamp comprises the following technical scheme:
according to the working method of the temperature measurement and heat dissipation device for the mini backlight module to turn off the lamp, heat on the LED substrate (1) is transmitted to the bottom of the LED substrate (1) through the heat conduction layer (3);
the thermocouple element (8) senses the temperature of the LED array (2);
when the temperature of the LED array (2) exceeds the set value of the thermocouple element (8), the micro-pump system works, fluid generated by the micro-pump system is transmitted to the bottom cavity of the jet flow device through the liquid outlet pipe, heat exchange fluid from the bottom cavity dilutes heat generated in the LED working state through the micro-jet array (9), and the heat exchange device reduces the heat of liquid in the pipeline.
The invention has the beneficial effects that: overall structure is simple, and the heat that gives off through the base plate bottom triggers miniature thermocouple component and arouses miniature spraying system work, takes away the heat, reduces heat transmission to the lamp plate and glues, reduces the thermal expansion rate that the lamp plate glued and the thermal expansion rate difference of base plate, and then reduces the lamp plate and glues the thrust to mini-LED granule, improves the phenomenon of turning off the light. The heat generated by the LED array of the SMT on the LED substrate in the lighting state is reduced.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a schematic diagram of a micro pump system;
FIG. 3 is a view showing the structure of a heat exchange apparatus;
the attached drawing in the figure illustrates that the LED micro-pump system comprises an LED substrate 1, an LED array 2, a micro-pump system 3, a jet flow cavity 4, a liquid inlet pipeline 5, a liquid outlet pipeline 6, a heat conducting adhesive tape 7, a thermocouple element 8, a micro-jet array 9, a heat exchanger 10, an air cooling device 11, a connecting rivet 12, an exchange pipe 13, a contact bottom plate 14, a partition plate 15, a pump body 16, a vertical cavity 17, a horizontal channel 18, a left valve clack 19 and a right valve clack 20.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3:
the temperature measurement heat abstractor of mini backlight unit lamp-out, including LED base plate 1, LED array 2, heat-conducting layer 3 and jet flow cavity 4;
a mounting hole is formed in the jet flow cavity 4, and the LED array 2 is mounted on the mounting hole;
a liquid inlet and a liquid outlet are respectively arranged on the jet flow cavity 4;
this inlet is through inlet pipe 5 and micropump system's entry intercommunication, and this liquid outlet is through outlet pipe 6 and micropump system's export intercommunication, wherein, micropump in the micropump system is the valveless pump body, the micropump contains the pump body, horizontal passage, perpendicular cavity, left valve clack, right valve clack, horizontal passage with perpendicular cavity is located micropump left valve clack becomes 45 jiaos with horizontal passage, micropump right valve clack becomes 45 jiaos with horizontal passage, micropump left valve clack and micropump right valve clack distance are the half that horizontal passage is long.
The LED array 2 is installed on the LED array 2, a heat conduction layer 3 is arranged at the bottom of the LED array 2, and the heat conduction layer 3 is made of a heat conduction adhesive tape 7.
Thermocouple elements 8 are uniformly arranged on the heat conducting layer 3, a micro-spray array 9 is arranged in the jet flow cavity 4, the micro-spray array 9 is positioned below the LED array 2, and the micro-spray array 9 is aligned with the thermocouple elements 8;
the liquid outlet pipe 6 is provided with a heat exchange port, and a heat exchange device is arranged on the heat exchange port.
In the present invention, the heat exchange device comprises a heat exchanger 10 and an air cooling device 11, and the air cooling device 11 adopts a cooling fan.
The heat exchanger 10 comprises connecting rivets 12, exchange tubes 13 and two contact bottom plates 14;
the exchange tubes 13 are uniformly arranged between the two contact bottom plates 14 through connecting rivets 12, and partition plates 15 are uniformly arranged along the exchange tubes 13.
The specific technical scheme of the working method of the temperature measurement and heat dissipation device for the mini backlight module to turn off the lamp is that heat on the LED substrate 1 is transmitted to the bottom of the LED substrate 1 through the heat conduction layer 3;
the thermocouple element 8 senses the temperature of the LED array 2;
when the temperature of the LED array 2 exceeds the set value of the thermocouple element 8, the micro-pump system works, fluid generated by the micro-pump system is transmitted to the bottom cavity of the jet flow device through the liquid outlet pipe, heat exchange fluid from the bottom cavity dilutes heat generated in the working state of the LED through the micro-jet array 9, and the heat exchange device reduces the heat of liquid in the pipeline.
The working principle of the invention is as follows: the heat on the LED substrate is transmitted to the bottom end of the LED substrate through the heat conducting adhesive tape, when the heat emitted by the heat conducting adhesive tape under the LED substrate reaches the trigger value of the miniature thermocouple element, the heat triggers the miniature thermocouple element to cause the miniature spraying system to work, the heat is taken out, the heat is reduced and transmitted to the lamp panel glue, the difference value of the thermal expansion rate of the lamp panel glue and the thermal expansion rate of the substrate is reduced, the thrust of the lamp panel glue to mini-LED particles is further reduced, and the phenomenon of light failure is improved. The heat generated by the LED array of the SMT on the LED substrate in the lighting state is reduced.
The working principle of the micro pump is that in the process of descending fluid, when the fluid is pushed into the horizontal channel from the vertical cavity, heat medium emitted from the lamp panel is sensed on the driving mechanism under the condition of thermal pressure, the driving mechanism drives the left valve clack and the right valve clack to start working, the release of heat in the horizontal channel is accelerated, and cold medium in the vertical channel is supplemented in time.
The reason for the 45-degree inclination angle with the horizontal channel is that when the heat does not reach a certain degree, the valve clack does not need to be started to work, the valve clack with 45 degrees on both sides can reach the maximum dilution value of the heat, and when the heat reaches a certain degree, the valve clack system starts to work.
The working method of the temperature measurement and heat dissipation device for the mini backlight module to turn off the lamp comprises the following technical scheme:
according to the working method of the temperature measurement and heat dissipation device for the mini backlight module to turn off the lamp, heat on the LED substrate is transmitted to the bottom of the LED substrate through the heat conduction layer;
the thermocouple element senses the temperature of the LED array;
when the temperature of the LED array exceeds the set value of the thermocouple element, the micro-pump system works, fluid generated by the micro-pump system is transmitted to the bottom cavity of the jet flow device through the liquid outlet pipe, heat exchange fluid from the bottom cavity dilutes heat generated in the LED working state through the micro-jet array, and the heat exchange device reduces the heat of liquid in the pipeline.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
- The temperature measurement heat abstractor that mini backlight unit goes out lamp, its characterized in that: the LED heat dissipation device comprises an LED substrate (1), an LED array (2), a heat conduction layer (3) and a jet flow cavity (4);a mounting hole is formed in the jet flow cavity (4), and the LED array (2) is mounted on the mounting hole;a liquid inlet and a liquid outlet are respectively arranged on the jet flow cavity (4);the liquid inlet is communicated with the inlet of the micro-pump system through a liquid inlet pipeline (5), and the liquid outlet is communicated with the outlet of the micro-pump system through a liquid outlet pipeline (6);the LED array (2) is arranged on the LED array (2), and a heat conduction layer (3) is arranged at the bottom of the LED array (2);thermocouple elements (8) are uniformly arranged on the heat conducting layer (3), a micro-spray array (9) is installed in the jet flow cavity (4), the micro-spray array (9) is located below the LED array (2), and the micro-spray array (9) is aligned to the thermocouple elements (8);the liquid outlet pipeline (6) is provided with a heat exchange port, and a heat exchange device is arranged on the heat exchange port.
- 2. The temperature measurement heat abstractor that put out light of mini backlight unit of claim 1, characterized in that: the micropump is a valveless pump body.
- 3. The temperature measurement heat abstractor that put out light of mini backlight unit of claim 2, characterized in that: the micropump comprises a pump body (16), a vertical chamber (17), a horizontal channel (18), a left valve flap (19) and a right valve flap (18), wherein the horizontal channel (18) and the vertical chamber (17) are positioned at an angle of 45 degrees between the left valve flap (19) and the horizontal channel (18), the right valve flap (18) and the horizontal channel form an angle of 45 degrees, and the distance between the left valve flap (18) and the right valve flap (19) is half of the length of the horizontal channel.
- 4. The temperature measurement heat dissipation device for extinguishing the light of the mini backlight module according to claim 3, wherein: the heat conducting layer (3) adopts a heat conducting adhesive tape (7).
- 5. The temperature measurement and heat dissipation device for extinguishing the light of the mini backlight module according to claim 4, wherein: the heat exchange device comprises a heat exchanger (10) and an air cooling device (11), wherein the heat exchanger (10) comprises a connecting rivet (12), an exchange tube (13) and two contact bottom plates (14);the exchange tubes (13) are uniformly arranged between the two contact bottom plates (14) through connecting rivets (12), and partition plates (15) are uniformly arranged along the exchange tubes (13).
- 6. The temperature measurement heat abstractor that put out light of mini backlight unit of claim 5, characterized in that: the air cooling device (11) adopts a cooling fan.
- 7, the working method of the temperature measurement heat dissipation device for the light-out of the mini backlight module is characterized in that: the heat on the LED substrate (1) is transmitted to the bottom of the LED substrate (1) through the heat conduction layer (3);the thermocouple element (8) senses the temperature of the LED array (2);when the temperature of the LED array (2) exceeds the set value of the thermocouple element (8), the micro-pump system works, fluid generated by the micro-pump system is transmitted to the bottom cavity of the jet flow device through the liquid outlet pipe, heat exchange fluid from the bottom cavity dilutes heat generated in the LED working state through the micro-jet array (9), and the heat exchange device reduces the heat of liquid in the pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110941858.8A CN113485045A (en) | 2021-08-17 | 2021-08-17 | Temperature measurement and heat dissipation device for lighting-out of mini backlight module and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110941858.8A CN113485045A (en) | 2021-08-17 | 2021-08-17 | Temperature measurement and heat dissipation device for lighting-out of mini backlight module and working method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113485045A true CN113485045A (en) | 2021-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110941858.8A Pending CN113485045A (en) | 2021-08-17 | 2021-08-17 | Temperature measurement and heat dissipation device for lighting-out of mini backlight module and working method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
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2021
- 2021-08-17 CN CN202110941858.8A patent/CN113485045A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116360159A (en) * | 2023-06-02 | 2023-06-30 | 惠科股份有限公司 | Light-emitting module and display device |
| CN116360159B (en) * | 2023-06-02 | 2023-09-05 | 惠科股份有限公司 | Light-emitting module and display device |
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