CN208994300U - A kind of temp-sensing device - Google Patents

Abstract

The utility model proposes a kind of temp-sensing device, temp-sensing device includes: heating module, including hot chamber and the PTC heater intracavitary set on heat；Refrigeration module, including cold chamber and set on cold intracavitary semiconductor chilling plate；And air intake assembly, go out pneumatic module.The utility model embodiment has selected semiconductor chilling plate and PTC heater small in size and thin respectively as refrigeration source and heating source, it is individually enclosed in two independent cavitys and is worked, also can provide various temperature perception tactile while reducing the volume of device.

Description

A kind of temp-sensing device

Technical field

The utility model relates to the technical fields that temperature is adjusted, and in particular to a kind of temp-sensing device.

Background technique

With the fast development and application of virtual reality and augmented reality, the temperature sense based on virtual reality or augmented reality Know that tactile is also an important research direction.Temperature sensing tactile is exactly to perceive cold and hot process.Existing temperature sensing Haptic device mostly uses high voltage, and energy consumption is high, and the wasting of resources is larger.And current temperature sensing haptic device volume is larger, such as Freezed by the way of condensing refrigerant and compression, in addition there are also liquid vaporization refrigeration, absorption type refrigerating, gas expansion refrigeration, whirlpool Flow tube refrigeration etc., these refrigeration modes are all higher to equipment requirement, cause equipment volume larger, can not be applied to the work of chain-wales Make environment.

Utility model content

In view of the deficiencies of the prior art, the utility model proposes a kind of temperature sensing device, system and its control method, energy Temperature sensing tactile that is enough while generating cold air and hot gas, the device volume is small, and refrigeration and heating efficiency are high, solves existing skill The bulky problem of temperature control equipment in art.

The technical solution of the utility model is achieved in that

A kind of temp-sensing device, comprising:

Heating module, including hot chamber and the PTC heater intracavitary set on heat, PTC heater is perpendicularly fixed at by fixture block On hot cavity wall, PTC heater is arranged such and is not contacted with cavity wall, increases air-flow and PTC heater contact area, can be improved Radiating efficiency；Refrigeration module, including cold chamber and set on cold intracavitary semiconductor chilling plate, semiconductor chilling plate is embedded in the chamber of cold chamber In wall, the huyashi-chuuka (cold chinese-style noodles) of cooling piece is towards cold intracavitary, and the heat of semiconductor chilling plate faces outside cold chamber, and cold chamber and hot chamber are arranged side by side；Into Pneumatic module, the air inlet including being set to hot chamber and cold bottom of chamber seat, further, air inlet is U-type groove；Pneumatic module out, including set In the gas outlet and the exhaust fan between gas outlet and air inlet of hot chamber and cold top of chamber, the face of blade direction of exhaust fan Gas outlet, for intracavitary air-flow to be discharged from gas outlet.

It further, is the radiating efficiency for improving PTC heater, PTC heater single side is equipped with cooling fin or two-sided is equipped with Cooling fin is used for auxiliary heat dissipation.

Further, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate connects cooling fin, and the hot face of semiconductor chilling plate connects water-cooled cooling Component, to improve cooling efficiency.

Further, cooling piece is the double-deck cooling piece, the bilayer cooling piece be a piece of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) with The hot face of another chip semiconductor cooling piece be bonded, and meets larger range of refrigeration demand.

Further, air intake assembly further include first baffle for reducing hot chamber inlet channel and for reduce cold chamber into The setting position of second plate washer in gas channel, first baffle and the second plate washer is higher than the coboundary of air inlet.Baffle reduce into Gas channel, it is intracavitary to become smaller with the outer heat interchange channel of chamber, play certain thermal effect.

Further, plane where the second plate washer and exhaust fan is arranged in certain inclination angle, and the inclination angle is 5 °~ 45 °, the lowest part of the water droplet generated when for collecting the cold intracavitary refrigeration to second plate washer, the lowest part is equipped with Water hole, the water droplet generated for cold chamber refrigeration to be discharged.

Further, pneumatic module further includes non-return piece mechanism for heat preservation out, and non-return piece mechanism includes insulation board, spring Torsional spring and inside casing, insulation board are set to below exhaust fan, and insulation board is wherein connected to form rotation by spring torsional spring and cavity wall on one side Shaft, inside casing are the setting of horizontal circle cavity wall for limit the frame for keeping the temperature Board position, inside casing and insulation board close to and be set to The lower section of insulation board, when intracavitary airless, the insulation board and inside casing are closed, and when there is air stream drives, insulation board, which surrounds, to be turned Axis rotation.

Further, influencing each other for the temperature of reduction two chambers, the cavity wall of hot chamber and cold chamber is all made of thermal insulating material Material, or one layer of heat preservation material is coated in the inner cavity of hot chamber and cold chamber.

Further, temp-sensing device further includes display module, and display module includes: for showing the intracavitary and cold intracavitary temperature of heat The instruction device of the display device of degree and the working condition for being used to indicate PTC heater and semiconductor chilling plate.

The utility model has the beneficial effects that

(1) the utility model has selected semiconductor chilling plate and PTC heater small in size and thin respectively as refrigeration source And heating source, it is individually enclosed in two independent cavitys and is worked, can produce cold and hot two kinds of air-flows, reduce device Also it can provide various temperature perception tactile while volume.

(2) the utility model is protected by connecting cooling fin on cooling piece and PTC heater, while in two intracavitary are equipped with The non-return piece mechanism of temperature improves device refrigeration and heating efficiency.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property It puts, is also possible to obtain other drawings based on these drawings.

Fig. 1 is a kind of Facad structure perspective view of temp-sensing device one embodiment of the utility model；

Fig. 2 is a kind of side structure perspective view of temp-sensing device one embodiment of the utility model；

Fig. 3 is the PTC heating element structure in a kind of temp-sensing device one embodiment of the utility model；

Fig. 4 is a kind of system structure diagram of warming system one embodiment of the utility model；

Fig. 5 is a kind of system control block figure of warming system one embodiment of the utility model.

Attached drawing mark: 1 heating module；11 hot chambers；12PTC heater；13 fixture blocks；21 cold chambers；22 semiconductor chilling plates；23 Water cooling adapter；231 water inlets；232 water outlets；24 water inlet pipes；25 water pumps；26 outlet pipes；27 sinks；3 air intake assemblies；31 into Port；32 first plate washers；33 second plate washers；34 drainpipes；4 go out pneumatic module；41 gas outlets；42 exhaust fans；43 support frames；44 stop Return chip architecture；441 insulation boards；442 spring torsional springs；5 control modules；51 first temperature sensors；52 second temperature sensors；53 Host computer；6 cooling fins；7 guidewire ports；8 display modules；81 display devices；82 instruction devices；9 host computers.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts Every other embodiment obtained, fall within the protection scope of the utility model.

Embodiment 1,

A kind of temp-sensing device, referring to Fig. 1 to 4, comprising:

Heating module 1, the PTC heater 12 including hot chamber 11 and in hot chamber 11, PTC heater 12 pass through fixture block 13 It is perpendicularly fixed on hot 11 inner wall of chamber, the present embodiment preferably uses 2 fixture blocks 13 to fix a PTC heater 12；

Refrigeration module, the semiconductor chilling plate 22 including cold chamber 21 and in cold chamber 21, semiconductor refrigerating 22 is embedded in cold In the cavity wall of chamber 21, towards in cold chamber 21, the heat of semiconductor chilling plate 22 is faced outside cold chamber 21 for the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 22, As seen from the figure, hot chamber 11 and cold chamber 21 are two independent cavitys, and cold chamber 21 is arranged side by side with hot chamber 11；

Air intake assembly 3, the air inlet 31 including being respectively arranged on 21 pedestal of hot chamber 11 and cold chamber, it is preferred that air inlet 31 is set It is set to U-type groove；

Pneumatic module 4 out, including be respectively arranged on the gas outlet 41 of hot chamber 11 and the top of cold chamber 21 and be set to gas outlet 41 and into Exhaust fan 42 between port 31, the face of blade of exhaust fan 42 is towards gas outlet 41.

Preferably, as shown in Figure 1, being equipped with two panels PTC heater 12 in hot chamber 11, PTC heater 12 passes through two fixture blocks 13 threaded connections are perpendicularly fixed on hot 11 inner wall of chamber, are not contacted with cavity wall, and the setting of 12 horizontal Tile of two panels PTC heater increases Big air-flow and 12 contact area of PTC heater, can be improved radiating efficiency；The model of PTC heater 12 according to temperature requirements into Row selection；In other embodiments, by the one or both sides in PTC heater 12 add cooling fin 6, carry out auxiliary heat dissipation with Hot chamber heating efficiency is improved, as shown in figure 3, adding the structural schematic diagram of cooling fin 6 for 12 two sides of PTC heater.

Preferably, as shown in the figures 1 and 2, two panels semiconductor chilling plate 22, two panels semiconductor chilling plate 22 are equipped in cold chamber 21 It is vertically embedded in the cavity wall of cold chamber 21 side by side, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 22 connects cooling fin 6 towards in cold chamber 21, excellent Choosing, it is connected using silica gel；The heat of semiconductor chilling plate 22 faces the outside of cold chamber 21, and connects water-cooled cooling component, preferably , water-cooled cooling component includes water cooling adapter 23, water inlet pipe 24, water pump 25, outlet pipe 26 and sink 27.Water cooling adapter 23 Connect semiconductor chilling plate 22 hot face, water cooling adapter 23 include water inlet 231 and water outlet 232, water inlet 231 connect into Water pipe 24 is drawn water from sink 27 using water pump 25, and water outlet 232 accesses sink 27 by outlet pipe 26.As shown in figure 4, this reality It applies and is equipped with two panels semiconductor chilling plate 22 in example, two water cooling adapters 23 are distinguished coupled, and two water inlets 231 are carried out Integration is flowed on water inlet pipe 24, and two water outlets 232 are carried out integration and are connected on outlet pipe 26, then unified connection screw clamp 27, as shown in figure 4, water pipe is silicone tube resistant to high temperature herein.

In other embodiments, when being unable to satisfy refrigeration demand, monolithic semiconductor cooling piece 22 is replaced with into the double-deck refrigeration Chip architecture, bilayer refrigeration chip architecture are that the hot face of the huyashi-chuuka (cold chinese-style noodles) and another chip semiconductor cooling piece of a piece of semiconductor chilling plate is pasted It closes, is then placed according to the form of monolithic semiconductor cooling piece 22, inwardly, heat faces outwardly huyashi-chuuka (cold chinese-style noodles), accelerates refrigerating speed.

Further, air intake assembly 3 further includes first baffle 32 for reducing hot 11 inlet channel of chamber and for reducing The setting position of second plate washer 33 of cold 21 inlet channel of chamber, first baffle 32 and the second plate washer 33 is higher than the top of air inlet 31 Boundary.Preferably, the area of first baffle 32 is the half of the intracavitary cavity horizontal cross-section of heat, the first plate washer 32 and the exhaust fan 42 Place plane is parallel, and the former inlet channel width of hot chamber 11 is made to reduce half；The length of second baffle 33 is equal to cold 21 internal cavity of chamber Length, width be cold 21 internal cavity of chamber it is wide 2/3rds.

Further, because semiconductor chilling plate 22 can generate water droplet in cold chamber 21 when freezing, by second baffle 33 and row Gas is fanned 42 planes and is arranged in certain inclination angle, and inclination angle is between 5 °~45 °, as shown in the figures 1 and 2, when for collecting refrigeration The water droplet of generation opens up an apopore in lowest part, apopore is connected to drainpipe 34, is used for the lowest part of the second plate washer 33 Water droplet is discharged into sink 27；Since the coolant-temperature gage that semiconductor chilling plate 22 generates is low, this advantageously reduces the temperature of water in sink 27 Degree, the cold cycling for reaching water to a certain extent utilize.

Further, exhaust fan 42 is set to the lower section of gas outlet 41, as shown in the figures 1 and 2.Exhaust fan 42 passes through support frame 43 are separately fixed in hot chamber 11 and cold chamber 21, and perpendicular to cavity wall, the face of blade of exhaust fan 42 is towards gas outlet 41；It is preferred that , gas outlet 41 be arranged to can external pipe circular port, and be equipped with chimb for clamping external pipe.

Further, pneumatic module 4 further includes non-return piece mechanism 44 for heat preservation out, and non-return piece mechanism 44 includes insulation board 441, spring torsional spring 442 and inside casing.Insulation board 441 is set to 42 lower section of exhaust fan, reserves between insulation board 441 and exhaust fan 42 A certain distance, guarantees to be stopped by exhaust fan 42 when insulation board 441 is rotated up, and two panels is equipped in each cavity and is protected Warm plate 441, every insulation board 441 are wherein connected to form rotary shaft by spring torsional spring 442 and cavity wall on one side, and inside casing is level Around cavity wall setting for limit the frame of 441 position of insulation board, inside casing and insulation board 441 close to and be set under insulation board Side, when intracavitary airless, insulation board 441 and inside casing are closed, when there is air stream drives, insulation board 441 enclose rotate around the axis to Upper opening acts similar open the door.

Further, temp-sensing device further includes the control module according to the temperature instruction control temp-sensing device work received 5, further, control module 5 includes the first temperature sensor 51 in hot chamber 11, the second temperature in cold chamber 21 Sensor 52, the slave computer 53 being mounted on 21 outer wall of hot chamber 11 or cold chamber；Wherein, semiconductor chilling plate 22, PTC heater 12, the first temperature sensor 51, second temperature sensor 52,42 connecting line of exhaust fan, which all pass through guidewire port 7 and be pierced by, is connected to bottom Machine 53, slave computer 53 are mounted on the rear end face of device, reduce the area of apparatus system, and as described in Figure 1, guidewire port 7 is set to hot chamber Near 11 air inlet 31.In other embodiments, connecting line can also be embedded in cavity wall.Preferably, slave computer Arduino Single-chip microcontroller.

Further, temp-sensing device further includes display module 8, display module 8 include: for showing in the hot chamber 11 and The instruction of the display device 81 of temperature and the working condition for being used to indicate PTC heater 12 and semiconductor chilling plate 22 in cold chamber 21 Device 82.Display device 81 is that two groups of charactrons show the temperature value in hot chamber 11 and cold chamber 21 respectively, in other embodiments, LCD screen can also be used in display device 81.Instruction device 82 is the work shape that two LED light indicate respectively hot chamber 11 and cold chamber 21 State, LED light can show two kinds of colors of reddish yellow, when for red, indicate that the cavity is in heating or refrigerating state, when for yellow When indicate cavity in temperature reached target temperature value, be in keeping warm mode.

Further, influencing each other for the temperature of reduction two chambers, the cavity wall of hot chamber 11 and cold chamber 21 is all made of guarantor Adiabator, or one layer of heat preservation material is coated in the inner cavity of hot chamber 11 and cold chamber 21.

Further, the present embodiment is using the voltage of power supply adaptor 12V to semiconductor chilling plate 22, PTC calandria 12 It is powered；Display module 8, the first temperature sensor 51, second temperature sensor 52, exhaust fan 42 are connected directly between slave computer It is powered and controls on 53；Water pump 25 is directly connected to 12V power supply adaptor.Those skilled in the art can be according to semiconductor The model of cooling piece 22 and PTC calandria 12 modifies power module accordingly.In other embodiments, PTC calandria When 12 voltage ratings are not 12V, voltage is become PTC using transformer by the power supply adaptor of connection 12V by slave computer 53 The voltage rating of calandria 12 carries out pressure stabilizing control using relay connection PTC calandria 12.The big portion of the device of the present embodiment Subassembly all uses low-voltage power supply, and energy consumption is lower.

Embodiment 2:

A kind of warming system, referring to Fig. 5, the temp-sensing device including host computer 9 and embodiment 1:

Host computer 9 receives the warming demand of scenario triggered and issues temperature instruction to temp-sensing device, includes in temperature instruction The type of air-flow and the target temperature range of air-flow are needed, needing the type of air-flow is cold airflow or thermal current, it is preferred that upper Machine is PC (PC)；

The control module 5 of temp-sensing device receives the temperature instruction, and controls the discharge of gas outlet 41 and need air-flow type Consistent and Current Temperatures meet the air-flow of target temperature range；

Host computer 9 is communicated to connect by slave computer 53 and temp-sensing device；Optionally, the connection of host computer 9 and slave computer 53 It can be carried out data transmission by USB interface, bluetooth, WiFi connection；

Slave computer 9 and semiconductor chilling plate 22, PTC heater 12, the first temperature sensor 51, second temperature sensor 52 Pass through conducting wire with, exhaust fan 42 and water pump 25 to connect.

The control method of embodiment medium temperature sensing system:

S1 host computer 9 receives the warming demand of scenario triggered, and sends temperature instruction to temp-sensing device, wraps in temperature instruction The target temperature range for including the type and air-flow that need air-flow, needing the type of air-flow is cold airflow or thermal current；Scenario triggered Warming demand may be cold or hot one of which, or require cold and hot two kinds of temperature simultaneously.

S2 control module 5 receives temperature instruction, and it is consistent with air-flow type is needed and current warm to control the discharge of gas outlet 41 Degree meets the air-flow of target temperature range.

S2 includes:

S21 slave computer 53 obtains the temperature instruction, and extraction needs air-flow type and target temperature range.

If desired air-flow type is thermal current to S211, and slave computer 53 obtains the first temperature of the first temperature sensor 51 measurement Value is compared with target temperature range, while real-time first temperature value of slave computer 53 is sent to display device 81, shows current hot chamber Gas flow temperature in 11.

If the first temperature value is located in target temperature range, slave computer 53 controls the rotation of the exhaust fan 42 in hot chamber 11, Under the driving of air-flow, the insulation board 441 in hot chamber 11 is rotated, and Current Temperatures consistent with air-flow type is needed are discharged in gas outlet 41 Meet the air-flow of target temperature range；The working condition of PTC heater 12 is sent to instruction dress in real time by slave computer 53 simultaneously Set 82, LED light is that yellow indicates that hot chamber 11 be in keeping warm mode, and in the present embodiment, instruction device 82 is two LED light, is distinguished The working condition of real-time display cold chamber 21 and hot chamber 11.

If the first temperature value, not in target temperature range, slave computer 53 passes through the size of current of control PTC heater 12 The temperature in hot chamber 11 is adjusted, non-return piece mechanism 44 is in the state of closure heat preservation at this time, and the insulation board 441 in hot chamber 11 is in bullet The effect of spring torsional spring 442 and inside casing are closed, while the working condition of PTC heater 12 is sent to instruction device by slave computer 53 82, LED light is red, indicates that hot chamber 11 belongs to heated condition, until the first temperature is fallen into target temperature range, LED light by Red becomes yellow, indicates that hot chamber 11 is in keeping warm mode.Slave computer 53 controls the rotation of the exhaust fan 42 in hot chamber 11, in air-flow Driving under, insulation board 441 in hot chamber 11 rotates, and gas outlet 41 is discharged and Current Temperatures consistent with air-flow type is needed and meets The air-flow of target temperature range；

If desired air-flow type is cold airflow to S212, and slave computer 53 obtains the second temperature that second temperature sensor 52 measures Value is compared with target temperature range；

If second temperature value is located in target temperature range, slave computer 53 controls cold intracavitary exhaust fan 42 and rotates, in gas Under the driving of stream, the insulation board 441 in cold chamber 21 is rotated, and the discharge of gas outlet 41 is consistent with air-flow type is needed and Current Temperatures accord with Close the air-flow of target temperature range；The working condition of semiconductor chilling plate 22 is sent to instruction dress in real time by slave computer 53 simultaneously 82 are set, LED light is that yellow indicates that cold chamber 11 is in keeping warm mode.

If second temperature value, not in target temperature range, slave computer 53 passes through the electric current tune of control semiconductor chilling plate 22 The temperature in cold chamber 21 is saved, non-return piece mechanism 44 is in the state of closure heat preservation at this time, and the insulation board 441 in cold chamber 21 is in spring The effect of torsional spring 442 and inside casing are closed, while the working condition of semiconductor chilling plate 22 is sent to instruction device by slave computer 53 82, LED light is red, indicates that cold chamber 21 belongs to refrigerating state, until second temperature is fallen into the target temperature range, LED Lamp becomes yellow from red, indicates that cold chamber 21 is in keeping warm mode.Slave computer 53 is controlled the exhaust fan 42 in refrigerating chamber 21 and is rotated, Under the driving of air-flow, the insulation board 441 in cold chamber 21 is rotated, and Current Temperatures consistent with air-flow type is needed are discharged in gas outlet 41 Meet the air-flow of target temperature range；

S22 slave computer 53 by control semiconductor chilling plate 22, PTC calandria 12, exhaust fan 42 electric current size, shape At an automatic negative feedback control loop, keeps gas outlet 41 that and Current Temperatures consistent with air-flow type is needed are discharged and meet target The air-flow of temperature range.

The utility model embodiment can be applied to the touch temperature induction of virtual reality or augmented reality, by using opening The communication module of hair can connect Unity3d virtual development engine, carry out communications, and then control the fortune of whole device Row, or the temperature for adjusting small range space in actual life.For example, can be applied in VR or AR environment, realize to fire The enhancing of the temperature tactile of flame or snowflake, can allow people really to experience rising or falling for temperature；In can be used for It learns in virtual experimental, it is virtual to the warming for chemically reacting cold and hot variation.

The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model Protection scope within.

Claims (10)

1. a kind of temp-sensing device characterized by comprising

Heating module, including hot chamber and the PTC heater intracavitary set on the heat, the PTC heater is vertically solid by fixture block Due on the hot cavity wall；

Refrigeration module, including cold chamber and set on the cold intracavitary semiconductor chilling plate, described in the semiconductor chilling plate insertion In the cavity wall of cold chamber, towards described cold intracavitary, the heat of the semiconductor chilling plate faces institute for the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate It states outside cold chamber, the cold chamber and the hot chamber are independent two cavitys, and the cold chamber and the hot chamber are arranged side by side；

Air intake assembly, the air inlet including being respectively arranged on the hot bottom of chamber seat and the cold bottom of chamber seat；

Pneumatic module out, including be respectively arranged on the hot top of chamber and the cold top of chamber gas outlet and be set to the gas outlet and Exhaust fan between the air inlet, the face of blade of the exhaust fan is towards the gas outlet.

2. temp-sensing device as described in claim 1, which is characterized in that the PTC heater single side is equipped with cooling fin or two-sided sets There is cooling fin.

3. temp-sensing device as described in claim 1, which is characterized in that the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate connects cooling fin, institute State the hot face connection water-cooled cooling component of semiconductor chilling plate.

4. temp-sensing device as described in claim 1, which is characterized in that the semiconductor chilling plate is the double-deck cooling piece, described double Layer cooling piece is that the huyashi-chuuka (cold chinese-style noodles) of a piece of semiconductor chilling plate be bonded with the hot face of another chip semiconductor cooling piece.

5. temp-sensing device as described in claim 1, which is characterized in that the air intake assembly further include for reduce the hot chamber into The first baffle in gas channel and the second plate washer for reducing the cold chamber inlet channel, the first baffle and the second plate washer The coboundary that position is higher than the air inlet is set.

6. temp-sensing device as claimed in claim 5, which is characterized in that plane where second plate washer and exhaust fan is in certain Inclination angle setting, the inclination angle are 5 °~45 °, the water droplet generated when for collecting the cold intracavitary refrigeration to the second gear The lowest part of plate, the lowest part are equipped with apopore.

7. temp-sensing device as described in claim 1, which is characterized in that the pneumatic module out further includes the non-return piece machine for heat preservation Structure, including insulation board, spring torsional spring and inside casing, the insulation board are set to below exhaust fan, and the insulation board wherein leads on one side It crosses the spring torsional spring and cavity wall is connected to form rotary shaft, the inside casing is the setting of horizontal circle cavity wall for limiting the guarantor The frame of warm Board position, the inside casing and the insulation board are close to the inside casing is set to the lower section of the insulation board, when intracavitary nothing When air-flow, the insulation board and the inside casing are closed, and when there is air stream drives, the insulation board is rotated around the shaft.

8. temp-sensing device as described in claim 1, it is characterised in that the cavity wall of hot chamber and the cold chamber is all made of thermal insulation material, or One layer of heat preservation material is coated in the inner cavity of the hot chamber and the cold chamber.

9. the temp-sensing device any one of as described in claim 1-8, which is characterized in that the temp-sensing device further includes display module.

10. temp-sensing device as claimed in claim 9, which is characterized in that the display module includes: for showing that the heat is intracavitary With the display device of the cold cavity temperature and it is used to indicate the working condition of the PTC heater and the semiconductor chilling plate Instruction device.