CN216793704U

CN216793704U - Packaging adhesive film for photovoltaic module

Info

Publication number: CN216793704U
Application number: CN202122665400.2U
Authority: CN
Inventors: 季志超; 吕松; 黄宝玉; 张刚; 徐炜琴; 刘俊; 陈书亮; 杨求平; 吴斌; 吴丰华
Original assignee: Changzhou Sveck Photovoltaic New Material Co ltd
Current assignee: Changzhou Sveck Photovoltaic New Material Co ltd
Priority date: 2021-11-01
Filing date: 2021-11-01
Publication date: 2022-06-21
Anticipated expiration: 2031-11-01

Abstract

The utility model discloses a packaging adhesive film for a photovoltaic module, which has a net-shaped structure with a specific rule, wherein the net-shaped structure can control the shape, size and spacing of holes through hole-opening equipment. The adhesive film with the net structure has the characteristic of low flow during lamination, and the adhesive film is matched with a conventional adhesive film for use, so that the conventional adhesive film can permeate into a battery through meshes during lamination, and forms good adhesion with the battery.

Description

Packaging adhesive film for photovoltaic module

Technical Field

The utility model relates to a packaging adhesive film for a photovoltaic module, in particular to a thin packaging adhesive film with a specific rule net structure.

Background

The assembly is divided into two processes of vacuum pumping and laminating in the packaging process. During lamination, the adhesive film flows to form good adhesion with the battery, glass, etc. assembly components. For white film adhesive films, a lower fluidity is required to reduce the defective white bleeding, and the white bleeding ratio is usually reduced by a pre-crosslinking treatment. The higher the pre-crosslinking is, the lower the white overflow ratio is, but the pre-crosslinking exceeds a certain degree, the hidden crack ratio of the battery piece is increased, and meanwhile, the bonding strength of the adhesive film, the battery and the glass is also reduced.

In addition, for the new generation of heterojunction battery, the future technology is directed to further reduce the silver consumption, and one important approach is to use the silver consumption reduced to 100 mg/sheet in combination with smartwire technology, which requires that grid lines are positioned and fixed with a specific thermoplastic film in advance, and then good electrical contact is formed through high-temperature welding equipment. However, the equipment used in this method is expensive, and the cost of the thermoplastic film used is also high.

Disclosure of Invention

In order to solve the above problems, an object of the present invention is to provide an encapsulant film for a photovoltaic module, which has low fluidity, and is used in combination with a conventional adhesive film to improve the reliability of bonding with a battery piece or glass, thereby further ensuring the stability of the photovoltaic module.

The technical proposal adopted by the utility model is that: a packaging adhesive film for a photovoltaic module is provided, which has a porous net structure.

Through above-mentioned scheme, through with the glued membrane trompil, can reduce the mobility of glued membrane to very low, solve the problem of excessive white. The adhesive film with the porous reticular structure is matched with a conventional adhesive film for use, and the welding strip can be electrically contacted with the battery well in a normal laminating mode. The conventional adhesive film penetrates through the through holes in the adhesive film with the porous net structure to the surface of the battery to form good adhesion, so that the adhesive film can be formed in one step, the preparation method is simple, a high-temperature welding step is not needed, and the cost of the heterojunction assembly can be greatly reduced.

As a preferred scheme of the utility model, the packaging adhesive film is provided with array type through holes.

Through using conventional glued membrane and the trompil glued membrane cooperation that hangs down, the lamination in-process, conventional glued membrane permeates to the battery piece surface through the trompil position, forms better bonding with the battery piece, and conventional glued membrane also has better bonding with glass to guarantee the reliability of subassembly, improve the life of subassembly.

As a preferable scheme of the present invention, the through hole is one of a diamond hole, a circular hole, an elliptical hole, a square hole or a triangular hole.

Through above-mentioned scheme, be regular array through-hole with the through-hole design, and the shape of through-hole is regular shape, can select the pertinence trompil according to the user demand, the die sinking mould is easy to be made, and is easy and simple to handle, promotes conventional rule glued membrane and permeates to battery piece surface homogeneity and adhesive force through the trompil position.

As a preferred scheme of the utility model, the area of the through hole (2) accounts for 3-30% of the surface area of the packaging adhesive film (1), and the area of the through hole is not less than 3.14mm²。

Through the scheme, the area size of the through hole is limited to be not less than 3.14mm2, and the conventional glue is ensured to smoothly permeate to the surface of the battery piece from the through hole.

As a preferable scheme of the utility model, the area of the through hole accounts for 3-30% of the surface area of the packaging adhesive film.

Through the scheme, the occupied area of the through holes is limited, so that the cost is saved on the premise of ensuring the mass transfer effect.

As a preferable scheme of the utility model, the minimum distance between the center points of the adjacent through holes is not less than 2 mm.

Through above-mentioned scheme, inject the minimum interval of central point of adjacent through-hole, mutual interference when avoiding the conventional glue infiltration of adjacent through-hole, improve the infiltration homogeneity to guarantee the intensity of network structure glued membrane.

As a preferable scheme of the utility model, the thickness of the adhesive film is 50-400 microns.

Through the scheme, the conventional glue with the penetration depth of the glue film can smoothly pass through in the laminating process, and meanwhile, the thickness of the glue film ensures that the conventional glue film, the battery piece or the glass are firmly bonded and cannot be separated after being laminated.

Compared with the prior art, the utility model has the beneficial effects that:

through opening the holes on the adhesive film, the fluidity of the adhesive film can be reduced to be very low, and the problem of white overflow is solved. Through using conventional glued membrane and the trompil glued membrane cooperation of low flow, during the lamination, conventional glued membrane permeates to the battery piece surface through the trompil position, forms better bonding with the battery piece, and conventional glued membrane also has better bonding with glass to guarantee the reliability of subassembly.

The low-temperature solder strip is fixed on the surface of the battery in a dispensing mode, and the adhesive film with the porous reticular structure is matched with a conventional adhesive film for use, so that the solder strip can be electrically contacted with the battery well only in a normal laminating mode. The conventional adhesive film penetrates to the surface of the battery through the through holes in the adhesive film with the porous net structure to form good adhesion, so that the adhesive film can be formed in one step, the preparation method is simple, the high-temperature welding step is not needed, and the cost of the heterojunction assembly can be greatly reduced.

Drawings

FIG. 1 is a schematic view illustrating a structure of a packaging adhesive film with a mesh structure according to an embodiment;

FIG. 2 is a schematic view of a second embodiment of a film structure of a mesh-structured packaging film;

FIG. 3 is a schematic view of a third embodiment of a film structure of a mesh-structured packaging film;

FIG. 4 is a schematic structural diagram of a packaging adhesive film with a mesh structure according to a fourth embodiment;

fig. 5 is a schematic structural diagram of five components of the embodiment.

The reference numbers in the figures are:

1, packaging an adhesive film; 2. a through hole; 3. glass; 4. packaging the adhesive film conventionally; 5. packaging the adhesive film with a net structure; 6. a battery; 7. a back plate.

Detailed Description

As shown in fig. 1 to 4, an encapsulant film for a photovoltaic module has a porous network structure.

A packaging adhesive film for a photovoltaic module is characterized in that the packaging adhesive film 1 has a porous net structure. Through opening the holes on the adhesive film, the fluidity of the adhesive film can be reduced to be very low, and the problem of white overflow is solved. The adhesive film with the porous reticular structure is matched with a conventional adhesive film for use, and the welding strip can be electrically contacted with the battery well in a normal laminating mode. The conventional adhesive film penetrates to the surface of the battery through the through holes in the adhesive film with the porous net structure to form good adhesion, so that the adhesive film can be formed in one step, the preparation method is simple, the high-temperature welding step is not needed, and the cost of the heterojunction assembly can be greatly reduced.

Furthermore, the packaging adhesive film 1 is provided with an array type through hole 2. Through using conventional glued membrane and the trompil glued membrane cooperation that hangs down, the lamination in-process, conventional glued membrane permeates to the battery piece surface through the trompil position, forms better bonding with the battery piece, and conventional glued membrane also has better bonding with glass to guarantee the reliability of subassembly, improve the life of subassembly.

Further, the through hole 2 is one of a diamond hole, a circular hole, an elliptical hole, a square hole or a triangular hole. Through-hole 2 is designed into regular array through-hole 2, and the shape of through-hole 2 is regular shape, can select the pertinence trompil according to the user's needs, and the die sinking mould is easy to be made, and is easy and simple to handle, promotes conventional rule glued membrane and permeates to battery piece surface homogeneity and adhesive force through the trompil position.

Further, as a preferable scheme of the utility model, the area of the through hole 2 is not less than 3.14mm²The size of the area of the through hole 2 is limited to be not less than3.14mm²And the conventional glue is ensured to smoothly permeate to the surface of the battery piece from the position of the through hole 2.

Furthermore, the area of the through hole 2 accounts for 3-30% of the surface area of the packaging adhesive film 1, so that the cost is saved on the premise of ensuring the mass transfer effect.

Further, the minimum pitch of the center points of the adjacent through holes 2 is not less than 2 mm. The minimum distance between the central points of the adjacent through holes 2 is limited, mutual interference when conventional glue of the adjacent through holes 2 permeates is avoided, permeation uniformity is improved, and the strength of the reticular structure glue film is ensured.

In order to clearly understand the technical contents of the present invention, the following examples are given in detail.

Example 1:

the structure of this embodiment is shown in FIG. 1, the thickness of the adhesive film is 50 μm, the through holes are circular holes, and the area of the through holes is 3.14mm²The distance between the central points of the transversely adjacent array through holes is 10mm, and the distance between the central points of the longitudinally adjacent array through holes is 8 mm.

Example 2:

the structure of this embodiment is shown in FIG. 2, the thickness of the adhesive film is 400 μm, the through holes formed in the adhesive film are elliptical holes, and the area of the through holes is 6.28mm²And the distance between the central points of the adjacent array through holes is 8 mm.

Example 3:

the structure of this embodiment is shown in FIG. 3, the thickness of the adhesive film is 100 μm, the through holes are diamond-shaped, and the area of the through holes is 24mm²And the distance between the central points of the adjacent array through holes is 10 mm.

Example 4:

the structure of this embodiment is shown in FIG. 4, the thickness of the adhesive film is 200 μm, the through holes formed in the adhesive film are square holes, and the area of the through holes is 36mm²And the distance between the central points of the adjacent array-type through holes is 16 mm.

Example 5:

in this embodiment, the assembly is shown in fig. 5, and includes, from top to bottom, a glass 3, a conventional packaging film 4, a mesh-structured packaging film 5, a battery 6, a mesh-structured packaging film 5, a conventional packaging film 4, and a back plate 7, in sequence, where the structure of the mesh-structured packaging film 5 is shown in embodiment 3, the conventional packaging film 4 is a common packaging film in the market, and the back plate 7 may be a common back plate or glass.

The foregoing is merely a preferred embodiment of the utility model and is not intended to limit the scope of the utility model, which is defined in the claims of this application, and all technical equivalents and modifications that can be made by any person skilled in the art are deemed to be within the scope of the utility model.

Claims

1. The packaging adhesive film for the photovoltaic module is characterized in that the packaging adhesive film (1) is of a porous net structure, and the packaging adhesive film (1) is provided with array-type through holes (2).

2. The encapsulant film for photovoltaic module as claimed in claim 1, wherein the through-hole (2) is one of a diamond-shaped hole, a circular hole, an elliptical hole, a square hole or a triangular hole.

3. The encapsulant film as claimed in claim 1, wherein the through-hole (2) has an area of not less than 3.14mm²。

4. The packaging film for photovoltaic module as claimed in claim 1, wherein the area of the through hole (2) is 3% to 30% of the surface area of the packaging film (1).

5. The encapsulant film for photovoltaic modules according to claim 1, wherein the minimum pitch of the center points of adjacent through holes (2) is not less than 2 mm.

6. The encapsulant film as claimed in claim 1, wherein the thickness of the encapsulant film is 50-400 μm.