CN209691769U - A kind of imbrication component with improvement adhesive property - Google Patents
A kind of imbrication component with improvement adhesive property Download PDFInfo
- Publication number
- CN209691769U CN209691769U CN201920519511.2U CN201920519511U CN209691769U CN 209691769 U CN209691769 U CN 209691769U CN 201920519511 U CN201920519511 U CN 201920519511U CN 209691769 U CN209691769 U CN 209691769U
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- CN
- China
- Prior art keywords
- cell piece
- conducting resinl
- strip cell
- strip
- adhesive property
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
It is provided by the utility model a kind of with the imbrication component for improving adhesive property, it is related to area of solar cell, the stacked wafer moudle can not only improve inaccuracy is bonded between component caused by the unstable problem of contact resistance, but also the consumption problem of electrocondution slurry can be reduced.A kind of imbrication component with improvement adhesive property of the utility model, including at least the first strip cell piece and the second strip cell piece, it is electrically connected between the first strip cell piece and the second strip cell piece by the way that the conducting resinl of segmental structure is arranged, the conducting resinl of the segmental structure is arranged in hollow out, and the width of the conducting resinl in hollow out setting is 150-500um.The beneficial effect is that: the utility model realizes cell piece front electrode for be electrically connected the first strip cell piece and the width of the conducting resinl of the second strip cell piece and contacts with the good of conducting resinl by increasing, and the consumption of electrocondution slurry is reduced by the setting for being in hollow out for the conducting resinl of segmental structure.
Description
Technical field
The utility model relates to area of solar cell, and in particular to a kind of with the imbrication component for improving adhesive property.
Background technique
Conventional photovoltaic battery component is generally realized between full wafer cell piece by using the connection type of welding welding
Circuit interconnection, this by using welding welding connecting mode to will lead to the electric current in circuit relatively large --- the electricity in circuit
Stream is equal to the electric current of full wafer cell piece, thus will cause higher power loss --- 12W.
The electric current that correlative study and volume production data demonstrate in circuit is lower, and power loss is smaller, component power output
Ability also stronger conclusion.Therefore.In order to reduce the electric current in circuit, the power loss of component, the technology of this field are reduced
Personnel expect to reduce the electric current in electric current, and then reducing the power loss in circuit by cutting cell piece.
Initially enter people's sight is half component, and 72 type half component output powers can be higher by same type full wafer group
Part 10W or so；As market acceptance is promoted, the imbrication component output power of higher power can be than 72 type full wafer group of same type
The high 20W or more of part.I.e. pass through laser is cut into multi-disc battery strip piece for cell piece to imbrication technology, then by a kind of printable
Conducting resinl is bonded bar shaped cell piece, and the welding welding interconnection between this method and full wafer cell piece is identical function.
Along with the mass production of imbrication subassembly product, imbrication component also exposes some problems, such as in imbrication group
In the production process of part, in order to reduce the consumption of conducting resinl, conducting resinl printing width may need to be reduced to 0.2mm or so,
And the width of the front electrode of cell piece is 0.5mm or so, therefore, can there is conducting resinl printing precision and battery strip piece bonding
The not high problem of alignment precision, or even there is also bonding dislocation, and then contact resistance is caused to increase, eventually lead to component power
The impaired problem of output.
In order to solve to reduce conducting resinl by using the printing width for reducing conducting resinl in above-mentioned imbrication component technology
Dosage caused by bonding excursion, and then caused contact resistance increase the problem of, and develop one kind can improve bonding not
The accurate and problem that causes contact resistance unstable, but imbrication component the problem of can reduce the consumption of electrocondution slurry is very
It is necessary.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of can both improve between component and are bonded
Inaccuracy and the problem that causes contact resistance unstable, and the imbrication component of the consumption problem of electrocondution slurry can be reduced.
It is provided by the utility model a kind of with the imbrication component for improving adhesive property, technical solution are as follows:
A kind of imbrication component with improvement adhesive property, it is characterised in that: the imbrication component includes at least first
Shape cell piece and the second strip cell piece pass through setting segmentation knot between the first strip cell piece and the second strip cell piece
The conducting resinl of structure is electrically connected, and the conducting resinl of the segmental structure is arranged in hollow out, and the width of the conducting resinl of the segmental structure is
150-500um。
It is provided by the utility model a kind of with the imbrication component for improving adhesive property, it further include following attached technical side
Case:
It wherein, is 5-90% in the hollow out rate of the conducting resinl of the segmental structure of hollow out setting.
Wherein, the shape of the hollow out of the conducting resinl of the segmental structure includes rectangle, ellipse or circle.
Wherein, the front of the first strip cell piece and the second strip cell piece is provided with front electrode and thin grid
The back side of line, the first strip cell piece and the second strip cell piece is provided with Al-BSF and rear electrode, and described first
Pass through the conduction of the setting segmental structure between the front electrode of strip cell piece and the front electrode of the second strip cell piece
Glue electrical connection.
Wherein, the first strip cell piece and the second strip cell piece are cut by laser full wafer battery and are formed.
The implementation of the utility model includes following technical effect:
It is provided by the utility model a kind of with the imbrication component for improving adhesive property, by that will be used to be electrically connected first
The width of shape cell piece and the second strip cell piece conducting resinl is set as 150-500um, to improve in the prior art because of cell piece
Front electrode it is not high with the bonding alignment precision of conducting resinl caused by contact resistance increase the problem of；By the way that conducting resinl is set
It is set to discrete segmental structure, and further the conducting resinl of discrete segmental structure is arranged in hollow out, to save conduction
The dosage of glue.Therefore, the present embodiment can be realized the good accessible premise in the front electrode and conducting resinl for guaranteeing cell piece
Under, farthest reduce the purpose of the dosage of conducting resinl.
Detailed description of the invention
Fig. 1 is the positive structure schematic of the full wafer battery of the utility model.
Fig. 2 is the structure schematic diagram of the full wafer battery of the utility model.
Fig. 3 is the positive structure schematic of the strip cell of the utility model.
Fig. 4 is the structure schematic diagram of the strip cell of the utility model.
Fig. 5 is the structural schematic diagram of the conducting resinl of the utility model.
Fig. 6 is the imbrication component scheme of installation of the utility model.
In figure, 1- the first strip cell piece, 2- the second strip cell piece, 3- conducting resinl, 4- front electrode, the thin grid line of 5-,
6- Al-BSF, 7- rear electrode.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
As shown in figures 1 to 6, provided by the utility model a kind of with the imbrication component for improving adhesive property, the imbrication group
Part includes at least the first strip cell piece 1 and the second strip cell piece 2, the first strip cell piece 1 and the second strip cell
It being electrically connected between piece 2 by the conducting resinl 3 of setting segmental structure, the conducting resinl 3 of the segmental structure is arranged in hollow out, and described point
The width of the conducting resinl of segment structure is 150-500um.The utility model will be by that will be used to be electrically connected the first strip cell piece and the
The width of two strip cell piece conducting resinls is set as 150-500um, with improve in the prior art because the front electrode of cell piece with
The problem of contact resistance increases caused by the bonding alignment precision of conducting resinl is not high；It is discrete by the way that conducting resinl to be arranged to
Segmental structure, and further the conducting resinl setting of discrete segmental structure is arranged in hollow out, to save the dosage of conducting resinl.
Therefore, under the premise of the present embodiment can be realized the good contact in the front electrode of guarantee cell piece and conducting resinl, maximum journey
Degree ground reduces the purpose of the dosage of conducting resinl.
In some preferred embodiments, the hollow out rate in the conducting resinl of the segmental structure of hollow out setting is 5-
90%.
In other preferred embodiments, when the segmental structure conducting resinl hollow out rate be 50%, conducting resinl
When width is 300um or so, the imbrication component energy conservation in the utility model enough saves conducting resinl 62.5% --- 62.5%=1-
50%* (100+50) %*50%.
Wherein, as shown in Figs 1-4, the front of the first strip cell piece 1 and the second strip cell piece 2 is provided with just
The back side of face electrode 4 and thin grid line 5, the first strip cell piece 1 and the second strip cell piece 2 is provided with 6 He of Al-BSF
Rear electrode 7, by setting between the front electrode of the first strip cell piece 1 and the front electrode 4 of the second strip cell piece 2
The conducting resinl 3 for setting the segmental structure is electrically connected.
Wherein, the first strip cell piece 1 and the second strip cell piece 2 are cut by laser full wafer battery and are formed.
Wherein, the shape of the hollow out of the conducting resinl 3 of the segmental structure includes rectangle, ellipse or circle.
Those skilled in the art will readily occur to its of the disclosure after considering specification and practicing disclosure disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (5)
1. a kind of with the imbrication component for improving adhesive property, it is characterised in that: the imbrication component includes at least the first strip
Cell piece and the second strip cell piece pass through setting segmental structure between the first strip cell piece and the second strip cell piece
Conducting resinl electrical connection, the conducting resinl of the segmental structure is in hollow out setting, the width of the conducting resinl of the segmental structure
150-500um。
2. according to claim 1 a kind of with the imbrication component for improving adhesive property, which is characterized in that be arranged in hollow out
The segmental structure conducting resinl hollow out rate be 5-90%.
3. according to claim 2 a kind of with the imbrication component for improving adhesive property, which is characterized in that the segmentation knot
The shape of the hollow out of the conducting resinl of structure includes rectangle, ellipse or circle.
4. according to claim 1-3 a kind of with the imbrication component for improving adhesive property, which is characterized in that institute
The front for stating the first strip cell piece and the second strip cell piece is provided with front electrode and thin grid line, the first strip electricity
The back side of pond piece and the second strip cell piece is provided with Al-BSF and rear electrode, the front electricity of the first strip cell piece
It is electrically connected between pole and the front electrode of the second strip cell piece by the way that the conducting resinl of the segmental structure is arranged.
5. according to claim 4 a kind of with the imbrication component for improving adhesive property, which is characterized in that described first
Shape cell piece and the second strip cell piece are cut by laser full wafer battery and are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920519511.2U CN209691769U (en) | 2019-04-17 | 2019-04-17 | A kind of imbrication component with improvement adhesive property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920519511.2U CN209691769U (en) | 2019-04-17 | 2019-04-17 | A kind of imbrication component with improvement adhesive property |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209691769U true CN209691769U (en) | 2019-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920519511.2U Active CN209691769U (en) | 2019-04-17 | 2019-04-17 | A kind of imbrication component with improvement adhesive property |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554767A (en) * | 2020-05-08 | 2020-08-18 | 泰州隆基乐叶光伏科技有限公司 | Conductive adhesive tape, laminated tile assembly and preparation method thereof |
-
2019
- 2019-04-17 CN CN201920519511.2U patent/CN209691769U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554767A (en) * | 2020-05-08 | 2020-08-18 | 泰州隆基乐叶光伏科技有限公司 | Conductive adhesive tape, laminated tile assembly and preparation method thereof |
| WO2021223415A1 (en) * | 2020-05-08 | 2021-11-11 | 泰州隆基乐叶光伏科技有限公司 | Conductive tape, imbricated assembly, and method for preparing conductive tape |
| CN111554767B (en) * | 2020-05-08 | 2023-11-03 | 芜湖隆基光伏科技有限公司 | Conductive adhesive tape, laminated tile assembly and preparation method thereof |
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