CN216771573U - Experimental device for measuring solid heat conductivity coefficient by quasi-steady state method - Google Patents
Experimental device for measuring solid heat conductivity coefficient by quasi-steady state method Download PDFInfo
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- CN216771573U CN216771573U CN202123301489.0U CN202123301489U CN216771573U CN 216771573 U CN216771573 U CN 216771573U CN 202123301489 U CN202123301489 U CN 202123301489U CN 216771573 U CN216771573 U CN 216771573U
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Abstract
The utility model discloses an experimental device for measuring solid heat conductivity coefficient by a quasi-steady state method, belonging to the technical field of thermophysical property test, and comprising a heating plate, a heat insulation plate, a fixing device, a fastening device, a device shell, a control circuit and a middle aluminum plate, wherein the heating plate consists of a power supply and a heating diaphragm; the heating plate is divided into a main plate and a protective plate which are respectively connected with a direct current power supply and a switching power supply, a platinum resistor temperature sensor in a control circuit is arranged on the heating plate, and uniform heat flow is realized through the two power supplies and the control circuit; the backplate completely cuts off external environment's influence, can make the quasi-steady state keep for a long time, satisfies the experiment test requirement. The hot plate both sides are total 4 same test pieces, and 2 heated boards have been placed in the test piece outside, fix through fixing device and fastener, reduce the thermal contact resistance of test piece and hot plate. The problem of heat can not one-dimensional transmission among the prior art effectively, judge whether reach the quasi-steady state through artifical reading potential difference, the experiment precision is lower is solved.
Description
Technical Field
The utility model belongs to the technical field of thermophysical property testing, and particularly relates to an experimental device for measuring solid heat conductivity coefficient by a quasi-steady state method.
Background
The thermal conductivity is one of the important thermophysical parameters of the material, reflects the thermal conductivity of the material, and has important application in the fields of petroleum, chemical engineering, energy, materials, military industry and the like. Meanwhile, the measurement of the heat conductivity coefficient is also a basic teaching experiment of the heat transfer science of colleges and universities. The measurement method of the thermal conductivity of the substance can be divided into two main categories, namely a steady state and an unsteady state. The steady state method is that a certain amount of heat is added to a sample, the process of heating and radiating reaches a balanced state, a stable temperature field is presented in the sample, and the heat conductivity coefficient is determined by measuring the amount of heat addition and the temperature difference. The principle of the steady state method is simple and clear, and the method is suitable for teaching, but the time for reaching the steady state is longer. The unsteady state method is characterized in that after heat is applied to a sample, the temperature distribution in the sample changes to form an unsteady temperature field, and the heat conductivity coefficient of the sample can be calculated by measuring the temperature change condition of the surface of the measured sample.
Due to the short testing time of the unsteady state method, rapid development is achieved in recent years, such as a transient hot wire method, a plane heat source method, a quasi-steady state method and the like, wherein the principle of the quasi-steady state method is simple, and the testing method is closer to the steady state method. Ideally, the quasi-steady state can be maintained for a long time, however, as the temperature rises, the heat dissipation all around is increased, and the system is separated from the quasi-steady state. In the prior quasi-steady-state method measuring device, the realization of one-dimensional heat flow mainly creates uniform heat flow by arranging a heating film and a soaking aluminum foil, and simultaneously coats a heat insulating material around a sample to reduce the heat dissipation around the sample, but the one-dimensional transfer of heat cannot be ensured; and along with the temperature rise, the heat leakage of the heat insulating layer is intensified, and the quasi-stable state can not be maintained for a long time; the thermocouple is arranged at the central point of the sample for temperature measurement, and the potential difference is manually read to judge whether the quasi-steady state is achieved, so that the experiment precision is low.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide an experimental device for measuring the heat conductivity of a solid by a quasi-steady state method, so as to solve the problems that in the prior art, heat cannot be transferred in one dimension, whether the quasi-steady state is achieved or not is judged by manually reading a potential difference, and the experimental precision is low.
In order to achieve the purpose, the utility model adopts the following technical scheme to realize the purpose:
the utility model discloses an experimental device for measuring solid heat conductivity coefficient by a quasi-steady state method, which comprises the following steps: the device comprises a fixing device, a device shell, a control circuit, an intermediate aluminum plate, a plurality of heating plates and a plurality of heat-insulating plates;
the fixing device is arranged on the device shell, the control circuit is connected with the middle aluminum plate and the heating plates, the heating plates are arranged in the middle of the heat insulation plate, the heating plates and the heat insulation plate are tightly fixed on the fixing device, and the heating plates and the control circuit are connected with the power supply;
the hot plate includes mainboard and backplate, and the mainboard is located in the middle of the backplate and mainboard and backplate coplanar.
Preferably, the control circuit includes: the device comprises a first temperature controller, a second temperature controller, a relay, a direct current power supply, a switching power supply, a first platinum resistor, a second platinum resistor and a third platinum resistor; the first temperature controller, the second temperature controller, the relay, the switching power supply and the protection plate form a closed loop, the first platinum resistor is arranged on the mainboard and electrically connected with the first temperature controller, the second platinum resistor is arranged on the protection plate and electrically connected with the second temperature controller, the third platinum resistor is arranged at the central position of the middle aluminum plate and connected with the computer, and the mainboard is connected with the direct-current power supply.
Preferably, the fixing device is provided with a slide way, a guide rail, a slide block and a cushion block; the slide sets up in fixing device bottom, and the guide rail sets up in fixing device top, and the slider uses with the guide rail cooperation, and cushion one end is fixed on the slider, and the other end is used for fixed test piece, and backplate bottom cooperatees with the slide.
Preferably, the guide rail and the slideway are both bolted to the fixing means.
Preferably, the main board and the guard board are composed of two heating films and two soaking aluminum plates fixed on two sides of the heating films, a gap is formed between the main board and the guard board, and the electric heating films of the main board and the guard board are mutually independent.
Preferably, the heating film is a film-shaped heating sheet consisting of a nichrome resistance wire and a polyimide heating film coated outside.
Preferably, a groove for connecting a control circuit is formed in the soaking aluminum plate.
Preferably, the utility model further comprises a fastening device, wherein one end of the fastening device is connected with the heat insulation plate, and the fastening device is provided with an external thread.
Preferably, a threaded hole through which the fastening device can pass is formed in one side of the fixing device.
Preferably, the heat insulation board is a polystyrene foam board.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model discloses an experimental device for measuring solid heat conductivity coefficient by a quasi-steady state method, wherein a heating plate is divided into a main plate and a guard plate, the temperature of the guard plate is enabled to track the temperature change of the main plate through a power supply and a control circuit, the heating condition of uniform heat flow is realized, the influence of the external environment is isolated, the uniformity of the temperature of the main plate and the one-dimensional transfer of heat are further realized, and the key problems that the quasi-steady state boundary condition of the conventional experimental device is difficult to completely realize and the quasi-steady state is difficult to maintain for a long time are solved; the heating plate and the heat-insulating plates are tightly fixed on the fixing device through the fastening device, and the contact thermal resistance is favorably reduced.
Further, the direct current power supply is used for heating the mainboard, the first platinum resistor measures the temperature of the mainboard and transmits a measurement signal to the first temperature controller and the second temperature controller, and the temperature of the mainboard is used as the set temperature of the second temperature controller; meanwhile, the temperature of the second platinum resistance measuring protection plate is transmitted and displayed on the second temperature controller, and the switch of the relay is controlled according to the difference value of the set temperature and the measured temperature on the second temperature controller, so that the on-off of the switching power supply is controlled; according to the method, the temperature of the mainboard can be tracked by the temperature of the guard plate, the influence of the external environment is isolated, and the uniformity of the temperature of the mainboard and the one-dimensional transfer of heat are further realized.
Furthermore, the fixing device is provided with a slide way, a guide rail, a sliding block and a cushion block test piece which are placed in the fixing device, so that the test piece is ensured to be in close contact with the heating plate and the heat insulation plate, and the thermal contact resistance is reduced.
Furthermore, the main board and the guard board are composed of two heating films and two soaking aluminum plates fixed on two sides of the heating films, and the soaking aluminum plates are pasted on the outer sides of the heating films so that the test piece is uniformly heated; be provided with a crack in the middle of mainboard and the backplate, the mainboard is independent with the electrical heating membrane of backplate each other, then the mainboard temperature does not receive the backplate influence, is favorable to isolated external environment to the interference of experiment test.
Furthermore, the heating film is a film-shaped heating sheet and consists of a nickel-chromium alloy resistance wire and a polyimide heating film coated outside, and the uniform heat flow of the experiment is facilitated.
Furthermore, a threaded hole through which the fastening device can pass is formed in one side of the fixing device, one end of the fastening device is connected with the heat insulation plate, and threads are arranged on the fastening device, so that the fastening device is matched with the fastening device, the test piece is in close contact with the heating plate and the heat insulation plate, and thermal contact resistance is reduced.
Furthermore, the heat insulation plate is a polystyrene foam plate, so that the heat conductivity coefficient is small, and the heat insulation effect is good.
Drawings
FIG. 1 is a schematic view of the apparatus of the present invention;
FIG. 2 is a schematic view of a heating film structure according to the present invention;
FIG. 3 is a layout of grooves on a soaking aluminum plate of the utility model;
FIG. 4 is a diagram showing the arrangement of the test pieces and the heating plate according to the present invention;
FIG. 5 is a circuit diagram of the temperature tracking control of the motherboard and the protection board according to the present invention.
Wherein: 1-a main board; 2-guard board; 3-heat insulation board; 4-a fixing device; 5-a slideway; 6-a guide rail; 7-a slide block; 8-cushion block; 9-a fastening device; 10-a device housing; 11-a control circuit; 12-a first temperature controller; 13-a second temperature controller; 14-a relay; 15-a direct current power supply; 16-a switching power supply; 17-a first platinum resistor; 18-a second platinum resistor; 19-a third platinum resistor; 20-on the first test piece; 21-a second test piece; 22-third test piece; 23-a fourth test piece; 24-intermediate aluminium sheet; 25-heating plate.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are capable of operation in sequences other than those illustrated or described herein. Moreover, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The utility model is described in further detail below with reference to the accompanying drawings:
the utility model discloses an experimental device for measuring solid heat conductivity coefficient by a quasi-steady state method, which comprises two heating plates 25, wherein each heating plate 25 consists of a main board 1 and a guard board 2, and further comprises a heat insulation board 3, a fixing device 4, a slide way 5, a guide rail 6, a slide block 7, a cushion block 8, a fastening device 9, a device shell 10 and a control circuit 11; the control circuit 11 is composed of a first temperature controller 12, a second temperature controller 13, a relay 14, a direct current power supply 15, a switching power supply 16, a first platinum resistor 17, a second platinum resistor 18 and a third platinum resistor 19.
The direct current power supply 15 is used for heating the mainboard 1, the first platinum resistor 17 measures the temperature of the mainboard 1 and transmits a measurement signal to the first temperature controller 12 and the second temperature controller 13, and the temperature of the mainboard 1 is used as the set temperature of the second temperature controller 13; meanwhile, the temperature of the guard plate 2 measured by the second platinum resistor 18 is transmitted and displayed on the second temperature controller 13, and the switch of the relay 14 is controlled according to the difference value between the set temperature and the measured temperature on the second temperature controller 13, so that the on-off of the switching power supply 16 is controlled; according to the method, the temperature of the protection plate 2 can track the temperature of the mainboard 1, the influence of the external environment is isolated, and the uniformity of the temperature of the mainboard 1 and the one-dimensional heat transfer are further realized.
Slider 7 is connected with cushion 8, and cushion 8 links to each other with backplate 2, and the device lower extreme is equipped with slide 5 and is used for fixing the test piece together with cushion 8, and fastener 9 links to each other with right side heated board 3, rotates fastener 9 and makes heated board 3 remove, drives test piece and backplate 2 and removes, guarantees test piece and hot plate 25 and heated board 3 in close contact with.
This device adopts four the same test pieces to place in proper order, places insulation material 3 in the outside of first test piece 20 and fourth test piece 23, places a hot plate 25 between first test piece 20 and second test piece 21, places 1 hot plate between third test piece 22 and the fourth test piece 23, and two hot plates 25 are the same completely, constitute by mainboard 1 and backplate 2, through same mains operated. Since the four test pieces are identical and the resistance values of the heating films are equal, if the same heating power is applied, a symmetrical surface for heat transfer, namely a heat insulation surface, can be constructed between the test pieces 21 and 22, the middle aluminum plate 24 is placed, and the third platinum resistor 19 is arranged for measuring the temperature of the heat insulation surface.
As shown in fig. 1, an experimental apparatus for measuring solid thermal conductivity by a quasi-steady state method includes a main board 1, a protection board 2, a thermal insulation board 3, a fixing device 4, a slideway 5, a guide rail 6, a slider 7, a cushion block 8, a fastening device 9, an apparatus housing 10, and a control circuit 11, where the control circuit 11 is composed of a first temperature controller 12, a second temperature controller 13, a relay 14, a dc power supply 15, a first platinum resistor 17, a second platinum resistor 18, and a third platinum resistor 19.
The main board 1 and the guard board 2 are respectively provided with a first platinum resistor 17 and a second platinum resistor 18 in a groove. Platinum resistance adopts 1.6 x 1 mm's chip self-control, and the lead wire is 0.2 mm's enameled copper line, and the fluting is gone up at soaking aluminum plate, as shown in fig. 3, the groove depth is 1mm, and the width is 2mm, and the lead wire groove depth is 0.5mm, and width 1mm, the gap is filled with heat conduction silicone grease and is leveled up, reduces the influence of the inslot air convection to temperature measurement behind the fluting.
Heated board 3 adopts the polystyrene foam board, and the left side part is glued on fixing device 4 with adiabatic glue, and the right side part is connected with fastener 9, has the screw thread on fastener 9, thereby screws through the rocker and applys pressure and step up the test piece. The fixing device 4 is connected with the guide rail 6 through screws, the cushion block 8 is connected with the guard plate 2 through screws and assembled with the sliding block 7 through a clamping groove, and the sliding block 7 can move left and right on the guide rail 6. The left side of the device is provided with an independent space for placing the control circuit 11.
Fig. 4 is a layout diagram of test pieces and a heating plate 25, wherein four identical test pieces are sequentially placed, and the heat insulation plate 3 is placed on the outer sides of the first test piece 20 and the fourth test piece 23. Be first test piece 20 from a left side to the right side in proper order, hot plate 25, second test piece 21, middle aluminum plate 24, third test piece 22, hot plate 25, fourth test piece 23, hot plate 25 comprises mainboard 1 and backplate 2, mainboard 1 applys same heating power through DC power supply 15, then construct the plane of symmetry of conducting heat between second test piece 21 and third test piece 22, adiabatic face promptly, thereby second test piece 21 and third test piece 22 all satisfy the one side and receive the heating of invariable heat flow, the adiabatic boundary condition of one side.
As shown in fig. 5, a circuit diagram of the present apparatus is given. The direct-current power supply 15 is used for supplying power to the mainboard 1, the heating circuit of the protection plate 2 is supplied with power by the switch power supply 16, the on-off of the heating circuit is controlled by the relay 14, and the direct-current power supply and the heating circuit of the mainboard 1 are mutually independent. The first platinum resistor 17 measures the temperature of the main board 1 and transmits and displays the temperature on the first temperature controller 12, and the first temperature controller 12 transmits the temperature signal of the temperature of the main board 1 to the second temperature controller 13 as the set temperature; meanwhile, the temperature signal of the guard plate 2 measured by the second platinum resistor 18 is transmitted and displayed on the second temperature controller 13, the switch of the relay 14 is controlled according to the difference value of the set temperature and the measured temperature on the second temperature controller 13, the on-off of the circuit is further controlled, and when the temperature of the guard plate 2 is lower than that of the main board 1, the relay 14 is switched on, so that the temperature of the guard plate 2 is increased; when the temperature of the protection plate 2 is higher than that of the mainboard 1, the relay is disconnected, according to the method, the temperature of the protection plate 2 can track the temperature of the mainboard 1, the influence of the external environment is isolated, and the uniformity of the temperature of the mainboard 1 and the one-dimensional transmission of heat are further realized. The third platinum resistor 19 is arranged in the center of the intermediate aluminum plate 24.
The working process of the utility model is as follows: the method comprises the following steps of taking organic glass as a test piece, placing the test piece on a slide way 5, fixing the test piece through a cushion block 8, aligning the test piece with a heating plate 25, symmetrically installing four test pieces, optionally placing two test pieces between two heating plates 25 to construct an insulating surface, and respectively placing the other two test pieces on two sides, namely respectively placing the test pieces between the heating plates 25 and an insulation plate 3; the fastening device 9 is rotated, the heat insulation plate 3 moves leftwards, the sliding block 7 moves on the guide rail 6 and drives the heating plate 25 to move and the test piece to move on the slide rail 5 until the test piece is in close contact with the heating plate 25 and the heat insulation plate 3.
The heating plate 25 mainboard is connected with a direct current power supply, the guard plate is connected with a switching power supply, the platinum resistor is respectively connected with a temperature controller and a data acquisition system, and the data acquisition system consists of a multimeter and a computer and is used for realizing data acquisition and operation. Starting a direct-current power supply and a data acquisition system, adjusting voltage, heating a mainboard, observing the condition that the temperature of the protection plate is changed along with the temperature of the mainboard through a temperature controller, simultaneously observing a temperature rise curve in the data acquisition system and a temperature difference curve of a heating surface and a heat insulation surface, wherein when the temperature difference curve is more gentle, namely, a change value is less than 0.1 ℃ in 10 minutes, the system can be considered to enter a quasi-stable state.
Selecting data after entering quasi-steady state, and averaging the difference value between the temperature of the two heating surface main boards and the temperature of the heat insulation surface to obtain delta tmaxReading the voltage and current values to calculate the heating power phi, measuring the thickness d and area A of the sample, and substituting the thickness d and area A into a heat conductivity coefficient calculation formula
The heat conductivity coefficient of the organic glass sample can be obtained.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (10)
1. The utility model provides an experimental apparatus for solid coefficient of heat conductivity is measured to quasi-steady state method which characterized in that includes: the device comprises a fixing device (4), a device shell (10), a control circuit (11), a middle aluminum plate (24), a plurality of heating plates (25) and a plurality of heat-insulating plates (3);
the fixing device (4) is arranged on the device shell (10), the control circuit (11) is connected with the middle aluminum plate (24) and the plurality of heating plates (25), the heating plates (25) are arranged in the middle of the heat insulation plate (3), the heating plates (25) and the heat insulation plate (3) are tightly fixed on the fixing device (4), and the heating plates (25) and the control circuit (11) are connected with the power supply;
the heating plate (25) comprises a main plate (1) and a protection plate (2), wherein the main plate (1) is located in the middle of the protection plate (2), and the main plate (1) and the protection plate (2) are coplanar.
2. Experimental apparatus for measuring the thermal conductivity of solids according to the quasi-steady state method of claim 1, characterized in that said control circuit (11) comprises: the device comprises a first temperature controller (12), a second temperature controller (13), a relay (14), a direct current power supply (15), a switching power supply (16), a first platinum resistor (17), a second platinum resistor (18) and a third platinum resistor (19); the first temperature controller (12), the second temperature controller (13), the relay (14), the switching power supply (16) and the protection plate (2) form a closed loop, the first platinum resistor (17) is arranged on the main board (1) and is electrically connected with the first temperature controller (12), the second platinum resistor (18) is arranged on the protection plate (2) and is electrically connected with the second temperature controller (13), the third platinum resistor (19) is arranged at the central position of the middle aluminum plate (24) and is connected with the computer, and the main board (1) is connected with the direct current power supply (15).
3. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method according to claim 1, wherein the fixing device (4) is provided with a slide way (5), a guide rail (6), a slide block (7) and a cushion block (8); slide (5) set up in fixing device (4) bottom, and guide rail (6) set up in fixing device (4) top, and slider (7) and guide rail (6) cooperation are used, and cushion (8) one end is fixed on slider (7), and the other end is used for fixed test piece, and backplate (2) bottom cooperatees with slide (5).
4. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method according to claim 3, wherein the guide rail (6) and the slideway (5) are both fixed on the fixing device (4) by bolts.
5. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method according to claim 1, wherein the main plate (1) and the protective plate (2) are composed of two heating films and two soaking aluminum plates fixed on two sides of the heating films, a gap is arranged between the main plate (1) and the protective plate (2), and the electric heating films of the main plate (1) and the protective plate (2) are independent from each other.
6. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method as claimed in claim 5, wherein the heating film is a film type heating sheet consisting of a nichrome resistance wire and a polyimide heating film coated outside.
7. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method according to claim 5, wherein the soaking aluminum plate is provided with a groove for connecting a control circuit (11).
8. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady-state method according to claim 1, further comprising a fastening device (9), wherein one end of the fastening device (9) is connected with the insulation board (3), and an external thread is arranged on the fastening device (9).
9. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method according to claim 8, wherein one side of the fixing device (4) is provided with a threaded hole through which the fastening device (9) can pass.
10. The experimental device for measuring the thermal conductivity of the solid by the quasi-steady state method according to claim 1, wherein the heat-insulating plate (3) is a polystyrene foam plate.
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| CN114152643A (en) * | 2021-12-25 | 2022-03-08 | 西安交通大学 | Experimental device and method for measuring heat conductivity coefficient by quasi-steady state method |
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