CN102230841A - Controlled infrared planar radiative heat source with high degree of homogeneity - Google Patents
Controlled infrared planar radiative heat source with high degree of homogeneity Download PDFInfo
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- CN102230841A CN102230841A CN2011100698221A CN201110069822A CN102230841A CN 102230841 A CN102230841 A CN 102230841A CN 2011100698221 A CN2011100698221 A CN 2011100698221A CN 201110069822 A CN201110069822 A CN 201110069822A CN 102230841 A CN102230841 A CN 102230841A
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Abstract
With the development of infrared imaging technologies and probing technologies, detection equipment applied to infrared imaging and probing systems is the important research object in the infrared optics fields; and planar array simulation equipment for generating standard infrared target sources is the main content in detection equipment of infrared imaging devices. According to the infrared radiation mechanism, the simulation equipment is realized by controlling radiation temperature on the surfaces of simulated target boards usually. The controlled infrared planar radiative heat source is a high-accuracy controlled heat source for a simulation system and can provide controlled thermal power output for the standard infrared target sources. The operating principle of the infrared planar radiative heat source is as follows: an electronic copper-cladding technology is utilized to deposit and form copper resistance wires with certain patterns on a planar substrate made of thermal insulation materials; and the copper conductivity and the linear stability of temperature are utilized to control the high-accuracy thermal power output on a temperature control board of the infrared planar radiative source under the condition of a certain voltage. The manufacturing technology of the temperature control board is simple; the relationship linearity of the resistance and the temperature is good, thus being convenient to modify output power; the wire distribution is diverse, thus being easy to generate even heat radiation; and the thermal power output is simple in control and high in accuracy.
Description
Technical field
The present invention relates to temperature control Infrared Heating field, be a kind of be used under the far field condition than large tracts of land, the controlled infrared surface radiation thermal source of high evenness.
Background technology
The development of infrared remote sensing technology need be assessed accurately to the infrared optical system performance parameter.And often need make assessment to the far-field optics characteristic of infrared system.The standard infrared analog object of big bin is a main tool of estimating infrared optical system, and far field surface radiation thermal source is the key element of infrared radiation.Present most infrared analog object all adopts blackbody radiation source as the infrared emanation element, Fig. 1 is typical blackbody radiation source cavity body structure synoptic diagram, well heater (1) parcel blackbody chamber (2) also heats blackbody chamber (2), send heat radiation after making it to be heated, radiation energy makes cavity temperature even at cavity inner surface through repeatedly reflecting, absorbing.Simultaneously by blackbody chamber temperature element (3), (4) monitoring blackbody chamber temperature.Between the basic comprising form of blackbody radiation source, in order to reach the consistance of blackbody radiation face source surface temperature, the accent (5) of black matrix furnace chamber one end is that the useful area of blackbody radiation source can not done very greatly, and the diameter of common big extend blackbody is about 200mm.This kind blackbody radiation source generally is used for the laboratory to various big or be that the system of detected object carries out test calibration work to the higher target source of energy requirement with range of temperature.The conventional infrared environment imaging system of night vision device is operated in the infrared band of 8 to 12 μ m, and the temperature of corresponding peak wavelength is :-30 ℃ to+80 ℃.For the detection of far field Far-Infrared System, infrared the battle array simulated target source of developing this temperature range is with significant.
Big bin infrared simulation image under the far field condition should be produced by a large amount of infrared surface radiation unit.If directly adopt the radiating element of common blackbody radiation source as infrared battle array simulated target, increase along with number of unit, the complicacy of its technology and test macro and high cost are that general data is difficult to bear, and the range of application of conventional blackbody radiation source is far above in the test of far field characteristic far infrared optical system, can cause a large amount of wastings of resources.Be that 8 to 12 microns the large-scale planar array radiation simulated target of infrared band is developed infrared source radiation source of a kind of technology high uniformity easy, with low cost and will be had great application prospect.
Summary of the invention
The object of the invention is to provide a kind of high evenness controlled infrared surface radiation thermal source.This heat power supply device has higher temperature homogeneity and controllability, can provide electrical heating for infrared target face source unit.And having lower cost and favorable manufacturability, the standard target source that can be (wave band is 8 to 12 microns) under the far infrared radiation environment provides thermal source.The controlled infrared surface radiation heat source configurations of high evenness provided by the invention is made of emissivity coating (6), aluminium sheet (7), heat-conducting silicone grease layer (8), copper-clad plate and heater circuit (9) thereof as shown in Figure 2.Because it is very ripe that electronics covers process for copper, can effectively reduce cost of manufacture, and the circuit form in the copper-clad plate can adopt multiple wire laying mode flexibly, as Fig. 4 hibert curve, Fig. 5 helix form, guarantees uniform heat flow density.The Joule's law and the copper resistance temperature variation curve (Fig. 3) of energising thermal resistance can be realized infrared area radiation source high precision thermal power output control.Simultaneously suitably reduce the live width of circuit in area radiation source edge, the resistance value that can increase copper conductor effectively compensates the thermal loss of edge to increase the heating power of area radiation source edge, makes area radiation source reach heat flow density more uniformly.Aluminium has bigger specific heat capacity (0.88 * 10
3J/kg ℃)) and good heat conductivity (coefficient of heat conductivity is 237W/m ℃), adopt the base material of aluminium sheet as the emissivity coating, help keeping the environmental stability of radiation output.Coating material can be selected the product of different emissivity according to the specific tasks demand for use.This infrared surface radiation thermal source manufacture craft is simple; The resistance and the temperature relation linearity are good, are convenient to the output power correction; And the wiring diversification is easy to produce even heat radiation; Thermal power output control is simple, the precision height.
Technical problem underlying and good effect thereof that the present invention can solve are:
1, can provide the output of high evenly hot-fluid for the infrared surface radiation simulated target in big face source.Its technology is simple, and the Controllable Temperature precision reaches the level (being about≤0.1 ℃) of black matrix of the same type.
2, its cost of manufacture is far below similar applicable product.
Description of drawings
Fig. 1 blackbody radiation source structural representation.
The infrared surface radiation heat source configurations of Fig. 2 synoptic diagram is also as Figure of abstract.
Fig. 3 copper resistance temperature variation curve.
Fig. 4 hibert curve synoptic diagram.
Fig. 5 helix synoptic diagram.
1 well heater among the figure; 2 blackbody chambers; 3 black matrix temperature elements; 4 blackbody chamber temperature elements; 5 accents; 6 high emissivity coatings; 7 aluminium sheets; 8 heat-conducting silicone greases; 9 copper-clad plates and circuit thereof; 10 supply sockets;
Embodiment
The copper-clad plate heat-barrier material has heat-insulation and heat-preservation and supporting role as the base material that covers copper conductor, can select for use PCB to make the bin substrate.Utilize electronics to cover process for copper, deposition forms the copper resistance silk of certain pattern on the substrate heat-barrier material.In order to reduce the control difficulty of subsequent conditioning circuit, can adopt the mode of operation of low-voltage, high-current, can adopt following running parameter:
Working power U=24V;
Working current I
Max〉=2A;
System's peak power output is P
Max=50W;
Resistance is R=12.5 Ω (temperature 20 ℃ time).
Draw according to the relation of covering copper thickness, live width and electric current: cover copper thickness 50um, conductor width 1mm, wiring is 0.6mm at interval.The useful area of infrared source is 250mm * 250mm.Copper conductor can adopt multiple wiring form, as the form (shown in Figure 4) or the helix form (shown in Figure 5) that can adopt hibert curve (space filling curve).Hibert curve can be filled square 2 dimension spaces of any size uniformly, make that curve being evenly distributed on the vertical and horizontal space is equal, avoided owing to heater circuit produces graded because of the temperature that skewness causes, thereby guaranteed higher temperature homogeneity in the anisotropic medium.After circuit is connected, the copper conductor radiant heat energy, through thermal energy exchange, thermal power is given aluminium sheet (7) by thick heat-conducting silicone grease layer (8) conduction of about 0.5mm, and by outwards radiated infrared heat radiation of emissivity coating (6).By a large amount of radiant heat source cellular arraies, can finish simulation to far infrared surface source, far field target infrared characteristic.
Claims (2)
1. controlled infrared surface radiation thermal source of high evenness is characterized in that: by 8, high emissivity coating 9, aluminium sheet 10, heat conductive silica gel 11, copper-clad plate and circuit 12 thereof, power line form.
2. the controlled infrared surface radiation thermal source of high evenness according to claim 1 is characterized in that: adopt electronics to cover process for copper, make the infrared radiation thermal source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100698221A CN102230841A (en) | 2011-03-23 | 2011-03-23 | Controlled infrared planar radiative heat source with high degree of homogeneity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100698221A CN102230841A (en) | 2011-03-23 | 2011-03-23 | Controlled infrared planar radiative heat source with high degree of homogeneity |
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| CN102230841A true CN102230841A (en) | 2011-11-02 |
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| CN2011100698221A Pending CN102230841A (en) | 2011-03-23 | 2011-03-23 | Controlled infrared planar radiative heat source with high degree of homogeneity |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103278311A (en) * | 2013-05-16 | 2013-09-04 | 中国电子科技集团公司第四十一研究所 | Uniformity measurement device and method for infrared radiation surface |
| CN103759587A (en) * | 2013-12-20 | 2014-04-30 | 河北汉光重工有限责任公司 | Ultra-low cost infrared tooling target simulator |
| CN104427770A (en) * | 2013-09-10 | 2015-03-18 | 上海空间电源研究所 | Method for manufacturing power line of modular power supply controller on printed circuit board |
| CN105142245A (en) * | 2015-09-14 | 2015-12-09 | 姚永平 | Vehicle infrared bait |
| CN105547496A (en) * | 2016-02-02 | 2016-05-04 | 中国计量学院 | Minimum temperature resolution testing device and testing method |
| CN107677375A (en) * | 2017-09-21 | 2018-02-09 | 中国科学院长春光学精密机械与物理研究所 | A kind of infrared radiation measurement system robot scaling equipment and calibrating method |
| CN111141393A (en) * | 2019-12-31 | 2020-05-12 | 航天新气象科技有限公司 | Black body radiation device for simulating meteorological environment |
| CN114293424A (en) * | 2022-01-10 | 2022-04-08 | 中建五局土木工程有限公司 | Winter construction heating maintenance method for base layer in cold region |
| WO2024109655A1 (en) * | 2022-11-25 | 2024-05-30 | 比亚迪股份有限公司 | Infrared heating panel, infrared baking device, and infrared baking system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518779A (en) * | 1992-12-16 | 1996-05-21 | Industrial Technology Research Institute | Forming copper clad laminates |
| CN2403197Y (en) * | 2000-01-07 | 2000-10-25 | 中国人民解放军军械工程学院 | Temp. controlled heat source with uniform distribution of temp. |
| CN2571108Y (en) * | 2002-09-25 | 2003-09-03 | 时利华 | Far-infrared radiation heating source |
-
2011
- 2011-03-23 CN CN2011100698221A patent/CN102230841A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518779A (en) * | 1992-12-16 | 1996-05-21 | Industrial Technology Research Institute | Forming copper clad laminates |
| CN2403197Y (en) * | 2000-01-07 | 2000-10-25 | 中国人民解放军军械工程学院 | Temp. controlled heat source with uniform distribution of temp. |
| CN2571108Y (en) * | 2002-09-25 | 2003-09-03 | 时利华 | Far-infrared radiation heating source |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103278311A (en) * | 2013-05-16 | 2013-09-04 | 中国电子科技集团公司第四十一研究所 | Uniformity measurement device and method for infrared radiation surface |
| CN103278311B (en) * | 2013-05-16 | 2015-12-09 | 中国电子科技集团公司第四十一研究所 | A kind of infrared radiation surface uniformity measurement mechanism and method |
| CN104427770A (en) * | 2013-09-10 | 2015-03-18 | 上海空间电源研究所 | Method for manufacturing power line of modular power supply controller on printed circuit board |
| CN103759587A (en) * | 2013-12-20 | 2014-04-30 | 河北汉光重工有限责任公司 | Ultra-low cost infrared tooling target simulator |
| CN105142245A (en) * | 2015-09-14 | 2015-12-09 | 姚永平 | Vehicle infrared bait |
| CN105547496A (en) * | 2016-02-02 | 2016-05-04 | 中国计量学院 | Minimum temperature resolution testing device and testing method |
| CN105547496B (en) * | 2016-02-02 | 2018-10-26 | 中国计量学院 | Minimum temperature resolving power testing device and its test method |
| CN107677375A (en) * | 2017-09-21 | 2018-02-09 | 中国科学院长春光学精密机械与物理研究所 | A kind of infrared radiation measurement system robot scaling equipment and calibrating method |
| CN111141393A (en) * | 2019-12-31 | 2020-05-12 | 航天新气象科技有限公司 | Black body radiation device for simulating meteorological environment |
| CN114293424A (en) * | 2022-01-10 | 2022-04-08 | 中建五局土木工程有限公司 | Winter construction heating maintenance method for base layer in cold region |
| WO2024109655A1 (en) * | 2022-11-25 | 2024-05-30 | 比亚迪股份有限公司 | Infrared heating panel, infrared baking device, and infrared baking system |
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Application publication date: 20111102 |