CN102230841A - Controlled infrared planar radiative heat source with high degree of homogeneity - Google Patents
Controlled infrared planar radiative heat source with high degree of homogeneity Download PDFInfo
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- CN102230841A CN102230841A CN2011100698221A CN201110069822A CN102230841A CN 102230841 A CN102230841 A CN 102230841A CN 2011100698221 A CN2011100698221 A CN 2011100698221A CN 201110069822 A CN201110069822 A CN 201110069822A CN 102230841 A CN102230841 A CN 102230841A
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- copper
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- 230000005855 radiation Effects 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000004411 aluminium Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000741 silica gel Substances 0.000 claims 1
- 229910002027 silica gel Inorganic materials 0.000 claims 1
- 238000004088 simulation Methods 0.000 abstract description 6
- 238000001514 detection method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012937 correction Methods 0.000 abstract description 2
- 238000011161 development Methods 0.000 abstract description 2
- 238000003331 infrared imaging Methods 0.000 abstract 3
- 238000005253 cladding Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 230000005457 Black-body radiation Effects 0.000 description 9
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000004519 grease Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 206010006895 Cachexia Diseases 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 208000016318 wasting Diseases 0.000 description 1
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Abstract
随着红外成像技术与探测技术的发展，应用于红外成像与探测系统的检测设备也成为红外光学领域中的重要研究对象，而用于产生标准红外目标源的面阵模拟设备，是红外成像器件检测设备的主要内容。根据红外辐射的机理，这一模拟设备通常是通过控制模拟目标板的表面辐射温度来实现。本发明主要为这一模拟系统提供高精度可控热源，可为高于环境温度的标准红外目标源提供可控热功率输出。其工作原理为：利用电子覆铜工艺，在由隔热材料制成的面元基底沉积形成一定图案的铜电阻丝，利用铜电导率与温度的线性稳定特性，在通以一定电压下，可实现红外面辐射源温控板高精度热功率输出控制。该温控板制作工艺简单；电阻与温度关系线性度好，便于输出功率修正；布线多元化，易于产生均匀热辐射；热功率输出控制简单，精度高。
With the development of infrared imaging technology and detection technology, detection equipment used in infrared imaging and detection systems has also become an important research object in the field of infrared optics, and the area array simulation equipment used to generate standard infrared target sources is an infrared imaging device. The main content of the detection equipment. According to the mechanism of infrared radiation, this simulation device is usually realized by controlling the surface radiation temperature of the simulation target board. The invention mainly provides a high-precision controllable heat source for this simulation system, and can provide a controllable heat power output for a standard infrared target source with a temperature higher than the environment. Its working principle is: use the electronic copper cladding process to deposit a certain pattern of copper resistance wires on the panel base made of heat insulating materials, and use the linear stability characteristics of copper conductivity and temperature to pass a certain voltage. Realize the high-precision thermal power output control of the infrared surface radiation source temperature control board. The manufacturing process of the temperature control board is simple; the linearity of the relationship between resistance and temperature is good, which is convenient for output power correction; the wiring is diversified, and it is easy to generate uniform heat radiation; the thermal power output control is simple and the precision is high.
Description
Technical field
The present invention relates to temperature control Infrared Heating field, be a kind of be used under the far field condition than large tracts of land, the controlled infrared surface radiation thermal source of high evenness.
Background technology
The development of infrared remote sensing technology need be assessed accurately to the infrared optical system performance parameter.And often need make assessment to the far-field optics characteristic of infrared system.The standard infrared analog object of big bin is a main tool of estimating infrared optical system, and far field surface radiation thermal source is the key element of infrared radiation.Present most infrared analog object all adopts blackbody radiation source as the infrared emanation element, Fig. 1 is typical blackbody radiation source cavity body structure synoptic diagram, well heater (1) parcel blackbody chamber (2) also heats blackbody chamber (2), send heat radiation after making it to be heated, radiation energy makes cavity temperature even at cavity inner surface through repeatedly reflecting, absorbing.Simultaneously by blackbody chamber temperature element (3), (4) monitoring blackbody chamber temperature.Between the basic comprising form of blackbody radiation source, in order to reach the consistance of blackbody radiation face source surface temperature, the accent (5) of black matrix furnace chamber one end is that the useful area of blackbody radiation source can not done very greatly, and the diameter of common big extend blackbody is about 200mm.This kind blackbody radiation source generally is used for the laboratory to various big or be that the system of detected object carries out test calibration work to the higher target source of energy requirement with range of temperature.The conventional infrared environment imaging system of night vision device is operated in the infrared band of 8 to 12 μ m, and the temperature of corresponding peak wavelength is :-30 ℃ to+80 ℃.For the detection of far field Far-Infrared System, infrared the battle array simulated target source of developing this temperature range is with significant.
Big bin infrared simulation image under the far field condition should be produced by a large amount of infrared surface radiation unit.If directly adopt the radiating element of common blackbody radiation source as infrared battle array simulated target, increase along with number of unit, the complicacy of its technology and test macro and high cost are that general data is difficult to bear, and the range of application of conventional blackbody radiation source is far above in the test of far field characteristic far infrared optical system, can cause a large amount of wastings of resources.Be that 8 to 12 microns the large-scale planar array radiation simulated target of infrared band is developed infrared source radiation source of a kind of technology high uniformity easy, with low cost and will be had great application prospect.
Summary of the invention
The object of the invention is to provide a kind of high evenness controlled infrared surface radiation thermal source.This heat power supply device has higher temperature homogeneity and controllability, can provide electrical heating for infrared target face source unit.And having lower cost and favorable manufacturability, the standard target source that can be (wave band is 8 to 12 microns) under the far infrared radiation environment provides thermal source.The controlled infrared surface radiation heat source configurations of high evenness provided by the invention is made of emissivity coating (6), aluminium sheet (7), heat-conducting silicone grease layer (8), copper-clad plate and heater circuit (9) thereof as shown in Figure 2.Because it is very ripe that electronics covers process for copper, can effectively reduce cost of manufacture, and the circuit form in the copper-clad plate can adopt multiple wire laying mode flexibly, as Fig. 4 hibert curve, Fig. 5 helix form, guarantees uniform heat flow density.The Joule's law and the copper resistance temperature variation curve (Fig. 3) of energising thermal resistance can be realized infrared area radiation source high precision thermal power output control.Simultaneously suitably reduce the live width of circuit in area radiation source edge, the resistance value that can increase copper conductor effectively compensates the thermal loss of edge to increase the heating power of area radiation source edge, makes area radiation source reach heat flow density more uniformly.Aluminium has bigger specific heat capacity (0.88 * 10
3J/kg ℃)) and good heat conductivity (coefficient of heat conductivity is 237W/m ℃), adopt the base material of aluminium sheet as the emissivity coating, help keeping the environmental stability of radiation output.Coating material can be selected the product of different emissivity according to the specific tasks demand for use.This infrared surface radiation thermal source manufacture craft is simple; The resistance and the temperature relation linearity are good, are convenient to the output power correction; And the wiring diversification is easy to produce even heat radiation; Thermal power output control is simple, the precision height.
Technical problem underlying and good effect thereof that the present invention can solve are:
1, can provide the output of high evenly hot-fluid for the infrared surface radiation simulated target in big face source.Its technology is simple, and the Controllable Temperature precision reaches the level (being about≤0.1 ℃) of black matrix of the same type.
2, its cost of manufacture is far below similar applicable product.
Description of drawings
Fig. 1 blackbody radiation source structural representation.
The infrared surface radiation heat source configurations of Fig. 2 synoptic diagram is also as Figure of abstract.
Fig. 3 copper resistance temperature variation curve.
Fig. 4 hibert curve synoptic diagram.
Fig. 5 helix synoptic diagram.
1 well heater among the figure; 2 blackbody chambers; 3 black matrix temperature elements; 4 blackbody chamber temperature elements; 5 accents; 6 high emissivity coatings; 7 aluminium sheets; 8 heat-conducting silicone greases; 9 copper-clad plates and circuit thereof; 10 supply sockets;
Embodiment
The copper-clad plate heat-barrier material has heat-insulation and heat-preservation and supporting role as the base material that covers copper conductor, can select for use PCB to make the bin substrate.Utilize electronics to cover process for copper, deposition forms the copper resistance silk of certain pattern on the substrate heat-barrier material.In order to reduce the control difficulty of subsequent conditioning circuit, can adopt the mode of operation of low-voltage, high-current, can adopt following running parameter:
Working power U=24V;
Working current I
Max〉=2A;
System's peak power output is P
Max=50W;
Resistance is R=12.5 Ω (temperature 20 ℃ time).
Draw according to the relation of covering copper thickness, live width and electric current: cover copper thickness 50um, conductor width 1mm, wiring is 0.6mm at interval.The useful area of infrared source is 250mm * 250mm.Copper conductor can adopt multiple wiring form, as the form (shown in Figure 4) or the helix form (shown in Figure 5) that can adopt hibert curve (space filling curve).Hibert curve can be filled square 2 dimension spaces of any size uniformly, make that curve being evenly distributed on the vertical and horizontal space is equal, avoided owing to heater circuit produces graded because of the temperature that skewness causes, thereby guaranteed higher temperature homogeneity in the anisotropic medium.After circuit is connected, the copper conductor radiant heat energy, through thermal energy exchange, thermal power is given aluminium sheet (7) by thick heat-conducting silicone grease layer (8) conduction of about 0.5mm, and by outwards radiated infrared heat radiation of emissivity coating (6).By a large amount of radiant heat source cellular arraies, can finish simulation to far infrared surface source, far field target infrared characteristic.
Claims (2)
1. controlled infrared surface radiation thermal source of high evenness is characterized in that: by 8, high emissivity coating 9, aluminium sheet 10, heat conductive silica gel 11, copper-clad plate and circuit 12 thereof, power line form.
2. the controlled infrared surface radiation thermal source of high evenness according to claim 1 is characterized in that: adopt electronics to cover process for copper, make the infrared radiation thermal source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100698221A CN102230841A (en) | 2011-03-23 | 2011-03-23 | Controlled infrared planar radiative heat source with high degree of homogeneity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100698221A CN102230841A (en) | 2011-03-23 | 2011-03-23 | Controlled infrared planar radiative heat source with high degree of homogeneity |
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| Publication Number | Publication Date |
|---|---|
| CN102230841A true CN102230841A (en) | 2011-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100698221A Pending CN102230841A (en) | 2011-03-23 | 2011-03-23 | Controlled infrared planar radiative heat source with high degree of homogeneity |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103278311A (en) * | 2013-05-16 | 2013-09-04 | 中国电子科技集团公司第四十一研究所 | Uniformity measurement device and method for infrared radiation surface |
| CN103759587A (en) * | 2013-12-20 | 2014-04-30 | 河北汉光重工有限责任公司 | Ultra-low cost infrared tooling target simulator |
| CN104427770A (en) * | 2013-09-10 | 2015-03-18 | 上海空间电源研究所 | Method for manufacturing power line of modular power supply controller on printed circuit board |
| CN105142245A (en) * | 2015-09-14 | 2015-12-09 | 姚永平 | Vehicle infrared bait |
| CN105547496A (en) * | 2016-02-02 | 2016-05-04 | 中国计量学院 | Minimum temperature resolution testing device and testing method |
| CN107677375A (en) * | 2017-09-21 | 2018-02-09 | 中国科学院长春光学精密机械与物理研究所 | A kind of infrared radiation measurement system robot scaling equipment and calibrating method |
| CN111141393A (en) * | 2019-12-31 | 2020-05-12 | 航天新气象科技有限公司 | Black body radiation device for simulating meteorological environment |
| CN114293424A (en) * | 2022-01-10 | 2022-04-08 | 中建五局土木工程有限公司 | Winter construction heating maintenance method for base layer in cold region |
| WO2024109655A1 (en) * | 2022-11-25 | 2024-05-30 | 比亚迪股份有限公司 | Infrared heating panel, infrared baking device, and infrared baking system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518779A (en) * | 1992-12-16 | 1996-05-21 | Industrial Technology Research Institute | Forming copper clad laminates |
| CN2403197Y (en) * | 2000-01-07 | 2000-10-25 | 中国人民解放军军械工程学院 | Temp. controlled heat source with uniform distribution of temp. |
| CN2571108Y (en) * | 2002-09-25 | 2003-09-03 | 时利华 | Far-infrared radiation heating source |
-
2011
- 2011-03-23 CN CN2011100698221A patent/CN102230841A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5518779A (en) * | 1992-12-16 | 1996-05-21 | Industrial Technology Research Institute | Forming copper clad laminates |
| CN2403197Y (en) * | 2000-01-07 | 2000-10-25 | 中国人民解放军军械工程学院 | Temp. controlled heat source with uniform distribution of temp. |
| CN2571108Y (en) * | 2002-09-25 | 2003-09-03 | 时利华 | Far-infrared radiation heating source |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103278311A (en) * | 2013-05-16 | 2013-09-04 | 中国电子科技集团公司第四十一研究所 | Uniformity measurement device and method for infrared radiation surface |
| CN103278311B (en) * | 2013-05-16 | 2015-12-09 | 中国电子科技集团公司第四十一研究所 | A kind of infrared radiation surface uniformity measurement mechanism and method |
| CN104427770A (en) * | 2013-09-10 | 2015-03-18 | 上海空间电源研究所 | Method for manufacturing power line of modular power supply controller on printed circuit board |
| CN103759587A (en) * | 2013-12-20 | 2014-04-30 | 河北汉光重工有限责任公司 | Ultra-low cost infrared tooling target simulator |
| CN105142245A (en) * | 2015-09-14 | 2015-12-09 | 姚永平 | Vehicle infrared bait |
| CN105547496A (en) * | 2016-02-02 | 2016-05-04 | 中国计量学院 | Minimum temperature resolution testing device and testing method |
| CN105547496B (en) * | 2016-02-02 | 2018-10-26 | 中国计量学院 | Minimum temperature resolving power testing device and its test method |
| CN107677375A (en) * | 2017-09-21 | 2018-02-09 | 中国科学院长春光学精密机械与物理研究所 | A kind of infrared radiation measurement system robot scaling equipment and calibrating method |
| CN111141393A (en) * | 2019-12-31 | 2020-05-12 | 航天新气象科技有限公司 | Black body radiation device for simulating meteorological environment |
| CN114293424A (en) * | 2022-01-10 | 2022-04-08 | 中建五局土木工程有限公司 | Winter construction heating maintenance method for base layer in cold region |
| WO2024109655A1 (en) * | 2022-11-25 | 2024-05-30 | 比亚迪股份有限公司 | Infrared heating panel, infrared baking device, and infrared baking system |
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Application publication date: 20111102 |