CN216752225U - 一种可快速散热的pcb线路板 - Google Patents
一种可快速散热的pcb线路板 Download PDFInfo
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- CN216752225U CN216752225U CN202123328290.7U CN202123328290U CN216752225U CN 216752225 U CN216752225 U CN 216752225U CN 202123328290 U CN202123328290 U CN 202123328290U CN 216752225 U CN216752225 U CN 216752225U
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- Prior art keywords
- heat dissipation
- circuit board
- pcb circuit
- pcb
- fixedly connected
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 59
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 18
- 239000000110 cooling liquid Substances 0.000 abstract description 7
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- 238000005057 refrigeration Methods 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 description 15
- 230000037431 insertion Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 7
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 6
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202123328290.7U CN216752225U (zh) | 2021-12-28 | 2021-12-28 | 一种可快速散热的pcb线路板 |
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CN202123328290.7U CN216752225U (zh) | 2021-12-28 | 2021-12-28 | 一种可快速散热的pcb线路板 |
Publications (1)
Publication Number | Publication Date |
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CN216752225U true CN216752225U (zh) | 2022-06-14 |
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Family Applications (1)
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CN202123328290.7U Active CN216752225U (zh) | 2021-12-28 | 2021-12-28 | 一种可快速散热的pcb线路板 |
Country Status (1)
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CN (1) | CN216752225U (zh) |
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2021
- 2021-12-28 CN CN202123328290.7U patent/CN216752225U/zh active Active
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240511 Address after: No. 41 Wubeishan Village, Xinpo Village Committee, Sanjia Town, Yangchun City, Yangjiang City, Guangdong Province, 529600 Patentee after: Liang Ling Country or region after: China Patentee after: Liu Yiguang Address before: 215000 No. 70 Emeishan Road, science and Technology City, high tech Zone, Suzhou City, Jiangsu Province (3rd floor of No. 5 plant) Patentee before: Merckwell transmission technology (Suzhou) Co.,Ltd. Country or region before: China |