CN216738600U

CN216738600U - Jet flow device for vertical continuous nickel-electroplating gold thread and gold groove segmentation

Info

Publication number: CN216738600U
Application number: CN202123225263.7U
Authority: CN
Inventors: 刘飞
Original assignee: Guangde Zhengda Electronic Technology Co ltd
Current assignee: Guangde Zhengda Electronic Technology Co ltd
Priority date: 2021-12-21
Filing date: 2021-12-21
Publication date: 2022-06-14
Anticipated expiration: 2031-12-21

Abstract

The utility model relates to a segmented jet flow device of a vertical continuous nickel electroplating gold thread gold groove, which comprises a base, wherein the upper surface of the base is fixedly connected with a plurality of fixed columns, the upper surfaces of the fixed columns are fixedly connected with a plating bath, a jet flow mechanism is arranged inside the plating bath, and an adjusting mechanism is arranged inside the jet flow mechanism; the adjusting mechanism comprises a first motor fixedly connected to the jet flow mechanism, an output shaft of the first motor is fixedly connected with a first gear, and a second gear is meshed with the left side of the first gear. This perpendicular continuous electroplating nickel gold thread gold groove segmentation's jet flow device through being equipped with adjustment mechanism in that jet flow mechanism is inside, and adjustment mechanism can adjust jet flow mechanism's jet flow volume, has improved the density and the speed that the object of plating that need electroplate is electroplated, and the homogeneity of electroplating effect can be ensured promptly, makes the operation get up more effectively, and is convenient, and the jet flow device application range before comparing is wider.

Description

Jet flow device for vertical continuous nickel-electroplating gold thread and gold groove segmentation

Technical Field

The utility model relates to a jet flow device technical field specifically is a perpendicular continuous electroplating nickel gold thread gold groove segmentation jet flow device.

Background

The nickel-gold electroplating is mainly used as a substrate plating layer of noble metal and base metal, and the nickel layer belongs to a cathode plating layer for a copper matrix, wherein the gold layer belongs to noble metal and has good weldability, so that the nickel plating layer is used as a bottom layer to form a uniform gold plating layer on the nickel layer, thereby improving the wear resistance and weldability of the product.

With the development of science and technology, the electroplating technology in the semiconductor industry is also developed rapidly, the industrial electroplating also hopes for high current density to improve the yield, the above are great challenges for electroplating, most of the existing electroplating devices lack a device capable of improving the flow rate of electroplating solution inside the electroplating bath, so the electroplating density and the flow rate of electroplating products cannot be guaranteed, even the electroplating effect can be influenced, the electroplating uniformity cannot be well guaranteed, the flow rate of the electroplating solution inside the electroplating bath cannot be adjusted, the requirement on the flow rate of the electroplating solution during the electroplating of products with different sizes cannot be met, and the application range is limited.

SUMMERY OF THE UTILITY MODEL

To the deficiency of the prior art, the utility model provides a perpendicular continuous electroplating nickel gold thread gold groove segmentation jet flow device possesses advantages such as control and spouts the flow, has solved the problem that can't control spouts the flow.

In order to achieve the above object, the utility model provides a following technical scheme: a segmented jet flow device for a vertical continuous nickel-electroplating gold thread groove comprises a base, wherein the upper surface of the base is fixedly connected with a plurality of fixing columns, the upper surfaces of the fixing columns are fixedly connected with an electroplating groove, a jet flow mechanism is arranged inside the electroplating groove, and an adjusting mechanism is arranged inside the jet flow mechanism;

the adjusting mechanism comprises a first motor fixedly connected to the jet flow mechanism, an output shaft of the first motor is fixedly connected with a first gear, a second gear is meshed with the left side of the first gear, a rotating rod is fixedly connected to the bottom of the second gear, a rotating disc is fixedly connected to the bottom of the rotating rod, and a plurality of through holes are formed in the rotating disc.

Further, the jet flow mechanism includes the circulating pump with base top fixed connection, the output fixedly connected with drain pipe of circulating pump, one side fixedly connected with jet flow case that the circulating pump output was kept away from to the drain pipe, the bottom fixedly connected with jet flow pipe of jet flow case, the outer fixed surface of drain pipe is connected with the support column, the input fixedly connected with feed liquor pipe of circulating pump, the jet flow mechanism still include with plating bath inner wall fixed connection's otter board.

Furthermore, the bottom of the electroplating bath is provided with a water outlet hole, and the water outlet hole is communicated with one side of the liquid inlet pipe, which is far away from the input end of the circulating pump.

Furthermore, the inside of support column has seted up the fixed orifices, and the inner wall of fixed orifices and the outer fixed surface of drain pipe are connected.

Furthermore, the bottom of the supporting column is fixedly connected with the top of the right side of the electroplating bath, and the outer surface of the rotary table is fixedly connected with a waterproof ring.

Furthermore, the number of the jet pipes is multiple, and the plurality of jet pipes are distributed symmetrically and equidistantly.

Furthermore, the top of the inner cavity of the jet flow box is provided with a groove, and the groove is rotatably connected with the top of the turntable.

Furthermore, the diameters of the through holes are different, and the diameter of the through hole with the largest diameter is consistent with that of the liquid outlet pipe.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this perpendicular continuous electroplating nickel gold thread gold groove segmentation's jet flow device through being equipped with adjustment mechanism in that jet flow mechanism is inside, and adjustment mechanism can adjust jet flow mechanism's jet flow volume, has improved the density and the speed that the object of plating that need electroplate is electroplated, and the homogeneity of electroplating effect can be ensured promptly, makes the operation get up more effectively, and is convenient, and the jet flow device application range before comparing is wider.

2. According to the sectional jet flow device for the vertical continuous nickel-gold electroplating groove, the jet flow mechanism is arranged in the electroplating groove, and can jet flow to the electroplating workpiece, so that the electroplating workpiece can prevent metal oxidation and the like, and the application range of the jet flow device is wider than that of the conventional jet flow device.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural diagram of the adjusting mechanism of the present invention;

FIG. 3 is a schematic top view of the turntable and the through hole of the present invention;

fig. 4 is a schematic structural view of the jet flow mechanism of the present invention.

In the figure: the device comprises a base 1, a fixing column 2, a plating bath 3, an adjusting mechanism 4, a first motor 401, a first gear 402, a second gear 403, a rotating rod 404, a rotating disk 405, a through hole 406, a jet flow mechanism 5, a circulating pump 501, a liquid outlet pipe 502, a jet flow box 503, a jet flow pipe 504, a support column 505, a liquid inlet pipe 506 and a screen plate 507.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the sectional jet flow device for a vertical continuous nickel-electroplating gold-wire groove in the present embodiment includes a base 1, a plurality of fixing columns 2 fixedly connected to an upper surface of the base 1, an electroplating bath 3 fixedly connected to an upper surface of the fixing columns 2, a jet flow mechanism 5 disposed inside the electroplating bath 3, and an adjusting mechanism 4 disposed inside the jet flow mechanism 5.

The adjusting mechanism 4 comprises a first motor 401 fixedly connected to the jet mechanism 5, an output shaft of the first motor 401 is fixedly connected with a first gear 402, a second gear 403 is meshed with the left side of the first gear 402, a rotating rod 404 is fixedly connected to the bottom of the second gear 403, a rotating disk 405 is fixedly connected to the bottom of the rotating rod 404, and a plurality of through holes 406 are formed in the rotating disk 405.

Wherein, the outer surface of the turntable 405 is fixedly connected with a waterproof ring to prevent the electroplating solution from overflowing.

In this embodiment, the motor 401 drives the turntable 405 to rotate, and the through holes 406 are switched to adjust the size of the water flow.

Referring to fig. 1 and 4, in order to jet the electroplating workpiece, the jet mechanism 5 of the embodiment includes a circulating pump 501 fixedly connected to the top of the base 1, a liquid outlet pipe 502 is fixedly connected to an output end of the circulating pump 501, a jet box 503 is fixedly connected to a side of the liquid outlet pipe 502 away from the output end of the circulating pump 501, a plurality of jet pipes 504 are fixedly connected to a bottom of the jet box 503, the plurality of jet pipes 504 are symmetrically and equidistantly distributed, a support column 505 is fixedly connected to an outer surface of the liquid outlet pipe 502, a bottom of the support column 505 is fixedly connected to a top of a right side of the electroplating bath 3, a fixing hole is formed inside the support column 505, an inner wall of the fixing hole is fixedly connected to an outer surface of the liquid outlet pipe 502, a liquid inlet pipe 506 is fixedly connected to an input end of the circulating pump 501, a water outlet hole is formed at a bottom of the electroplating bath 3, and the water outlet hole is communicated with a side of the liquid inlet pipe 506 away from an input end of the circulating pump 501, the jet flow mechanism 5 also comprises a mesh plate 507 fixedly connected with the inner wall of the electroplating bath 3.

Wherein, the top of jet flow box 503 inner chamber is seted up flutedly, and the recess rotates with the top of carousel 405 to be connected, makes the carousel 405 tighter with the laminating of jet flow box 503, avoids the plating solution to flow from carousel 405 both sides, and the diameter of a plurality of through-holes 406 is not of uniform size, and the diameter of maximum diameter through-hole 406 is unanimous with drain pipe 502, plays the effect of regulation rivers size.

In this embodiment, a workpiece to be sprayed is placed on the mesh plate 507, and the plating solution is transported to the spray tank 503 by the circulation pump 501 and sprayed from the spray pipe 504, thereby achieving a spraying effect on the workpiece.

The working principle of the above embodiment is as follows:

firstly, electroplating solution circulates an electroplating bath 3, a liquid inlet pipe 506 and a liquid outlet pipe 502 through a circulating pump 501, a workpiece needing to be sprayed is placed on a screen plate 507, the electroplating solution in the liquid outlet pipe 502 is conveyed to a spraying tank 503, a motor 401 drives a first gear 402, the first gear 402 is meshed with a second gear 403, the first gear 402 drives the second gear 403 to rotate, the second gear 403 rotates to drive a rotating shaft 404 to rotate, the rotating shaft 404 rotates to drive a rotating disc 405 to rotate, a plurality of through holes 406 with different sizes are formed in the rotating disc 405, the through holes 406 can be switched by the rotation of the rotating disc 405, the effect of adjusting the size of water flow is achieved, the electroplating solution is sprayed out from a spraying pipe 504 after being conveyed to the spraying tank 503, and the spraying effect on the workpiece is achieved.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a jet current device of perpendicular continuous electroplating nickel gold thread gold groove segmentation, includes base (1), its characterized in that: the upper surface of the base (1) is fixedly connected with a plurality of fixing columns (2), the upper surfaces of the plurality of fixing columns (2) are fixedly connected with an electroplating bath (3), a jet flow mechanism (5) is arranged inside the electroplating bath (3), and an adjusting mechanism (4) is arranged inside the jet flow mechanism (5);

the adjusting mechanism (4) comprises a first motor (401) fixedly connected to the jet flow mechanism (5), an output shaft of the first motor (401) is fixedly connected with a first gear (402), a second gear (403) is meshed with the left side of the first gear (402), a rotating rod (404) is fixedly connected to the bottom of the second gear (403), a rotating disc (405) is fixedly connected to the bottom of the rotating rod (404), and a plurality of through holes (406) are formed in the rotating disc (405).

2. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 1, wherein: the jet flow mechanism (5) comprises a circulating pump (501) fixedly connected with the top of the base (1), an output end of the circulating pump (501) is fixedly connected with a liquid outlet pipe (502), one side of the liquid outlet pipe (502) far away from the output end of the circulating pump (501) is fixedly connected with a jet flow box (503), a bottom of the jet flow box (503) is fixedly connected with a jet flow pipe (504), an outer surface of the liquid outlet pipe (502) is fixedly connected with a support column (505), an input end of the circulating pump (501) is fixedly connected with a liquid inlet pipe (506), and the jet flow mechanism (5) further comprises a screen plate (507) fixedly connected with the inner wall of the electroplating bath (3).

3. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 2, wherein: the bottom of the electroplating bath (3) is provided with a water outlet hole, and the water outlet hole is communicated with one side of the liquid inlet pipe (506) far away from the input end of the circulating pump (501).

4. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 2, wherein: the inside of support column (505) has seted up the fixed orifices, and the inner wall of fixed orifices and the outer fixed connection of surface of drain pipe (502).

5. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 2, wherein: the bottom of the supporting column (505) is fixedly connected with the top of the right side of the electroplating bath (3), and the outer surface of the rotary disc (405) is fixedly connected with a waterproof ring.

6. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 2, wherein: the number of the jet pipes (504) is multiple, and the jet pipes (504) are distributed symmetrically and equidistantly.

7. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 2, wherein: the top of the inner cavity of the jet flow box (503) is provided with a groove, and the groove is rotationally connected with the top of the turntable (405).

8. The sectional jet flow device for the vertical continuous electroplating nickel, gold and wire groove according to claim 2, wherein: the diameters of the through holes (406) are different, and the diameter of the through hole (406) with the largest diameter is consistent with that of the liquid outlet pipe (502).