CN216719977U - High-power LED lumen-simulating packaging support and LED lamp bead - Google Patents

Abstract

The utility model provides a high-power LED (light-emitting diode) lumen-simulating packaging support which comprises an injection molding part, a first connecting part and a second connecting part, wherein the first connecting part comprises a first internal connecting part arranged on the injection molding part and a first external connecting part arranged outside the injection molding part; the second connecting part comprises a second inner connecting part arranged on the injection molding part and a second outer connecting part arranged outside the injection molding part; the bottom surfaces of the first external connecting portion and the second external connecting portion are located on the same horizontal plane. According to the utility model, the bottom surfaces of the first external connecting part and the second external connecting part are arranged on the same horizontal plane, so that the first connecting part and the second connecting part can be conveniently fixed during the injection molding of the lamp bead, and the high-low surface fixing of the first connecting part and the second connecting part is not needed, so that the process steps can be effectively saved, and the injection molding processing is more convenient.

Description

High-power LED lumen-simulating packaging support and LED lamp bead

Technical Field

The utility model relates to the technical field of lighting equipment, in particular to a high-power LED lumen-simulating packaging support and an LED lamp bead.

Background

An LED lamp is a solid-state semiconductor device that can convert electrical energy into visible light, and can directly convert electricity into light.

The LED lamp has the incomparable advantages of a series of traditional light sources, such as energy conservation, long service life, vibration resistance, environmental protection, impact resistance and the like, so the LED lamp occupies a main share in the existing light source market, and various LED light source products emerge like bamboo shoots in spring after rain.

The positive and negative pins of the conventional high-power LED lumen-simulating packaging support are not on the same horizontal plane, so that great inconvenience exists in assembly and installation.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high-power LED lumen-simulating packaging support and an LED lamp bead, aiming at solving the technical problem that the existing lamp bead is inconvenient to assemble.

The utility model provides a high-power LED (light-emitting diode) lumen-simulating packaging support which comprises an injection molding part, a first connecting part and a second connecting part, wherein the first connecting part comprises a first internal connecting part arranged on the injection molding part and a first external connecting part arranged outside the injection molding part; the second connecting part comprises a second inner connecting part arranged on the injection molding part and a second outer connecting part arranged outside the injection molding part; the bottom surfaces of the first external connecting portion and the second external connecting portion are located on the same horizontal plane.

Furthermore, the high-power LED lumen-simulating packaging support also comprises a support and an LED vertical chip arranged on the support, the support comprises a base and a support pillar arranged on the base, and the LED vertical chip is arranged on the top surface of the support pillar.

Furthermore, the first internal connecting part is sleeved on the support column, the first internal connecting part is provided with a circular ring part, and the circular ring part is sleeved on the support column; the one end that the support column is connected with the base is from up being equipped with rake, fixed part and guide part down in proper order, the rake is set up and is leaned out towards being close to base one side by keeping away from base one side around the support column.

Further, the second connecting portion is connected with the LED vertical chip through a connecting line.

Furthermore, the injection molding part is provided with a containing cavity, and the high-power LED lumen-simulating packaging support is also provided with a glue sealing part arranged in the containing cavity.

Further, the diameter of the containing groove is 4.0 mm-4.5 mm.

Further, the bottom of the support is also provided with a bonding pad.

On the other hand, the utility model also provides an LED lamp bead which comprises the high-power LED lumen-imitating packaging support.

The utility model has the beneficial effects that: according to the utility model, the bottom surfaces of the first external connecting part and the second external connecting part are arranged on the same horizontal plane, so that the first connecting part and the second connecting part can be conveniently fixed during the injection molding of the lamp bead, and the high-low surface fixing of the first connecting part and the second connecting part is not needed, so that the process steps can be effectively saved, and the injection molding processing is more convenient.

Drawings

FIG. 1 is a perspective view of an embodiment of a high-power LED lumen-imitating packaging support according to the present invention.

FIG. 2 is a side view of an embodiment of a high power LED lumen-mimicking package support of the present invention.

FIG. 3 is a perspective view of another embodiment of a high power LED lumen-mimicking package support of the present invention.

FIG. 4 is a side view of a bracket of one embodiment of the high power LED lumen-mimicking package bracket of the present invention.

FIG. 5 is a perspective view of a bracket of an embodiment of the high-power LED lumen-imitating packaging bracket of the utility model.

FIG. 6 is a perspective view of a first connecting portion of an embodiment of a high power LED lumen-simulating package support according to the utility model.

FIG. 7 is a perspective view of a second connecting portion of an embodiment of a high power LED lumen-simulating package support according to the utility model.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the utility model and are not to be construed as limiting the utility model.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The present invention will be described in further detail with reference to the following detailed description and accompanying drawings.

As shown in fig. 1 to 7, the present invention provides a high-power LED lumen-simulating package support, which includes an injection molding part 1, a first connecting part 31 and a second connecting part 32, wherein the first connecting part 31 includes a first internal connecting part 312 installed on the injection molding part 1 and a first external connecting part 311 installed outside the injection molding part 1; the second connecting portion 32 includes a second inner portion 322 installed on the injection molding portion 1 and a second outer portion 321 installed outside the injection molding portion 1; the first external connection portion 311 and the second external connection portion 321 are located at the same horizontal plane.

According to the utility model, the bottom surfaces of the first external connecting part 311 and the second external connecting part 321 are arranged on the same horizontal plane, so that the first connecting part 31 and the second connecting part 32 can be conveniently fixed without fixing the first connecting part and the second connecting part in a high-low surface manner when the lamp bead is subjected to injection molding, the process steps can be effectively saved, and the injection molding processing is more convenient.

In an optional embodiment, the high-power LED lumen-simulating package support further comprises a support and an LED vertical chip 4 mounted on the support, the support comprises a base 22 and a supporting column 21 mounted on the base 22, and the LED vertical chip 4 is mounted on the top surface of the supporting column 21. Specifically, the second connection portion 32 is connected to the LED vertical chip 4 through a connection wire. The first inner connection portion 312 is sleeved on the supporting column 21, the first inner connection portion 312 is provided with a circular ring portion 3121, and the circular ring portion 3121 is sleeved on the supporting column 21; the one end that support column 21 and base 22 are connected is from up being equipped with slope 233, fixed part 232 and guide part 231 in proper order down, slope 233 sets up and leans out towards one side of being close to base 22 by keeping away from base 22 one side around support column 21.

In this embodiment, one end of the first inner connecting portion 312 is set to be annular, and the annular portion 3121 is sleeved on the supporting pillar 21, so that the assembly is facilitated, and the production efficiency can be effectively improved; then set up slope 233, fixed part 232 and guide part 231 in the supporting part and the junction of base 22, through guide part 231, be convenient for locate fixed part 232 with ring portion 3121 cover, simultaneously, through slope 233, can be with on ring portion 3121 joint and the support column 21, effectively stabilize the support column 21 and be connected with first connecting portion 31, improve the stability of the imitative lumen encapsulation support of high-power LED.

In an alternative embodiment, a first connecting arm 3122 is disposed between the circular ring portion 3121 and the first external connecting portion 311; the second connecting arm 333 is provided between the second external connection portion 321 and the second internal connection portion 322, and the horizontal height difference between the first external connection portion 31 and the second external connection portion 32 can be adjusted by adjusting the heights of the first connecting arm 3122 and the second connecting arm 321.

In an optional embodiment, the injection molding part 1 is provided with a containing cavity, and the high-power LED lumen-simulating package support is further provided with a sealing part 5 installed in the containing cavity. The diameter of the containing groove is 4.0mm ~4.5 mm. The glue sealing part 5 is arranged to protect the LED vertical chip 4; and the large-diameter accommodating groove is convenient for secondary light distribution of the high-power LED lumen-simulating packaging bracket.

In an alternative embodiment, the bottom of the bracket is also provided with a pad 24. The welding pad 24 is arranged, so that the stability of welding the high-power LED lumen-imitating packaging bracket on external equipment can be effectively improved.

On the other hand, the utility model also provides an LED lamp bead which comprises the high-power LED lumen-imitating packaging support.

According to the utility model, the bottom surfaces of the first external connecting part 311 and the second external connecting part 321 are arranged on the same horizontal plane, so that the first connecting part 31 and the second connecting part 32 can be conveniently fixed without fixing the first connecting part and the second connecting part on high and low surfaces when the high-power LED lumen-simulating packaging bracket is subjected to injection molding, the process steps can be effectively saved, and the injection molding processing is more convenient.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing is a more detailed description of the present invention that is presented in conjunction with specific embodiments, and the practice of the utility model is not to be considered limited to those descriptions. It will be apparent to those skilled in the art that a number of simple derivations or substitutions can be made without departing from the inventive concept.

Claims (8)

1. A high-power LED (light-emitting diode) lumen-simulating packaging support is characterized by comprising an injection molding part, a first connecting part and a second connecting part, wherein the first connecting part comprises a first internal connecting part arranged on the injection molding part and a first external connecting part arranged outside the injection molding part; the second connecting part comprises a second inner connecting part arranged on the injection molding part and a second outer connecting part arranged outside the injection molding part; the bottom surfaces of the first external connecting portion and the second external connecting portion are located on the same horizontal plane.

2. The high-power LED lumen-imitating package support according to claim 1, wherein the high-power LED lumen-imitating package support further comprises a support and an LED vertical chip mounted on the support, the support comprises a base and a supporting pillar mounted on the base, and the LED vertical chip is mounted on the top surface of the supporting pillar.

3. The high-power LED lumen-imitating package support according to claim 2, wherein the first inner connecting part is sleeved on the support pillar, the first inner connecting part is provided with a circular ring part, and the circular ring part is sleeved on the support pillar; the one end that the support column is connected with the base is from up being equipped with rake, fixed part and guide part down in proper order, the rake is set up and is leaned out towards being close to base one side by keeping away from base one side around the support column.

4. The high-power LED lumen-imitating package support according to claim 1, wherein the second connecting portion is connected with the LED vertical chip through a connecting wire.

5. The high-power LED lumen-simulating package support according to claim 1, wherein the injection molding part is provided with a receiving cavity, and the high-power LED lumen-simulating package support is further provided with a sealant part installed in the receiving cavity.

6. The high-power LED lumen-imitating packaging bracket according to claim 5, wherein the diameter of the accommodating groove is 4.0 mm-4.5 mm.

7. The high-power LED lumen-imitating package support according to claim 2, wherein the support is further provided with a bonding pad at the bottom.

8. An LED lamp bead, characterized in that, comprises the high-power LED lumen-imitating packaging support of any one of claims 1 to 7.

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