CN216671576U - Semiconductor heating table lifting and temperature protection mechanism under high-cleanliness grade environment - Google Patents
Semiconductor heating table lifting and temperature protection mechanism under high-cleanliness grade environment Download PDFInfo
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- CN216671576U CN216671576U CN202220005808.9U CN202220005808U CN216671576U CN 216671576 U CN216671576 U CN 216671576U CN 202220005808 U CN202220005808 U CN 202220005808U CN 216671576 U CN216671576 U CN 216671576U
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Abstract
The utility model discloses a semiconductor heating table lifting and temperature protecting mechanism under a high-cleanliness grade environment, which comprises a bottom plate, wherein a lifting mechanism vertically penetrates through the bottom plate, a Z-axis connecting block is slidably arranged on the lifting mechanism, a heat insulating mechanism is arranged on the top surface of the Z-axis connecting block, a heating table is arranged at the top of the heat insulating mechanism, a plurality of product supporting rods are vertically arranged on the bottom plate around the lifting mechanism, and the top ends of the product supporting rods respectively penetrate through and are slidably connected with the heating table; by adopting the scheme, the heating table is lifted and lowered in the vertical direction by the lifting mechanism, so that the product can complete the corresponding process at the required height, and the yield of the product is improved; by utilizing the mechanical structure and gas circulation, the management of cooling gas is realized while the temperature of the mechanical structure is reduced, and the environmental pollution caused by gas turbulence is avoided; the cleanliness of the product in the production process of the product is ensured, and the yield of the product is ensured.
Description
Technical Field
The utility model relates to the technical field of semiconductor production, in particular to a semiconductor heating table lifting and temperature protecting mechanism in a high-cleanliness grade environment.
Background
With the development of science and technology, more and more electronic devices need to use chips, the market has more and more demands for semiconductors, and the demands for devices in the field of semiconductors are about to break out at a high speed; the wafer is used as a basis for manufacturing the chip, in the process of manufacturing a finished chip, a plurality of process sections need to use a heating device, the heating device can damage other mechanisms which do not resist high temperature because of the high-temperature property of the heating device, especially some standard part systems, such as the standard part system for adjusting the height of the heating device, the normal work of the heating device must be ensured not to be damaged by high temperature because of the non-high-temperature property of the heating device, and the production life of the heating device is prolonged.
SUMMERY OF THE UTILITY MODEL
In view of the disadvantages of the prior art, the present invention provides a semiconductor heating stage lifting and temperature protection mechanism under a high clean level environment, so as to solve the problems of the background art mentioned above. In order to achieve the purpose, the utility model adopts the following technical scheme: this semiconductor heating platform goes up and down and temperature protection mechanism under high clean grade environment, comprising a base plate, it is provided with elevating system to run through perpendicularly on the bottom plate, elevating system goes up to slide and is provided with Z hub connection piece, Z hub connection piece top surface is provided with thermal-insulated mechanism, thermal-insulated mechanism top is provided with the warm table, encircle on the bottom plate elevating system is provided with many product support bars perpendicularly, many product support bar top is run through respectively and sliding connection the warm table.
Preferably, the lifting mechanism includes: drive arrangement, mount pad, slip subassembly, drive arrangement sets up the bottom plate bottom surface, drive arrangement is used for the drive Z axle connecting block vertical lift, the mount pad sets up the bottom plate top surface, the slip subassembly sets up perpendicularly the mount pad is relative drive arrangement one side, Z axle connecting block passes through slip subassembly sliding connection the mount pad.
Preferably, a cavity is formed in the middle of the Z shaft connecting block, a cooling cavity is arranged around the outer side of the cavity, an air inlet pipeline and an air outlet pipeline penetrate through the side wall of the Z shaft connecting block, one ends of the inner sides of the air inlet pipeline and the air outlet pipeline are respectively communicated with the cooling cavity, and one ends of the outer sides of the air inlet pipeline and the air outlet pipeline are respectively connected with an air pipe connector.
Preferably, heat-proof mechanism includes heat insulating block, warm table installation piece, the heat insulating block sets up Z axle connecting block top surface, the warm table installation piece sets up the heat insulating block top surface, the warm table sets up the warm table installation piece top surface.
Preferably, the lifting mechanism further comprises a limiting device, and the limiting device comprises an inductor, an induction sheet, a hard limiting block and a protection block;
the two sensors are respectively arranged on the side wall of the mounting seat and positioned in the moving range of the sensing piece;
the protection block is arranged at the top end of the sliding assembly;
the hard limiting block is arranged on the side wall of the mounting seat, and the front end of the hard limiting block is positioned below the heat insulation mechanism.
Preferably, the top surface and the bottom surface of the heating platform are both provided with a plurality of bosses.
Preferably, a plurality of bosses are arranged on the bottom surface of the heat insulation block.
Compared with the prior art, the utility model has the advantages that by adopting the scheme, the utility model has the following advantages:
1. the heating table is lifted and lowered in the vertical direction by the lifting mechanism, so that the corresponding process of the product is finished at the required height, and the yield of the product is improved.
2. The utility model utilizes the mechanical structure and the gas circulation, ensures that the temperature of the mechanical structure is reduced, simultaneously realizes the management of cooling gas, and avoids the environmental pollution caused by the gas turbulence.
3. The cleanliness of the product in the production process of the product is ensured, and the yield of the product is ensured.
Drawings
FIG. 1 is a schematic view of the overall assembly structure of one embodiment of the present invention;
FIG. 2 is a schematic diagram of the lifting mechanism of the embodiment of FIG. 1 according to the present invention;
FIG. 3 is a schematic view of the drive and insulation of the embodiment of FIG. 1 according to the present invention;
FIG. 4 is a schematic view of the heating station mounting block structure of the embodiment of FIG. 1 of the present invention;
FIG. 5 is a schematic view of the thermal insulating block of the embodiment of FIG. 1 according to the present invention.
Detailed Description
In order to facilitate an understanding of the utility model, reference will now be made in detail to the present embodiments of the utility model, examples of which are illustrated in the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," "front," "rear," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.
As shown in fig. 1-2, an embodiment of the present invention is a semiconductor heating stage 140 lifting and temperature protecting mechanism under high clean level environment, which includes a bottom plate 110, a lifting mechanism 120 vertically penetrates through the bottom plate 110, a Z-axis connecting block 131 is slidably disposed on the lifting mechanism 120, a heat insulating mechanism 130 is disposed on a top surface of the Z-axis connecting block 131, a heating stage 140 is disposed on a top of the heat insulating mechanism 130, a plurality of product supporting rods 150 are vertically disposed on the bottom plate 110 around the lifting mechanism 120, and top ends of the plurality of product supporting rods 150 respectively penetrate through and slidably connect with the heating stage 140.
Preferably, as shown in fig. 2, the lifting mechanism 120 includes: the driving device 126 is arranged on the bottom surface of the bottom plate 110, the driving device 126 is used for driving the Z-axis connecting block 131 to vertically lift, the mounting seat 121 is arranged on the top surface of the bottom plate 110, the sliding block 122 is vertically arranged on one side of the mounting seat 121 opposite to the driving device 126, and the Z-axis connecting block 131 is connected with the mounting seat 121 in a sliding mode through the sliding block 122.
Preferably, as shown in fig. 3, a cavity 135 is arranged in the middle of the Z-axis connecting block 131, a cooling cavity 136 is arranged around the outside of the cavity 135, an air inlet pipeline 137 and an air outlet pipeline 138 penetrate through the side wall of the Z-axis connecting block 131, one end of the inner side of the air inlet pipeline 137 and one end of the inner side of the air outlet pipeline 138 are respectively communicated with the cooling cavity 136, and one end of the outer side of the air inlet pipeline 137 and one end of the outer side of the air outlet pipeline 138 are respectively connected with the air pipe joint 132.
Preferably, as shown in fig. 2, the heat insulation mechanism 130 includes a heat insulation block 133 and a heating stage installation block 134, the heat insulation block 133 is disposed on the top surface of the Z-axis connection block 131, the heating stage installation block 134 is disposed on the top surface of the heat insulation block 133, and the heating stage 140 is disposed on the top surface of the heating stage installation block 134.
Preferably, as shown in fig. 2, the lifting mechanism 120 further includes a limiting device, and the limiting device includes an inductor, an induction sheet, a hard limiting block, and a protection block;
the two induction sheets are arranged on the Z-axis connecting block 131, the two inductors are respectively arranged on the side wall of the mounting seat 121 and are positioned in the moving range of the induction sheets,
the protective block is disposed on top of the sliding assembly 122,
the hard limiting block is arranged on the side wall of the mounting seat 121, and the front end of the hard limiting block is positioned below the heat insulation mechanism 130.
Preferably, as shown in fig. 4, the heating stage mounting block 134 is provided with four bosses on the top surface and six bosses on the bottom surface.
This configuration advantageously reduces the contact area of the heat block mounting block 134 with the heat block 140 and the heat insulating block 133, and the bosses serve to reduce the thermal contact area and reduce heat transfer.
Preferably, as shown in fig. 5, the heat insulation block 133 is provided with four bosses on the bottom surface.
This structure is favorable to reducing through thermal-insulated piece 133 to Z axle connecting block 131 and elevating system 120 heat transfer, and the material selection material of thermal-insulated piece 133 is hard, and the thermal conductivity is poor and the non-metallic material that is difficult for ageing, and the boss is used for reducing hot contact area, reduces heat-conduction.
The sliding assembly 122 includes a guide rail and a slider, which are slidably connected.
The driving device 126 comprises a servo motor 127, a screw rod 128 is arranged at the working end of the servo motor, a nut 129 is arranged at the bottom of the cavity 135, and the screw rod 128 is in threaded connection with the nut 129.
In other different embodiments, the driving device 126 comprises a driving cylinder, and the working end of the driving cylinder is connected with the Z-axis connecting block 131.
Before the product is put in, the driving device 126 drives the heating table 140 to descend to a receiving position, and after the product 160 is placed at the top ends of the product supporting rods 150, the driving device 126 drives the heating table 140 to ascend to a working position, so that the product 160 is jacked up from the supporting rods, the product 160 is heated, and meanwhile, the product can ascend to different distances according to the thickness of the product;
after the heating table 140 starts to work, the surface temperature of the heating table 140 reaches 200 ℃, the temperature of the lifting mechanism 120 associated with the heating table 140 exceeds 70 ℃, the working temperature of the driving device 126 is lower than 50 ℃, and under the working environment, the service life of the driving device 126 is greatly shortened;
the upper surface and the lower surface of the heating table installation block 134 are not flat, the upper surface and the lower surface are respectively provided with four convex surfaces and six convex surfaces, the structure is favorable for reducing the contact area of the heating table installation block 134 with the heating table 140 and the heat insulation block 133, the heat insulation block 133 is made of hard materials, has poor heat conductivity and is not easy to age, the single surface of the heat insulation block 133 is provided with four convex surfaces, the heat transfer from the heat insulation block 133 to the Z shaft connection block 131 and the driving device 126 is reduced, after the heat is transferred to the Z shaft connection block 131, two air pipe connectors 132 on the Z shaft connection block 131 pass through the air inlet pipeline 137 and the air outlet pipeline 138, high-speed compressed air passes through the cooling cavity 136, the heat of the Z shaft connection block 131 is taken away, the effect of reducing the temperature of the driving device 126 is effectively realized after the temperature is reduced for many times, the Z shaft connection block works in a safe temperature range, and the service life of the Z shaft connection block is prolonged.
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the utility model as defined by the appended claims.
Claims (7)
1. The utility model provides a semiconductor heating table goes up and down and temperature protection mechanism under high clean grade environment, a serial communication port, comprising a base plate, it is provided with elevating system to run through perpendicularly on the bottom plate, elevating system goes up to slide and is provided with Z axle connecting block, Z axle connecting block top surface is provided with thermal-insulated mechanism, thermal-insulated mechanism top is provided with the heating table, encircle on the bottom plate elevating system is provided with many product support bars perpendicularly, many product support bar top is run through respectively and sliding connection the heating table.
2. The semiconductor heating stage lifting and temperature protection mechanism of claim 1, wherein the lifting mechanism comprises: drive arrangement, mount pad, slip subassembly, drive arrangement sets up the bottom plate bottom surface, drive arrangement is used for the drive Z axle connecting block vertical lift, the mount pad sets up the bottom plate top surface, the slip subassembly sets up perpendicularly the mount pad is relative drive arrangement one side, Z axle connecting block passes through slip subassembly sliding connection the mount pad.
3. The semiconductor heating table lifting and temperature protecting mechanism under high cleanliness class environment according to claim 1, wherein a cavity is arranged in the middle of the Z-axis connecting block, a cooling cavity is arranged around the outside of the cavity, an air inlet pipeline and an air outlet pipeline are arranged on the side wall of the Z-axis connecting block in a penetrating manner, one ends of the inner sides of the air inlet pipeline and the air outlet pipeline are respectively communicated with the cooling cavity, and one ends of the outer sides of the air inlet pipeline and the air outlet pipeline are respectively connected with an air pipe joint.
4. The semiconductor heating stage lifting and temperature protecting mechanism under high cleanliness class environment according to claim 1, wherein the heat insulation mechanism comprises a heat insulation block and a heating stage mounting block, the heat insulation block is arranged on the top surface of the Z-axis connecting block, the heating stage mounting block is arranged on the top surface of the heat insulation block, and the heating stage is arranged on the top surface of the heating stage mounting block.
5. The semiconductor heating stage lifting and temperature protecting mechanism under high cleanliness class environment according to claim 2, wherein the lifting mechanism further comprises a limiting device, and the limiting device comprises an inductor, an induction sheet, a hard limiting block and a protecting block;
the two sensors are respectively arranged on the side wall of the mounting seat and positioned in the moving range of the sensing piece;
the protection block is arranged at the top end of the sliding assembly;
the hard limiting block is arranged on the side wall of the mounting seat, and the front end of the hard limiting block is positioned below the heat insulation mechanism.
6. The semiconductor heating stage lifting and temperature protection mechanism of claim 1, wherein the heating stage has a plurality of bosses on both the top and bottom surfaces.
7. The mechanism of claim 4, wherein the bottom surface of the heat block is provided with a plurality of bosses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220005808.9U CN216671576U (en) | 2022-01-05 | 2022-01-05 | Semiconductor heating table lifting and temperature protection mechanism under high-cleanliness grade environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220005808.9U CN216671576U (en) | 2022-01-05 | 2022-01-05 | Semiconductor heating table lifting and temperature protection mechanism under high-cleanliness grade environment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216671576U true CN216671576U (en) | 2022-06-03 |
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ID=81758978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220005808.9U Active CN216671576U (en) | 2022-01-05 | 2022-01-05 | Semiconductor heating table lifting and temperature protection mechanism under high-cleanliness grade environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216671576U (en) |
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2022
- 2022-01-05 CN CN202220005808.9U patent/CN216671576U/en active Active
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