CN216671398U

CN216671398U - I-shaped ceramic capacitor

Info

Publication number: CN216671398U
Application number: CN202220123624.2U
Authority: CN
Inventors: 董加银
Original assignee: Huai'an Yongjie Electronic Technology Co ltd
Current assignee: Huai'an Yongjie Electronic Technology Co ltd
Priority date: 2022-01-17
Filing date: 2022-01-17
Publication date: 2022-06-03
Anticipated expiration: 2032-01-17

Abstract

The utility model relates to the technical field of capacitors and discloses an I-shaped ceramic capacitor, which comprises a ceramic capacitor main body, wherein welding pins are equidistantly arranged at the bottom of the ceramic capacitor main body, a heat conducting plate is fixedly connected inside the ceramic capacitor main body, heat conducting columns are fixedly connected on the upper surface of the heat conducting plate at equal intervals, a heat radiating plate is fixedly connected on the upper surface of the ceramic capacitor main body, heat radiating blocks are fixedly connected on the upper surface of the heat radiating plate at equal intervals, the stability of the ceramic capacitor main body can be enhanced by arranging the fixing columns, after the ceramic capacitor main body is attached to a circuit board, the outer surfaces of steel balls can be tightly abutted against the lower surface of the circuit board through the elasticity of the elastic blocks, the stability is enhanced, the stability of the ceramic capacitor main body can be enhanced by arranging the fixing columns, after the ceramic capacitor main body is attached to the circuit board, the outer surfaces of the steel balls can be tightly abutted against the lower surface of the circuit board through the elasticity of the elastic blocks, the stability is enhanced.

Description

I-shaped ceramic capacitor

Technical Field

The utility model relates to the technical field of capacitors, in particular to an I-shaped ceramic capacitor.

Background

The capacitor is very diverse depending on the dielectric, for example: electrolyte capacitors, paper capacitors, thin film capacitors, ceramic capacitors, mica capacitors, air capacitors, and the like. Compared with other capacitors, the ceramic capacitor has the advantages of higher service temperature, large specific capacity, good moisture resistance, smaller dielectric loss, large-range selection of capacitance temperature coefficient and the like, and can be widely used in electronic circuits with considerable dosage.

Although the existing ceramic capacitor can bear high temperature, the service life of the capacitor can be influenced by overhigh temperature, and after the existing capacitor is welded on a circuit board, when the existing capacitor is collided, the force applied to pins is large, so that the welded part is easy to fall off, and the capacitor is poor in contact when in use.

SUMMERY OF THE UTILITY MODEL

To the not enough of prior art existence, the utility model aims to provide a good and strong I shape ceramic capacitor of installation stability of heat dispersion.

In order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides a I shape ceramic capacitor, including ceramic capacitor main part, the bottom equidistance of ceramic capacitor main part is provided with the welding pin, the inside rigid coupling of ceramic capacitor main part has the heat-conducting plate, the upper surface equidistance rigid coupling of heat-conducting plate has the heat conduction post, the upper surface rigid coupling of ceramic capacitor main part has the heating panel, the upper surface equidistance rigid coupling of heating panel has the radiating block, the lower surface equidistance rigid coupling of ceramic capacitor main part has the fixed column, the steel ball is installed to the inside equidistance of fixed column, the slider is installed to the inside equidistance of ceramic capacitor main part, the elastic block is installed to the inside center department of ceramic capacitor main part

Preferably, the heat conducting plate, the heat radiating plate and the heat conducting column are all made of metal copper, the heat radiating block is made of metal aluminum, heat conducting silicone grease is filled at the joint of the heat conducting plate and the ceramic capacitor main body, and heat conducting silicone grease is also filled at the joint of the heat conducting column and the ceramic capacitor main body.

Preferably, the heat dissipation block is square, and an upper surface of the heat dissipation block extends to an outer surface of the ceramic capacitor body.

Preferably, the number of the steel balls and the number of the sliding blocks are two, the surface of each sliding block is arc-shaped, and the outer surface of each steel ball abuts against the surface of each sliding block.

Preferably, the side surfaces of the two sliding blocks are abutted against the outer surface of the elastic block, and the outer surface of the steel ball extends to the outer surface of the fixed column.

Preferably, the number of the fixing posts is four, and one end of each fixing post extends to the inside of the ceramic capacitor main body.

Compared with the prior art, this practicality possesses following beneficial effect:

1. through setting up the fixed column, can strengthen the stability of ceramic capacitor main part, after ceramic capacitor main part laminating is on the circuit board, through the elasticity of elastic block, can make the surface of steel ball tightly support and lean on the lower surface at the circuit board, strengthened stability.

2. Through setting up the fixed column, can strengthen the stability of ceramic capacitor main part, after ceramic capacitor main part laminating is on the circuit board, through the elasticity of elastic block, can make the surface of steel ball tightly support and lean on the lower surface at the circuit board, strengthened stability.

Drawings

FIG. 1 is a schematic diagram of an embodiment of the present invention;

FIG. 2 is a cross-sectional view of an embodiment of the present invention;

fig. 3 is an enlarged view of a portion a in fig. 2.

In the figure: 1. a ceramic capacitor body; 2. fixing a column; 11. welding pins; 12. a heat conducting plate; 13. a heat dissipation plate; 14. a heat dissipating block; 15. a heat-conducting column; 21. steel balls; 22. a slider; 23. an elastic block.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The first embodiment is as follows:

referring to fig. 1-2, an i-shaped ceramic capacitor includes a ceramic capacitor body 1, wherein welding pins 11 are equidistantly disposed at the bottom of the ceramic capacitor body 1, a heat conducting plate 12 is fixedly connected inside the ceramic capacitor body 1, heat conducting pillars 15 are fixedly connected to the upper surface of the heat conducting plate 12 at equal intervals, a heat dissipating plate 13 is fixedly connected to the upper surface of the ceramic capacitor body 1, heat dissipating blocks 14 are fixedly connected to the upper surface of the heat dissipating plate 13 at equal intervals, the heat conducting plate 12, the heat dissipating plate 13 and the heat conducting pillars 15 are made of copper, the heat dissipating block 14 is made of aluminum, the heat dissipating block 14 is square, the upper surface of the heat dissipating block 14 extends to the outer surface of the ceramic capacitor body 1, the joint between the heat conducting plate 12 and the ceramic capacitor body 1 is filled with heat conducting silicone grease, the joint between the heat conducting pillars 15 and the ceramic capacitor body 1 is also filled with heat conducting silicone grease, and by disposing a fixing pillar 2, can strengthen ceramic capacitor body 1's stability, after ceramic capacitor body 1 laminating on the circuit board, through the elasticity of elastic block 23, can make the surface of steel ball 21 tightly support and lean on the lower surface at the circuit board, strengthened stability.

Referring to fig. 2-3, the lower surface of the ceramic capacitor body 1 is equidistantly and fixedly connected with four fixing posts 2, one end of each fixing post 2 extends into the ceramic capacitor body 1, steel balls 21 are equidistantly mounted in each fixing post 2, sliders 22 are equidistantly mounted in the ceramic capacitor body 1, the number of the steel balls 21 and the number of the sliders 22 are both two, the surface of each slider 22 is arc-shaped, the outer surfaces of the steel balls 21 abut against the surfaces of the sliders 22, an elastic block 23 is mounted at the center of the interior of the ceramic capacitor body 1, the side surfaces of the two sliders 22 abut against the outer surfaces of the elastic blocks 23, the outer surfaces of the steel balls 21 extend to the outer surfaces of the fixing posts 2, and by arranging the fixing posts 2, the stability of the ceramic capacitor body 1 can be enhanced, when the ceramic capacitor body 1 is attached to the circuit board, the elastic blocks 23 are elastic, the outer surface of the steel ball 21 can be tightly abutted against the lower surface of the circuit board, so that the stability is enhanced.

The working principle is as follows: before installation, according to the installation position of the ceramic capacitor main body 1, four preformed holes with the diameter equal to that of the fixed columns 2 are arranged on the circuit board in advance, during installation, the ceramic capacitor main body 1 is placed at the installation position, welding pins 11 penetrate through the welding holes, meanwhile, the ceramic capacitor main body 1 is pressed downwards, the outer surfaces of the steel balls 21 are tightly abutted against the inner wall of the preformed holes, the fixed columns 2 penetrate through the preformed holes, when the lower surface of the ceramic capacitor main body 1 is tightly attached to the circuit board, the steel balls 21 are ejected out due to the elasticity of the elastic blocks 23, the stability of the ceramic capacitor main body 1 can be enhanced by arranging the fixed columns 2, after the ceramic capacitor main body 1 is attached to the circuit board, the outer surfaces of the steel balls 21 can be tightly abutted against the lower surface of the circuit board through the elasticity of the elastic blocks 23, the stability is enhanced, and during heat dissipation, the heat generated inside the ceramic capacitor body 1 is absorbed by the heat conducting plate 12, and then is guided into the heat radiating plate 13 through the heat conducting columns 15, and finally the heat radiating plate 13 is cooled on the surface of the heat radiating block 14 through the flowing of the outside air, so that the practicability is enhanced.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. An I-shaped ceramic capacitor, includes ceramic capacitor main part (1), its characterized in that: the bottom equidistance of ceramic capacitor main part (1) is provided with welding pin (11), the inside rigid coupling of ceramic capacitor main part (1) has heat-conducting plate (12), the upper surface equidistance rigid coupling of heat-conducting plate (12) has heat-conducting post (15), the upper surface rigid coupling of ceramic capacitor main part (1) has heating panel (13), the upper surface equidistance rigid coupling of heating panel (13) has radiating block (14), the lower surface equidistance rigid coupling of ceramic capacitor main part (1) has fixed column (2), steel ball (21) are installed to the inside equidistance of fixed column (2), slider (22) are installed to the inside equidistance of ceramic capacitor main part (1), elastic block (23) are installed to the inside center department of ceramic capacitor main part (1).

2. An i-shaped ceramic capacitor according to claim 1, characterized in that: the heat conducting plate (12), the heat radiating plate (13) and the heat conducting column (15) are all made of metal copper, the heat radiating block (14) is made of metal aluminum, heat conducting silicone grease is filled at the joint of the heat conducting plate (12) and the ceramic capacitor main body (1), and heat conducting silicone grease is also filled at the joint of the heat conducting column (15) and the ceramic capacitor main body (1).

3. An i-shaped ceramic capacitor according to claim 1, characterized in that: the radiating block (14) is square, and the upper surface of the radiating block (14) extends to the outer surface of the ceramic capacitor main body (1).

4. An i-shaped ceramic capacitor according to claim 1, characterized in that: the quantity of steel balls (21) and sliders (22) is two, the surfaces of the sliders (22) are arc-shaped, and the outer surfaces of the steel balls (21) abut against the surfaces of the sliders (22).

5. An i-shaped ceramic capacitor according to claim 1, characterized in that: the side surfaces of the two sliding blocks (22) are abutted against the outer surface of the elastic block (23), and the outer surface of the steel ball (21) extends to the outer surface of the fixed column (2).

6. An i-shaped ceramic capacitor according to claim 1, characterized in that: the number of the fixed columns (2) is four, and one ends of the fixed columns (2) extend into the ceramic capacitor main body (1).