CN216646887U

CN216646887U - Novel heat radiation structure photovoltaic module

Info

Publication number: CN216646887U
Application number: CN202122707009.4U
Authority: CN
Inventors: 吴金汉; 刘国栋
Original assignee: Shanghai Aerospace Science and Industry Appliance Co Ltd
Current assignee: Shanghai Aerospace Science and Industry Appliance Co Ltd
Priority date: 2021-11-03
Filing date: 2021-11-03
Publication date: 2022-05-31
Anticipated expiration: 2031-11-03

Abstract

The utility model provides a novel heat dissipation structure photoelectric module which comprises an upper cover, a lower cover and a fuzz button connector, wherein the upper cover and the lower cover are connected through bolts; the two groups of transmission units generate heat which is diffused to the outside through the upper cover and the lower cover respectively; the utility model has the beneficial effects that: the transmission unit through setting up is connected with upper cover, lower cover respectively, and at the in-process that transmits data, can distribute away the heat through the surface of upper cover, lower cover respectively, can effectually prevent that the heat from piling up, causes the transmission unit to damage.

Description

Novel heat radiation structure photovoltaic module

Technical Field

The utility model relates to the technical field of photoelectric transmission, in particular to a novel radiating structure photoelectric module.

Background

The network cable cannot meet the requirement of long-distance transmission, people begin to try to expand the bandwidth and improve the transmission rate, so that an optical module is provided, the optical module consists of an optoelectronic element, a functional circuit, an optical interface and the like, the optical module is an integrated module for converting optical signals into electric signals and converting the electric signals into optical signals, and the optical module is mainly developed in the direction of miniaturization, high-rate, long-distance and hot plugging at present.

With the development of miniaturization of an optical module, the heat dissipation of the optical module is a problem which needs to be solved, if devices with excessive heat dissipation are accumulated together, the heat of the devices is inevitably difficult to dissipate, the heat dissipation difficulty causes the temperature rise of the devices, so that the working state of a chip is changed, the chip can be stopped seriously, if the operating temperature of the optical module is too high, the optical power of the optical module is increased, a received signal is mistakenly received, even the optical module can be burnt out, the optical module can not normally operate, and the conventional heat dissipation of the optical module can not meet the existing problems.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides a novel photoelectric module with a heat dissipation structure.

The utility model solves the technical problems through the following technical means:

a novel photoelectric module with a heat dissipation structure comprises an upper cover, a lower cover and a fuzz button connector, wherein the upper cover and the lower cover are connected through bolts, an upper PCB is connected in the upper cover through bolts, a lower PCB is connected in the lower cover through bolts, the fuzz button connector is arranged between the upper PCB and the lower PCB, and transmission units are arranged in the upper cover and the lower cover;

the two groups of transmission units generate heat which is diffused to the outside through the upper cover and the lower cover respectively.

As an improvement of the technical scheme, a tail sleeve is arranged between the upper cover and the lower cover, a heat shrink tube and a silica gel winding tube are arranged on the tail sleeve, an MT assembly is arranged on the silica gel winding tube and connected with the transmission unit, and an electric connector is further arranged on the lower cover and connected with the lower PCB.

As the improvement of the technical scheme, the transmission unit comprises an FD assembly, a driving chip and a laser chip, the driving chip and the laser chip are welded in the lower cover, the FD assembly is arranged on the lower cover, the driving chip is further provided with a protective shell, and the protective shell is connected with the lower PCB.

As an improvement of the technical scheme, the fuzz button connector comprises a guide post and a base, the base is connected with the lower PCB, the guide post is fixedly arranged on the base, the upper PCB is provided with a groove, and the groove is matched with the guide post.

As an improvement of the technical scheme, the upper cover is provided with a first limiting block, the upper PCB is arranged between the first limiting block and the upper cover, the lower cover is provided with a second limiting block, and the lower PCB is arranged between the second limiting block and the lower cover.

The utility model has the beneficial effects that:

1. the transmission units are respectively connected with the upper cover and the lower cover, so that heat can be radiated out through the surfaces of the upper cover and the lower cover in the data transmission process, and the transmission units can be effectively prevented from being damaged due to heat accumulation;

2. through the last PCB board that sets up, cooperation between lower PCB board and the connection of hair button, at the in-process that carries out data transmission, the problem that can not go down using the soft board data has been solved, and also can effectually conveniently dispel the heat through the surface of upper cover, lower cover, can effectually prevent the accumulational phenomenon of heat, and at the in-process of carrying out the equipment, through last PCB board, lower PCB board symmetry sets up, can reasonable utilization space, install in order to make things convenient for other parts.

Drawings

FIG. 1 is a schematic view of the connection between the upper cover and the lower cover according to the embodiment of the present invention;

fig. 2 is a schematic structural diagram of a transmission unit according to an embodiment of the present invention;

FIG. 3 is a schematic view of the electrical connector and the lower cover according to the embodiment of the present invention;

FIG. 4 is a schematic structural view of a fuzz button connector according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of the upper cover according to the embodiment of the present invention;

fig. 6 is a schematic structural diagram of the lower cover according to the embodiment of the present invention.

In the figure: 10. an upper cover; 11. a first stopper; 12. an upper PCB board; 20. a tail sleeve; 30. a heat shrink tube; 40. a silica gel winding tube; an MT component; 60. a lower cover; 61. a lower PCB board; 62. an electrical connector; 63. a second limiting block; 70. a fuzz button connector; 71. a guide post; 72. a base; 80. a transmission unit; 81. a protective shell; 82. an FD element; 83. a driving chip; 84. and a laser chip.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Example (b):

as shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, the photovoltaic module with the novel heat dissipation structure according to the present embodiment includes an upper cover 10, a lower cover 60 and a fuzz button connector 70, where the upper cover 10 and the lower cover 60 are connected by a bolt, the upper cover 10 is connected with an upper PCB 12 by a bolt, the lower cover 60 is connected with a lower PCB 61 by a bolt, the fuzz button connector 70 is disposed between the upper PCB 12 and the lower PCB 61, and transmission units 80 are disposed in both the upper cover 10 and the lower cover 60;

the two sets of the transmission units 80 generate heat, and the heat is diffused to the outside through the upper cover 10 and the lower cover 60, respectively.

In this embodiment, the connection position of the transmission unit 80 and the upper cover 10 is the same as the connection position of the transmission unit 80 and the lower cover 60, and the positions are matched;

when the transmission unit 80 transmits data to generate heat, the transmission unit 80 transmits the heat to the lower cover 10, and then the heat is dissipated through the surface of the lower cover 10, and the transmission unit 80 of the upper cover 10 adopts the same heat dissipation principle as the above;

the transmission unit 80 is connected with the upper cover 10 and the lower cover 60 respectively, so that heat can be dissipated through the surfaces of the upper cover 10 and the lower cover 60 respectively in the data transmission process, and the transmission unit 80 can be effectively prevented from being damaged due to heat accumulation;

through the last PCB board 12 that sets up, cooperation between lower PCB board 61 and the hair button connection 70, at the in-process that carries out data transmission, the problem that can not walk is solved to use the soft board data, and also can effectually conveniently pass through upper cover 10, the surface of lower cover 60 dispels the heat, can effectually prevent the accumulational phenomenon of heat, and at the in-process of carrying out the equipment, through last PCB board 12, lower PCB board 61 symmetry sets up, can reasonable utilization space, in order to make things convenient for other parts to install.

As shown in fig. 1, a tail sleeve 20 is disposed between the upper cover 10 and the lower cover 60, a heat shrink tube 30 and a silica gel winding tube 40 are disposed on the tail sleeve 20, an MT component 50 is disposed on the silica gel winding tube 40, the MT component 50 is connected with a transmission unit 80, an electrical connector 62 is further disposed on the lower cover 60, the electrical connector 62 is connected with a lower PCB 61, and the MT component 50 and the electrical connector 62 are disposed to facilitate connection with peripheral devices.

As shown in fig. 2 and 3, the transmission unit 80 includes an FD assembly 82, a driving chip 83, and a laser chip 84, the driving chip 83 and the laser chip 84 are welded in the lower cover 60, the FD assembly 82 is disposed on the lower cover 60, a protective casing 81 is further disposed on the driving chip 83, and the protective casing 81 is connected to the lower PCB 61.

In this embodiment, the connection modes of the FD assembly 82, the driving chip 83, the laser chip 84 and the protective casing 81 in the upper cover 10 are the same as those of the FD assembly 82, the driving chip 83, the laser chip 84 and the protective casing 81 in the lower cover 60, and the positions are matched;

in the data transmission process, the driving chip 83 and the laser chip 84 work to generate heat, and then the heat is led out through the upper cover 10 and the lower cover 60 respectively to dissipate heat.

As shown in fig. 4, the fuzz button connector 70 includes a guide post 71 and a base 72, the base 72 is connected with the lower PCB 61, the guide post 71 is fixedly disposed on the base 72, the upper PCB 12 is provided with a groove, and the groove is matched with the guide post 71.

When the upper PCB 12 and the lower PCB 61 are connected for data transmission, namely the upper cover 10 and the lower cover 60 are combined, the guide columns 71 are matched with the grooves, so that the upper PCB 12 can be conveniently guided, and the installation convenience can be improved;

in this embodiment, the base 72 is made of a heat-conducting insulating material, so that rapid heat dissipation can be conveniently performed in the data transmission process.

As shown in fig. 5 and 6, the upper cover 10 is provided with a first stopper 11, the upper PCB 12 is disposed between the first stopper 11 and the upper cover 10, the lower cover 60 is provided with a second stopper 63, and the lower PCB 61 is disposed between the second stopper 63 and the lower cover 60.

First stopper 11 through setting up can carry on spacingly to last PCB board 12, at the in-process of installing, improves the stability of going up PCB board 12, can carry on spacingly to PCB board 61 down through the second stopper 63 that sets up, at the in-process of installing, improves the stability of PCB board down.

It should be noted that, in this document, if there are first and second, etc., relational terms are only used for distinguishing one entity or operation from another entity or operation, and there is no necessarily any requirement or suggestion that any actual relation or order exists between the entities or operations. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. The utility model provides a novel heat radiation structure photovoltaic module which characterized in that: the PCB packaging box comprises an upper cover (10), a lower cover (60) and a fuzz button connector (70), wherein the upper cover (10) and the lower cover (60) are connected through bolts, an upper PCB (12) is connected in the upper cover (10) through bolts, a lower PCB (61) is connected in the lower cover (60) through bolts, the fuzz button connector (70) is arranged between the upper PCB (12) and the lower PCB (61), and transmission units (80) are arranged in the upper cover (10) and the lower cover (60);

the two groups of transmission units (80) generate heat and diffuse the heat to the outside through the upper cover (10) and the lower cover (60) respectively.

2. The photovoltaic module with the novel heat dissipation structure of claim 1, wherein: be provided with tail cover (20) between upper cover (10), lower cover (60), be provided with pyrocondensation pipe (30) and silica gel winding pipe (40) on tail cover (20), be provided with MT subassembly (50) on silica gel winding pipe (40), MT subassembly (50) are connected with transmission unit (80), still be provided with electric connector (62) on lower cover (60), electric connector (62) are connected with lower PCB board (61).

3. The photovoltaic module with the novel heat dissipation structure of claim 1, wherein: the transmission unit (80) comprises an FD assembly (field-programmable gate) component (82), a driving chip (83) and a laser chip (84), the driving chip (83) and the laser chip (84) are welded in the lower cover (60), the FD assembly (82) is arranged on the lower cover (60), a protective shell (81) is further arranged on the driving chip (83), and the protective shell (81) is connected with the lower PCB (61).

4. The novel photovoltaic module with the heat dissipation structure of claim 1, wherein: the fuzz button connector (70) comprises a guide column (71) and a base (72), the base (72) is connected with a lower PCB (61), the guide column (71) is fixedly arranged on the base (72), the upper PCB (12) is provided with a groove, and the groove is matched with the guide column (71).

5. The photovoltaic module with the novel heat dissipation structure of claim 1, wherein: the PCB assembling structure is characterized in that a first limiting block (11) is arranged on the upper cover (10), the upper PCB (12) is arranged between the first limiting block (11) and the upper cover (10), a second limiting block (63) is arranged on the lower cover (60), and the lower PCB (61) is arranged between the second limiting block (63) and the lower cover (60).