CN216646717U - Thermal resistance testing device for surface mounted device - Google Patents
Thermal resistance testing device for surface mounted device Download PDFInfo
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- CN216646717U CN216646717U CN202122945996.1U CN202122945996U CN216646717U CN 216646717 U CN216646717 U CN 216646717U CN 202122945996 U CN202122945996 U CN 202122945996U CN 216646717 U CN216646717 U CN 216646717U
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Abstract
The utility model discloses a device for testing thermal resistance of a chip device.A heat insulation and conduction cushion layer is arranged between a conductive chip layer and a cooling chip layer, and two sides of the heat insulation and conduction cushion layer are respectively attached to one sides of the conductive chip layer and the cooling chip layer; adopt the conductive patch layer, the superimposed structure setting of insulating heat conduction bed course and cooling patch layer, form the structure of insulating heat conduction, utilize the through-hole structure, can direct detection device surface's temperature to be measured, combine the inside temperature of device to be measured simultaneously, the inside and outside temperature difference of device to be measured obtains the thermal resistance of device to be measured, adopt insulating layer both ends to set up conductive patch layer and cooling patch layer, can make the device to be measured of paster class under the normal condition of switching on work, avoid with the insulation that cooling structure direct contact leads to, utilize insulating layer to play the purpose of insulating while heat conduction, and do not influence the detection of device surface temperature to be measured, the measuring efficiency and the degree of accuracy of the thermal resistance of patch structure have been improved greatly.
Description
Technical Field
The utility model belongs to the technical field of power device testing, and particularly relates to a thermal resistance testing device for a surface mounted device.
Background
In the power device test, a test item for measuring the heat dissipation capability of the power device is called a thermal resistance test. When the thermal resistance of a common direct-insertion type testing device is tested, an auxiliary thermal resistance test is mainly carried out by an external water chiller, but an effective test method for the thermal resistance of a patch type device does not exist. When a conventional direct-insert type device is used for testing thermal resistance, in order to simulate the state in normal use, the back of the device is placed on a water chiller, and a thermocouple for detecting the temperature of a back shell is placed in the center of a cold water plate of the water chiller so as to test the thermal resistance. The main test problem is that the cold water plate used in the test is basically made of metal,imost of the back plates of the patch type devices are parallel to the device tube legs or are higher than the device tube legs, and the patch type devices can be directly short-circuited through the metal cold plate if an in-line measurement method is used, so that the devices are damaged. If the direct-insert type test method is used, the device can be short-circuited and failed, and the thermal resistance measurement of the chip device cannot be effectively realized.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a device for testing the thermal resistance of a chip device, which is used for overcoming the defects of the prior art.
A thermal resistance testing device for a surface mounted device comprises a conductive surface mounted layer, an insulating heat conduction cushion layer and a cooling surface mounted layer, wherein the insulating heat conduction cushion layer is arranged between the conductive surface mounted layer and the cooling surface mounted layer, and two sides of the insulating heat conduction cushion layer are respectively attached to one sides of the conductive surface mounted layer and the cooling surface mounted layer; the other side of the conductive patch layer is provided with a pin side joint with the device to be tested, the other side of the cooling patch layer is provided with a cooling device, a through hole is arranged among the conductive patch layer, the insulating heat conduction cushion layer and the cooling patch layer, and a temperature sensor for detecting the temperature of the surface radiator of the device to be tested is arranged in the through hole.
Furthermore, the radius of the through hole among the conductive patch layer, the insulating heat conduction cushion layer and the cooling patch layer is not more than 1.5 mm.
Furthermore, the radius of the through hole among the conductive patch layer, the insulating heat conduction cushion layer and the cooling patch layer is 1 mm.
Furthermore, the conductive patch layer adopts a metal layer.
Furthermore, the cooling patch layer adopts a metal layer.
Furthermore, the cooling device adopts a cold water cooling plate.
Furthermore, the surface of the conductive patch layer is provided with lead wiring, and the lead wiring is connected with pin wiring of the device to be tested.
Furthermore, the thickness of the insulating and heat-conducting cushion layer is 0.08-0.12 mm.
Furthermore, the thickness of the insulating and heat-conducting pad layer is 0.1 mm.
Furthermore, the insulating heat-conducting cushion layer adopts a PCB.
Compared with the prior art, the utility model has the following beneficial technical effects:
the utility model relates to a device for testing thermal resistance of a surface mounted device, which comprises a conductive surface mounted layer, an insulating heat conduction cushion layer and a cooling surface mounted layer, wherein the insulating heat conduction cushion layer is arranged between the conductive surface mounted layer and the cooling surface mounted layer; adopt the electrically conductive SMD layer, the superimposed structure setting of insulating heat conduction bed course and cooling SMD layer, form the structure of insulating heat conduction, utilize the through-hole structure, can direct detection to the temperature on device surface that awaits measuring, combine the inside temperature of device that awaits measuring simultaneously, form the inside and outside temperature difference of device that awaits measuring and obtain the thermal resistance of device that awaits measuring, adopt insulating layer both ends to set up electrically conductive SMD layer and cooling SMD layer, under the device that awaits measuring that can make the paster class normally switches on the condition of work, avoid with the insulation that cooling structure direct contact leads to, utilize insulating layer play insulating purpose of heat conduction simultaneously, and do not influence the measuring of device surface temperature that awaits measuring, the measurement of SMD structure thermal resistance efficiency and the degree of accuracy have been improved greatly.
Furthermore, the radius of the through hole among the conductive patch layer, the insulating heat conduction cushion layer and the cooling patch layer is not more than 1.5mm, so that the test end of the system can directly measure the temperature of the back plate of the device to be tested through the thermocouple, and the purpose of conveniently testing the thermal resistance of the patch type device on the original direct-insertion thermal resistance test system is realized.
Furthermore, the conductive patch layer and the cooling patch layer are both metal layers, so that the heat dissipation efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of a testing apparatus according to an embodiment of the present invention.
In the figure, 1, a conductive patch layer; 2. an insulating heat-conducting cushion layer; 3. cooling the surface mount layer; 4. a temperature sensor; 5. a device under test; 6. and a cooling device.
Detailed Description
The utility model is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, a thermal resistance testing device for a chip device comprises a conductive chip layer 1, an insulating and heat conducting cushion layer 2 and a cooling chip layer 3, wherein the insulating and heat conducting cushion layer 2 is arranged between the conductive chip layer 1 and the cooling chip layer 3, and two sides of the insulating and heat conducting cushion layer 2 are respectively attached to one sides of the conductive chip layer 1 and the cooling chip layer 3; the other side of the conductive patch layer 1 is attached to the side of a pin of a device to be detected 5, the other side of the cooling patch layer 3 is provided with a cooling device 6, through holes are formed among the conductive patch layer 1, the insulating heat conduction cushion layer 2 and the cooling patch layer 3, and a temperature sensor 4 is arranged in each through hole and used for detecting the temperature of a radiator on the surface of the device to be detected; adopt electrically conductive paster layer 1, the superimposed structural setting of insulating heat conduction bed course 2 and cooling paster layer 3, form the structure of insulating heat conduction, utilize the through-hole structure, can direct detection await measuring the temperature on device surface, combine the inside temperature of the device that awaits measuring simultaneously, form the inside and outside temperature difference of the device that awaits measuring and obtain the thermal resistance of the device that awaits measuring, adopt insulating layer both ends to set up electrically conductive paster layer 1 and cooling paster layer 3, under the condition that can make the device that awaits measuring of paster class normally switch on work, avoid with the insulation that cooling structure direct contact leads to, utilize insulating layer to play the purpose of insulating while heat conduction, and do not influence the detection of the device surface temperature that awaits measuring, the measuring efficiency and the degree of accuracy of paster structure thermal resistance have been improved greatly.
Specifically, as shown in fig. 1, the radius of the through hole in the middle of the conductive patch layer 1, the insulating heat conduction cushion layer 2 and the cooling patch layer 3 is not greater than 1.5mm, and the radius of the through hole in the middle of the conductive patch layer 1, the insulating heat conduction cushion layer 2 and the cooling patch layer 3 is 1mm, so that the test end of the system can directly measure the temperature of the back plate of the device to be tested through the thermocouple, and the purpose of conveniently testing the thermal resistance of the patch type device on the original direct-insertion thermal resistance test system is achieved.
The surface of the conductive patch layer 1 is provided with lead wiring for leading out pin wiring of the device to be detected 5 and detecting the power of the device to be detected 5.
The conductive patch layer 1 and the cooling patch layer 3 both adopt metal layers, so that the heat dissipation efficiency is improved.
The cooling device 6 adopts a cold water radiating plate, and a cold water channel is arranged on the cold water radiating plate and used for introducing cooling circulating liquid; the heat resistance test of a surface-mounted device can be realized by using the structure in the original test system without modifying the material and the test method of the cooling plate of the water chiller, and the three-layer structure adopted by the plate adopts the structure of the bimetallic clamping piece, so that the part close to the cold water plate is made of metal materials, can be well attached to the cold water plate, and is welded with the front surface of the device easily made of metal materials.
The thickness of the insulating heat conduction cushion layer 2 is 0.08-0.12mm, and the insulating heat conduction cushion layer 2 specifically adopts a PCB. Specifically, this application adopts 0.1mm thickness, and the insulating heat conduction bed course 2 that the centre set up adopt 0.1mmPCB board can, on the one hand be used for keeping apart, and on the other hand does not influence the device because thickness is little and dispels the heat through the cold water board. The center of the plate is provided with a circular through hole with the radius of 1mm, so that the thermocouple can directly measure the temperature of the back plate of the device through the plate, the electric isolation is realized, and the temperature sampling is not isolated.
The surface of the conductive patch layer 1 is provided with a gold-plated layer, and the surface of the conductive patch layer 1 is plated with metal so as to facilitate welding of devices and simultaneously facilitate joining with a test board in a convenient period, and meanwhile, the whole board area is subjected to partition isolation, so that short circuit caused by metal contact of the devices and a cold water board is avoided.
Claims (10)
1. A thermal resistance testing device of a surface mount device is characterized by comprising a conductive surface mount layer (1), an insulating and heat conducting cushion layer (2) and a cooling surface mount layer (3), wherein the insulating and heat conducting cushion layer (2) is arranged between the conductive surface mount layer (1) and the cooling surface mount layer (3), and two sides of the insulating and heat conducting cushion layer (2) are respectively attached to one sides of the conductive surface mount layer (1) and the cooling surface mount layer (3); the opposite side of electrically conductive paster layer (1) is provided with the pin side with device to be measured (5) and laminates, and the opposite side of cooling paster layer (3) is provided with cooling device (6), is equipped with the through-hole in the middle of electrically conductive paster layer (1), insulating heat conduction bed course (2) and cooling paster layer (3), installs temperature sensor (4) that are used for detecting the temperature of device to be measured surface radiator in the through-hole.
2. The thermal resistance testing device of the patch device according to claim 1, wherein the radius of the through hole among the conductive patch layer (1), the insulating and thermal conductive pad layer (2) and the cooling patch layer (3) is not more than 1.5 mm.
3. The thermal resistance testing device of the patch device according to claim 2, wherein the radius of the through hole among the conductive patch layer (1), the insulating and thermal conductive cushion layer (2) and the cooling patch layer (3) is 1 mm.
4. The thermal resistance testing device of the patch device according to claim 1, wherein the conductive patch layer (1) is a metal layer.
5. The thermal resistance testing device of the patch device according to claim 1, wherein the cooling patch layer (3) is a metal layer.
6. The thermal resistance testing device of the patch device as claimed in claim 1, wherein the cooling device (6) is a cold water heat sink.
7. The thermal resistance testing device of the patch device as claimed in claim 1, wherein the surface of the conductive patch layer (1) is provided with lead wiring, and the lead wiring is connected with pin wiring of the device to be tested (5).
8. The thermal resistance testing device of the patch device as claimed in claim 1, wherein the thickness of the insulating and heat conducting cushion layer (2) is 0.08-0.12 mm.
9. The thermal resistance testing device of the patch device as claimed in claim 8, wherein the thickness of the insulating and heat conducting cushion layer (2) is 0.1 mm.
10. The thermal resistance testing device of the patch device as claimed in claim 1, wherein the insulating and heat conducting cushion layer (2) is a PCB board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122945996.1U CN216646717U (en) | 2021-11-26 | 2021-11-26 | Thermal resistance testing device for surface mounted device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122945996.1U CN216646717U (en) | 2021-11-26 | 2021-11-26 | Thermal resistance testing device for surface mounted device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216646717U true CN216646717U (en) | 2022-05-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122945996.1U Active CN216646717U (en) | 2021-11-26 | 2021-11-26 | Thermal resistance testing device for surface mounted device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216646717U (en) |
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2021
- 2021-11-26 CN CN202122945996.1U patent/CN216646717U/en active Active
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