CN216624939U - Power distribution cabinet with rotary heat dissipation device - Google Patents

Abstract

The utility model discloses a power distribution cabinet with a rotary type heat dissipation device, which comprises a power distribution cabinet main body with a hollow structure inside, wherein the inner part of the outer wall of the power distribution cabinet main body is of a hollow structure, a through power distribution cabinet opening is formed in the middle position of one side of the power distribution cabinet main body, a matched cabinet door is installed in the power distribution cabinet opening, hinges are installed at the positions of two ends of one side, connected with the power distribution cabinet opening, of the cabinet door in an embedded mode, the power distribution cabinet main body and the cabinet door are in rotating fit, and heat dissipation mechanisms are installed at the positions of two sides of one end of the power distribution cabinet main body at equal intervals in an embedded mode. The heat dissipation mechanism is arranged, the heat dissipation motor is started to drive the heat dissipation fan blades to rotate, so that gas in the inner space of the power distribution cabinet main body and the inner space of the outer wall of the power distribution cabinet main body can be absorbed, high-temperature gas in the power distribution cabinet is exchanged with the outside, the temperature in the power distribution cabinet is reduced, and the heat of the power distribution cabinet is dissipated.

Description

Power distribution cabinet with rotary heat dissipation device

Technical Field

The utility model relates to the technical field of power distribution cabinets, in particular to a power distribution cabinet with a rotary type heat dissipation device.

Background

The distribution cabinet is also called distribution box, which is a device for distributing the total electric energy transmitted from a long distance to a plurality of near-end electric appliances according to the requirement, and simultaneously has the functions of protecting, monitoring and controlling the accessed electric appliances, a plurality of circuit wires and electric elements for protecting, monitoring and controlling the electric appliances are arranged in the distribution cabinet,

in the switch board use, the electric current can make circuit electric wire and electric elements produce the heat through circuit electric wire and electric elements, if can not in time wave away the heat, cause the inside high temperature of switch board easily, burn out the condition of circuit electric wire and electric elements, can arouse the conflagration even when serious, for this reason, we propose a switch board with rotation type heat abstractor to in order to solve above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a power distribution cabinet with a rotary heat dissipation device, so as to solve the problems in the background technology.

To achieve the above object, the present invention provides the following solutions:

the utility model provides a switch board with rotation type heat abstractor, is hollow structure's switch board main part including inside, the inside hollow structure that is of outer wall of switch board main part, the switch board opening that link up is seted up to one side intermediate position department of switch board main part, install the cabinet door of adaptation in the switch board opening, the hinge is installed to one side both ends equidistant position department embedded of cabinet door and switch board opening handing-over, switch board main part and cabinet door normal running fit, the equal embedded installation heat dissipation mechanism in one end both sides equidistant position department of switch board main part, the equal embedded semiconductor refrigeration piece of installing in one end both sides equidistant position department that heat dissipation mechanism was kept away from to the switch board main part.

Preferably, one side of semiconductor refrigeration piece is provided with heat conduction insulating ceramic wafer, the one end that semiconductor refrigeration piece kept away from heat conduction insulating ceramic wafer is provided with down heat conduction insulating ceramic wafer, it is close to the one end of heat conduction insulating ceramic wafer down and is the equidistant range of linear array and have a plurality of last metallic conductor to go up heat conduction insulating ceramic wafer, the one end that heat conduction insulating ceramic wafer is close to last heat conduction insulating ceramic wafer down is the equidistant range of linear array and has metallic conductor under a plurality of, it is connected with N type semiconductor with one side between the metallic conductor down to go up metallic conductor, it is connected with P type semiconductor with one side of keeping away from N type semiconductor between the metallic conductor down.

Preferably, the upper metal conductors and the lower metal conductors are staggered by half the length of the semiconductor and are arranged in a one-to-one correspondence manner, and the N-type semiconductors and the P-type semiconductors are alternately arranged among the plurality of upper metal conductors and the plurality of lower metal conductors.

Preferably, two sides of the lower metal conductor are connected with a direct current set, a direct current power supply is arranged in the direct current set, and two wires led out from the direct current power supply are respectively and independently connected with two ends of the lower metal conductor.

Preferably, the outside of heat dissipation mechanism is provided with the heat dissipation shell that both ends link up, the embedded protection network that installs of one end that the switch board main part was kept away from to the heat dissipation shell, the inside one end that is close to the switch board main part of heat dissipation shell is provided with the heat dissipation motor, the transmission end of heat dissipation motor is connected with the heat dissipation flabellum, and the conveying end of heat dissipation motor keeps away from switch board main part one end setting.

Preferably, the switch board main part all sets up the second installation opening that link up in heat dissipation mechanism's position department, heat dissipation mechanism installs in the second installation opening, the first installation opening that link up is all seted up in the position department of semiconductor refrigeration piece to the switch board main part, the semiconductor refrigeration piece is installed in first installation opening.

Preferably, the one end intermediate position department that the switch board main part was kept away from to the semiconductor refrigeration piece is provided with the warning sign, the cabinet door is kept away from the embedded cabinet lock of installing of one end intermediate position department of cabinet lock, the switch board opening corresponds the position department of cabinet lock and has seted up inside sunken lockhole, the cooperation of pegging graft of cabinet lock and lockhole, the one end that the switch board main part was kept away from to the semiconductor refrigeration piece is provided with the cabinet door handle at the lower extreme of cabinet lock.

Compared with the prior art, the utility model has the beneficial effects that:

1. the heat dissipation mechanism is arranged, the heat dissipation motor is started to drive the heat dissipation fan blades to rotate, so that gas in the inner space of the power distribution cabinet main body and the inner space of the outer wall of the power distribution cabinet main body can be absorbed, high-temperature gas in the power distribution cabinet is exchanged with the outside, the temperature in the power distribution cabinet is reduced, and heat dissipation is carried out on the power distribution cabinet;

2. be provided with the semiconductor refrigeration piece, the semiconductor refrigeration piece is after the circular telegram, produce the Peltier effect, give off cold volume to switch board main part inside, cold volume can be cooled down switch board main part inside and switch board main part outer wall inside, the drive of rethread heat dissipation mechanism for the inside circulation of air with switch board main part outer wall inside of switch board main part makes cold volume propagate to each corner inside and switch board main part outer wall inside of switch board main part, to the inside cooling of switch board main part.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic view of the split structure of the present invention;

FIG. 3 is a schematic diagram of a disassembled structure of a power distribution cabinet main body according to the present invention;

FIG. 4 is a schematic diagram of a disassembled structure of the heat dissipation mechanism of the present invention;

FIG. 5 is a schematic view of a disassembled structure of the cabinet door of the present invention;

FIG. 6 is a cross-sectional view of a semiconductor chilling plate of the present invention;

in the figure: 1. a power distribution cabinet main body; 11. a power distribution cabinet opening; 12. a first mounting opening; 13. a second mounting opening; 2. a semiconductor refrigeration sheet; 21. an upper heat-conducting insulating ceramic sheet; 22. a lower heat-conducting insulating ceramic sheet; 23. an upper metal conductor; 24. a lower metal conductor; 25. an N-type semiconductor; 26. a P-type semiconductor; 27. a DC power pack; 3. a heat dissipation mechanism; 31. a heat dissipation housing; 32. a protection net; 33. a heat dissipation motor; 34. a heat dissipation fan blade; 4. a cabinet door; 41. a cabinet door lock; 42. a cabinet door handle; 43. a warning board; 44. and (7) a hinge.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Examples

Referring to fig. 1-6, in the embodiment of the present invention, a power distribution cabinet with a rotary heat dissipation apparatus includes a power distribution cabinet main body 1 having a hollow structure inside, the power distribution cabinet main body 1 has a hollow structure inside an outer wall, a through power distribution cabinet opening 11 is formed in a middle position of one side of the power distribution cabinet main body 1, a cabinet door 4 adapted to the power distribution cabinet opening 11 is installed in the power distribution cabinet opening 11, hinges 44 are embedded at positions equidistant from two ends of a side where the cabinet door 4 is connected to the power distribution cabinet opening 11, the power distribution cabinet main body 1 and the cabinet door 4 are rotatably engaged, heat dissipation mechanisms 3 are embedded at positions equidistant from two sides of one end of the power distribution cabinet main body 1, semiconductor cooling fins 2 are embedded at positions equidistant from two sides of one end of the power distribution cabinet main body 1 away from the heat dissipation mechanisms 3, and the power distribution cabinet main body 1 is opened inside by the rotary engagement of the power distribution cabinet main body 1 and the cabinet door 4, the operation of installing and maintaining circuit wires and electrical elements is convenient, the outer wall of the power distribution cabinet main body 1 is of a hollow structure, the gas in the power distribution cabinet main body 1 and the space in the outer wall of the power distribution cabinet main body 1 can be conveniently circulated, the heat transfer is convenient, the heat dissipation mechanism 3 is started, the heat dissipation mechanism 3 can drive the gas in the power distribution cabinet main body 1 and the space in the outer wall of the power distribution cabinet main body 1, the gas can be quickly circulated with the outside, the heat exchange is convenient, the inside of the power distribution cabinet main body 1 is radiated, and the cabinet door 4 arranged at the same time generates cold energy to the inside of the power distribution cabinet main body 1 after being electrified and is driven by the heat radiation mechanism 3, make cold volume transmission to the inside space of 1 inside and 1 outer wall of switch board main part, carry out thermal exchange, cool down 1 inside switch board main part, strengthen heat dissipation mechanism 3's radiating effect.

Referring to fig. 2, 3 and 6, an upper heat-conducting insulating ceramic sheet 21 is disposed on one side of the semiconductor refrigerating sheet 2, a lower heat-conducting insulating ceramic sheet 22 is disposed on one end of the semiconductor refrigerating sheet 2 away from the upper heat-conducting insulating ceramic sheet 21, a plurality of upper metal conductors 23 are arranged in a linear array at equal intervals on one end of the upper heat-conducting insulating ceramic sheet 21 close to the lower heat-conducting insulating ceramic sheet 22, a plurality of lower metal conductors 24 are arranged in a linear array at equal intervals on one end of the lower heat-conducting insulating ceramic sheet 22 close to the upper heat-conducting insulating ceramic sheet 21, an N-type semiconductor 25 is connected to one side between the upper metal conductors 23 and the lower metal conductors 24 far from the N-type semiconductor 25, P-type semiconductors 26 are connected to one side between the upper metal conductors 23 and the lower metal conductors 24, the upper metal conductors 23 and the lower metal conductors 24 are arranged in a half-semiconductor length staggered manner one-to-one, the N-type semiconductors 25 and the P-type semiconductors 26 are alternately arranged between the upper metal conductors 23 and the lower metal conductors 24, the two sides of the lower metal conductor 24 are connected with a direct current set 27, a direct current power supply is arranged in the direct current set 27, two wires led out from the direct current power supply are respectively and independently connected with the two ends of the lower metal conductor 24, after the semiconductor refrigerating sheet 2 is electrified, a peltier effect is formed between the N-type semiconductor 25 and the P-type semiconductor 26 connected through the upper metal conductor 23 and the lower metal conductor 24, so that the end 21 of the upper heat-conducting insulating ceramic plate generates a cold effect, the cold effect of the end 21 of the upper heat-conducting insulating ceramic plate can cool the interior of the main body 1 of the power distribution cabinet, through the arrangement mode of the upper metal conductor 23 and the lower metal conductor 24, the N-type semiconductor 25 and the P-type semiconductor 26, the semiconductor refrigerating sheet 2 is convenient to generate the Peltier effect after being electrified, the generated cold effect at one end is generated, the Peltier effect can be effectively realized under the condition of power supply of a direct current power supply, and the direct current power set 27 provides power for the semiconductor refrigerating sheet 2 to generate the Peltier effect.

Please refer to fig. 2, fig. 3 and fig. 4, the outside of the heat dissipation mechanism 3 is provided with a heat dissipation shell 31 with two through ends, one end of the heat dissipation shell 31 far away from the power distribution cabinet main body 1 is embedded with a protection net 32, one end of the heat dissipation shell 31 close to the power distribution cabinet main body 1 is provided with a heat dissipation motor 33, a transmission end of the heat dissipation motor 33 is connected with a heat dissipation fan blade 34, and a transmission end of the heat dissipation motor 33 is far away from one end of the power distribution cabinet main body 1, the heat dissipation motor 33 is started to drive the heat dissipation fan blade 34 to rotate, the heat dissipation fan blade 34 rotates to generate suction inside the power distribution cabinet main body 1 and inside the power distribution cabinet main body 1, the air inside the power distribution cabinet main body 1 and inside the outer wall of the power distribution cabinet main body 1 are driven to exchange with the outside air circulation, heat exchange is performed with the outside, and the heat is dissipated to the power distribution cabinet main body 1.

Please refer to fig. 2 and fig. 3, switch board main part 1 all sets up the second installing opening 13 that link up in the position department of heat dissipation mechanism 3, heat dissipation mechanism 3 is installed in second installing opening 13, switch board main part 1 all sets up the first installing opening 12 that link up in the position department of semiconductor refrigeration piece 2, semiconductor refrigeration piece 2 is installed in first installing opening 12, second installing opening 13 is convenient for heat dissipation mechanism 3 and installs in the outer wall of switch board main part 1, first installing opening 12 is convenient for semiconductor refrigeration piece 2 and installs in the outer wall of switch board main part 1, be convenient for semiconductor refrigeration piece 2 and heat dissipation mechanism 3 are better to switch board main part 1 inside cooling heat dissipation.

Referring to fig. 1, 2 and 5, a warning board 43 is disposed at a middle position of one end of the semiconductor refrigeration sheet 2 away from the power distribution cabinet main body 1, a cabinet door lock 41 is embedded at a middle position of one end of the cabinet door 4 away from the cabinet door lock 41, an inward-recessed lock hole is disposed at a position of the power distribution cabinet opening 11 corresponding to the cabinet door lock 41, the cabinet door lock 41 is in plug-in fit with the lock hole, a cabinet door handle 42 is disposed at a lower end of the cabinet door lock 41 at one end of the semiconductor refrigeration sheet 2 away from the power distribution cabinet main body 1, the warning board 43 is used for warning irrelevant persons to notice the existence of the power distribution cabinet main body 1 and preventing electric leakage risk caused by accidental touch, the cabinet door handle 42 facilitates the rotational fit between the power distribution cabinet main body 1 and the cabinet door 4, facilitates the opening or closing of a space inside the power distribution cabinet main body 1, and the cabinet door lock 41 facilitates the rotational fit between the power distribution cabinet door main body 1 and the cabinet door 4 to be locked, the circuit wires and the electrical components inside the power distribution cabinet main body 1 are protected.

The working principle of the utility model is as follows:

the power distribution cabinet main body 1 is arranged at a designated position, corresponding circuit wires and electric elements are arranged inside the power distribution cabinet main body 1, when the power distribution cabinet main body 1 is used, the circuit wires and the electric elements inside the power distribution cabinet main body 1 can generate heat, so that the temperature inside the power distribution cabinet main body 1 is raised, at the moment, the heat dissipation motor 33 is started to drive the heat dissipation fan blades 34 to rotate to drive the gas inside the power distribution cabinet main body 1 and the gas inside the outer wall of the power distribution cabinet main body 1, so that the gas inside the power distribution cabinet main body 1 and the gas inside the outer wall of the power distribution cabinet main body 1 are exchanged with the outside, the heat dissipation effect is achieved, meanwhile, the semiconductor refrigeration sheets 2 are electrified, the Peltier effect is generated after the semiconductor refrigeration sheets 2 are electrified, the cold energy is provided for the inside the power distribution cabinet main body 1, and the gas inside the outer wall of the power distribution cabinet main body 1 and the gas inside the outer wall are driven by the heat dissipation mechanism 3 to circulate, transmit cold volume to inside and the inside everywhere of 1 outer wall of switch board main part 1 of switch board main part for cold volume can exchange the heat that produces to 1 internal circuit electric wire of switch board main part and electric elements during operation and offset, cools down switch board main part 1, further strengthens radiating effect of heat dissipation mechanism 3.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims (7)

1. The utility model provides a switch board with rotation type heat abstractor, is hollow structure's switch board main part (1) including inside, its characterized in that: the utility model discloses a heat dissipation mechanism, including switch board main part (1), switch board opening (11) that link up are seted up to one side intermediate position department of switch board main part (1), install cabinet door (4) of adaptation in switch board opening (11), hinge (44) are installed to one side both ends equidistant position department embedded of cabinet door (4) and switch board opening (11) handing-over, switch board main part (1) and cabinet door (4) normal running fit, the equal embedded installation heat dissipation mechanism (3) of one end both sides equidistant position department of switch board main part (1), the equal embedded semiconductor refrigeration piece (2) of installing of one end both sides equidistant position department that heat dissipation mechanism (3) were kept away from in switch board main part (1).

2. The switch board with rotary heat sink of claim 1, wherein: one side of the semiconductor refrigerating sheet (2) is provided with an upper heat-conducting insulating ceramic sheet (21), one end of the semiconductor refrigerating plate (2) far away from the upper heat-conducting insulating ceramic plate (21) is provided with a lower heat-conducting insulating ceramic plate (22), a plurality of upper metal conductors (23) are arranged at equal intervals in a linear array at one end of the upper heat-conducting insulating ceramic sheet (21) close to the lower heat-conducting insulating ceramic sheet (22), a plurality of lower metal conductors (24) are arranged at equal intervals in a linear array at one end of the lower heat-conducting insulating ceramic plate (22) close to the upper heat-conducting insulating ceramic plate (21), one side between the upper metal conductor (23) and the lower metal conductor (24) is connected with an N-type semiconductor (25), and a P-type semiconductor (26) is connected between the upper metal conductor (23) and the lower metal conductor (24) at one side far away from the N-type semiconductor (25).

3. The power distribution cabinet with the rotary heat dissipation device according to claim 2, wherein: the upper metal conductors (23) and the lower metal conductors (24) are staggered by half the length of the semiconductor and are arranged in a one-to-one correspondence mode, and the N-type semiconductors (25) and the P-type semiconductors (26) are alternately arranged among the upper metal conductors (23) and the lower metal conductors (24).

4. The power distribution cabinet with the rotary heat dissipation device according to claim 2, wherein: two sides of the lower metal conductor (24) are connected with a direct current set (27), a direct current power supply is arranged in the direct current set (27), and two wires led out from the direct current power supply are respectively and independently connected with two ends of the lower metal conductor (24).

5. The switch board with rotary heat sink of claim 1, wherein: the outside of heat dissipation mechanism (3) is provided with heat dissipation shell (31) that both ends link up, the one end embedded installation that switch board main part (1) was kept away from in heat dissipation shell (31) has protecting net (32), the inside one end that is close to switch board main part (1) of heat dissipation shell (31) is provided with heat dissipation motor (33), the transmission end of heat dissipation motor (33) is connected with heat dissipation flabellum (34), and the conveying end of heat dissipation motor (33) keeps away from switch board main part (1) one end setting.

6. The switch board with rotary heat sink of claim 1, wherein: switch board main part (1) all sets up second installing opening (13) that link up in the position department of heat dissipation mechanism (3), heat dissipation mechanism (3) are installed in second installing opening (13), switch board main part (1) all sets up first installing opening (12) that link up in the position department of semiconductor refrigeration piece (2), semiconductor refrigeration piece (2) are installed in first installing opening (12).

7. The switch board with rotary heat sink of claim 1, wherein: semiconductor refrigeration piece (2) keep away from the one end intermediate position department of switch board main part (1) and be provided with warning sign (43), the one end intermediate position department that cabinet door lock (41) were kept away from in cabinet door (4) is embedded installs cabinet door lock (41), the position department that switch board opening (11) correspond cabinet door lock (41) has seted up inside sunken lockhole, cabinet door lock (41) and lockhole grafting cooperation, the one end that switch board main part (1) was kept away from in semiconductor refrigeration piece (2) is provided with cabinet door handle (42) at the lower extreme of cabinet door lock (41).

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