CN216599743U - Circuit board, camera module and electronic equipment - Google Patents

Abstract

The utility model discloses a circuit board, a camera module and electronic equipment, wherein the circuit board comprises a substrate, a plurality of flexible connecting plates and a wiring board, the flexible connecting plates are independently arranged, each flexible connecting plate is spirally or reversely arranged in a hollow part of the substrate, each flexible connecting plate is provided with a first connecting end and a second connecting end which are opposite, the first connecting end of each flexible connecting plate is fixedly connected to the substrate, the wiring board is positioned in the hollow part, the wiring board is arranged at the second connecting end, and the wiring board is electrically connected with the second connecting end. Because the flexible connection board includes a plurality of flexible connection bands, only need overcome less material stress during crooked, deformation, and the flexible connection band is the spiral or returns the type and extends, has certain redundancy, only need overcome less resistance when being stretched to can improve optics anti-shake response speed.

Description

Circuit board, camera module and electronic equipment

Technical Field

The utility model relates to the technical field of imaging devices, in particular to a circuit board, a camera module and electronic equipment.

Background

The camera module in the related art generally comprises a lens assembly, a photosensitive chip and a fixed circuit board, wherein the lens assembly is located on one side of an imaging surface of the photosensitive chip, light rays entering from the lens assembly reach the imaging surface of the photosensitive chip and form images on the imaging surface, and the fixed circuit board is located on one side, away from the lens assembly, of the photosensitive chip.

In the related art camera module, in order to achieve optical anti-shake for improving imaging quality, the photosensitive chip is usually mounted on the movable circuit board, the movable circuit board can move transversely (perpendicular to the optical axis) relative to the fixed circuit board, and the movable circuit board and the fixed circuit board are connected by a flexible board to achieve electrical connection between the photosensitive chip and the fixed circuit board. Due to the limitation of the elastic modulus of the soft board material, the movable circuit board is subjected to larger resistance when moving transversely, and the response speed of optical anti-shake is influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model discloses a circuit board, a camera module and electronic equipment, which can reduce the resistance in the optical anti-shake process and improve the response speed of the optical anti-shake process.

In order to achieve the above object, the present invention discloses a circuit board, including:

a substrate having a hollowed-out portion;

each flexible connecting belt is spirally or reversely arranged in the hollow part and is provided with a first connecting end and a second connecting end, and the first connecting end of each flexible connecting belt is fixedly connected to the substrate and is electrically connected with the substrate; and

the wiring board is located in the hollow part, the wiring board is arranged at the second connecting end, and the wiring board is electrically connected with the second connecting end.

The application provides a circuit board can be applied to the module of making a video recording, specifically can be used to realize connecing of sensitization chip and switch on, and the wiring board of circuit board is connected with the activity circuit board electricity that is used for bearing sensitization chip promptly, and the base plate of circuit board sets firmly in the shell of the module of making a video recording and is connected with the fixed circuit board electricity of the module of making a video recording, and sensitization chip and activity circuit board can be relative the base plate removes. Compared with a complete circuit board, the circuit board provided by the application has the advantages that the hollowed-out substrate is adopted, so that the elastic modulus is smaller, the deformation is easier, and the photosensitive chip is easier to drive for optical anti-shake; meanwhile, the flexible connecting belts are arranged, so that the flexible connecting belts are in a belt shape under the condition that the wiring amount is not changed, namely under the condition that the power connection conduction of the photosensitive chip is not influenced, and can be bent and deformed only by overcoming smaller material stress when stressed, so that the resistance of the photosensitive chip during movement is smaller; moreover, the flexible connecting band extends in a spiral or zigzag manner, and has a certain redundancy compared with a linear strip structure, so that the resistance required to be overcome when the flexible connecting band is deformed is favorably reduced, and the resistance to the photosensitive chip during movement is smaller. In other words, when the optical anti-shake is performed, the resistance to the movement of the photosensitive chip can be reduced, thereby facilitating the improvement of the response speed of the optical anti-shake and facilitating the optical anti-shake.

Further, in the circuit board that this application provided, many flexonics areas set up relatively independently, each flexonics area breaks off the interval setting each other promptly, thus, in each flexonics area atress by tensile in-process, can reduce the control effect between each flexonics area, take place mutual interference when avoiding warping, make each flexonics area more easily stretched and take place deformation, resistance that receives when further reducing sensitization chip and removing, thereby can further improve the response speed of optics anti-shake, make things convenient for sensitization chip's optics anti-shake more.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, at least one of the flexible connection bands includes a plurality of first sub flexible connection bands, and the plurality of first sub flexible connection bands are arranged at intervals along a direction perpendicular to the optical axis. This is equivalent to the flexonics area of single broad decompose into many thinner first sub flexonics area, like this, can be under the unchangeable circumstances of line volume of guaranteeing to walk, reduces flexonics area's modulus of elasticity to can improve flexonics area's compliance, reduce the deformation resistance, so that flexonics area is stretched more easily and takes place the deformation, reduce the resistance that receives when sensitization chip removes, thereby can improve the response speed of optics anti-shake, in order to ensure optics anti-shake effect.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, at least one of the flexible connection bands includes a plurality of second sub flexible connection bands, and the plurality of second sub flexible connection bands are arranged at intervals along the optical axis direction. This is equivalent to decomposing into the second sub-flexonics area that many thickness are thinner with single thicker flexonics area, be about to flexonics area design into bilayer or multilayer structure, there is the clearance between the layer, carry out the attenuate processing to the thicker flexonics area of list, thus, can be under the unchangeable circumstances of the volume of guaranteeing to walk the line, further reduce the elastic modulus of flexonics area, and can further improve the compliance of flexonics area, reduce the deformation resistance, so that the flexonics area can be stretched more easily and take place the deformation, thereby further can reduce the resistance that receives when sensitization chip removes, further improve the response speed of optics anti-shake, in order to further ensure optics anti-shake effect.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, the plurality of flexible connection bands are symmetrically disposed about the center of the substrate, which is beneficial to make the stress on the entire circuit board relatively uniform and balanced, and to make the force balance between the circuit board and the photosensitive chip, so as to improve the stress uniformity of the photosensitive chip, thereby improving the movement stability of the photosensitive chip, and ensuring the optical anti-shake effect.

As an alternative implementation manner, in the embodiment of the first aspect of the present invention, the plurality of wiring boards are symmetrically arranged about the center of the substrate, which is also beneficial to make the stress on the entire circuit board relatively uniform and balanced, and thus beneficial to make the stress distribution of the photosensitive chip more uniform, so that the photosensitive chip can move smoothly, and the optical anti-shake effect is ensured.

As an alternative implementation manner, in an embodiment of the first aspect of the present invention, each flexible connecting band includes a plurality of flexible segments connected in sequence, and every two adjacent flexible segments are connected perpendicularly, so that an outer contour of the whole formed by the plurality of flexible connecting bands is substantially square.

Based on that most of the photosensitive chips in the related art are square photosensitive chips, the outline of the substrate is approximately square in order to match the photosensitive chips, and the hollow part is a square area matched with the outline of the substrate so as to form a larger hollow part; and every two adjacent flexible sections are limited to be vertically connected, so that the outline of the overall structure formed by the flexible connecting belts is approximately in a square structure, the flexible connecting belts are convenient to match with the shape of the hollow parts, the space of the hollow parts can be fully utilized under the condition that the substrate meets the requirement of miniaturization, the length of the flexible connecting belts is increased as much as possible, and the elastic modulus and the deformation resistance of the flexible connecting belts are reduced.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, a plurality of the first connection ends are distributed near two corners of a first diagonal line of the substrate, and a plurality of the second connection ends are distributed near two corners of a second diagonal line of the substrate, where the first diagonal line and the second diagonal line intersect each other. Like this, can roughly be square holistic every bight in the outline that many flexible connection area formed and set up at least one first link or second link to through the overall structure atress balance that realizes many flexible connection area formation at four stress points, be favorable to making the overall structure atress of many flexible connection area formation on all directions even, thereby be favorable to making the atress distribution of sensitization chip can be more even, so that sensitization chip can steadily remove, ensure optics anti-shake effect.

As an alternative implementation, in an embodiment of the first aspect of the present invention, the wiring board is plural;

the plurality of wiring boards are respectively arranged corresponding to the plurality of flexible connecting belts, each wiring board is respectively connected to the second connecting end of each flexible connecting belt, and the plurality of wiring boards are limited to be respectively arranged corresponding to the plurality of flexible connecting belts one by one, so that the overall layout of the plurality of flexible connecting belts and the plurality of wiring boards is regular, the overall structure of the circuit board is small, and the miniaturization design is met; or

The number of the wiring boards is less than that of the flexible connecting belts, and at least one wiring board is connected to the second connecting ends of at least two flexible connecting belts, so that the use of the wiring boards can be reduced, and the material cost is reduced.

As an optional implementation manner, in an embodiment of the first aspect of the present invention, when the plurality of wiring boards are respectively disposed corresponding to the plurality of flexible connection bands, the plurality of wiring boards respectively extend from the corresponding second connection ends to the corresponding first connection ends, which is beneficial to relatively uniform and balanced stress of an overall structure formed by the plurality of flexible connection bands, so that the stress of the entire circuit board is relatively uniform and balanced, and the stress between the circuit board and the photosensitive chip is balanced, so as to improve the stress uniformity of the photosensitive chip.

In a second aspect, the utility model discloses a camera module, which comprises a photosensitive chip, a movable circuit board and the circuit board of the first aspect;

the movable circuit board is electrically connected with the wiring boards and can move relative to the substrate along the direction perpendicular to the optical axis, the wiring boards can move relative to the substrate along the direction perpendicular to the optical axis under the driving of the movable circuit board, and the flexible connecting bands can deform; the photosensitive chip is arranged on the movable circuit board and electrically connected with the movable circuit board, and under the driving of the movable circuit board, the photosensitive chip can move relative to the substrate along the direction perpendicular to the optical axis.

The camera module of circuit board, the movable circuit board can carry the relative base plate of sensitization chip to the circuit board and remove, and simultaneously, the wiring board of circuit board can remove along with movable circuit board together, and the flexonics board of circuit board can deform, because the flexonics board includes the flexonics area that many intervals set up, it only need overcome less material stress when deformation, the deformation resistance is less, therefore, can be under the circumstances that the electricity that does not influence sensitization chip switched on, reduce the resistance that the sensitization chip removed, improve optics anti-shake response speed, be convenient for carry out optics anti-shake.

In a third aspect, the utility model discloses an electronic device, which has the camera module set of the second aspect. The electronic equipment with the camera module can reduce the resistance of the movement of the photosensitive chip under the condition of not influencing the electric conduction of the photosensitive chip, and improve the optical anti-shake response speed so as to facilitate optical anti-shake.

Compared with the prior art, the utility model has the beneficial effects that:

compared with a complete circuit board, the flexible circuit board, the camera module and the electronic equipment provided by the embodiment of the utility model have smaller elastic modulus and are easier to deform by adopting the hollowed-out substrate, so that the photosensitive chip is easier to drive to perform optical anti-shake; meanwhile, by arranging the plurality of flexible connecting bands, the flexible connecting bands are in a band shape under the condition that the wiring amount is not changed, namely, the condition that the electric conduction of the photosensitive chip is prevented from being influenced, and the flexible connecting bands can be bent and deformed only by overcoming smaller material stress when stressed, so that the resistance of the photosensitive chip during movement is smaller; moreover, the flexible connecting band extends in a spiral or zigzag manner, has a certain redundancy amount relative to a linear strip structure, and only needs to overcome smaller resistance when being stretched, so that the resistance of the photosensitive chip during movement is smaller. In other words, when the optical anti-shake is performed, the resistance to the movement of the photosensitive chip can be reduced, thereby being beneficial to improving the optical anti-shake response speed and facilitating the optical anti-shake.

Further, in the circuit board that this application provided, because each flexonics area is independent interval setting, promptly, each flexonics area's the position that is close to fretwork portion middle part breaks off interval setting each other, like this, in each flexonics area atress by tensile in-process, can reduce the control effect between each flexonics area, make each flexonics area stretched more easily, with the resistance that further reduces sensitization chip and remove, thereby can further improve optics anti-shake response speed, make things convenient for the optics anti-shake of sensitization chip more.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a camera module disclosed in an embodiment of the present invention;

FIG. 2 is an exploded perspective view of the camera module of FIG. 1;

FIG. 3 is a cross-sectional view of the camera module of FIG. 1 taken along the direction a-a;

FIG. 4 is a front view of the camera module of FIG. 3;

FIG. 5 is a schematic diagram of a first structure of a circuit board according to an embodiment of the disclosure;

FIG. 6 is a schematic diagram of a second structure of a circuit board disclosed in the embodiment of the utility model;

FIG. 7 is a schematic diagram of a third structure of a circuit board disclosed in the embodiment of the utility model;

FIG. 8 is a schematic diagram of a fourth structure of a circuit board disclosed in the embodiment of the utility model;

fig. 9 is a schematic structural diagram of a circuit board when the flexible connecting band disclosed by the embodiment of the utility model comprises two first sub flexible connecting bands;

fig. 10 is a schematic structural diagram of a circuit board when the flexible connecting band disclosed by the embodiment of the utility model comprises three first sub flexible connecting bands;

fig. 11 is a schematic structural diagram of a circuit board when the flexible connecting band disclosed by the embodiment of the utility model comprises four first sub flexible connecting bands;

fig. 12 is a schematic structural diagram of a circuit board when the flexible connecting band disclosed by the embodiment of the utility model comprises five first sub flexible connecting bands;

fig. 13 is a schematic perspective view of a circuit board according to an embodiment of the present invention;

fig. 14 is a partial enlarged view at a in fig. 13;

fig. 15 is a schematic structural diagram of an electronic device disclosed in the embodiment of the present invention.

Icon: 100. a camera module; 101. a photosensitive chip; 102. a circuit board; 103. an upper shell; 1031. a first opening; 104. a lower case; 105. an anti-shake motor; 1051. a second opening; 106. an optical filter assembly; 1061. an optical filter; 107. a lens assembly; 200. a circuit board; 21. a substrate; 211. a hollow-out section; 22. a flexible connecting band; 22a, a first flexible connecting band; 22b, a second flexible connecting band; 221. a first connection end; 221a, a first sub-connection end; 221b, a second sub-connection end; 222. a second connection end; 222a and a third sub-connecting end; 222b, a fourth sub-connecting end; 223. a first sub-flexible connecting strip; 224. a second sub-flexible connecting strip; 23. a wiring board; 300. an electronic device; 301. a housing.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the utility model and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The technical solution of the present invention will be further described with reference to the following embodiments and the accompanying drawings.

The embodiment of the utility model discloses a circuit board, a camera module and electronic equipment, wherein the circuit board is applied to the camera module to reduce the resistance of a photosensitive chip during optical anti-shake movement, so that the response speed of optical anti-shake is improved, and the anti-shake of the chip is facilitated.

In order to facilitate understanding of the application of the circuit board in the camera module, the structure of the camera module will be described in detail below.

Referring to fig. 1 and fig. 2, an embodiment of the present invention discloses a camera module 100, where the camera module 100 may include a photosensitive chip 101, a movable circuit board 102, and a circuit board 200; the photosensitive chip 101 is disposed on the movable circuit board 102 and electrically connected to the movable circuit board 102, the movable circuit board 102 can move laterally relative to a fixed circuit board (not shown) of the camera module 100, the movable circuit board 102 can move in a direction perpendicular to the optical axis O (e.g., in a left, right, forward, and backward direction in fig. 1) relative to the fixed circuit board of the camera module 100, so that the photosensitive chip 101 can move laterally under the driving of the movable circuit board 102, thereby achieving an optical anti-shake effect, and the movable circuit board 102 can be electrically connected to the fixed circuit board of the camera module 100 through the circuit board 200, so as to achieve electrical connection and conduction of the photosensitive chip 101.

Illustratively, as shown in fig. 2 and 3, the camera module 100 may further include the components such as the upper housing 103, the lower housing 104, the anti-shake motor 105, the optical filter assembly 106, and the lens assembly 107, in addition to the photosensitive chip 101, the movable circuit board 102, and the circuit board 200. Specifically, the upper case 103 and the lower case 104 are disposed correspondingly up and down, the upper case 103 has a first opening 1031, the circuit board 200 is disposed between the upper case 103 and the lower case 104, the photosensitive chip 101 and the movable circuit board 102 are disposed between the upper case 103 and the circuit board 200, and the photosensitive chip 101 is disposed corresponding to the first opening 1031, the anti-shake motor 105 can be connected to the upper case 103 and located between the upper case 103 and the movable circuit board 102 through a spring, a suspension wire, or a silicon chip, and the like, the anti-shake motor 105 has a second opening 1051 disposed opposite to the first opening 1031, the optical filter assembly 106 can be bonded between the anti-shake motor 105 and the movable circuit board 102 through an adhesive (e.g., glue), and the optical filter assembly 106 covers the periphery of the photosensitive chip 101. The optical filter 1061 of the optical filter assembly 106 is disposed corresponding to the photosensitive chip 101, and the optical filter 1061 of the optical filter assembly 106 may be an infrared cut filter, which can filter out infrared interference in the environment. The lens assembly 107 is disposed on the upper housing 103 and corresponding to the first opening 1031 of the upper housing 103, and during imaging, light rays can enter from the lens assembly 107 and then sequentially pass through the optical filter 1061 and the photosensitive chip 101.

It can be understood that the anti-shake motor 105, i.e. the ois (optical imaging stabilization) motor, is a type of motor capable of adjusting the displacement of the photosensitive chip 101, that is, when shake occurs, the movable circuit board 102 carrying the photosensitive chip 101 can move laterally under the driving action of the anti-shake motor 105, and synchronously move the photosensitive chip 101 laterally, so as to compensate the shake of the camera module 100, thereby achieving the optical anti-shake effect. The anti-shake motor 105 can adopt a suspension wire structure anti-shake motor, a memory alloy anti-shake motor, a magnet structure anti-shake motor or a piezoelectric structure anti-shake motor, and the anti-shake motors 105 of the above types can drive the dynamic optical chip 101 to move in a large stroke, so that an optical anti-shake effect is achieved.

Referring to fig. 2, 4 and 5, in the circuit board 200 provided in the present application, the circuit board 200 may include a substrate 21, a plurality of flexible connection bands 22 and at least one wiring board 23, where the substrate 21 may be used to electrically connect with an external circuit, that is, the substrate 21 may be electrically connected with a fixed circuit board of a camera module 100, the substrate 21 has a hollow portion 211, the plurality of flexible connection bands 22 are disposed at intervals, each flexible connection band 22 is disposed in the hollow portion 211 in a spiral or zigzag shape, each flexible connection band 22 has a first connection end 221 and a second connection end 222, and the first connection end 221 of each flexible connection band 22 is fixedly connected to the substrate 21 and electrically connected with the substrate 21; the wiring board 23 is located in the hollow portion 211, the wiring board 23 is disposed at the second connection end 222 of the flexible connection belt 22, the wiring board 23 is electrically connected to the second connection end 222, and the wiring board 23 is further electrically connected to the movable circuit board 102.

As can be seen from the foregoing, when the shake occurs, the anti-shake motor 105 drives the movable circuit board carrying the photosensitive chip 101 to move laterally, that is, the movable circuit board 102 carries the photosensitive chip 101 to move relative to the substrate 21 along the direction perpendicular to the optical axis under the driving action of the anti-shake motor, and simultaneously drives the plurality of wiring boards 23 to move relative to the substrate 21 along the direction perpendicular to the optical axis, and at the same time, the plurality of flexible connection belts 22 can deform.

Therefore, in the circuit board 200 provided by the present application, the hollowed-out substrate 21 is adopted, and compared with a complete circuit board, the circuit board has a smaller elastic modulus and is easier to deform, so that the photosensitive chip 101 is easier to be driven to perform optical anti-shake; meanwhile, by arranging the plurality of flexible connecting belts 22, the circuit board 200 comprises the plurality of strip-shaped flexible connecting belts 22 under the condition that the wiring amount is not changed, namely under the condition that the power connection conduction of the photosensitive chip 101 is not influenced, and the flexible connecting belts can be bent and deformed only by overcoming small material stress when stressed, so that the resistance of the photosensitive chip 101 during movement is small; moreover, the flexible connection bands 22 extend spirally or in a zigzag manner, and have a certain redundancy compared with a linear strip structure, which is beneficial to reducing the resistance to be overcome when the flexible connection bands 22 deform, so that the resistance to the photosensitive chip during movement is smaller. In other words, when the shake takes place and needs to carry out optical anti-shake, the circuit board 200 that adopts this application to provide realizes connecing of photosensitive chip 101 to switch on, can reduce the resistance that photosensitive chip 101 removed to be favorable to improving optical anti-shake's response speed, be convenient for carry out optical anti-shake.

Further, in the circuit board 200 that this application provided, each flexible connection belt 22 breaks away from independent interval each other and sets up, namely, each flexible connection belt 22 can break away from interval each other in the position that is close to fretwork portion 211 middle part and set up, like this, in each flexible connection belt 22 atress by tensile in-process, can reduce the control effect between each flexible connection belt 22, in order to avoid taking place mutual interference when warping, make each flexible connection belt 22 more easily stretched and take place deformation, in order to further reduce the resistance that receives when sensitization chip 101 removed, thereby can further improve the response speed of optics anti-shake, make things convenient for the optics anti-shake of sensitization chip 101 more.

In addition, the substrate 21 accommodates the plurality of flexible connection bands 22 by the hollow portion 211, which can reduce the overall thickness of the camera module 100 in the optical axis direction compared to disposing the plurality of flexible connection bands 22 on the carrying surface of the substrate 21, and is beneficial to making the camera module 100 conform to the miniaturization design. In addition, the provision of the plurality of flexible connecting strips 22 and the plurality of wiring boards 23 is advantageous in increasing the contact area of the movable circuit board with the wiring board 200, thereby facilitating improvement in connection stability between the movable circuit board and the wiring board 200 to improve the conduction reliability.

Referring to fig. 4 again, it can be seen from fig. 4 that the plurality of flexible connection bands 22 are suspended relative to the lower shell 104, that is, a certain distance is kept between each of the plurality of flexible connection bands 22 and the lower shell 104, so that when the movable circuit board 102 carries the photosensitive chip 101 to move transversely, friction between each of the plurality of flexible connection bands 22 and the lower shell 104 can be prevented, and firstly, resistance force applied when the photosensitive chip 101 moves can be further reduced; secondly, the abrasion of the flexible connecting belt 22 can be avoided, and the service life of the flexible connecting belt 22 is prolonged.

In the present application, a strip of flexible connecting strap 22 may have one or more first connection ends 221 and may also have one or more second connection ends 222, i.e., when a strip of flexible connecting strap 22 has a first connection end 221, the strip of flexible connecting strap 22 may have one, two, three, four or more second connection ends 222; alternatively, when a strip of flexible connecting strip 22 has two, three, four, or more first connecting ends 221, the strip of flexible connecting strip 22 may also have one, two, three, four, or more second connecting ends 222. In addition, in the present application, the wiring board 23 may be one or more.

When a strip of flexible connecting tape 22 has a plurality of second connecting terminals 222 and the wiring board 23 is one, then the plurality of second connecting terminals 222 of the strip of flexible connecting tape 22 are all connected to the wiring board 23.

When one flexible connection tape 22 has a plurality of second connection terminals 222 and the wiring board 23 is plural, for example, the plurality of second connection terminals 222 of the flexible connection tape 22 are respectively provided corresponding to the plurality of wiring boards 23, and the plurality of second connection terminals 222 of the flexible connection tape 22 are respectively connected to the respective wiring boards 23. Alternatively, where the number of patch panels 23 is less than the number of second connection ends 222 of the strip of flexible connection tape 22, at least two second connection ends 222 are connected to the same patch panel 23. For example, the flexible connecting band 22 includes three second connecting terminals 222, the number of the wiring board 23 is two, one second connecting terminal 222 of the three second connecting terminals 222 is connected to one wiring board 23, and the other two second connecting terminals 222 are connected to the other wiring board 23. For another example, the flexible connecting band 22 includes four second connecting terminals 222, two of the wiring boards 23 are provided, two of the four second connecting terminals 222 are connected to one wiring board 23, and the other two second connecting terminals 222 are connected to the other wiring board 23; alternatively, one of the four second connection terminals 222 is connected to one of the wiring boards 23, and the other three second connection terminals 222 are connected to the other wiring board 23.

The connection relationship between the flexible connection tape 22 and the wiring board 23 will be exemplified below by taking the case where the wiring board 200 includes a plurality of flexible connection tapes 22, and each of the flexible connection tapes 22 has a first connection terminal 221 and a second connection terminal 222.

When the wiring board 23 is one, as shown in fig. 5, the second connection terminals 222 of the plurality of flexible connection tapes 22 are fixed and electrically connected to the wiring board 23.

When the number of the wiring boards 23 is plural, such as two, three, four, etc., as an alternative embodiment, as shown in fig. 6, the number of the wiring boards 23 is less than the number of the flexible connecting tapes 22, and at least one of the wiring boards 23 is connected to the second connecting ends 222 of at least two of the flexible connecting tapes 22, so that the use of the wiring boards 23 can be reduced, which is beneficial to reducing material costs. For example, in the embodiment shown in fig. 6, the number of the flexible connecting strips 22 is three, the number of the wiring boards 23 is two, one of the wiring boards 23 is connected to the second connection terminal 222 of one flexible connecting strip 22, and the other wiring board 23 is connected to two flexible connecting strips 22. For another example, four flexible connection strips 22 are provided, and two wiring boards 23 are provided, as shown in fig. 7, one of the two wiring boards 23 is connected to the second connection ends 222 of the two flexible connection strips 22, and the other wiring board 23 is connected to the two flexible connection strips 22; alternatively, one of the two wiring boards 23 is connected to the second connection terminals 222 of one flexible connection tape 22, and the other wiring board 23 is connected to three flexible connection tapes 22.

As another alternative, as shown in fig. 8, a plurality of the wiring boards 23 are respectively disposed corresponding to a plurality of the flexible connection belts 22, and each of the wiring boards 23 is respectively connected to the second connection ends 222 of each of the flexible connection belts 22, and by defining that the plurality of wiring boards 23 are respectively disposed corresponding to a plurality of the flexible connection belts 22 one to one, the overall layout of the plurality of flexible connection belts 22 and the plurality of wiring boards 23 is more regular, which is beneficial to making the overall structure of the circuit board 200 smaller and conforming to the miniaturization design.

As can be seen from the foregoing, the circuit board 200 may include a plurality of flexible connection tapes 22, that is, the circuit board 200 may include two flexible connection tapes, three flexible connection tapes, four flexible connection tapes, five flexible connection tapes, six flexible connection tapes, or more, and so on, and the number of the flexible connection tapes 22 and the wiring board 23 is not limited in this embodiment. The specific structure of the wiring board 200 will be further exemplified below by taking the case where the wiring board 200 includes two flexible connecting tapes 22 and two wiring boards 23.

As shown in fig. 9 to 12, in some embodiments, at least one of the flexible connecting bands 22 includes a plurality of first sub-flexible connecting bands 223, and the plurality of first sub-flexible connecting bands 223 are arranged at intervals along a direction perpendicular to the optical axis. This is equivalent to decomposing a single wider flexible connection band 22 into a plurality of thinner first sub-flexible connection bands 223, so that the elastic modulus of flexible connection band 22 can be further reduced under the condition of ensuring that the wiring amount is not changed, the flexibility of flexible connection band 22 can be further improved, and the deformation resistance can be reduced, so that flexible connection band 22 is more easily stretched to deform, the resistance received when the photosensitive chip moves is further reduced, and the response speed of optical anti-shake can be further improved, so that the optical anti-shake effect can be further ensured.

In the embodiment shown in fig. 9 to 12, all of the flexible connecting strips 22 comprise a plurality of first sub-flexible connecting strips 223, i.e. both flexible connecting strips 22 in fig. 9 to 12 comprise a plurality of first sub-flexible connecting strips 223. It will be appreciated that the number of first sub-flexible connecting strips 223 of each flexible connecting strip 22 need not be one, but may be a plurality of strips, such as two, three, four or five strips.

In a first exemplary embodiment, as shown in fig. 9, two flexible connecting bands 22 respectively include two first sub-flexible connecting bands 223 arranged at intervals, that is, a single wide flexible connecting band 22 can be divided into two first sub-flexible connecting bands 223 which are thinner.

In a second exemplary embodiment, as shown in fig. 10, two flexible connecting strips 22 respectively include three first sub-flexible connecting strips 223 arranged at intervals, that is, a single wide flexible connecting strip 22 can be divided into three first sub-flexible connecting strips 223 which are thinner.

In a third exemplary embodiment, as shown in fig. 11, the two flexible connecting strips 22 respectively include four first sub-flexible connecting strips 223 arranged at intervals, that is, a single wide flexible connecting strip 22 can be divided into four first sub-flexible connecting strips 223 which are thinner.

In a fourth exemplary embodiment, as shown in fig. 12, two flexible connecting strips 22 respectively include five first sub-flexible connecting strips 223 arranged at intervals, that is, a single wide flexible connecting strip 22 can be divided into five first sub-flexible connecting strips 223 which are thinner.

In some embodiments, the plurality of flexible connection bands 22 may be symmetrically disposed about the center M of the substrate 21, for example, as shown in fig. 9 to 12, two flexible connection bands 22 are symmetrically disposed about the center M of the substrate 21, which is beneficial to make the stress on the entire circuit board 200 relatively uniform and balanced, and facilitate the force balance between the circuit board 200 and the photo sensor chip, so as to improve the stress uniformity of the photo sensor chip, thereby improving the movement stability of the photo sensor chip and ensuring the optical anti-shake effect.

In some embodiments, a plurality of the wiring boards 23 may be symmetrically disposed about the center M of the substrate 21, for example, as shown in fig. 9 to 12, two wiring boards 23 are symmetrically disposed about the center M of the substrate 21, which is beneficial to make the stress on the entire circuit board 200 relatively uniform and balanced, and thus beneficial to make the stress distribution of the photo sensor chip more uniform, so that the photo sensor chip can move smoothly to ensure the optical anti-shake effect.

Based on the fact that most of the photo sensors in the related art are square photo sensors, in some embodiments, the outline of the substrate 21 is substantially square, and the hollow portion 211 can be a square area matching the outline of the substrate 21, so as to form a larger hollow portion 211. Moreover, in some embodiments, each flexible connecting band 22 includes a plurality of flexible segments connected in sequence, and every two adjacent flexible segments are connected vertically, so that the outer contour of the overall structure formed by the plurality of flexible connecting bands 22 can be square. That is, by limiting the vertical connection between every two adjacent flexible segments, the outer contour of the overall structure formed by the plurality of flexible connection bands 22 is approximately square, and is convenient to match with the shape of the hollow portion 211, so that the space of the hollow portion 211 can be fully utilized under the condition that the substrate 21 is miniaturized, the length of the flexible connection band 22 is increased as much as possible, and the elastic modulus and the deformation resistance of the flexible connection band 22 are reduced.

It will be appreciated that the square base plate 21 will generally have a first diagonal b1 and a second diagonal b2 disposed in an intersecting relationship.

In some embodiments, the plurality of first connection ends 221 may be distributed near two corners of the first diagonal b1 of the substrate 21, and the plurality of second connection ends 222 may be distributed near two corners of the second diagonal b2 of the substrate 21, so that at least one first connection end 221 or second connection end 222 may be disposed at each corner of the overall structure formed by the plurality of flexible connection strips 22 and having a substantially square outer contour, so as to achieve stress balance of the overall structure formed by the plurality of flexible connection strips 22 at four stress points, which is beneficial to uniform stress of the overall structure formed by the plurality of flexible connection strips 22 in all directions, and thus beneficial to more uniform stress distribution of the photosensitive chips, so that the photosensitive chips may move smoothly, and an optical anti-shake effect is ensured.

In the embodiment shown in fig. 9-12, where both flexible connecting strips 22 are provided, there are two first connecting ends 221 and two second connecting ends 222. For convenience of description, as shown in fig. 9 to 12, the two flexible connecting tapes 22 may be a first flexible connecting tape 22a and a second flexible connecting tape 22b, the two first connecting ends 221 may be a first sub-connecting end 221a and a second sub-connecting end 221b, the two second connecting ends 222 may be a third sub-connecting end 222a and a fourth sub-connecting end 222b, first flexible connecting strip 22a may have a first sub-connection end 221a and a third sub-connection end 222a, and second flexible connecting strip 22b may have second sub-connection end 221b and fourth sub-connection end 222b, first sub-connection end 221a and second sub-connection end 221b may be distributed near two corners of first diagonal b1 of said base panel 21, and the third and fourth sub-connection ends 222a and 222b may be distributed near both corners of the second diagonal portion b2 of the substrate 21. In this way, the stress balance of the overall structure formed by the plurality of flexible connecting belts 22 is realized at four stress points, which is beneficial to the uniform stress of the overall structure formed by the plurality of flexible connecting belts 22 in all directions.

In some embodiments, when the patch panel 23 is plural and the patch panels 23 are respectively disposed corresponding to the flexible connection tapes 22, the patch panels 23 respectively extend from the corresponding second connection ends 222 to the corresponding first connection ends 221, for example, as shown in fig. 9 to 12, the patch panels 23 may be two, and the two patch panels 23 may be respectively a first patch panel 23a and a second patch panel 23b, wherein the first patch panel 23a is fixedly connected to the third sub-connection end 222a and extends from the third sub-connection end 222a to the first sub-connection end 221a, and the second patch panel 23b is fixedly connected to the fourth sub-connection end 222b and extends from the fourth sub-connection end 222b to the second sub-connection end 221b, so that the stress of the whole structure formed by the flexible connection tapes 22 is relatively uniform and balanced, and the stress of the whole circuit board 200 is relatively uniform, The balance is convenient for the force balance between the circuit board 200 and the photosensitive chip, so as to improve the stress uniformity of the photosensitive chip.

For example, the terminal plate 23 may be a rigid plate or a flexible plate; the connection board 23 may be integrally formed with the flexible connection belt 22 or may be formed separately from the flexible connection belt. When the wiring board 23 is a hard board, both the wiring board 23 and the movable circuit board may be provided with pins so that the two may be electrically conducted through a wire or solder; when the wiring board 23 is a flexible board, the wiring board 23 and the movable circuit board may be electrically connected by using an Anisotropic Conductive Film (ACF), which simplifies the assembly process.

Referring to fig. 13 and 14, in some embodiments, at least one of the flexible connecting bands 22 includes a plurality of second sub-flexible connecting bands 224, and the plurality of second sub-flexible connecting bands 224 are arranged at intervals along the optical axis direction. This is equivalent to decomposing a single thicker flexible connection band into a plurality of second sub-flexible connection bands with thinner thickness, that is, the flexible connection band 22 is designed to be a double-layer or multi-layer structure (for example, a three-layer structure, a four-layer structure or a five-layer structure), and there are gaps between layers to thin the flexible connection band 22, so that the elastic modulus of the flexible connection band 22 can be further reduced under the condition of ensuring that the wiring amount is not changed, the flexibility of the flexible connection band 22 can be further improved, the deformation resistance is reduced, so that the flexible connection band 22 can be more easily stretched to deform, and the quality of the flexible connection band 22 can be reduced, so that the resistance received when the photosensitive chip moves can be reduced, the optical anti-shake response speed is improved, and the optical anti-shake effect is ensured.

In the embodiment shown in fig. 13 and 14, all of the flexible connecting strips 22 include two second sub-flexible connecting strips 224 arranged at intervals, that is, two flexible connecting strips 22 in fig. 13 and 14 include two second sub-flexible connecting strips 224 arranged at intervals, so as to design each flexible connecting strip 22 into a two-layer structure, and each flexible connecting strip 22 includes five first sub-flexible connecting strips 223 arranged at intervals, so as to divide a single wide flexible connecting strip 22 into five first sub-flexible connecting strips 223 which are thinner, so that each flexible connecting strip 22 has a lower elastic modulus and higher flexibility, and the deformation resistance of each flexible connecting strip 22 is reduced, and thus, the resistance to movement of the photosensitive chip can be reduced more effectively, and the optical anti-shake response speed can be improved more effectively.

Referring to fig. 15, the present invention further discloses an electronic device 300, wherein the electronic device 300 has the camera module 100 according to the foregoing embodiment. Specifically, as shown in fig. 15, the electronic device 300 may include a housing 301 and the aforementioned camera module 100 disposed in the housing to obtain image information. The electronic device 300 may be, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a smart watch, a monitor, and the like. The electronic device 300 having the camera module 100 according to the foregoing embodiment includes the flexible connection strips 22 disposed at the intervals, and the flexible connection strips only need to overcome the smaller material stress when being deformed, so that the deformation resistance is smaller, and therefore, the resistance to movement of the photosensitive chip can be reduced without affecting the power connection and conduction of the photosensitive chip, the optical anti-shake response speed is increased, and the optical anti-shake is facilitated.

The circuit board, the camera module and the electronic device disclosed by the embodiment of the utility model are introduced in detail, specific examples are applied to explain the principle and the embodiment of the utility model, and the description of the embodiment is only used for helping to understand the circuit board, the camera module and the electronic device and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (11)

1. A circuit board, comprising:

a substrate having a hollowed-out portion;

each flexible connecting belt is spirally or reversely arranged in the hollow part and is provided with a first connecting end and a second connecting end, and the first connecting end of each flexible connecting belt is fixedly connected to the substrate and is electrically connected with the substrate; and

the wiring board is located in the hollow part, the wiring board is arranged at the second connecting end, and the wiring board is electrically connected with the second connecting end.

2. The wiring board of claim 1, wherein at least one of the flexible connecting strips comprises a plurality of first sub-flexible connecting strips, and the plurality of first sub-flexible connecting strips are arranged at intervals along a direction perpendicular to the optical axis.

3. The wiring board of claim 1, wherein at least one of the flexible connecting strips comprises a plurality of second sub-flexible connecting strips, and the plurality of second sub-flexible connecting strips are arranged at intervals along the optical axis direction.

4. The wiring board of any of claims 1-3, wherein a plurality of the flexible connecting strips are symmetrically disposed about a center of the substrate.

5. The wiring board according to any one of claims 1 to 3, wherein a plurality of the wiring boards are arranged symmetrically with respect to the center of the substrate.

6. A wiring board according to any one of claims 1 to 3, wherein each of the flexible connecting strips comprises a plurality of flexible segments connected in sequence, and each adjacent two of the flexible segments are connected perpendicularly.

7. The wiring board of claim 6, wherein a plurality of the first connection terminals are distributed near two corners of a first diagonal of the substrate, and a plurality of the second connection terminals are distributed near two corners of a second diagonal of the substrate, wherein the first diagonal and the second diagonal intersect.

8. The wiring board according to any one of claims 1 to 3, wherein the wiring board is plural;

the plurality of wiring boards are respectively arranged corresponding to the plurality of flexible connecting belts, and each wiring board is respectively connected to the second connecting end of each flexible connecting belt; or

The number of the wiring boards is less than that of the flexible connecting belts, and at least one wiring board is connected to the second connecting ends of at least two flexible connecting belts.

9. The wiring board according to claim 8, wherein the number of the wiring boards is plural, and when plural ones of the wiring boards are provided corresponding to plural ones of the flexible connection tapes, the plural ones of the wiring boards extend from the corresponding second connection terminals to the corresponding first connection terminals, respectively.

10. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording includes:

the wiring board of any one of claims 1-9;

the movable circuit board is electrically connected with the wiring boards and can move relative to the substrate along the direction perpendicular to the optical axis, the wiring boards can move relative to the substrate along the direction perpendicular to the optical axis under the driving of the movable circuit board, and the flexible connecting bands can deform; and

the photosensitive chip is arranged on the movable circuit board and electrically connected with the movable circuit board, and under the driving of the movable circuit board, the photosensitive chip can move relative to the substrate along the direction perpendicular to the optical axis.

11. An electronic apparatus characterized by having the camera module according to claim 10.

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