CN216562465U - Controllable rapid heating device and testing equipment - Google Patents
Controllable rapid heating device and testing equipment Download PDFInfo
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- CN216562465U CN216562465U CN202122799859.1U CN202122799859U CN216562465U CN 216562465 U CN216562465 U CN 216562465U CN 202122799859 U CN202122799859 U CN 202122799859U CN 216562465 U CN216562465 U CN 216562465U
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Abstract
The utility model discloses a controllable rapid heating device and test equipment, and relates to the field of temperature control of memory bank production test environments, wherein the controllable rapid heating device comprises a power supply module, a processor module, a wind generation module, a heating module and a temperature sensing module; the heating module comprises a honeycomb heating core body and an electrode plate; the electrode plate is respectively connected with the processor module and the honeycomb heating core body; the power supply module is connected with the processor module; the processor module is respectively connected with the air making module, the heating module and the temperature sensing module; the air making module and the DRAM are respectively arranged on two opposite sides of the heating module. The utility model can quickly heat the test environment temperature to the specified temperature and realize the constant temperature state in the reliability test process of the memory bank product.
Description
Technical Field
The utility model relates to the field of temperature control of a memory bank production test environment, in particular to a controllable rapid heating device and test equipment.
Background
The reliability test process of the memory bank product needs to involve test environments such as high temperature and high humidity, and the like, and requires rapid heating to a specified temperature and a constant temperature state, while the prior art can not rapidly heat to the specified temperature and realize the constant temperature state, so that the reliability test of the memory bank product is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model provides a controllable rapid heating device and test equipment, and aims to solve the problems that in the prior art, a test environment cannot be rapidly heated to a specified temperature and a constant temperature state is realized in the reliability test process of a memory bank product.
In a first aspect, the utility model provides a controllable rapid heating device, which is applied to test equipment, wherein the test equipment is used for testing a DRAM (dynamic random access memory) memory bank, and the controllable rapid heating device comprises a power supply module, a processor module, an air making module, a heating module and a temperature sensing module; the heating module comprises a honeycomb heating core body and an electrode plate; the electrode plate is respectively connected with the processor module and the honeycomb heating core body; the power supply module is connected with the processor module; the processor module is respectively connected with the air making module, the heating module and the temperature sensing module; the air making module and the DRAM are respectively arranged on two opposite sides of the heating module.
Optionally, the controllable rapid heating device further comprises a ventilation window; the ventilation window is connected with the processor module; the ventilation window is arranged on one side of the air making module.
Optionally, a plurality of circular heating holes are arranged on the honeycomb heating core body.
Optionally, the cross-sectional area of the air producing module is larger than the cross-sectional area of the heating module.
Optionally, the air producing module is a fan.
Optionally, the controllable rapid heating device further comprises a boost converter; the boost converter is connected with the power supply module; the boost converter is connected with the processor module.
Optionally, the power supply module is a lithium battery.
Optionally, the temperature sensing module is a digital temperature sensor model DS18B 20.
Optionally, the processor module is an STM8S003F3 model single-chip microcomputer.
In a second aspect, the present invention also provides a testing apparatus comprising the controllable rapid heating device according to any one of the first aspect.
Compared with the prior art, the technical scheme provided by the embodiment of the utility model has the following advantages:
in the embodiment of the utility model, the temperature sensing module is used for monitoring the ambient temperature, when the test ambient temperature is higher than a set temperature value, the temperature sensing module feeds back to the processor module, and the processor module disconnects the power supply of the electrode plate in the heating module, so that the honeycomb heating core body does not generate heat and can also control the wind-making module to rotate reversely to dissipate heat; when the temperature of the test environment is lower than a set temperature value, the temperature sensing module feeds back the temperature to the processor module, the processor module conducts power supply of the electrode plate in the heating module to enable the honeycomb heating core body to generate heat, and simultaneously the air generation module can be controlled to rotate in the forward direction to enable heat of the honeycomb heating core body in the heating module to blow to the test environment along with the wind direction so as to accelerate the rise of the temperature of the test environment, and therefore the temperature of the test environment can be rapidly heated to a specified temperature in the reliability test process of the memory bank product and a constant temperature state can be achieved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a block diagram of a controllable rapid heating device and a testing apparatus according to an embodiment of the present invention;
FIG. 2 is a block diagram of a controllable rapid heating device and a testing apparatus according to an embodiment of the present invention;
FIG. 3 is a top view of a honeycomb heating core in a controlled rapid thermal heating apparatus according to an embodiment of the present invention;
fig. 4 is a structural diagram of a heating module, a blowing module and a DRAM memory bank in a controllable rapid heating apparatus according to an embodiment of the present invention.
Reference numerals
1. A power supply module; 2. a processor module; 3. a wind producing module; 4. a heating module; 5. a temperature sensing module; 6. an electrode sheet; 7. a honeycomb heating core; 8. a boost converter; 9. a ventilation window; 10. a circular heat-generating hole; 11. DRAM memory banks; 12. a controllable rapid heating device; 13. and (6) testing the equipment.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, wherein like reference numerals represent like elements in the drawings. It is apparent that the embodiments to be described below are only a part of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the embodiments of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the utility model. As used in the description of embodiments of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
In a first aspect, as shown in fig. 1, the present invention provides a controllable rapid heating apparatus 12, which is applied in a testing device 13, wherein the testing device 13 is used for testing a DRAM memory bank 11, and the controllable rapid heating apparatus 12 includes a power supply module 1, a processor module 2, a wind generation module 3, a heating module 4, and a temperature sensing module 5; the heating module 4 comprises a honeycomb heating core body 7 and an electrode plate 6; the electrode plate 6 is respectively connected with the processor module 2 and the honeycomb heating core body 7; the power supply module 1 is connected with the processor module 2; the processor module 2 is respectively connected with the air making module 3, the heating module 4 and the temperature sensing module 5; the air making module 3 and the DRAM 11 are respectively arranged on two opposite sides of the heating module 4.
Specifically, the power supply module 1 is used for supplying power to the air making module 3 and the heating module 4; the temperature sensing module 5 is used for monitoring the temperature of the testing environment, when the temperature of the testing environment is higher than a set temperature value, the temperature sensing module 5 feeds back to the processor module 2, the processor module 2 cuts off the power supply of the electrode plate 6 in the heating module 4 to ensure that the honeycomb heating core body 7 does not generate heat, and meanwhile, the processor module 2 can also control the wind-making module 3 to rotate reversely to ensure that the testing environment dissipates heat; when the temperature of the test environment is lower than a set temperature value, the temperature sensing module 5 feeds back the temperature to the processor module 2, the processor module 2 conducts the power supply of the electrode plate 6 in the heating module 4 to enable the honeycomb heating core body 7 to generate heat, meanwhile, the processor module 2 can also control the air-making module 3 to rotate in the forward direction to enable the heat of the heating module 4 to be blown to the DRAM memory bank 11 in the test environment along with the wind direction, so that the temperature of the test environment is accelerated to rise, and the test environment can be rapidly heated to a specified temperature and a constant temperature state is realized in the reliability test process of the DRAM memory bank 11.
Further, as shown in fig. 1 to 4, the controllable rapid heating apparatus 12 further includes a ventilation window 9; the ventilation window 9 is connected with the processor module 2; the ventilation window 9 is disposed at one side of the wind generation module 3.
Specifically, a driving motor is arranged on the ventilation window 9 and connected with the processor module 2, when the temperature of the test environment is higher than a set temperature value, the temperature sensing module 5 feeds back the temperature to the processor module 2, the processor module 2 cuts off the power supply of the electrode plate 6 in the heating module 4 to ensure that the honeycomb heating core 7 does not heat, and the air making module 3 can also be controlled to rotate reversely to ensure that the test environment radiates heat; when the air making module 3 is controlled to rotate reversely, the processor module 2 controls the driving motor on the ventilating window 9 to rotate positively, so that the ventilating window 9 is opened, and heat is dissipated to the outside through the ventilating window 9 on one side of the air making module 3.
When the test environment temperature is lower than the set temperature value, the processor module 2 controls the driving motor on the ventilation window 9 to rotate reversely, so that the ventilation window 9 is closed, and heat cannot be dissipated to the outside through the ventilation window 9.
Further, as shown in fig. 1 to 4, a plurality of circular heat-generating holes 10 are provided in the honeycomb heat-generating core 7.
Specifically, the honeycomb heating core 7 is provided with a plurality of circular heating holes 10, when the test environment temperature is lower than the set temperature value, the circular heating holes 10 enable heat to rapidly contact with the test environment so as to rapidly raise the test environment temperature, and the circular heating holes 10 enable heat to be rapidly transported to the DRAM memory bank 11 through the forward rotation of the air making module 3; when the test environment temperature is higher than the set temperature value, the circular heat generating hole 10 enables the heat to be rapidly transported to the external environment through the reverse rotation of the wind making module 3.
Further, referring to fig. 4, in combination with fig. 1-3, the cross-sectional area of the air producing module 3 is larger than the cross-sectional area of the heating module 4.
Specifically, the cross-sectional area of the air making module 3 is larger than that of the heating module 4, so that the heat generated by the honeycomb heating core 7 in the heating module 4 can be driven by the wind generated by the air making module 3, and the test environment can be rapidly heated or radiated.
Further, as shown in fig. 1 to 4, the air producing module 3 is a fan.
Specifically, when the temperature of the test environment is higher than a set temperature value, the temperature sensing module 5 feeds back to the processor module 2, and the processor module 2 controls the fan to rotate in the reverse direction so as to dissipate heat of the test environment; when the test environment temperature is lower than the set temperature value, the temperature sensing module 5 feeds back to the processor module 2, the processor module 2 controls the fan to rotate in the forward direction to enable the heat of the honeycomb heating core body 7 to be blown to the test environment along with the wind direction so as to accelerate the rise of the test environment temperature, and therefore the test environment can be rapidly heated to the specified temperature and the constant temperature state can be achieved in the reliability test process of the memory bank product.
Further, as shown in fig. 1-4, the processor module 2 is a single chip microcomputer of STM8S003F3 model.
Further, as shown in fig. 1 to 4, the power supply module 1 is a lithium battery.
Further, as shown in fig. 1-4, the controllable rapid heating device 12 further includes a boost converter 8; the boost converter 8 is connected with the power supply module 1; the boost converter 8 is connected to the processor module 2.
Specifically, when processor module 2 is the singlechip of STM8S003F3 model, works as power module 1 is the lithium cell, boost converter 8 is used for right the lithium cell carries out charging protection, and will the output voltage of lithium cell promotes to 5V and transports to the singlechip of STM8S003F3 model again.
Further, as shown in fig. 1-4, the temperature sensing module is a digital temperature sensor model DS18B 20.
Specifically, the digital temperature sensor of the model DS18B20 is used for monitoring the temperature of the test environment, and when the temperature of the test environment is lower than the temperature value set by the digital temperature sensor of the model DS18B20, the digital temperature sensor of the model DS18B20 outputs a low level signal to the processor module 2, and the processor module 2 switches on the power supply of the heating module 4 and simultaneously controls the forward rotation of the air generating module 3 so that the heat of the heating module 4 is blown to the test environment along with the wind direction to accelerate the rise of the temperature of the test environment.
When the temperature of the test environment is higher than the temperature value set by the DS18B20 type digital temperature sensor, the DS18B20 type digital temperature sensor outputs a high level signal to the processor module 2, and the processor module 2 disconnects the power supply of the heating module 4 and can also control the wind-making module 3 to rotate reversely so as to dissipate heat of the test environment.
In a second aspect, as shown in fig. 1-4, the present invention also provides a test apparatus 13 comprising the controllable rapid heating device 12 of the first aspect.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the utility model. Thus, while the utility model has been described with respect to the above-described embodiments, it will be understood that the utility model is not limited thereto but may be embodied with various modifications and changes.
While the utility model has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A controllable rapid heating device is applied to test equipment, the test equipment is used for testing a DRAM, and the controllable rapid heating device comprises a power supply module, a processor module, a wind generation module, a heating module and a temperature sensing module; the heating module comprises a honeycomb heating core body and an electrode plate; the electrode plate is respectively connected with the processor module and the honeycomb heating core body; the power supply module is connected with the processor module; the processor module is respectively connected with the air making module, the heating module and the temperature sensing module; the air making module and the DRAM are respectively arranged on two opposite sides of the heating module.
2. The controllable rapid heating device according to claim 1, further comprising a ventilation window; the ventilation window is connected with the processor module; the ventilation window is arranged on one side of the air making module.
3. The controllable rapid heating device according to claim 1, wherein the honeycomb heating core is provided with a plurality of circular heating holes.
4. Controllable rapid heating device according to claim 1, characterized in that the cross-sectional area of the wind module is larger than the cross-sectional area of the heating module.
5. Controllable rapid heating device according to claim 1, characterized in that the wind module is a fan.
6. The controllable rapid heating device according to claim 1, further comprising a boost converter; the boost converter is connected with the power supply module; the boost converter is connected with the processor module.
7. Controllable rapid heating device according to claim 1, characterized in that the power supply module is a lithium battery.
8. The controllable rapid heating device according to claim 1, wherein said temperature sensing module is a digital temperature sensor model DS18B 20.
9. A controllable rapid heating apparatus according to claim 1, wherein said processor module is a model STM8S003F3 single chip microcomputer.
10. A test apparatus comprising a controllable rapid heating device according to any of claims 1 to 9.
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CN202122799859.1U CN216562465U (en) | 2021-11-15 | 2021-11-15 | Controllable rapid heating device and testing equipment |
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CN202122799859.1U CN216562465U (en) | 2021-11-15 | 2021-11-15 | Controllable rapid heating device and testing equipment |
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