CN212580171U - Temperature regulation and control system of space station - Google Patents
Temperature regulation and control system of space station Download PDFInfo
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- CN212580171U CN212580171U CN202021300568.2U CN202021300568U CN212580171U CN 212580171 U CN212580171 U CN 212580171U CN 202021300568 U CN202021300568 U CN 202021300568U CN 212580171 U CN212580171 U CN 212580171U
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Abstract
The utility model provides a temperature regulation and control system of space station, temperature regulation and control system include control by temperature change cabin and control room, still include: the temperature sensor is arranged in the temperature control cabin and is electrically connected with the control room. The control room comprises a processor, a film key, a display and a control switch, wherein the processor is electrically connected with the temperature sensor, the film key is positioned on the display, the film key is electrically connected with the processor and the display, and the control switch is electrically connected with the processor; the temperature control cabin comprises a heat insulation layer, an air cooling system, a heat exchanger and a water cooling system which are sequentially arranged from inside to outside, the heat exchanger comprises a semiconductor temperature control sheet, and the semiconductor temperature control sheet is electrically connected with the control switch. The refrigeration system has the advantages that the refrigeration efficiency is improved, the temperature adjusting range is wider, and the emission weight is reduced; the device is easy to assemble, convenient to replace parts and suitable for space operation. The water cooling circulation is tightly attached to the outside of the heat exchanger.
Description
Technical Field
The utility model relates to a temperature control technical field especially relates to a temperature regulation and control system of space station.
Background
At present, the main mode of temperature regulation of a space station is to use a bionic principle to simulate a butterfly, wherein a set of fine scales covers the body surface of the butterfly to form an infinite number of optical mirrors, and the optical mirrors play a role in regulating the temperature by regulating the opening and closing angles of the scales. The principle of the novel satellite radiating shutter is that a metal wire expanding with heat and contracting with cold is arranged at the rotating part of the shutter, when the temperature of the sun surface of the earth exceeds the standard of the metal wire when a satellite flies to the earth, the metal wire can expand with heat, so that blades are opened in succession, the surface with large radiation radiating capacity faces the space, and when the temperature of the satellite rapidly drops, the metal wire can contract immediately after precooling, so that each blade is tightly closed, and the heat radiation of the satellite is inhibited. Although the device plays a role in cooling, the device is overlarge in size, inconvenient to use, easy to damage by space garbage, and capable of increasing the weight during launching and wasting resources.
In addition, chemical substances can also be used for regulating the temperature of the space station, but with the issuance and implementation of the technical provision of refrigerating by prohibiting the use of Freon (CFC) substances globally, the refrigerating by the Freon is not environment-friendly enough, and the energy consumption is increased.
Therefore, it is necessary to develop a temperature control system for a space station, which can refrigerate through a semiconductor temperature control sheet, so that the refrigeration element is more environment-friendly and energy-saving, the volume of the whole temperature control system is smaller, the use is more convenient, and the weight during emission is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art or the correlation technique.
Therefore the utility model provides a temperature regulation and control system of space station.
In view of this, the utility model provides a temperature regulation and control system of space station, temperature regulation and control system includes control by temperature change cabin and control room, temperature regulation and control system still includes:
the temperature sensor is arranged in the temperature control cabin and is electrically connected with the control room;
the control room comprises a processor, a film key, a display and a control switch, wherein the processor is electrically connected with the temperature sensor, the film key is positioned on the display, the film key is electrically connected with the processor and the display, and the control switch is electrically connected with the processor;
the temperature control cabin comprises a heat insulation layer, an air cooling system, a heat exchanger and a water cooling system which are sequentially arranged from inside to outside, wherein the heat exchanger comprises a semiconductor temperature control sheet, and the semiconductor temperature control sheet is electrically connected with the control switch.
Further, the semiconductor temperature control chip comprises:
a cold end insulator;
the hot end insulator is arranged opposite to the cold end insulator;
the semiconductor assemblies are arranged between the cold-end insulator and the hot-end insulator, an upper metal sheet is arranged between the cold-end insulator and the semiconductor assemblies, and a lower metal sheet is arranged between the hot-end insulator and the semiconductor assemblies;
the semiconductor assembly comprises an N-type semiconductor element and a P-type semiconductor element, the upper end of the N-type semiconductor element and the upper end of the P-type semiconductor element share one upper metal sheet, the lower end of the P-type semiconductor element and the lower end of the adjacent N-type semiconductor element share one lower metal sheet, and the lower ends of the N-type semiconductor element and the P-type semiconductor element at two ends are respectively connected with the positive electrode and the negative electrode of a power supply through one lower metal sheet.
Further, the P-type semiconductor element and the N-type semiconductor element are cylindrical or prismatic.
Further, the semiconductor assemblies are arranged in a matrix and are arranged between the cold-end insulator and the hot-end insulator.
Furthermore, the heat exchanger comprises a refrigeration type heat exchanger and a heating type heat exchanger, the refrigeration type heat exchanger and the heating type heat exchanger are arranged at intervals, the refrigeration type heat exchanger connects all the semiconductor temperature control sheets of the cold-end insulators facing the air cooling system and then is connected with the control switch, and the heating type heat exchanger connects all the semiconductor temperature control sheets of the hot-end insulators facing the air cooling system and then is connected with the control switch.
Furthermore, the air cooling system comprises fans, and the fans are uniformly arranged in the heat preservation layer.
Furthermore, the water cooling system corresponds to the air cooling system in position, and the water cooling system is arranged close to the heat exchanger.
Further, the control switch is a relay.
The utility model provides a technical scheme can include following beneficial effect:
refrigerate through semiconductor temperature control piece, the refrigeration original paper environmental protection and energy saving more, whole temperature regulation and control system's volume is less, and it is more convenient to use, weight when reducing the transmission, and each part is current part, and it is more convenient to make to have higher economic nature.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 shows a schematic view of a temperature regulation system according to an embodiment of the present invention;
fig. 2 shows a schematic view of a semiconductor temperature control chip according to an embodiment of the present invention;
FIG. 3 shows a schematic view of the direction A-A according to FIG. 1;
fig. 4 shows a schematic diagram of an air cooling system arrangement according to an embodiment of the present invention;
fig. 5 shows a schematic view of a heat exchanger according to an embodiment of the present invention;
fig. 6 shows a schematic view of a control room according to an embodiment of the invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 6 is:
the temperature control device comprises a semiconductor temperature control sheet 1, a cold end insulator 101, a hot end insulator 102, a P-type semiconductor element 103, an N-type semiconductor element 104, an upper metal sheet 105, a lower metal sheet 106, a power supply 107, a temperature control cabin 2, a heat insulation layer 201, an air cooling system 202, a heat exchanger 203, a heating type heat exchanger 2031, a cooling type heat exchanger 2032, a water cooling system 204, a control room 3, a control switch 301, a display 302, a film key 303, a processor 304 and a temperature sensor 4.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
Examples
Fig. 1 shows a schematic view of a temperature regulation system according to an embodiment of the present invention; FIG. 3 shows a schematic view of the direction A-A according to FIG. 1; fig. 6 shows a schematic view of a control room according to an embodiment of the invention.
As shown in fig. 1, fig. 3 and fig. 6, the utility model provides a temperature regulation and control system of space station, temperature regulation and control system include control by temperature change cabin 2 and control room 3, and temperature regulation and control system still includes:
the temperature sensor 4 is arranged in the temperature control cabin 2, and the temperature sensor 4 is electrically connected with the control room 3;
the control room 3 comprises a processor 304, a membrane key 303, a display 302 and a control switch 301, wherein the processor 304 is electrically connected with the temperature sensor 4, the membrane key 303 is positioned on the display 302, the membrane key 303 is electrically connected with the processor 304 and the display 302, and the control switch 301 is electrically connected with the processor 304;
the temperature control cabin 2 comprises an insulating layer 201, an air cooling system 202, a heat exchanger 203 and a water cooling system 204 which are sequentially arranged from inside to outside, the heat exchanger 203 comprises a semiconductor temperature control sheet 1, and the semiconductor temperature control sheet 1 is electrically connected with a control switch 301.
It should be noted that the display 302, the membrane keys 303 and the processor 304 constitute a control panel of the control room 3.
The temperature sensor 4 obtains the temperature in the semiconductor temperature control sheet 1 and transmits the temperature to the processor 304, the processor 304 compares the actual temperature of the semiconductor temperature control sheet 1 with the set temperature to control the direction of current, the set temperature is input into the processor 304 through the membrane key 303, the connection and disconnection of the whole circuit are controlled through the control switch 301, the actual temperature and the set temperature are displayed through the display 302, visual observation is facilitated, and the working efficiency of workers is improved.
Wherein, the temperature sensor 4 is a DH11 sensor, and the DHT11 sensor is a temperature and humidity composite sensor containing calibrated digital signal output, and has extremely high reliability and long-term stability. The DHT11 sensor comprises a resistance-type humidity sensing element and an NTC temperature measuring element, and is connected with a high-performance 8-bit singlechip, so that the DHT11 sensor has the advantages of ultra-fast response, strong anti-interference capability, extremely high cost performance and the like. Each DHT11 sensor is calibrated in a very accurate humidity verification chamber with calibration coefficients programmed into the OTP memory that are called up internally within the DHT11 sensor during the processing of the detection signal. In addition, the DHT11 sensor adopts a single-wire serial interface, so that the temperature regulation and control integration of the system becomes simple and rapid, the size is small, the power consumption is low, the application occasion is wider, and the connection is convenient due to the encapsulation of 4-pin single-row pins.
The processor 304 is an arduino nano single-chip processor, and the single-chip processor is adopted to enable the whole temperature regulation and control system to be more convenient to use, small in size, convenient to carry and install, and capable of improving the economy of the whole temperature regulation and control system.
The display 302 is an Icd1602A display, the Icd1602A display is an industrial character type liquid crystal display capable of displaying 16 × 2 or 32 characters simultaneously, and the character generation memory inside the Icd1602A display already stores 160 different dot matrix character patterns, and the characters and characters include: the characters have a fixed code, and when the character is used, a software program is directly written to drive according to a certain time sequence; the display writing is clear, the price is low, and the economical efficiency of the temperature control system is improved.
The control switch 301 is a relay, the performance of the relay is stable, the operation is more reliable, and the stability and the accuracy of the temperature regulation and control system are further improved.
Fig. 2 shows a schematic diagram of a semiconductor temperature control chip according to an embodiment of the present invention.
As shown in fig. 2, the semiconductor temperature control chip 1 includes:
a hot side insulator 102 disposed opposite the cold side insulator 101;
the semiconductor components are arranged between the cold-end insulator 101 and the hot-end insulator 102, an upper metal sheet 105 is arranged between the cold-end insulator 101 and the semiconductor components, and a lower metal sheet 106 is arranged between the hot-end insulator 102 and the semiconductor components;
the semiconductor assembly comprises an N-type semiconductor element 104 and a P-type semiconductor element 103, wherein the upper end of the N-type semiconductor element 104 and the upper end of the P-type semiconductor element 103 share an upper metal sheet 105, the lower end of the P-type semiconductor element 103 and the lower end of the adjacent N-type semiconductor element 104 share a lower metal sheet 106, and the lower ends of the N-type semiconductor elements 104 and the lower ends of the P-type semiconductor elements 103 at two ends are respectively connected with the positive electrode and the negative electrode of a power supply 107 through the lower metal sheets 106.
The semiconductor temperature control sheet 1 is used for refrigerating, the refrigerating element is more environment-friendly and energy-saving, the whole temperature regulation and control system adopts thermoelectric refrigeration, the refrigerating efficiency is improved, the temperature regulation range is wider, and the emission weight is reduced; the space station can continuously work without a refrigerant, has no pollution source and rotating parts, can not generate a rotation effect, has no sliding part, can modularize the space station, is easy to assemble, is convenient for replacing parts, and is suitable for space operation; the vibration is not generated during the work, and the service cycle is prolonged; the temperature regulation and control system can form an integrated circuit, so that an automatic control system can be conveniently formed; all the parts are the existing parts, so that the manufacturing is more convenient, and the economical efficiency is higher.
Specifically, electrons of the N-type semiconductor element 104 flow from the negative electrode to the positive electrode, and holes of the P-type semiconductor element 103 flow from the positive electrode to the negative electrode, according to the law of conservation of energy, when carriers in the semiconductor assembly pass through the metal sheet, the energy level is lowered to emit heat, and when carriers enter the semiconductor from the metal sheet, the energy level is raised to absorb heat, so that heat exchange is realized.
The P-type semiconductor element 103 and the N-type semiconductor element 104 are cylindrical or prismatic.
The semiconductor element with the shape is convenient to produce and process, the two ends of the semiconductor element are convenient to weld, welding efficiency and quality are improved, and meanwhile the semiconductor element is convenient to arrange according to a matrix so as to improve the refrigeration effect.
A plurality of semiconductor elements are arranged in a matrix between cold side insulator 101 and hot side insulator 102.
The structure is convenient for the production and processing of the semiconductor assemblies, the two ends of the semiconductor assemblies are convenient to weld, and the plurality of semiconductor assemblies are arranged in series.
Fig. 5 shows a schematic view of a heat exchanger according to an embodiment of the present invention.
As shown in fig. 5, the heat exchanger 203 includes a cooling heat exchanger 2032 and a heating heat exchanger 2031, the cooling heat exchanger 2032 and the heating heat exchanger 2031 are arranged at an interval, the cooling heat exchanger 2032 is connected to the relay after all the cold-end insulators 101 are connected to the semiconductor temperature control sheets 1 of the air-cooling system 202, and the heating heat exchanger 2031 is connected to the relay after all the hot-end insulators 102 are connected to the semiconductor temperature control sheets 1 of the air-cooling system 202.
It should be noted that the semiconductor temperature control fins 1 in each row are connected in series and then connected in parallel in the cooling heat exchanger 2032 and the heating heat exchanger 2031.
Specifically, the cooling heat exchangers 2032 and the heating heat exchangers 2031 are arranged alternately, in this embodiment, the heat exchanger 203 is made of semiconductor temperature control plates 1, the semiconductor temperature control plates 1 of the cold-end insulator 101 in the temperature control chamber 2 in the same direction are connected to form the cooling heat exchanger 2032, and the semiconductor temperature control plates 1 of the hot-end insulator 102 in the temperature control chamber 2 in the same direction are connected to form the heating heat exchanger 2031, wherein the processor 304 compares the actual temperature with the set temperature, outputs an electrical signal, and controls cooling or heating through a relay switch.
When the actual temperature is higher than the set temperature, the refrigeration switch in the relay switch is closed, the heating switch in the relay switch is opened, and the refrigeration type heat exchanger 2032 starts to work; when the actual temperature is lower than the set temperature, the heating switch in the relay switch is turned on, the cooling switch in the relay switch is turned off, and the heating heat exchanger 2031 starts to operate, thereby achieving the purpose of temperature control.
The heat exchanger 203 continuously dissipates heat from the hot-end insulator 102 of the semiconductor temperature control sheet 1, and the cold-end insulator 101 continuously absorbs heat, so that the purpose of heat transfer is achieved, and the purpose of changing the temperature in the temperature control cabin 2 is further achieved.
Fig. 4 shows a schematic diagram of an air cooling system arrangement according to an embodiment of the present invention.
As shown in fig. 4, the air cooling system 202 includes fans, and the fans are uniformly disposed in the insulating layer 201.
In this embodiment, the number of fans is one per square meter.
When the control switch 301 is turned on, the air cooling system 202 is started, and the fan thereof rotates to accelerate the air circulation of the temperature control cabin 2, thereby being beneficial to improving the speed of temperature reduction and temperature rise.
Further, the water cooling system 204 corresponds to the air cooling system 202, and the water cooling system 204 is disposed closely to the heat exchanger 203.
The working environment of the temperature control system is vacuum, no convection exists in the vacuum environment, the whole heat exchange with the outside is basically carried out through heat radiation, the area of the water cooling system is large, the heat dissipation speed is high, the specific heat capacity of the cooling liquid is high, the temperature change after heat absorption is small, and the stability and the service life of the temperature control system are improved.
The heat-insulating layer 201 in the temperature control cabin 2 plays a role in maintaining temperature, and can effectively prevent the temperature in the temperature control cabin 2 from being changed violently.
In this embodiment, the insulating material of the insulating layer 201 is space insulating ceramic, which is made of a plurality of tiny ceramic particles suspended in inert latex, and has low thermal conductivity, low heat storage coefficient and other thermal properties, and excellent heat insulation function.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims (8)
1. A temperature regulation system of a space station, the temperature regulation system comprising a temperature controlled compartment and a control room, the temperature regulation system further comprising:
the temperature sensor is arranged in the temperature control cabin and is electrically connected with the control room;
the control room comprises a processor, a film key, a display and a control switch, wherein the processor is electrically connected with the temperature sensor, the film key is positioned on the display, the film key is electrically connected with the processor and the display, and the control switch is electrically connected with the processor;
the temperature control cabin comprises a heat insulation layer, an air cooling system, a heat exchanger and a water cooling system which are sequentially arranged from inside to outside, wherein the heat exchanger comprises a semiconductor temperature control sheet, and the semiconductor temperature control sheet is electrically connected with the control switch.
2. The temperature conditioning system of a space station according to claim 1, wherein the semiconductor temperature control chip comprises:
a cold end insulator;
the hot end insulator is arranged opposite to the cold end insulator;
the semiconductor assemblies are arranged between the cold-end insulator and the hot-end insulator, an upper metal sheet is arranged between the cold-end insulator and the semiconductor assemblies, and a lower metal sheet is arranged between the hot-end insulator and the semiconductor assemblies;
the semiconductor assembly comprises an N-type semiconductor element and a P-type semiconductor element, the upper end of the N-type semiconductor element and the upper end of the P-type semiconductor element share one upper metal sheet, the lower end of the P-type semiconductor element and the lower end of the adjacent N-type semiconductor element share one lower metal sheet, and the lower ends of the N-type semiconductor element and the P-type semiconductor element at two ends are respectively connected with the positive electrode and the negative electrode of a power supply through one lower metal sheet.
3. The temperature regulation system of a space station of claim 2, wherein the P-type semiconductor elements and the N-type semiconductor elements are cylindrical or prismatic.
4. The space station temperature conditioning system of claim 2, wherein a plurality of said semiconductor assemblies are arranged in a matrix between said cold side insulator and said hot side insulator.
5. The temperature control system for the space station according to claim 2, wherein the heat exchanger includes a refrigeration heat exchanger and a heating heat exchanger, the refrigeration heat exchanger and the heating heat exchanger are arranged at an interval, the refrigeration heat exchanger is connected to the control switch after all the cold-end insulators are connected to the semiconductor temperature control sheet facing the air cooling system, and the heating heat exchanger is connected to the control switch after all the hot-end insulators are connected to the semiconductor temperature control sheet facing the air cooling system.
6. The temperature regulating system of the space station as claimed in claim 1, wherein the air cooling system comprises fans, and the fans are uniformly arranged in the heat insulating layer.
7. The temperature regulating system of the space station as claimed in claim 6, wherein the water cooling system corresponds to the air cooling system in position, and the water cooling system is arranged closely to the heat exchanger.
8. The temperature conditioning system of a space station according to any one of claims 1 to 7, wherein the control switch is a relay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021300568.2U CN212580171U (en) | 2020-07-06 | 2020-07-06 | Temperature regulation and control system of space station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021300568.2U CN212580171U (en) | 2020-07-06 | 2020-07-06 | Temperature regulation and control system of space station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212580171U true CN212580171U (en) | 2021-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021300568.2U Expired - Fee Related CN212580171U (en) | 2020-07-06 | 2020-07-06 | Temperature regulation and control system of space station |
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| Country | Link |
|---|---|
| CN (1) | CN212580171U (en) |
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2020
- 2020-07-06 CN CN202021300568.2U patent/CN212580171U/en not_active Expired - Fee Related
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Granted publication date: 20210223 |