CN216539370U

CN216539370U - Semiconductor chip surface treatment device convenient to it is fixed

Info

Publication number: CN216539370U
Application number: CN202123422829.5U
Authority: CN
Inventors: 李妍琼; 李盛伟
Original assignee: Shenzhen Zhongbao Group Co ltd
Current assignee: Shenzhen Zhongbao Group Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-17
Anticipated expiration: 2031-12-31

Abstract

The utility model discloses a semiconductor chip surface treatment device convenient to fix, which comprises a fixed base, wherein two sides of the top of the fixed base are fixedly provided with a first fixed plate and a second fixed plate which are symmetrical, the two first fixed plates are positioned on the inner walls of the two second fixed plates, the outer walls of the two first fixed plates are provided with rotating holes, and the inner walls of the rotating holes are movably connected with rotating shafts through bearings. According to the utility model, the chip main body is placed on the inner wall of the chip groove, the positioning plate is placed on the inner wall of the positioning groove, the top of the chip main body is coated with the aluminum oxide and glycerol mixed protection layer and is positioned on the inner wall of the baking opening, when the chip main body is baked, the whole chip main body is not heated, only one surface of the chip main body, which is coated with the aluminum oxide and glycerol mixed protection layer, is exposed outside, so that the internal overheating of the chip main body can not be caused in the baking process of the chip main body, and the chip in the chip main body is less influenced by heating.

Description

Semiconductor chip surface treatment device convenient to it is fixed

Technical Field

The utility model relates to the field of semiconductors, in particular to a semiconductor chip surface treatment device convenient to fix.

Background

The semiconductor chip is a semiconductor device which is manufactured by etching and wiring a semiconductor wafer and can realize a certain function, and with the development of modernization, electronic appliances used in life need to be used as the semiconductor chip.

It is known that the semiconductor need coat aluminium oxide and glycerine mixed protective layer on semiconductor chip's surface in process of production, consequently need to dry the processing to semiconductor chip surface adnexed aluminium oxide and glycerine mixed protective layer, but current drying device all places the semiconductor chip in toasting the incasement and toasts, need often open and shut to toasting the case for this reason, need frequent switch toast the case, consequently, the durability is poor, work efficiency is low, when toasting the semiconductor chip with toasting the case simultaneously, can lead to the chip to be heated wholly, for this reason can greatly influence the quality of chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor chip surface treatment device convenient to fix, so as to solve the defects in the technology.

In order to achieve the above purpose, the utility model provides the following technical scheme: a semiconductor chip surface treatment device convenient to fix comprises a fixed base, wherein symmetrical first fixed plates are fixedly arranged on two sides of the top of the fixed base, symmetrical second fixed plates are fixedly arranged on two sides of the top of the fixed base, the two first fixed plates are positioned between the two second fixed plates, two rotating holes positioned on the same horizontal line are formed in one sides of the two first fixed plates, the inner walls of the rotating holes are movably connected with rotating shafts through bearings, rotary tables are fixedly arranged at two ends of the two rotating shafts, the two rotary tables are sleeved with gear conveyor belts, the rotary tables and the gear conveyor belts are positioned between the adjacent first fixed plates and the second fixed plates, heating covers are fixedly arranged at the tops of the two second fixed plates, heating ports are formed in one side of the tops of the heating covers, and baking covers are fixedly arranged on the inner walls of the bottoms of the heating ports, the fixed heating post that is equipped with the equidistance and distributes of both sides inner wall of heating mantle, the fixed air heater that is equipped with of top one end of heating mantle, the output of air heater and the inner wall intercommunication of heating port, first fixed plate is equipped with the fixed block with top one side of second fixed plate, the fixed rack that is equipped with of bottom both ends outer wall of fixed block, two the both sides outer wall of rack and the clearance sliding connection of first fixed plate and second fixed plate, open fixed block top one side has the constant head tank, the inner wall of constant head tank is equipped with the locating plate, open top one side of locating plate has the chip groove that the equidistance distributes, the chip main part has been placed in the chip groove.

Preferably, a material preparing platform is fixedly arranged on one side of the top of each of the two second fixing plates, and a material discharging platform is arranged on one side, away from the material preparing platform, of the top of each of the two second fixing plates.

Preferably, the fixed motor that is equipped with in unable adjustment base's top one side, the output shaft of motor passes through the fixed drive pulley that is equipped with of shaft coupling, the fixed driven pulley that is equipped with of outer wall of pivot, the belt strip has been cup jointed with driven pulley's outer wall to the drive pulley of drive pulley through the output shaft of motor, and it is rotatory that drive pulley passes through the belt strip and drives driven pulley, and driven pulley drives the pivot and the carousel is rotatory, and it is rotatory to drive gear transmission belt through the outer wall of carousel.

Preferably, an insulation can is fixedly arranged on one side of the top of the fixed base, the insulation can is located under the heating cover, and an air outlet is formed in the outer wall of one side of the insulation can.

Preferably, the pitch of the rack is matched with the pitch of the gear transmission belt.

Preferably, the outer wall of one side of the top of the fixed block is movably connected with a cover plate through a hinge, one side of the top of the fixed block, away from the hinge, is fixedly provided with a metal iron sheet, one side of the top of the cover plate, away from the hinge, is fixedly provided with a permanent magnet sheet, and the cover plate is convenient to close through the metal iron sheet and the permanent magnet sheet.

Preferably, the top one side of apron is opened has the roast mouth of equidistance distribution, the inner wall profile of toasting the mouth and the top outer wall profile looks adaptation of chip main part, the fixed first in command that is equipped with in top one side of locating plate is convenient for take out the locating plate from the inner wall of constant head tank through the first in command, the fixed second in command that is equipped with in one side outer wall of apron, be convenient for open the apron from the top of fixed block through the second in command.

In the technical scheme, the utility model provides the following technical effects and advantages:

through placing the chip main part in the inner wall in chip groove, place the locating plate in the inner wall of constant head tank, it is closed with the apron through metal iron sheet and permanent magnet piece, chip main part top scribbles the inner wall that aluminium oxide and glycerine mixed protection layer are located the stoving mouth, make chip main part be located the inside of fixed block, when the chip main part toasts, the whole of chip main part can not be heated, only the chip main part scribbles aluminium oxide and glycerine mixed protection layer one side and exposes outside, consequently the chip main part can not lead to the inside of chip main part overheated baking the in-process, the chip in the chip main part is heated and is influenced for a short time.

The hot air blower can automatically enter the bottom of the heating cover for baking without being frequently started, and can automatically move out of the baking area.

Drawings

In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

FIG. 3 is a schematic perspective view of a heating mantle of the present invention;

FIG. 4 is a schematic view of a fixing block according to the present invention;

FIG. 5 is a schematic perspective view of a fixing block according to the present invention;

fig. 6 is a schematic perspective view of the positioning plate of the present invention.

Description of reference numerals:

the device comprises a fixed base 1, a first fixed plate 2, a second fixed plate 3, a material preparation table 4, a material discharge table 5, a rotating hole 6, a rotating shaft 7, a rotating disc 8, a gear transmission belt 9, a motor 10, a driven belt pulley 11, a driving belt pulley 12, an incubator 13, an exhaust port 14, a heating cover 15, a heating port 16, a baking cover 17, a heating column 18, a hot air blower 19, a fixed block 20, a rack 21, a positioning groove 22, a cover plate 23, a baking port 24, a metal iron sheet 25, a permanent magnet iron sheet 26, a positioning plate 27, a chip groove 28, a chip main body 29, a first handle 30 and a second handle 31.

Detailed Description

In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.

Example one

Referring to the attached drawings 1-6 of the specification, a semiconductor chip surface treatment device convenient for fixation comprises a fixed base 1, wherein symmetrical first fixed plates 2 are fixedly arranged on two sides of the top of the fixed base 1, symmetrical second fixed plates 3 are fixedly arranged on two sides of the top of the fixed base 1, the two first fixed plates 2 are positioned between the two second fixed plates 3, two rotating holes 6 positioned on the same horizontal line are respectively formed in one side of each first fixed plate 2, the inner walls of the rotating holes 6 are movably connected with rotating shafts 7 through bearings, rotary tables 8 are fixedly arranged at two ends of each rotating shaft 7, gear conveyor belts 9 are sleeved on the two rotary tables 8, the rotary tables 8 and the gear conveyor belts 9 are positioned between the adjacent first fixed plates 2 and the adjacent second fixed plates 3, heating covers 15 are fixedly arranged on the tops of the two second fixed plates 3, heating ports 16 are formed in one side of the tops of the heating covers 15, baking covers 17 are fixedly arranged on the inner walls of the bottoms of the heating ports 16, fixed heating post 18 that is equipped with the equidistance and distributes of both sides inner wall of heating mantle 15, the fixed air heater 19 that is equipped with of top one end of heating mantle 15, the output of air heater 19 and the inner wall intercommunication of heating port 16, first fixed plate 2 is equipped with fixed block 20 with top one side of second fixed plate 3, the fixed rack 21 that is equipped with of bottom both ends outer wall of fixed block 20, the both sides outer wall of two rack 21 and the clearance sliding connection of first fixed plate 2 and second fixed plate 3, open fixed block 20 top one side has constant head tank 22, the inner wall of constant head tank 22 is equipped with locating plate 27, open chip groove 28 that has the equidistance and distribute on top one side of locating plate 27, chip main part 29 has been placed to chip groove 28.

Example two

Based on embodiment one, the fixed preparation platform 4 that is equipped with in top one side of two second fixed plates 3, the one side that the preparation platform 4 was kept away from in the top of two second fixed plates 3 is equipped with blowing platform 5, and the fixed insulation can 13 that is equipped with in top one side of unable adjustment base 1, insulation can 13 are located under heating cover 15, and the gas vent 14 has been opened to one side outer wall of insulation can 13.

EXAMPLE III

Based on embodiment one, the fixed motor 10 that is equipped with in top one side of unable adjustment base 1, motor 10's output shaft passes through the fixed driving pulley 12 that is equipped with of shaft coupling, the outer wall of pivot 7 is fixed and is equipped with driven pulley 11, driving pulley 12 has cup jointed the belt strip with driven pulley 11's outer wall, the tooth pitch of rack 21 and gear transmission belt 9's tooth pitch looks adaptation, it is rotatory that output shaft through motor 10 drives driving pulley 12, driving pulley 12 passes through the belt strip and drives driven pulley 11 rotatory, driven pulley 11 drives pivot 7 and carousel 8 rotatory, it is rotatory to drive gear transmission belt 9 through the outer wall of carousel 8.

Example four

Based on the first embodiment, the outer wall of one side of the top of the fixing block 20 is movably connected with the cover plate 23 through the hinge, one side of the top of the fixing block 20, which is far away from the hinge, is fixedly provided with the metal iron sheet 25, one side of the top of the cover plate 23, which is far away from the hinge, is fixedly provided with the permanent magnet sheet 26, the cover plate 23 is closed through the metal iron sheet 25 and the permanent magnet sheet 26, one side of the top of the cover plate 23 is provided with the baking openings 24 which are distributed equidistantly, the inner wall profile of the baking openings 24 is matched with the profile of the outer wall of the top of the chip main body 29, one side of the top of the positioning plate 27 is fixedly provided with the first handle 30, the positioning plate 27 is conveniently taken out from the inner wall of the positioning groove 22 through the first handle 30, the outer wall of one side of the cover plate 23 is fixedly provided with the second handle 31, and the cover plate 23 is conveniently opened from the top of the fixing block 20 through the second handle 31.

The working principle of the utility model is as follows:

referring to the attached drawings 1-6 of the specification, when in use, firstly, the chip main body 29 is placed on the inner wall of the chip groove 28, then the positioning plate 27 is placed on the inner wall of the positioning groove 22, the cover plate 23 is closed through the metal iron sheet 25 and the permanent magnet iron sheet 26, the top of the chip main body 29 is coated with the aluminum oxide and glycerin mixed protection layer and is positioned on the inner wall of the baking opening 24, so that the chip main body 29 is positioned inside the fixed block 20, when the chip main body 29 is baked, the whole chip main body 29 is not heated, only the side of the chip main body 29 needing to be baked is exposed outside, therefore, the chip main body 29 cannot cause the inner wall of the chip main body 29 to be overheated in the baking process, the chip in the chip main body 29 is slightly influenced by heat, the baking effect is good, the fixed block 20 is placed on the top of the material preparation table 4, the rack 21 arranged at the bottom of the fixed block 20 slides on the outer walls of the first fixed plate 2 and the second fixed plate 3, the fixed block 20 is pushed to slide to the bottom of the heating cover 15, teeth of a rack 21 are meshed with teeth of the outer wall of the gear transmission belt 9 at the moment, an output shaft of a motor 10 drives a driving belt pulley 12 to rotate, the driving belt pulley 12 drives a driven belt pulley 11 to rotate through a belt strip, the driven belt pulley 11 drives a rotating shaft 7 and a rotating disc 8 to rotate, the outer wall of the rotating disc 8 drives the gear transmission belt 9 to rotate, the fixed block 20 is moved to the position under the heating cover 15 through the gear transmission belt 9, hot air generated by a hot air blower 19 is discharged into the inner wall of a baking cover 17, the outer wall of a chip main body 29 can be baked, heating columns 18 distributed at equal intervals are arranged on the inner walls of two sides of the heating cover 15 to further bake an aluminum oxide and glycerin mixed layer coated on the outer wall of the chip main body 29, when the inner wall of the fixed block 20 moves out of the heating cover 15, the rack 21 arranged at the bottom of the fixed block 20 is separated from the outer wall of the gear transmission belt 9, the fixed block 20 slides to the top of the discharging table 5, and then the fixed block 20 moved to the top of the discharging table 5 is collected, the utility model does not need to be started frequently, the hot air blower 19 can automatically enter the bottom of the heating cover 15 for baking, and can automatically move out of a baking area, therefore, the utility model has long service life and high working efficiency.

While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the utility model.

Claims

1. A semiconductor chip surface treatment device convenient to fix, includes unable adjustment base (1), its characterized in that: the fixing device is characterized in that symmetrical first fixing plates (2) are fixedly arranged on two sides of the top of the fixing base (1), symmetrical second fixing plates (3) are fixedly arranged on two sides of the top of the fixing base (1), the two first fixing plates (2) are positioned between the two second fixing plates (3), two rotating holes (6) positioned on the same horizontal line are formed in one side of the two first fixing plates (2), the inner wall of each rotating hole (6) is movably connected with a rotating shaft (7) through a bearing, rotary tables (8) are fixedly arranged at two ends of the two rotating shafts (7), gear conveyor belts (9) are sleeved on the two rotary tables (8), the rotary tables (8) and the gear conveyor belts (9) are positioned between the adjacent first fixing plates (2) and the adjacent second fixing plates (3), and heating covers (15) are fixedly arranged on the tops of the two second fixing plates (3), a heating opening (16) is formed in one side of the top of the heating cover (15), a baking cover (17) is fixedly arranged on the inner wall of the bottom of the heating opening (16), heating columns (18) distributed at equal intervals are fixedly arranged on the inner walls of the two sides of the heating cover (15), an air heater (19) is fixedly arranged at one end of the top of the heating cover (15), the output end of the air heater (19) is communicated with the inner wall of the heating opening (16), a fixing block (20) is arranged on one side of the tops of the first fixing plate (2) and the second fixing plate (3), racks (21) are fixedly arranged on the outer walls of the two ends of the bottom of the fixing block (20), the outer walls of the two sides of the two racks (21) are in sliding connection with the gaps of the first fixing plate (2) and the second fixing plate (3), a positioning groove (22) is formed in one side of the top of the fixing block (20), and a positioning plate (27) is arranged on the inner wall of the positioning groove (22), chip grooves (28) are formed in one side of the top of the positioning plate (27) and are distributed equidistantly, and chip main bodies (29) are placed in the chip grooves (28).

2. A semiconductor chip surface treatment apparatus for facilitating mounting according to claim 1, wherein: two fixed being equipped with in top one side of second fixed plate (3) prepares for material platform (4), two one side that prepares for material platform (4) are kept away from in second fixed plate (3) top is equipped with blowing platform (5).

3. A semiconductor chip surface treatment apparatus for facilitating mounting according to claim 1, wherein: the fixed motor (10) that is equipped with in top one side of unable adjustment base (1), the output shaft of motor (10) passes through the fixed driving pulley (12) that is equipped with of shaft coupling, the fixed driven pulley (11) that is equipped with of outer wall of pivot (7), the belt strip has been cup jointed with the outer wall of driven pulley (11) driving pulley (12).

4. A semiconductor chip surface treatment apparatus for facilitating mounting according to claim 1, wherein: an insulation can (13) is fixedly arranged on one side of the top of the fixed base (1), the insulation can (13) is located under the heating cover (15), and an air outlet (14) is formed in the outer wall of one side of the insulation can (13).

5. A semiconductor chip surface treatment apparatus for facilitating mounting according to claim 1, wherein: the pitch of the rack (21) is matched with the pitch of the gear conveyor belt (9).

6. A semiconductor chip surface treatment apparatus for facilitating mounting according to claim 1, wherein: the hinge is characterized in that the outer wall of one side of the top of the fixing block (20) is connected with a cover plate (23) through a hinge in a movable mode, a metal iron sheet (25) is fixedly arranged on one side, away from the hinge, of the top of the fixing block (20), and a permanent magnet sheet (26) is fixedly arranged on one side, away from the hinge, of the top of the cover plate (23).

7. The semiconductor chip surface treatment apparatus facilitating mounting according to claim 6, wherein: the top one side of apron (23) is opened there are baking mouth (24) that the equidistance distributes, the inner wall profile of baking mouth (24) and the top outer wall profile looks adaptation of chip main part (29), top one side of locating plate (27) is fixed and is equipped with first handle (30), one side outer wall of apron (23) is fixed and is equipped with second handle (31).