CN212720513U

CN212720513U - Semiconductor chip baking device

Info

Publication number: CN212720513U
Application number: CN202021112051.0U
Authority: CN
Inventors: 李双玉
Original assignee: Yongming Technology Shanghai Co ltd
Current assignee: Yongming Technology Shanghai Co ltd
Priority date: 2020-06-16
Filing date: 2020-06-16
Publication date: 2021-03-16
Anticipated expiration: 2030-06-16

Abstract

The utility model discloses a semiconductor chip baking equipment, the power distribution box comprises a box body, box front side bilateral symmetry articulates installs two sets of chamber doors with the size, two sets of blast pipes with the size are installed to box inner wall bottom bilateral symmetry intercommunication, two sets of first logical grooves with the size are seted up to box bilateral symmetry, the equal demountable installation in the first logical inslot side of every group has resistance heating wire, the equal demountable installation in the first logical groove outside of every group has the mounting bracket, the equal demountable installation of every group mounting bracket has the forced draught blower of multiunit with the model, bottom half demountable installation has the motor, the pivot is installed in the inside rotation of box. The utility model discloses a resistance heating wire heated air, inside the forced draught blower sent hot-air into to the installation framework, because semiconductor chip is in the rotating condition, the homogeneity that is favorable to semiconductor chip to toast prevented that semiconductor chip from taking place the problem of burning out when static toasting.

Description

Semiconductor chip baking device

Technical Field

The utility model relates to a semiconductor chip toasts technical field, specifically is a semiconductor chip baking equipment.

Background

The semiconductor chip is dip-dyed and wired on a semiconductor plate, so that the semiconductor plate can realize a certain circuit control function, the semiconductor chip needs to be cleaned and cooled after being wired, and a large amount of water exists on the cleaned semiconductor plate and needs to be baked, so that the semiconductor chip baking device is provided.

In the process of implementing the invention, the inventor finds that at least the following problems in the prior art are not solved; when the prior art is baked through a baking machine, when the static baking exists, part of chips have the problem of excessive baking. This application passes through resistance heating wire heated air, and inside the forced draught blower sent hot-air into the installation framework, because semiconductor chip is in the rotation state, be favorable to the homogeneity that semiconductor chip toasted, take place the problem of burning out when preventing that semiconductor chip is static to toast, solved above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor chip baking equipment has solved the problem that proposes among the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip baking device comprises a box body, wherein two groups of box doors with the same size are symmetrically and hinged on the left and right of the front side of the box body, two groups of exhaust pipes with the same size are symmetrically and communicated on the left and right of the bottom of the inner wall of the box body, two groups of first through grooves with the same size are symmetrically arranged on the two sides of the box body, a resistance heating wire is detachably arranged on the inner side of each group of first through grooves, a mounting frame is detachably arranged on the outer side of each group of first through grooves, a plurality of groups of air blowers with the same type are detachably arranged on each group of mounting frame, a motor is detachably arranged on the bottom of the box body, a rotating shaft is rotatably arranged in the box body, the bottom of the rotating shaft is dynamically arranged with a motor shaft of the motor, a mounting frame body is fixedly arranged in, four groups of second through grooves with the same size are formed in the rectangular shape at the top of the box body.

In a preferred embodiment of the present invention, the surface of the shutter is porous.

As a preferred embodiment of the present invention, the cross-sectional area of the shutter is smaller than the cross-sectional area of the second through groove.

As a preferred embodiment of the present invention, the distance from the mounting frame to the resistance heating wire is 8 cm.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a carry the handle and can promote the shutter, place semiconductor chip inside the installation framework, close the shutter afterwards, thereby it produces centrifugal force to drive the pivot through the motor and rotate to realize that the installation framework is rotatory, throws away the moisture on semiconductor chip surface, reaches the dry purpose of semiconductor chip, sets up the shutter and conveniently places and take out semiconductor chip.

2. The utility model discloses a resistance heating wire heated air, inside the forced draught blower sent hot-air into to the installation framework, because semiconductor chip is in the rotating condition, the homogeneity that is favorable to semiconductor chip to toast prevented that semiconductor chip from taking place the problem of burning out when static toasting.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of a box body of a semiconductor chip baking device of the present invention;

fig. 2 is a front view of a semiconductor chip baking apparatus of the present invention;

fig. 3 is a top view of the box of the semiconductor chip baking apparatus of the present invention.

In the figure: 1. a box body; 2. a first through groove; 3. a mounting frame; 4. resistance heating wires; 5. a blower; 6. a second through groove; 7. a shutter; 8. lifting a handle; 9. installing a frame body; 10. a slide bar; 11. a separation grid; 12. a rotating shaft; 13. a motor; 14. an exhaust pipe; 15. and (4) a box door.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-3, the utility model provides a technical solution: a semiconductor chip baking device comprises a box body 1, wherein two groups of box doors 15 with the same size are symmetrically and hinged on the left and right of the front side of the box body 1, two groups of exhaust pipes 14 with the same size are symmetrically communicated and installed on the left and right of the bottom of the inner wall of the box body 1, two groups of first through grooves 2 with the same size are symmetrically arranged on the two sides of the box body 1, a resistance heating wire 4 is detachably installed on the inner side of each group of first through groove 2, an installation frame 3 is detachably installed on the outer side of each group of first through grooves 2, a plurality of groups of blowers 5 with the same type are detachably installed on each group of installation frame 3, a motor 13 is detachably installed on the bottom of the box body 1, a rotating shaft 12 is rotatably installed inside the box body 1, the bottom of the rotating shaft 12 is in power installation with a motor shaft, each group of sliding strips 10 is provided with a stop door 7 in a sliding way, the top of each group of stop doors 7 is fixedly provided with a lifting handle 8, and the top of the box body 1 is provided with four groups of second through grooves 6 with the same size in a rectangular way.

In this embodiment, as shown in fig. 1 and 3, the shutter 7 can be lifted by the lifting handle 8, the semiconductor chip is placed inside the mounting frame 9, then the shutter 7 is closed, the rotating shaft 12 is driven by the motor 13 to rotate, so that the mounting frame 9 rotates to generate centrifugal force, moisture on the surface of the semiconductor chip is thrown away, the purpose of drying the semiconductor chip is achieved, and the shutter 7 is arranged to facilitate placement and removal of the semiconductor chip.

Wherein, the surface of the shutter 7 is porous.

Wherein the cross-sectional area of the shutter 7 is smaller than the cross-sectional area of the second through groove 6.

In the embodiment, as shown in fig. 1 and 2, the air is heated by the resistance heating wire 4, and the air blower 5 sends the hot air into the mounting frame 9, so that the semiconductor chip is in a rotating state, which is beneficial to the baking uniformity of the semiconductor chip and prevents the problem of burning out of the semiconductor chip when the semiconductor chip is still baked.

Wherein, the distance between the mounting rack 3 and the resistance heating wire 4 is 8 cm.

The working principle is as follows: when a semiconductor chip baking equipment uses, can promote shutter 7 through carrying handle 8, shutter 7 slides on draw runner 10, shutter 7 accessible second leads to groove 6 and stretches out, place the semiconductor chip inside installation framework 9, separately place the semiconductor chip through separating grid 11, close shutter 7 afterwards, thereby it produces centrifugal force to drive pivot 12 through motor 13 and rotate to realize the rotatory installation framework 9 of realization, throw away the moisture on semiconductor chip surface, reach the dry purpose of semiconductor chip, it conveniently places and takes out the semiconductor chip to set up shutter 7, heat the air through resistance heating wire 4, forced draught blower 5 sends into hot-air to inside installation framework 9, because the semiconductor chip is in the rotating condition, be favorable to the homogeneity that the semiconductor chip toasts, the problem that takes place to burn out when preventing the static stoving of semiconductor chip.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a semiconductor chip baking equipment, includes box (1), its characterized in that: the box body (1) is provided with two groups of box doors (15) with the same size in a bilateral symmetry mode, the box body (1) is provided with two groups of exhaust pipes (14) with the same size in a bilateral symmetry mode at the bottom of the inner wall, two groups of first through grooves (2) with the same size are symmetrically arranged on two sides of the box body (1), each group of resistance heating wires (4) are detachably arranged on the inner sides of the first through grooves (2), each group of mounting frames (3) are detachably arranged on the outer sides of the first through grooves (2), each group of mounting frames (3) are detachably provided with a plurality of groups of air blowers (5) with the same type, a motor (13) is detachably arranged at the bottom of the box body (1), a rotating shaft (12) is rotatably arranged in the box body (1), the bottom of the rotating shaft (12) and a motor shaft of the motor (13) are dynamically arranged, the mounting frame body (9) is provided with four groups of side walls, sliding strips (10) are fixedly mounted on the four groups of side walls, each group of sliding strips (10) is provided with a stop door (7) in a sliding mode, each group of stop door (7) is fixedly mounted on the top of a lifting handle (8), and four groups of second through grooves (6) with the same size are formed in a rectangular shape in the top of the box body (1).

2. The semiconductor chip baking apparatus according to claim 1, wherein: the surface of the stop door (7) is porous.

3. The semiconductor chip baking apparatus according to claim 1, wherein: the cross sectional area of the stop door (7) is smaller than that of the second through groove (6).

4. The semiconductor chip baking apparatus according to claim 1, wherein: the distance between the mounting rack (3) and the resistance heating wire (4) is 8 cm.