CN216514119U - PECVD coating variable pitch transfer mechanism - Google Patents
PECVD coating variable pitch transfer mechanism Download PDFInfo
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- CN216514119U CN216514119U CN202122728092.3U CN202122728092U CN216514119U CN 216514119 U CN216514119 U CN 216514119U CN 202122728092 U CN202122728092 U CN 202122728092U CN 216514119 U CN216514119 U CN 216514119U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a PECVD (plasma enhanced chemical vapor deposition) coating variable-pitch transfer mechanism which comprises an installation frame and a clamping mechanism, wherein the clamping mechanism is arranged on one side of the installation frame and comprises two clamping arms and a fixing mechanism, the fixing mechanism is arranged on the clamping arms and comprises a plurality of clamping blocks, the clamping blocks are fixedly arranged on the clamping arms at equal intervals, a clamping groove is formed between every two adjacent clamping blocks, a sensor is fixedly connected to one side of each clamping block, and a bidirectional cylinder is fixedly connected to one side of the installation frame. According to the silicon wafer clamping device, the silicon wafers are moved to the positions below the clamping arms, so that the clamping grooves between two adjacent clamping blocks correspond to the positions of the single silicon wafers, the two clamping arms are driven to move oppositely along the guide rail by the operation of the bidirectional air cylinder, the two sides of each silicon wafer are clamped and fixed, the silicon wafers are arranged at equal intervals, the clamping arms rotate, belt marks are avoided, the labor amount of workers is reduced, and the production efficiency is improved.
Description
Technical Field
The utility model relates to the field of PECVD (plasma enhanced chemical vapor deposition) coating, in particular to a variable pitch transfer mechanism for the PECVD coating.
Background
The photovoltaic solar cell is a device for directly converting light energy into electric energy through a photoelectric effect or a photochemical effect, and a thin film type solar cell working through the photoelectric effect is the mainstream.
The front and the back of a silicon wafer are subjected to film coating treatment through a PECVD (plasma enhanced chemical vapor deposition) process in the manufacturing process of the photovoltaic solar cell, the silicon wafer is mostly conveyed through a conveying belt during film coating, and after a back film process is completed, an operator has to manually move a flower basket filled with silicon wafer products from a back film automatic blanking track and then place the flower basket on a front film automatic feeding track, so that the labor force and the production cost are increased, and the silicon wafer is easy to generate belt prints in the transmission process and influences the quality of the products.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a PECVD coating variable pitch transfer mechanism to solve the problems in the background technology.
In order to achieve the purpose, the utility model provides the following technical scheme: a PECVD coating variable-pitch transfer mechanism comprises a mounting frame and a clamping mechanism, wherein the clamping mechanism is arranged on one side of the mounting frame;
the clamping mechanism comprises two clamping arms and a fixing mechanism, the two clamping arms are arranged on one side of the mounting frame in a car-to-car mode, and the fixing mechanism is arranged on the clamping arms;
the fixing mechanism comprises a plurality of clamping blocks, the clamping blocks are fixedly mounted on the clamping arms at equal intervals, the clamping blocks are adjacent to each other, a clamping groove is formed between the clamping blocks, a sensor is fixedly connected to one side of each clamping block, and a bidirectional cylinder is fixedly connected to one side of each mounting frame.
Preferably, one side fixedly connected with guide rail one of mounting bracket, guide rail one and the one end of centre gripping arm slide and alternate and be connected, the output of two-way cylinder and the one end fixed connection of centre gripping arm.
Preferably, a fixing frame is arranged on the other side of the mounting frame, a one-way cylinder is fixedly mounted on one side of the fixing frame, and a second guide rail is fixedly connected to one side of the fixing frame.
Preferably, the opposite side of mounting bracket is provided with removes the frame, the one end and the two sliding interlude of guide rail of removing the frame are connected, the one end of removing the frame and the output fixed connection of one-way cylinder.
Preferably, the bottom of one side of the moving frame is fixedly connected with a placing frame, and the placing frame is arranged below the clamping arm.
The utility model has the technical effects and advantages that:
(1) according to the silicon wafer clamping device, the clamping grooves between two adjacent clamping blocks correspond to the positions of single silicon wafers by moving the silicon wafers to the positions below the clamping arms in a mode that the clamping arms, the clamping blocks and the bidirectional cylinder are matched, the two clamping arms are driven to move oppositely along the guide rail by the operation of the bidirectional cylinder to clamp and fix two surfaces of the silicon wafers, so that the silicon wafers are fixed between the two clamping blocks, the silicon wafers are arranged at equal intervals, the silicon wafers rotate through the clamping arms, belt stripes are avoided, the labor amount of workers is reduced, and the production efficiency is improved;
(2) according to the utility model, the one-way cylinder, the moving frame and the placing frame are matched, and the moving frame fixedly connected with the one-way cylinder is driven to horizontally move on the second guide rail through the operation of the one-way cylinder, so that the placing frame is driven to move below the clamping arm, the placing frame drives the processed silicon wafer to move, the silicon wafer is conveniently conveyed, and the production cost is reduced.
Drawings
Fig. 1 is a schematic top view of the mounting bracket of the present invention.
FIG. 2 is a schematic side view of the clamp arm according to the present invention.
Fig. 3 is a schematic view of the back structure of the mounting rack of the present invention.
In the figure: 1. a mounting frame; 2. a clamping mechanism; 21. a clamp arm; 22. a fixing mechanism; 221. a clamping block; 222. a card slot; 223. a sensor; 224. a bidirectional cylinder; 3. a first guide rail; 4. a fixed mount; 5. a one-way cylinder; 6. a second guide rail; 7. a movable frame; 8. and (5) placing the shelf.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a PECVD (plasma enhanced chemical vapor deposition) coating variable-pitch transfer mechanism as shown in figures 1-3, which comprises an installation frame 1 and a clamping mechanism 2, wherein the installation frame 1 is used for installing the clamping mechanism 2 and a fixed frame 4, the clamping mechanism 2 is arranged at one side of the installation frame 1, and the clamping mechanism 2 is used for clamping and fixing a silicon wafer placed between clamping arms 21, so that the silicon wafer is convenient to transfer;
the clamping mechanism 2 comprises two clamping arms 21 and a fixing mechanism 22, the two clamping arms 21 are arranged on one side of the mounting frame 1 in a car-to-car mode, the distance between the two clamping arms 21 is adjusted through the opposite movement of the two clamping arms 21, a silicon wafer is clamped, the fixing mechanism 22 is arranged on the clamping arms 21, and the fixing mechanism 22 is used for placing and clamping the fixed silicon wafer;
the fixing mechanism 22 comprises a plurality of clamping blocks 221, the clamping blocks 221 are fixedly mounted on the clamping arms 21 at equal intervals, the clamping blocks 221 are fixedly mounted on one sides of two clamping arms 21 opposite to each other through bolts, the clamping blocks 221 are arranged in two rows, a clamping groove 222 is arranged between every two adjacent clamping blocks 221, a gap between every two adjacent clamping blocks 221 is the clamping groove 222, two side sides of a silicon wafer are respectively arranged in the clamping groove 222 between every two adjacent clamping blocks 221, so that the silicon wafers are uniformly arranged between the two clamping arms 21, a sensor 223 is fixedly connected to one side of each clamping block 221, the sensor 223 is arranged in an inner cavity of the corresponding clamping groove 222, the silicon wafer clamped in the clamping groove 222 is detected through the sensor 223, a bidirectional cylinder 224 is fixedly connected to one side of the mounting frame 1, the bidirectional cylinder 224 is electrically connected with an external power supply through an external first switch, two output shafts of the bidirectional cylinder 224 are respectively fixedly mounted with the two clamping arms 21, the operation of the bidirectional cylinder 224 drives the two clamping arms 21 to move horizontally in opposite directions, and a plurality of silicon wafers arranged between the two clamping arms are clamped and fixed;
one side of the mounting frame 1 is fixedly connected with a first guide rail 3, the first guide rail 3 is used for mounting the clamping arm 21, so that the clamping arm 21 horizontally moves along the first guide rail 3, the first guide rail 3 is slidably and alternately connected with one end of the clamping arm 21, the output end of the bidirectional air cylinder 224 is fixedly connected with one end of the clamping arm 21, and the output end of the bidirectional air cylinder 224 is fixedly connected with one end of the clamping arm 21 through a piston rod to drive the clamping arm 21 to move;
the other side of the mounting rack 1 is provided with a fixing frame 4, the fixing frame 4 is used for mounting a one-way cylinder 5, one side of the fixing frame 4 is fixedly provided with the one-way cylinder 5, the one-way cylinder 5 is electrically connected with an external power supply through an external second switch, one side of the fixing frame 4 is fixedly connected with a second guide rail 6, and the second guide rail 6 is fixedly mounted on one side of the fixing frame 4 and used for mounting a movable rack 7;
the opposite side of mounting bracket 1 is provided with removes frame 7, the one end and the two 6 sliding interlude of guide rail of removing frame 7 are connected, remove one side sliding connection that frame 7 passes through two 6 guide rails and mount 4, be used for installing rack 8, it removes to drive rack 8, the one end of removing frame 7 and the output fixed connection of one-way cylinder 5, the piston rod that the output of one-way cylinder 5 is connected through the transmission and the 7 fixed connection that remove frame, through the operation of one-way cylinder 5, it carries out horizontal migration along two 6 guide rails to drive to remove frame 7, the bottom fixedly connected with rack 8 of removing frame 7 one side, rack 8 sets up in the below of centre gripping arm 21, rack 8 is used for placing the work piece, rack 8 removes along with removing frame 7, it removes to drive the work piece and removes the below of centre gripping arm 21.
The working principle of the utility model is as follows: through the below position that removes centre gripping arm 21 with the silicon chip, make draw-in groove 222 between two adjacent clamp splice 221 corresponding with the position of solitary silicon chip, utilize the operation of two-way cylinder 224, drive two centre gripping arms 21 along 3 moves in opposite directions of guide rail, press from both sides the clamp fixation to the both sides of silicon chip, make the silicon chip fix between two clamp splice 221, guarantee that a plurality of silicon chips equidistance arranges the setting, simultaneously through the operation of one-way cylinder 5, drive rather than fixed connection's removal frame 7 horizontal migration on two 6 of guide rail, and then drive rack 8 and remove in the below of centre gripping arm 21, make rack 8 drive the silicon chip of processing remove.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.
Claims (5)
1. A PECVD coating variable-pitch transfer mechanism comprises an installation frame (1) and a clamping mechanism (2), and is characterized in that the clamping mechanism (2) is arranged on one side of the installation frame (1);
the clamping mechanism (2) comprises two clamping arms (21) and a fixing mechanism (22), the two clamping arms (21) are arranged on one side of the mounting frame (1) in a car-to-car mode, and the fixing mechanism (22) is arranged on the clamping arms (21);
fixed establishment (22) include a plurality of clamp splice (221), and is a plurality of clamp splice (221) equidistance fixed mounting is on centre gripping arm (21), adjacent two be provided with draw-in groove (222) between clamp splice (221), one side fixedly connected with sensor (223) of clamp splice (221), one side fixedly connected with two-way cylinder (224) of mounting bracket (1).
2. The PECVD coating variable-pitch transfer mechanism of claim 1, wherein one side of the mounting frame (1) is fixedly connected with a first guide rail (3), the first guide rail (3) is slidably and alternately connected with one end of a clamping arm (21), and the output end of the bidirectional cylinder (224) is fixedly connected with one end of the clamping arm (21).
3. The PECVD coating variable-pitch transfer mechanism according to claim 1, wherein a fixing frame (4) is arranged on the other side of the mounting frame (1), a one-way cylinder (5) is fixedly mounted on one side of the fixing frame (4), and a second guide rail (6) is fixedly connected to one side of the fixing frame (4).
4. The PECVD coating variable-pitch transfer mechanism according to claim 3, wherein a moving frame (7) is arranged on the other side of the mounting frame (1), one end of the moving frame (7) is slidably and alternately connected with the second guide rail (6), and one end of the moving frame (7) is fixedly connected with the output end of the one-way cylinder (5).
5. A PECVD coating variable pitch transfer mechanism as in claim 4 wherein the bottom of one side of the movable frame (7) is fixedly connected with a placing frame (8), the placing frame (8) is arranged below the clamping arm (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122728092.3U CN216514119U (en) | 2021-11-09 | 2021-11-09 | PECVD coating variable pitch transfer mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122728092.3U CN216514119U (en) | 2021-11-09 | 2021-11-09 | PECVD coating variable pitch transfer mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216514119U true CN216514119U (en) | 2022-05-13 |
Family
ID=81529998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122728092.3U Active CN216514119U (en) | 2021-11-09 | 2021-11-09 | PECVD coating variable pitch transfer mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216514119U (en) |
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2021
- 2021-11-09 CN CN202122728092.3U patent/CN216514119U/en active Active
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