CN216491234U

CN216491234U - PCB with local heat dissipation function

Info

Publication number: CN216491234U
Application number: CN202123017994.2U
Authority: CN
Inventors: 张宗超; 冼康生
Original assignee: Shenzhen Chaofeng Keyu Technology Co ltd
Current assignee: Shenzhen Chaofeng Keyu Technology Co ltd
Priority date: 2021-12-03
Filing date: 2021-12-03
Publication date: 2022-05-10
Anticipated expiration: 2031-12-03

Abstract

The utility model discloses a local radiating PCB board, including the PCB board, two fixing bases of symmetry around being are all installed to the left end and the right-hand member of PCB board, four the mounting hole has all been seted up to the upper end of fixing base, the upper end middle part of PCB board is provided with the electronic component pad that two bilateral symmetry distribute, the upper end right side front portion and the upper end right rear portion of PCB board all are provided with high heating element pad, the radiating part is all installed to the front end right part and the rear end right part of PCB board. A local radiating PCB board, can improve the local radiating effect of PCB board through setting up the radiating part, guaranteed the life of the component on the heating element pad, can prevent PCB board surface oxidation through setting up the passivation rete to improved the anticorrosion effect from this, make dust and PCB board surface area of contact reduce 90% through setting up nanometer automatically cleaning coating, avoid the dust to arouse the component short circuit on the PCB board, improved the life of PCB board.

Description

PCB with local heat dissipation function

Technical Field

The utility model relates to a PCB board technical field, in particular to local radiating PCB board.

Background

The PCB board is printed circuit board, short for printed circuit board, is one of the important parts in electronic industry, almost every kind of electronic equipment, as small as electronic watch, calculator, as large as computer, communication electronic equipment and military weapon system, as long as there are electronic components such as integrated circuit, etc., in order to make the electric interconnection between each component, the printed circuit board is used, the printed circuit board is composed of insulating base plate, connecting wire and welding pad for assembling and welding electronic component, it has double function of conducting wire and insulating base plate, it can replace complicated wiring, implement the electric connection between each component in the circuit.

The existing PCB has the following disadvantages: 1. most of the existing PCB is provided with a high-heating element arranged at the edge of the PCB, heat is taken away by air flow, the area of the edge of the PCB is limited, and if the heat is not radiated, a device can be out of service due to overheating, so that the service life of the device is influenced; 2. after the existing PCB is used for a long time, external oxygen can oxidize the surface of the PCB to cause the surface aging of the PCB, and dust can be adsorbed on the surface of the PCB, so that hardware short circuit is easily caused, and the service life of the PCB is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a local radiating PCB board, can effectively solve the problem in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a PCB board of local heat dissipation, includes the PCB board, two fixing bases that are symmetry around all are installed to the left end and the right-hand member of PCB board, four the mounting hole has all been seted up to the upper end of fixing base, the upper end middle part of PCB board is provided with two bilateral symmetry's electronic component pads, the upper end right front portion and the upper end right rear portion of PCB board all are provided with high heating element pad, radiating part is all installed to the front end right part and the rear end right part of PCB board, the upper end of PCB board is provided with the anti-oxidation coating, the upper end of anti-oxidation coating is provided with the ash blanket.

Preferably, the radiating part is including the hollow block of heat dissipation, the hollow block of heat dissipation sets up the front end right part at the PCB board, the inner wall of the hollow block of heat dissipation is provided with a plurality of heat dissipation post, the dust screen is all installed to the left inner wall and the right inner wall of the hollow block of heat dissipation.

Preferably, the oxidation prevention layer comprises a passivation film layer, the passivation film layer is arranged at the upper end of the PCB, and an adhesion layer is arranged at the upper end of the passivation film layer.

Preferably, the dust-proof layer comprises an insulating layer, and the upper end of the insulating layer is provided with a nano self-cleaning coating.

Preferably, the insulating layer is disposed at an upper end of the adhesion layer.

Preferably, the two heat dissipation members are respectively located on the front side and the rear side of the two high heat generating element pads.

Compared with the prior art, the utility model discloses following beneficial effect has:

1. the utility model relates to a PCB board of local heat dissipation can improve the local radiating effect of PCB board through setting up the radiating part, the life of the component on the heating element pad has been guaranteed, during the use, the device of installing on high heating element pad transmits the heat to the PCB board, then the PCB board transmits part heat to the heat dissipation hollow block, and distribute away the heat, the air also can get into the temperature of taking away the heat dissipation post surface from the heat dissipation hollow block inside, the heat radiating area has been increased, the setting of dust screen has avoided the dust to enter into the heat dissipation hollow block inside, influence the radiating effect, the local temperature of PCB board has been reduced;

2. the utility model relates to a local radiating PCB board can prevent PCB board surface oxidation through setting up the passivation rete to having improved the anticorrosion effect from this, the rethread sets up nanometer automatically cleaning coating and makes dust and PCB board surface area of contact reduce 90%, and nanometer automatically cleaning coating has powerful hydrophobic, anti greasy dirt ability, has the automatic cleaning characteristic that does not have than superior, avoids the dust to arouse the component short circuit on the PCB board, has improved the life of PCB board.

Drawings

Fig. 1 is a schematic view of an overall structure of a PCB of the present invention with local heat dissipation;

fig. 2 is a schematic view of an overall structure of a heat dissipation component of a PCB of the present invention for dissipating heat locally;

fig. 3 is a schematic view of an overall structure of an anti-oxidation layer of a PCB board with local heat dissipation according to the present invention;

fig. 4 is a schematic view of the overall structure of the anti-dust layer of the PCB of the present invention with local heat dissipation.

In the figure: 1. a PCB board; 2. a fixed seat; 3. mounting holes; 4. an oxidation-resistant layer; 5. an anti-dust layer; 6. a heat dissipating member; 7. a high heat generating element pad; 8. an electronic component pad; 61. a heat dissipation hollow block; 62. a heat-dissipating column; 63. a dust screen; 41. an adhesion layer; 42. passivating the film layer; 51. a nano self-cleaning coating; 52. an insulating layer.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-4, a PCB board with local heat dissipation function, including PCB board 1, two fixing bases 2 that are symmetrical from beginning to end are all installed to the left end and the right end of PCB board 1, mounting hole 3 has all been seted up to the upper end of four fixing bases 2, the upper end middle part of PCB board 1 is provided with two bilateral symmetry's electronic component pad 8 that distribute, the upper end right front portion and the upper end right rear portion of PCB board 1 all are provided with high heating element pad 7, radiating part 6 is all installed to the front end right part and the rear end right part of PCB board 1, the upper end of PCB board 1 is provided with anti oxidation coating 4, the upper end of anti oxidation coating 4 is provided with anti-dust layer 5.

Radiating part 6 is including the hollow block 61 of heat dissipation, the hollow block 61 of heat dissipation sets up the front end right part at PCB board 1, the inner wall of the hollow block 61 of heat dissipation is provided with a plurality of heat dissipation post 62, the dust screen 63 is all installed to the left inner wall and the right inner wall of the hollow block 61 of heat dissipation, radiating part 6 is used for improving the local radiating effect of PCB board, the life of the component on heating element pad 7 has been guaranteed, the dust screen 63 is used for having avoided the dust to enter into the hollow block 61 of heat dissipation inside, influence the radiating effect, hollow block 61 of heat dissipation and heat dissipation post 62 are the copper product constitution.

Anti oxidation coating 4 includes passivation film layer 42, passivation film layer 42 sets up the upper end at PCB board 1, passivation film layer 42's upper end is provided with adhesion layer 41, dustproof layer 5 includes insulating layer 52, insulating layer 52's upper end is provided with nanometer self-cleaning coating 51, insulating layer 52 sets up the upper end at adhesion layer 41, two heat dissipation parts 6 are located the front side and the rear side of two high heating element pad 7 respectively, passivation film layer 42 is used for preventing PCB board 1 surface oxidation, nanometer self-cleaning coating 51 is used for making dust and PCB board 1 surface area of contact reduce 90%.

It should be noted that, the utility model relates to a PCB board with local heat dissipation, when in use, the screw can be passed through the mounting hole 3 to fix the PCB board 1, the device installed on the high heating element pad 7 transmits the heat to the PCB board 1, then the PCB board 1 transmits part of the heat to the heat dissipation hollow block 61 and distributes the heat, the air can enter from the inside of the heat dissipation hollow block 61 to take away the temperature of the surface of the heat dissipation column 62, the heat dissipation area is increased, the dust screen 63 is arranged to prevent the dust from entering the inside of the heat dissipation hollow block 61, the surface oxidation of the PCB board 1 can be prevented by arranging the passivation film layer 42, and the anti-corrosion effect is improved, the contact area between the dust and the surface of the PCB board 1 is reduced by 90% by arranging the nano self-cleaning coating 51, the nano self-cleaning coating 51 utilizes the bionic principle, and utilizes the lotus leaf double-thinning mechanism of binary synergy of nano materials, has low surface tension and high adhesion.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a PCB board of local heat dissipation, includes PCB board (1), its characterized in that: two fixing bases (2) that are symmetry around all installing at the left end and the right-hand member of PCB board (1), four mounting hole (3) have all been seted up to the upper end of fixing base (2), the upper end middle part of PCB board (1) is provided with electronic component pad (8) of two bilateral symmetry distributions, the upper end right side front portion and the upper end right rear portion of PCB board (1) all are provided with high heating element pad (7), radiating part (6) are all installed to the front end right part and the rear end right part of PCB board (1), the upper end of PCB board (1) is provided with anti-oxidation coating (4), the upper end of anti-oxidation coating (4) is provided with anti-ash layer (5).

2. The PCB board for local heat dissipation according to claim 1, wherein: the heat dissipation part (6) is including the hollow block (61) of heat dissipation, the hollow block (61) of heat dissipation sets up the front end right part at PCB board (1), the inner wall of the hollow block (61) of heat dissipation is provided with a plurality of heat dissipation post (62), dust screen (63) are all installed to the left inner wall and the right inner wall of the hollow block (61) of heat dissipation.

3. The PCB board for local heat dissipation according to claim 2, wherein: the anti-oxidation layer (4) comprises a passivation film layer (42), the passivation film layer (42) is arranged at the upper end of the PCB (1), and an adhesion layer (41) is arranged at the upper end of the passivation film layer (42).

4. The PCB board for local heat dissipation according to claim 3, wherein: the anti-dust layer (5) comprises an insulating layer (52), and a nano self-cleaning coating (51) is arranged at the upper end of the insulating layer (52).

5. The PCB board for local heat dissipation according to claim 4, wherein: the insulating layer (52) is disposed at an upper end of the adhesion layer (41).

6. The PCB board for local heat dissipation according to claim 5, wherein: the two heat dissipation parts (6) are respectively positioned at the front side and the rear side of the two high-heat-generating element pads (7).