CN216487246U - Chip on film and display device - Google Patents
Chip on film and display device Download PDFInfo
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- CN216487246U CN216487246U CN202122795410.8U CN202122795410U CN216487246U CN 216487246 U CN216487246 U CN 216487246U CN 202122795410 U CN202122795410 U CN 202122795410U CN 216487246 U CN216487246 U CN 216487246U
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- 239000000463 material Substances 0.000 claims abstract description 133
- 238000004146 energy storage Methods 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 229910052737 gold Inorganic materials 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 17
- 230000017525 heat dissipation Effects 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 6
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000005265 energy consumption Methods 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013310 covalent-organic framework Substances 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- OCGWQDWYSQAFTO-UHFFFAOYSA-N tellanylidenelead Chemical compound [Pb]=[Te] OCGWQDWYSQAFTO-UHFFFAOYSA-N 0.000 description 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The application belongs to the technical field of display devices and provides a chip on film and a display device, wherein the chip on film comprises a flexible circuit board, a driving chip and a first thermoelectric material layer, the driving chip is packaged on the flexible circuit board, and the first thermoelectric material layer is arranged on the driving chip; the display device comprises a display panel, a circuit board and a chip on film, wherein two ends of the chip on film are respectively bonded with the display panel and the circuit board. The application provides a chip on film adopts and sets up first thermoelectric material layer on driving chip, turns into the electric energy through the heat energy that first thermoelectric material layer produced driving chip to the heat energy that produces driving chip consumes, realizes the heat dissipation, and the display device of having solved jumbo size, high refresh rate in driving chip calorific capacity big, the slow technical problem of heat dissipation has promoted chip on film's radiating effect effectively, is favorable to prolonging driving chip's life.
Description
Technical Field
The application belongs to the technical field of display devices, and particularly relates to a chip on film and a display device.
Background
Cof (chip On film), commonly called chip On film, is a chip On film (cof) packaging technique for fixing an Integrated Circuit (IC) On a flexible circuit board. In the field of display device technology, COFs are generally used to connect a driving circuit board and a display panel, so as to drive the display panel to display a picture.
Because the large-size and high-refresh-rate display device can bring stronger visual impact and smoother operation experience to users, the market demand for the large-size and high-refresh-rate display device is increasing; however, the large size and high refresh rate mean that the display panel needs to include more pixel units and needs a Driver IC (Driver IC) with higher power, and the increase of the power of the Driver IC will result in a significant increase of the heat generation, the dissipation of the heat will mean the waste of energy, and the long-term high temperature will also shorten the service life of the Driver IC.
SUMMERY OF THE UTILITY MODEL
The present disclosure is directed to a chip on film and a display device, including but not limited to solving the technical problems of large heat generation and slow heat dissipation of a driving chip in a large-size and high-refresh-rate display device.
In order to achieve the above object, the present application provides a chip on film, including a flexible circuit board and a driving chip, wherein the driving chip is packaged on the flexible circuit board, and the chip on film further includes:
the first thermoelectric material layer is arranged on the driving chip.
In one embodiment, the first thermoelectric material layer covers the surface of the driving chip far away from the flexible circuit board; and/or the first thermoelectric material layer is arranged on the surface of the flexible circuit board and wraps the driving chip.
In one embodiment, the first thermoelectric material layer includes a thermoelectric material and an electrode provided on a surface of the thermoelectric material.
In one embodiment, the chip on film further comprises:
and the second thermoelectric material layer is arranged on the surface of the flexible circuit board and is adjacent to or spaced from the driving chip.
In one embodiment, a plurality of second thermoelectric material layers are arranged on the surface of the flexible circuit board on the same side as the driving chip; and/or a plurality of second thermoelectric material layers are arranged on the surface of the flexible circuit board far away from the driving chip.
In one embodiment, the first thermoelectric material layer and the second thermoelectric material layer include a thermoelectric material and an electrode, respectively, the electrode being provided on a surface of the thermoelectric material.
In one embodiment, a gold finger is arranged on the flexible circuit board, and the electrode is connected with the gold finger.
The application also provides a display device, which comprises a display panel, a circuit board and the chip on film, wherein the two ends of the chip on film are bonded with the display panel and the circuit board respectively.
In one embodiment, the first thermoelectric material layer is connected to a ground line of the circuit board.
In one embodiment, an energy storage element is arranged on the circuit board, and the first thermoelectric material layer is connected with the energy storage element.
The chip on film and the display device provided by the application have the beneficial effects that: the first thermoelectric material layer is arranged on the driving chip, and heat energy generated by the driving chip is converted into electric energy through the first thermoelectric material layer, so that the heat energy generated by the driving chip is consumed, heat dissipation is realized, the technical problems of large heat productivity and slow heat dissipation of the driving chip in a large-size and high-refresh-rate display device are solved, the heat dissipation effect of the chip-on-film is effectively improved, and the service life of the driving chip is prolonged. And if the electric energy obtained by converting the first thermoelectric material layer is stored, the electric energy can also be used for supplying power to low-energy-consumption electronic elements in the display device, so that the energy consumption of the display device can be reduced, and the utilization rate of energy sources is favorably improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic front view of a chip on film provided in the first and second embodiments of the present application;
fig. 2 is a schematic cross-sectional view of a flip-chip film in the direction a-a according to a first embodiment of the present application;
fig. 3 is a schematic cross-sectional view of a flip-chip film in the direction a-a according to a second embodiment of the present application;
fig. 4 is a schematic front view of a chip on film provided in the third and fourth embodiments of the present application;
fig. 5 is a schematic cross-sectional view of a flip-chip on film in the direction B-B according to a third embodiment of the present application;
fig. 6 is a schematic cross-sectional view of a flip-chip on film in the B-B direction according to a fourth embodiment of the present application;
fig. 7 is a schematic front view of a chip on film provided in the fifth and sixth embodiments of the present application;
fig. 8 is a schematic cross-sectional view of a chip on film in the C-C direction according to a fifth embodiment of the present application;
fig. 9 is a schematic cross-sectional view of a chip on film in the C-C direction according to a sixth embodiment of the present application;
fig. 10 is a schematic front view of a chip on film provided in the seventh embodiment and the eighth embodiment of the present application;
fig. 11 is a schematic cross-sectional view of a flip-chip on film in a direction D-D according to a seventh embodiment of the present application;
fig. 12 is a schematic cross-sectional view of a flip-chip on film in a direction D-D according to an eighth embodiment of the present application;
fig. 13 is a schematic diagram of an internal structure of a display device according to a ninth embodiment and a tenth embodiment of the present application.
Wherein, in the figures, the respective reference numerals:
1-display device, 10-flip chip, 20-display panel, 30-circuit board, 40-energy storage element, 11-flexible circuit board, 12-driving chip, 13-first thermoelectric material layer, 14-second thermoelectric material layer, 15-wire, 110-golden finger, 131-thermoelectric material, 132-electrode, X-flexible circuit board length direction.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that: when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. When a component is referred to as being "electrically connected" to another component, it can be electrically connected by conductors, or can be electrically connected by radios, or can be connected by various other means capable of carrying electrical signals.
The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the patent, and the specific meanings of the above terms will be understood by those skilled in the art according to specific situations.
The term "plurality" means two or more unless specifically limited otherwise.
The first embodiment:
referring to fig. 1 and fig. 2, the present embodiment provides a chip on film 10, the chip on film 10 includes a flexible circuit board 11, a driving chip 12 and a first thermoelectric material layer 13, wherein the driving chip 12 is packaged on the flexible circuit board 11, and the first thermoelectric material layer 13 is disposed on the driving chip 12.
Specifically, the surface of the driving chip 12 away from the flexible wiring board 11 is the main heating surface of the driving chip 12, and the first thermoelectric material layer 13 covers the surface of the driving chip 12 away from the flexible wiring board 11; the first thermoelectric material layer 13 is made of functional materials (such as bismuth telluride and alloys thereof, lead telluride and alloys thereof, or silicon-germanium alloys) capable of converting heat energy into electric energy; when the driving chip 12 generates heat energy during operation, the heat energy is directly conducted to the first thermoelectric material layer 13, and the thermoelectric material in the first thermoelectric material layer 13 consumes the heat energy by converting the heat energy into electric energy, so as to realize rapid heat dissipation of the driving chip 12.
In the chip on film 10 provided in this embodiment, the first thermoelectric material layer 13 is disposed on the driving chip 12, and the heat energy generated by the driving chip 12 is converted into electric energy through the first thermoelectric material layer 13, so that the heat energy generated by the driving chip 12 is consumed, heat dissipation is realized, the technical problems of large heat generation amount and slow heat dissipation of the driving chip in a large-size and high-refresh-rate display device are solved, the heat dissipation effect of the chip on film 10 is effectively improved, and the service life of the driving chip 12 is prolonged. And if the electric energy converted by the first thermoelectric material layer 13 is stored, the electric energy can also supply power to low-energy-consumption electronic elements in the display device, so that the energy consumption of the display device can be reduced, and the utilization rate of energy sources is favorably improved.
Further, in the present embodiment, the first thermoelectric material layer 13 includes the thermoelectric material 131 and the electrode 132, wherein the electrode 132 is disposed on the surface of the thermoelectric material 131. Specifically, the electrode 132 may be silver-nickel alloy, nickel-aluminum alloy, molybdenum, copper, or the like, and the electrode 132 is sintered on the surface of the thermoelectric material 131 to conduct away the charges accumulated on the surface of the thermoelectric material 131. It is understood that the number of electrodes 132 may be one or two; when the number of the electrodes 132 is one, charges inside the thermoelectric material 131 migrate to the surface of the thermoelectric material 131 due to a change in temperature, so that a voltage difference exists between the surface of the thermoelectric material 131 and the ground or the energy storage element, and the charges can be transferred from the side with higher voltage (the surface of the thermoelectric material 131) to the side with lower voltage (the ground or the energy storage element) by connecting the electrodes 132 to the ground or the energy storage element, so that the charges accumulated on the surface of the thermoelectric material 131 are conducted away; when the number of the electrodes 132 is two, the two electrodes 132 are respectively disposed on two surfaces (top and bottom surfaces) of the thermoelectric material 131, and a circuit can be formed by connecting the two electrodes 132 to the ground or the energy storage element, so that charges accumulated on the surface of the thermoelectric material 131 can be conducted away.
Further, in the present embodiment, the gold finger 110 is provided on the flexible wiring board 11, and the electrode 132 of the first thermoelectric material layer 13 is connected to the gold finger 110, so that the electric charges accumulated on the surface of the thermoelectric material 131 can be introduced into the ground or the energy storage element through the gold finger 110. Specifically, the gold finger 110 is a golden conductive contact formed on the surface of the flexible circuit board 11, and the electrode 132 is connected with the gold finger 110 directly or through a lead 15; when the chip on film 10 is bonded to the circuit board 30 (as shown in fig. 13), the gold finger 110 is connected to the ground or the energy storage element 40 on the circuit board 30. It is understood that the number of gold fingers 110 corresponds to the number of electrodes 132, i.e. the gold fingers 110 are arranged one-to-one with the electrodes 132.
Second embodiment:
referring to fig. 1 and fig. 3, the difference between the flip chip package provided in the present embodiment and the first embodiment is: the first thermoelectric material layer 13 is disposed on the surface of the flexible wiring board 11, and wraps the driving chip 12. That is, the first thermoelectric material layer 13 covers all surfaces of the driver chip 12 exposed on the flexible wiring board 11, and a portion of the surface of the flexible wiring board 11 near the driver chip 12. Thereby increasing the contact area between the first thermoelectric material layer 13 and the driving chip 12, and facilitating further improvement of the heat dissipation efficiency of the chip on film 10.
The third embodiment:
referring to fig. 4 and 5, the difference between the flip chip on film provided in the present embodiment and the flip chip on film provided in the first embodiment is: the flip chip film 10 further includes a second thermoelectric material layer 14, and the second thermoelectric material layer 14 is disposed on the surface of the flexible wiring board 11 and disposed adjacent to or spaced apart from the driving chip 12. Therefore, the second thermoelectric material layer 14 is additionally arranged on the surface of the flexible circuit board 11, so that the heat dissipation speed of the flexible circuit board 11 can be improved, and the heat dissipation efficiency of the chip on film 10 can be improved.
Specifically, the chip on film 10 further includes a plurality of second thermoelectric material layers 14, the plurality of second thermoelectric material layers 14 are disposed on the surface of the flexible circuit board 11 on the same side as the driving chip 12, that is, the plurality of second thermoelectric material layers 14 are disposed on the surface of the flexible circuit board 11 and located on the same surface as the driving chip 12, the second thermoelectric material layers 14 may extend onto the driving chip 12 and contact the driving chip 12, or have a gap with the driving chip 12, and the length direction of the second thermoelectric material layers 14 may be perpendicular to, or parallel to, or intersecting the length direction X of the flexible circuit board 11. When the flexible wiring board 11 generates heat energy during operation, the heat energy is directly conducted to the second thermoelectric material layer 14, and the thermoelectric material in the second thermoelectric material layer 14 consumes the heat energy by converting the heat energy into electric energy.
Further, in the present embodiment, the structure of the second thermoelectric material layer 14 is identical to that of the first thermoelectric material layer 13, that is, the second thermoelectric material layer 14 includes the thermoelectric material 131 and the electrode 132, wherein the electrode 132 is disposed on the surface of the thermoelectric material 131.
Further, in the present embodiment, the electrode 132 of the second thermoelectric material layer 14 is also connected to the gold finger 110 through the wire 15, so that the charges accumulated in the first thermoelectric material layer 13 and the second thermoelectric material layer 14 can be conducted to the ground or the energy storage element through the gold finger 110. It is understood that the electrodes 132 of the same polarity may be connected to the same gold finger 110, i.e., whether the electrodes 132 on the top surface of the first thermoelectric material layer 13 or the electrodes 132 on the top surface of the second thermoelectric material layer 14 are connected to the same gold finger 110 through the same wire 15, and the electrodes 132 on the bottom surface of the first thermoelectric material layer 13 and the electrodes 132 on the bottom surface of the second thermoelectric material layer 14 may be connected to another gold finger 110 through another wire 15.
The fourth embodiment:
referring to fig. 4 and fig. 6, the difference between the flip chip on film provided in the present embodiment and the second embodiment is: the flip chip film 10 further includes a second thermoelectric material layer 14, and the second thermoelectric material layer 14 is disposed on the surface of the flexible wiring board 11 and disposed adjacent to or spaced apart from the driving chip 12. Therefore, the second thermoelectric material layer 14 is additionally arranged on the surface of the flexible circuit board 11, so that the heat dissipation speed of the flexible circuit board 11 can be improved, and the heat dissipation efficiency of the chip on film 10 can be improved.
Specifically, the chip on film 10 further includes a plurality of second thermoelectric material layers 14, the plurality of second thermoelectric material layers 14 are disposed on the surface of the flexible printed circuit 11 on the same side as the driver chip 12, that is, the plurality of second thermoelectric material layers 14 are disposed on the surface of the flexible printed circuit 11 and located on the same surface as the driver chip 12, the second thermoelectric material layers 14 may extend onto the driver chip 12 and be connected to the first thermoelectric material layers 13, or have a gap with the first thermoelectric material layers 13, and the length direction of the second thermoelectric material layers 14 may be perpendicular to, or parallel to, or intersecting the length direction X of the flexible printed circuit 11. In this embodiment, since the operation principle of the second thermoelectric material layer 14 is the same as that of the second thermoelectric material layer 14 provided in the third embodiment, the description thereof is omitted.
Fifth embodiment:
referring to fig. 7 and 8, the difference between the flip chip on film provided in the present embodiment and the third embodiment is: several second thermoelectric material layers 14 are disposed on the surface of the flexible wiring board 11 away from the driving chip 12. Because the driving chip 12 is not obstructed, the second thermoelectric material layer 14 can be easily laid on the surface of the flexible circuit board 11, thereby being beneficial to reducing the processing difficulty of the chip on film 10 and being beneficial to increasing the coverage area of the second thermoelectric material layer 14.
Sixth embodiment:
referring to fig. 7 and 9, the difference between the flip chip on film provided in the present embodiment and the flip chip on film provided in the fourth embodiment is: several second thermoelectric material layers 14 are disposed on the surface of the flexible wiring board 11 away from the driving chip 12. Because the driving chip 12 is not obstructed, the second thermoelectric material layer 14 can be easily laid on the surface of the flexible circuit board 11, thereby being beneficial to reducing the processing difficulty of the chip on film 10 and being beneficial to increasing the coverage area of the second thermoelectric material layer 14.
Seventh embodiment:
referring to fig. 10 and 11, the difference between the flip chip on film provided in the present embodiment and the third embodiment is: the number of the second thermoelectric material layers 14 is two or more, wherein a plurality of the second thermoelectric material layers 14 are disposed on the surface of the flexible circuit board 11 on the same side as the driving chip 12, and another plurality of the second thermoelectric material layers 14 are disposed on the surface of the flexible circuit board 11 away from the driving chip 12. Namely, the front and back surfaces of the flexible circuit board 11 are respectively provided with at least one second thermoelectric material layer 14, so that the coverage area of the second thermoelectric material layer 14 is increased, the heat dissipation speed of the flexible circuit board 11 is effectively improved, and the heat dissipation efficiency of the chip on film 10 can be further improved.
Eighth embodiment:
referring to fig. 10 and 12, the difference between the flip chip on film provided in the present embodiment and the fourth embodiment is: the number of the second thermoelectric material layers 14 is two or more, wherein a plurality of the second thermoelectric material layers 14 are disposed on the surface of the flexible printed circuit 11 on the same side as the driving chip 12, and another plurality of the second thermoelectric material layers 14 are disposed on the surface of the flexible printed circuit 11 away from the driving chip 12. Namely, the front and back surfaces of the flexible circuit board 11 are respectively provided with at least one second thermoelectric material layer 14, so that the coverage area of the second thermoelectric material layer 14 is increased, the heat dissipation speed of the flexible circuit board 11 is effectively improved, and the heat dissipation efficiency of the chip on film 10 can be further improved.
Ninth embodiment:
referring to fig. 13, the present embodiment provides a display device 1, the display device 1 includes a display panel 20, a circuit board 30 and the chip on film 10 provided in the above embodiments, wherein two ends of the chip on film 10 are respectively bonded (bonded) to the display panel 20 and the circuit board 30.
The display device 1 provided by the embodiment adopts the chip on film 10, and the first thermoelectric material layer 13 converts the heat energy generated by the driving chip 12 into the electric energy, so that the heat energy generated by the driving chip 12 is consumed, the heat dissipation is realized, the technical problems of large heat productivity and slow heat dissipation of the driving chip in the display device with large size and high refresh rate are solved, the heat dissipation effect of the display device 1 is effectively improved, and the service life of the driving chip 12 is prolonged.
Further, in the present embodiment, the first thermoelectric material layer 13 and the second thermoelectric material layer 14 are respectively connected to the ground of the circuit board 30. That is, the first thermoelectric material layer 13 and the second thermoelectric material layer 14 are grounded through the ground line of the circuit board 30, so that the electric energy converted by the first thermoelectric material layer 13 and the second thermoelectric material layer 14 is conducted to the ground through the ground line of the circuit board 30, and the first thermoelectric material layer 13 and the second thermoelectric material layer 14 can be prevented from generating charge accumulation to cause adverse effects on the flexible circuit board 11 and the driving chip 12.
Tenth embodiment:
referring to fig. 13, the difference between the flip chip package provided in the present embodiment and the flip chip package provided in the ninth embodiment is: an energy storage element 40 is arranged on the circuit board 30, and the first thermoelectric material layer 13 and the second thermoelectric material layer 14 are respectively connected to the energy storage element 40.
Specifically, the first thermoelectric material layer 13 and the second thermoelectric material layer 14 may be electrically connected to the energy storage element 40 on the circuit board 30 through wires or conductors, respectively. During the operation of the display device 1, the electric energy converted by the first thermoelectric material layer 13 and the second thermoelectric material layer 14 is conducted to the energy storage element 40 to be stored, and when the low energy consumption electronic element of the display device 1 needs to be powered, the energy storage element 40 delivers the electric energy to the low energy consumption electronic element to ensure the normal operation of the low energy consumption electronic element. Therefore, the low-energy consumption electronic components of the display device 1 do not need to consume the energy of an external power supply (such as commercial power), thereby being beneficial to reducing the energy consumption of the display device 1 and improving the utilization rate of energy.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The utility model provides a chip on film, includes flexible line way board and driver chip, driver chip encapsulates in on the flexible line way board, its characterized in that: the chip on film further comprises:
the first thermoelectric material layer is arranged on the driving chip.
2. The chip on film of claim 1, wherein the first thermoelectric material layer covers a surface of the driving chip away from the flexible circuit board; and/or the first thermoelectric material layer is arranged on the surface of the flexible circuit board and wraps the driving chip.
3. The chip on film of claim 1, wherein the first thermoelectric material layer comprises a thermoelectric material and an electrode, and the electrode is disposed on a surface of the thermoelectric material.
4. The chip on film of claim 1, further comprising:
and the second thermoelectric material layer is arranged on the surface of the flexible circuit board and is adjacent to or spaced from the driving chip.
5. The chip on film of claim 4, wherein a plurality of the second thermoelectric material layers are disposed on the surface of the flexible circuit board on the same side as the driving chip; and/or a plurality of second thermoelectric material layers are arranged on the surface of the flexible circuit board far away from the driving chip.
6. The chip on film of claim 4, wherein the first thermoelectric material layer and the second thermoelectric material layer comprise a thermoelectric material and an electrode, respectively, and the electrode is disposed on a surface of the thermoelectric material.
7. The chip on film of claim 3 or 6, wherein a gold finger is disposed on the flexible circuit board, and the electrode is connected to the gold finger.
8. A display device comprising a display panel, a circuit board and the chip on film according to any one of claims 1 to 7, wherein two ends of the chip on film are bonded to the display panel and the circuit board, respectively.
9. The display device of claim 8, wherein the first thermoelectric material layer is connected to a ground line of the circuit board.
10. The display device of claim 8, wherein an energy storage element is disposed on the circuit board, and the first thermoelectric material layer is connected to the energy storage element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122795410.8U CN216487246U (en) | 2021-11-15 | 2021-11-15 | Chip on film and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122795410.8U CN216487246U (en) | 2021-11-15 | 2021-11-15 | Chip on film and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216487246U true CN216487246U (en) | 2022-05-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122795410.8U Active CN216487246U (en) | 2021-11-15 | 2021-11-15 | Chip on film and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216487246U (en) |
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2021
- 2021-11-15 CN CN202122795410.8U patent/CN216487246U/en active Active
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