CN216462506U - Laser processing apparatus - Google Patents

Abstract

The application provides a laser processing apparatus, includes: the unwinding assembly is used for providing and conveying a base material; the cutting assembly is arranged on the moving path of the base material and is used for cutting a required workpiece on the base material; the cleaning assembly is used for cleaning a part to be cleaned of the workpiece; the conveying assembly comprises a supporting platform, a first conveying driving piece and a second conveying driving piece; the first transmission driving part is in driving connection with the supporting platform and at least used for driving the supporting platform to move back and forth between the cutting assembly and the cleaning assembly; the second transmission driving part is in driving connection with the supporting platform and is used for driving the supporting platform to move towards the direction close to or far away from the base material. It can be seen that the laser processing equipment of this application can realize cutting out the work piece from the substrate to and can wash the position of treating on the work piece, degree of automation and the efficient of processing.

Description

Laser processing apparatus

Technical Field

The application belongs to the technical field of lithium battery processing, and particularly relates to laser processing equipment.

Background

With the rapid development of the lithium battery industry, the requirement on the processing efficiency of the lithium battery is higher and higher. Referring to fig. 1, for example, in the process of manufacturing a tab provided in a lithium battery, an anode sheet or a cathode sheet with a tab is cut from a coil sheet by a manufacturing apparatus. Generally, a coating layer is arranged on the upper surface or the lower surface of the coil pole piece or on the upper surface and the lower surface of the coil pole piece, and the coating layer is used for protecting the pole piece, so that the coating layer of the pole piece part needs to be cleaned after the anode pole piece or the cathode pole piece with the pole lug is cut from the coil pole piece, so that the welding of the pole lug in the subsequent process is convenient, and the like.

At present, the processing equipment for the pole piece can only cut the pole piece to obtain the anode pole piece or the cathode pole piece with the pole lug, but cannot clean the coating layer on the pole lug, and needs to utilize extra cleaning equipment for cleaning, so that the automation degree of the pole lug processing is low, and the processing efficiency is low.

Disclosure of Invention

The present application is directed to providing a laser processing apparatus to solve the above mentioned technical problems.

The technical scheme that this application adopted is a laser beam machining equipment, includes:

the unwinding assembly is used for providing and conveying a substrate;

the cutting assembly is arranged on the moving path of the base material and is used for cutting a required workpiece on the base material;

the cleaning assembly is used for cleaning the part to be cleaned of the workpiece; and

the conveying assembly comprises a supporting platform, a first conveying driving piece and a second conveying driving piece; wherein the content of the first and second substances,

the first transmission driving part is in driving connection with the supporting platform and at least used for driving the supporting platform to move back and forth between the cutting assembly and the cleaning assembly;

the second transmission driving part is in driving connection with the supporting platform, and when the supporting platform is located in a cutting area of the cutting assembly, the second transmission driving part is used for driving the supporting platform to move towards a direction close to or far away from the base material.

The laser processing equipment integrates the cutting component and the cleaning component into the same equipment, so that the workpiece can be cut from the base material and the part to be cleaned on the workpiece can be cleaned; the supporting platform, the first transmission driving part and the second transmission driving part are arranged, so that the base material is supported when the cutting assembly cuts the base material, and the cutting precision of the cutting assembly can be improved; when the workpiece is cut, the supporting platform can also timely transfer the workpiece generated by cutting to the cleaning assembly for cleaning, so that the automation degree of workpiece processing is improved, and the processing efficiency is improved.

Further, the conveying assembly further comprises a turnover platform and a turnover driving piece; wherein the content of the first and second substances,

the overturning platform is arranged along the movement direction of the supporting platform and is used for transferring the workpiece loaded on the supporting platform; and

the overturning driving piece is in driving connection with the overturning platform and used for driving the overturning platform to drive the workpiece to overturn, so that one end of a part to be cleaned of the workpiece is located in a cleaning range of the cleaning assembly.

Furthermore, the conveying assembly further comprises a third conveying driving element, and the third conveying driving element is in driving connection with the overturning platform and at least used for driving the overturning platform to convey the workpiece to the cleaning range of the cleaning assembly.

Furthermore, the overturning platform comprises an object carrying piece, the object carrying piece is connected with the overturning driving piece, the object carrying piece is provided with an object carrying surface, and a plurality of adsorption holes used for adsorbing workpieces are formed in the object carrying surface.

The cleaning device further comprises a first cleaning assembly, the first cleaning assembly is arranged at the downstream of the cleaning assembly along the movement direction of the supporting platform, and the supporting platform drives the workpiece cleaned by the cleaning assembly to move, so that one end, away from the supporting platform, of the workpiece acts on the first cleaning assembly.

The cleaning device further comprises a first cleaning assembly, the first cleaning assembly is arranged at the downstream of the cleaning assembly along the movement direction of the overturning platform, and the overturning platform drives the workpiece cleaned by the cleaning assembly to move, so that one end, far away from the overturning platform, of the workpiece acts on the first cleaning assembly.

The feeding device further comprises a feeding assembly, wherein the feeding assembly is arranged at the downstream of the conveying assembly; wherein the content of the first and second substances,

the blanking assembly comprises a blanking transfer structure and a workpiece storage structure, wherein the blanking transfer structure is movably arranged between the conveying assembly and the workpiece storage structure and is used for transferring the workpiece on the supporting platform to the workpiece storage structure.

The feeding device further comprises a feeding assembly, wherein the feeding assembly is arranged at the downstream of the conveying assembly; wherein the content of the first and second substances,

the blanking assembly comprises a blanking transfer structure and a workpiece storage structure, wherein the blanking transfer structure is movably arranged between the conveying assembly and the storage structure and is used for transferring the workpieces on the turnover platform to the workpiece storage structure.

The workpiece storage structure is arranged on the lower portion of the workpiece storage structure, and the workpiece storage structure is arranged on the lower portion of the workpiece storage structure and is used for storing workpieces.

The cleaning device is characterized by further comprising a workpiece feeding assembly, wherein the workpiece feeding assembly is arranged at the upstream of the cleaning assembly along the movement direction of the conveying assembly and used for feeding the workpieces onto the conveying assembly, and the conveying assembly drives the workpieces to move to the cleaning assembly for cleaning.

Further, the workpiece feeding assembly comprises a feeding frame and a feeding pushing piece; wherein the content of the first and second substances,

the feeding frame is arranged along the movement direction of the overturning platform and used for loading a workpiece cut by external equipment; and

the feeding pushing piece is movably arranged in the feeding frame and used for pushing the workpiece to move towards the direction close to the overturning platform, so that the workpiece can be taken by the overturning platform.

Furthermore, the device also comprises a rolling component, wherein the rolling component is arranged at the downstream of the cutting component along the movement direction of the substrate, and is matched with the unreeling component to drive the substrate to move, so that the cut substrate is collected.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a substrate and a workpiece according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a first view angle of a laser processing apparatus according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a second view angle of the laser processing apparatus shown in FIG. 2;

FIG. 4 is a schematic structural view of a support platform of the transfer assembly of FIG. 2;

FIG. 5 is a schematic view of the flipping platform of the transfer assembly of FIG. 2;

FIG. 6 is a schematic structural diagram of a first cleaning assembly, a second cleaning assembly and a blanking assembly in the laser processing apparatus shown in FIG. 2;

FIG. 7 is a schematic structural view of a first cleaning assembly, a second cleaning assembly and a workpiece storage structure of the laser machining apparatus shown in FIG. 2;

FIG. 8 is a schematic structural view of a blanking transfer structure in the blanking assembly shown in FIG. 2;

FIG. 9 is a schematic structural view of a workpiece loading assembly of the laser machining apparatus of FIG. 2;

FIG. 10 is a schematic view of a cutting assembly of the laser machining apparatus of FIG. 2;

fig. 11 is a schematic structural view of a cleaning assembly in the laser processing apparatus of fig. 2.

Reference numerals:

100. a substrate; 110. a workpiece; 120. cleaning the part;

200. an unwinding assembly;

300. a cutting assembly; 310. cutting the workpiece by laser; 320. cutting the dust extraction piece;

400. cleaning the assembly; 410. cleaning the workpiece by laser; 420. cleaning the dust extraction piece;

500. a transfer assembly; 510. a support platform; 511. a support member; 512. a negative pressure hole; 520. a first transfer drive; 530. a second transfer drive; 540. overturning the platform; 541. carrying an object; 542. an adsorption hole; 550. turning over the driving piece; 560. a third transfer drive;

600. a first cleaning assembly; 610. a first cleaning drive; 620. a first cleaning housing; 630. a first cleaning dust extraction part;

700. a blanking assembly; 710. a blanking transfer structure; 711. blanking parts; 712. a blanking driving part; 720. a workpiece storage structure; 721. NG material frames; 722. a finished product material frame;

800. a second cleaning assembly; 810. a second cleaning member; 820. a second cleaning drive; 830. a second cleaning housing; 840. a second opening; 850. a second cleaning dust extraction part;

900. a workpiece feeding assembly; 910. a feeding frame; 920. a feeding pusher;

1000. and (7) rolling the assembly.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It should be noted that, when a meta-structure is referred to as being "fixed" or "disposed" to another meta-structure, it may be directly on the other meta-structure or indirectly on the other meta-structure. When a meta structure is referred to as being "connected to" another meta structure, it can be directly connected to the other meta structure or indirectly connected to the other meta structure.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship illustrated in the drawings that is used solely to facilitate the description of the application and to simplify the description, and do not indicate or imply that the referenced device or element structure must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of some applications, "plurality" means two or more unless specifically limited otherwise.

The present application provides a laser processing apparatus generally installed on a production line (not shown) for processing individual workpieces 110 on a substrate 100 and cleaning a cleaning portion 120 of the workpiece 110. For example, in the production process of lithium batteries, it is necessary to cut individual anode or cathode sheets with tabs on a coil sheet provided with a coating layer, and to clean the coating layer on the tabs.

Referring to fig. 1, the substrate 100 is taken as a coil electrode plate in the present application, and the workpiece 110 is a cathode electrode plate with tabs cut from the substrate 100. In the lithium cell, the cathode plate is the aluminium foil material generally, so in order to prevent the pole piece mutual contact of rolling up together in coil stock pole piece, generally can scribble the coating on one of them surface of pole piece, this also causes a surface on the cathode plate that cuts out to have the coating, consequently need wash away the coating that corresponds utmost point ear part on the cathode plate to follow-up utmost point ear can weld electrically conductive etc.. Of course, in some embodiments, the coating layer corresponding to the tab position on the coil pole piece may be cleaned first, and then the cleaned coil pole piece may be cut.

Referring to fig. 2 and 3, the laser processing apparatus includes an unwinding assembly 200, a cutting assembly 300, a cleaning assembly 400, and a transfer assembly 500. Wherein, the unreeling assembly 200 is loaded with the substrate 100 to be processed, and conveys the substrate 100 to the cutting assembly 300; the cutting assembly 300 is disposed on the moving path of the substrate 100, and cuts the substrate 100 moving to the cutting range of the cutting assembly 300, so as to cut the desired workpiece 110 on the substrate 100; the cleaning assembly 400 is used for cleaning the cleaning part 120 of the workpiece 110 generated after cutting; the transfer assembly 500 moves back and forth between the cutting assembly 300 and the cleaning assembly 400 for transferring the work pieces 110 cut by the cutting assembly 300 to the cleaning assembly 400 for cleaning.

Specifically, the substrate 100 to be processed (e.g., a web pole piece) is loaded on the unwinding assembly 200, and the unwinding assembly 200 conveys the substrate 100 to the cutting range of the cutting assembly 300; the cutting assembly 300 cuts the substrate 100 moving within the cutting range into a desired workpiece 110 (e.g., a cathode plate), and the workpiece 110 is carried on the conveying assembly 500 after being cut; the conveying assembly 500 drives the workpiece 110 to move to the cleaning range of the cleaning assembly 400; the cleaning assembly 400 cleans the cleaning portion 120 of the workpiece 110 moved within the cleaning range. That is to say, the laser processing device of the present application integrates the cutting assembly 300 and the cleaning assembly 400 into the same device, and conveys the workpiece 110 generated by cutting to the cleaning assembly 400 for cleaning through the conveying assembly 500, so as to improve the automation degree of processing the workpiece 110 and improve the processing efficiency.

Further, in conjunction with fig. 2 and 4, the transfer assembly 500 includes a support platform 510, a first transfer drive 520, and a second transfer drive 530.

The supporting platform 510 is used to support the substrate 100 located in the cutting range before cutting, so that the cutting assembly 300 can better cut the substrate 100; on the other hand, the supporting platform 510 is used for driving the workpiece 110 generated by cutting to move to the cleaning range corresponding to the cleaning assembly 400, so that the cleaning assembly 400 can clean the cleaning portion 120 of the workpiece 110.

The first transfer drive 510 is drivingly connected to the support platform 510 for driving the support platform 510 back and forth between the cutting assembly 300 and the cleaning assembly 400 to effect transfer of the workpiece 110 from the cutting assembly 300 to the cleaning assembly 400. The second transfer driving member 520 is drivingly connected to the supporting platform 510, and when the supporting platform 510 is located in the cutting area of the cutting assembly 300, the second transfer driving member 530 is used for driving the supporting platform 510 to move toward or away from the substrate 100, so as to support the substrate 100 and drive the workpiece 110 generated by cutting away from the substrate 100.

Specifically, the second transmission driving element 530 may be disposed on a driving end of the first transmission driving element 520, and a driving end of the second transmission driving element 530 is connected to the supporting platform 510.

When the substrate 100 to be processed moves to the region to be cut of the cutting assembly 300 under the action of the unwinding assembly 200, the first transmission driving member 520 drives the supporting platform 510 to move to the cutting region of the cutting assembly 300 along the first direction, and then the second transmission driving member 530 drives the supporting platform 510 to move towards the direction close to the workpiece 110 along the second direction, so that the supporting platform 510 contacts with the substrate 100 and supports the substrate 100; the cutting assembly 300 cuts the substrate 100 supported by the support platform 510, and the workpiece 110 resulting from the cutting is properly carried on the support platform 510; the second transfer drive 530 drives the support platform 510 to move in a second direction away from the substrate 100 to disengage the workpiece 110 from the substrate 100, and the support platform 510 transports the workpiece 110 to a cleaning region of the cleaning assembly 400 under the driving of the first transfer drive 520; the cleaning assembly 400 cleans the cleaning portion 120 of the workpiece 110.

Wherein, the first direction may be an X-axis direction in the drawings of the present application, and the second direction may be a Z-axis direction in the drawings of the present application; the first transfer driving unit 520 may be a linear motor, a screw motor, or the like, and the second transfer driving unit 530 may be a lifting cylinder, a screw motor, or the like.

Of course, in some embodiments, the cutting assembly 300 and the cleaning assembly 400 may be disposed in the same direction along the first direction, such that the supporting platform 510 can transfer the workpiece 110 from the cutting assembly 300 to the cleaning assembly 400 under the action of the first transmission driving element 520, thereby making the entire laser processing apparatus simpler in structure and lower in cost.

In other embodiments, when the cutting assembly 300 and the cleaning assembly 400 are not arranged in the same direction, the supporting platform 510 can also be arranged on a three-dimensional driving platform, and the workpiece 110 generated by cutting can also be transferred into the cleaning assembly 400 by driving the supporting platform 510 to move through the three-dimensional driving platform.

In practical use, a layer of the substrate 100 having the cleaning portion 120 (e.g., a coating layer of a coil pole piece) is loaded upward in the unwinding assembly 200, so that the substrate 100 can be conveyed to the cutting assembly 300 in a manner that the cleaning portion 120 faces upward in the process of conveying the substrate 100 by the unwinding assembly 200; after the cutting assembly 300 cuts the substrate 100, the cleaning portion 120 of the workpiece 110 carried on the supporting platform 510 is located at an end away from the supporting platform 510, so that when the supporting platform 510 moves the workpiece 110 to the cleaning assembly 400, the cleaning assembly 400 can directly clean the cleaning portion 120 of the workpiece 110.

It can be seen that, in the laser processing apparatus of the present application, the cutting assembly 300 and the cleaning assembly 400 are integrated into the same apparatus, which can respectively cut the workpiece 110 from the substrate 100 and clean the cleaning portion 120 on the workpiece 110; by arranging the supporting platform 510, the first transmission driving element 520 and the second transmission driving element 530, when the cutting assembly 300 cuts the substrate 100, the substrate 100 is supported, so that the cutting precision of the cutting assembly 300 can be improved; when the workpiece 110 is cut, the supporting platform 510 can also transfer the cut workpiece 110 to the cleaning assembly 400 for cleaning, so as to improve the automation degree of the workpiece 110 processing and the processing efficiency.

Further, in conjunction with fig. 2, 4 and 5, the transfer assembly 500 may further include an inversion platform 540 and an inversion drive 550. Wherein, the turning platform 540 is arranged along the moving direction of the supporting platform 510, and is used for transferring the workpiece 110 carried on the supporting platform 510; the turning driving member 550 is drivingly connected to the turning platform 540, and is configured to drive the turning platform 540 to drive the workpiece 110 to turn over, so that one end of the cleaning portion 120 of the workpiece 110 turns over into the cleaning range of the cleaning assembly 400.

Specifically, flipping platform 540 may be disposed along the direction of movement of support platform 510 in a first direction and within the cleaning range of cleaning assembly 400; when the workpiece 110 moves to the cleaning range under the action of the supporting platform 510, one end of the workpiece 110 far away from the supporting platform 510 contacts with the turning platform 540, and the workpiece 110 is transferred onto the turning platform 540 and separated from the supporting platform 510; the turning platform 540 drives the workpiece 110 to turn under the action of the turning driving member 550, so that one end of the workpiece 110, which is far away from the turning platform 540, is turned to the cleaning range of the cleaning assembly 400, and the cleaning assembly 400 cleans the cleaning part 120 of the workpiece 110. The turnover driving member 550 may be a rotary cylinder or a rotary motor.

It can be understood that, in practical use, it is possible to load a layer of the cleaning portion 120 (e.g., a coating layer of a web pole piece) on the substrate 100 downward into the unwinding assembly 200, so that the unwinding assembly 200 can convey the substrate 100 to the cutting assembly 300 with the cleaning portion 120 downward during the conveying of the substrate 100; after the cutting assembly 300 cuts the substrate 100, the cleaning portion 120 of the workpiece 110 supported on the supporting platform 510 is just in contact with the supporting surface of the supporting platform 510, so that the cleaning portion 120 of the workpiece 110 is shielded by the supporting platform 510; therefore, the supporting platform 510 needs to move the workpiece 110 to the turning platform 540 along the first direction, and drive the workpiece 110 to move along the second direction, so that one end of the workpiece 110 away from the cleaning portion 120 contacts with the turning platform 540, and the workpiece 110 is transferred from the supporting platform 510 to the turning platform 540, so that the cleaning portion 120 of the workpiece 110 is exposed; the turning platform 540 is driven by the turning driving member 550 to turn the workpiece 110, so that one end of the cleaning portion 120 of the workpiece 110 is located within the cleaning range of the cleaning assembly 400, and the cleaning assembly 400 can clean the workpiece 110 conveniently.

It can be seen that, after the turning platform 540 and the turning driving member 550 are arranged, the cleaning part 120 of the workpiece 110 can be cleaned according to different feeding modes of the substrate 100 (namely when the substrate 100 is conveyed to the cutting assembly 300 in a mode that one surface of the cleaning part 120 faces upwards, and when the substrate 100 is conveyed to the cutting assembly 300 in a mode that one surface of the cleaning part 120 faces downwards), so that the compatibility of the laser processing equipment is improved, and the automation degree of the laser processing equipment is improved.

Further, with reference to fig. 2, 4 and 5, the transfer assembly 500 may further include a third transfer driving unit 560, wherein the third transfer driving unit 560 is drivingly connected to the flipping platform 540, and at least is used for driving the flipping platform 540 to transfer the workpiece 110 to the cleaning area of the cleaning assembly 400, so that the cleaning assembly 400 can clean the cleaning portion 120 of the workpiece 110.

Specifically, the third conveying driving member 560 is disposed along the first direction, and the flipping platform 540 is disposed on a driving end of the third conveying driving member 560 through the flipping driving member 550. After the workpiece 110 is transferred from the supporting platform 510 to the turning platform 540, the turning driving member 550 drives the turning platform 540 to rotate, so that the cleaning portion 120 of the workpiece 110 faces one side of the cleaning assembly 400; the third driving unit 560 drives the turning platform 540 to move the turned workpiece 110 along the first direction to a cleaning range of the cleaning assembly 400.

That is to say, the conveying assembly 500 of the present application, through setting up the third conveying driving element 560 to drive the turning platform 540 to move to the cleaning range of the cleaning assembly 400 along the first direction, can make the turning platform 540 movably disposed at one side of the cleaning assembly 400, for example, the turning platform 540 movably disposed at one side of the cleaning assembly 400 close to the cutting assembly 300, can prevent the turning platform 540 from interfering with the cleaning assembly 400 in the process of driving the workpiece 110 to turn, and simultaneously, makes the structure of the whole laser processing apparatus more reasonable.

Referring to fig. 5, the turnover platform 540 includes a carrier 541, the carrier 541 is used for carrying the workpiece 110, the carrier 541 is drivingly connected to the turnover driving unit 550, and the turnover driving unit 550 drives the carrier 541 to rotate, so as to turn over the workpiece 110.

Further, the object loading component 541 has an object loading surface, i.e. a surface for loading the workpiece 110, and a plurality of absorption holes 542 are disposed on the object loading surface for absorbing the workpiece 110.

Specifically, when the workpiece 110 on the supporting platform 510 contacts the object carrying surface of the object carrying element 541 under the action of the first and second transfer driving elements 520 and 530, the suction holes 542 generate suction force to suck the workpiece 110, so that the workpiece 110 is transferred from the supporting platform 510 to the object carrying element 541; the carrier 541 drives the workpiece 110 to turn over under the action of the turning driving unit 550, and transfers the workpiece 110 to the cleaning range of the cleaning assembly 400 under the action of the third transmission driving unit 560.

It can be seen that, in the turnover platform 540 of the present application, the adsorption holes 542 are formed in the carrying surface of the carrying piece 541, so that the workpiece 110 can be transferred from the supporting platform 510 to the turnover platform 540, the structure is simple, and the transfer efficiency of the workpiece 110 is high.

Of course, in other embodiments, the workpiece 110 may be transferred by providing a gripper on the carrier 541.

Referring to fig. 4, the support platform 510 includes a support 511, wherein the support 511 supports the substrate 100 on one side and supports the cut workpiece 110 on the other side; the supporting member 511 is respectively connected to the first conveying driving member 520 and the second conveying driving member 530 in a driving manner, and the supporting member 511 supports the substrate 100 and drives the workpiece 110 generated by cutting to move under the action of the first conveying driving member 520 and the second conveying driving member 530.

Further, the support 511 has a support surface, i.e., a surface for supporting the substrate 100, on which a plurality of suction holes 512 are provided. The negative pressure hole 512 is used for adsorbing the base material 100 and adsorbing the workpiece 110 generated after cutting the base material 100, so as to improve the precision of cutting the base material 100 and smoothly transfer the workpiece 110; on the other hand, in the cutting process of the substrate 100, the negative pressure hole 512 can also timely draw away dust generated by cutting, so that the cutting precision of the substrate 100 is improved.

Referring to fig. 2, the cutting assembly 300 is disposed on the moving path of the substrate 100, and cuts the substrate 100 moving within the cutting range to cut the desired workpiece 110 on the substrate 100.

Further, referring to fig. 10, the cutting assembly 300 includes a laser cutting member 310 and a cutting dust extraction member 320. The laser cutting unit 310 is disposed on a moving path of the substrate 100 and is used for cutting the substrate 100; the cutting dust-extraction member 320 sets the cutting range of the laser cutting member 310 for extracting dust generated during the cutting process in time. It should be noted that, the specific structural arrangement of the laser cutting element 310 and the cutting dust extraction element 320 is the existing mature technology, and does not belong to the improvement point of the present application, and the present application only needs to select the suitable laser cutting element 310 and the suitable cutting dust extraction element 320 from the laser cutting elements 310 and the cutting dust extraction elements 320 of various types.

Referring to fig. 2, the cleaning assembly 400 is disposed downstream of the cutting assembly 300 in the moving direction of the workpiece 110, and is used for cleaning the cleaning portion 120 of the workpiece 110 cut by the cutting assembly 300.

Further, referring to fig. 11, the cleaning assembly 400 includes a laser cleaning member 410 and a cleaning suction member 420. Wherein, the laser cleaning member 410 is disposed downstream of the cutting assembly 300, and is used for cleaning the cleaning portion 120 of the workpiece 110; the cleaning dust-extracting part 420 is arranged in the cleaning range of the laser cleaning part 410 and is used for extracting dust generated in the cleaning process in time. It should be noted that, the specific structural arrangement of the laser cleaning element 410 and the cleaning dust extraction element 420 is the existing mature technology, and does not belong to the improvement point of the present application, and the present application only selects and uses suitable ones from the laser cleaning elements 410 and the cleaning dust extraction elements 420 of various models.

Referring to fig. 2 and 6, the laser processing apparatus may further include a first cleaning assembly 600. The first cleaning assembly 600 is disposed downstream of the cleaning assembly 400 and is used for cleaning the cleaned workpiece 110 and removing dust adhered to the workpiece 110 during the cleaning process and the cutting process of the workpiece 110.

In the first embodiment of the present application, the first cleaning assembly 600 is disposed downstream of the rinsing assembly 400 in the moving direction of the support platform 510. After the workpiece 110 is cleaned by the cleaning assembly 400, the support platform 510 continues to move the workpiece 110 such that an end of the workpiece 110 remote from the support platform 510 (i.e., a cleaning surface of the workpiece 110) acts on the first cleaning assembly 600.

Specifically, the first cleaning assembly 600 is disposed downstream of the cleaning assembly in a first direction. After the supporting platform 510 drives the workpiece 110 to move to the cleaning assembly 400 along the first direction for cleaning under the action of the first transmission driving element 520, the supporting platform 510 continues to drive the workpiece 110 to move along the first direction under the action of the first transmission driving element 520, so that one end of the workpiece 110 far from the supporting platform 510 acts on the first cleaning assembly 600, and the first cleaning assembly 600 cleans an end surface of one end of the workpiece 110 far from the supporting platform 510.

In the second embodiment of the present application, the first cleaning assembly 600 is disposed downstream of the washing assembly 400 in the moving direction of the turn-over platform 540. After the workpiece 110 is cleaned by the cleaning assembly 400, the turning platform 540 continues to drive the workpiece 110, so that an end of the workpiece 110 away from the turning platform 540 (i.e., a cleaning surface of the workpiece 110) acts on the first cleaning assembly 600.

Specifically, the first cleaning assembly 600 is disposed downstream of the cleaning assembly in a first direction. After the turning platform 540 drives the workpiece 110 to move to the cleaning assembly 400 along the first direction for cleaning under the action of the third transmission driving element 560, the turning platform 540 continues to drive the workpiece 110 to move along the first direction under the action of the third transmission driving element 560, so that one end of the workpiece 110 far from the supporting platform 510 acts on the first cleaning assembly 600, and the first cleaning assembly 600 cleans an end surface of one end of the workpiece 110 far from the supporting platform 510.

Referring to fig. 7, the first cleaning assembly 600 includes a first cleaning member (not shown) and a first cleaning driving member 610. Wherein the first cleaning member is disposed downstream of the washing assembly 400 in the first direction; the first cleaning driving member 610 is in driving connection with the first cleaning member for driving the first cleaning member to rotate.

In this application, the first cleaning member may be a brush or other cleaning implement.

Specifically, when the supporting platform 510 or the turning platform 540 brings the cleaning surface of the workpiece 110 into contact with the first cleaning member, the first cleaning driving member 610 drives the first cleaning member to rotate, and the first cleaning member cleans the cleaning surface of the workpiece 110.

Further, the first cleaning assembly 600 further includes a first cleaning housing 620, the first cleaning member is movably disposed in the cavity of the first cleaning housing 620, and a first opening (first opening) is disposed on a lower surface of the first cleaning housing 620, and the first cleaning member contacts with the cleaning surface of the workpiece 110 through the first opening, so that dust generated in the cleaning process of the first cleaning chamber is collected in the first cleaning housing 620, and the dust is prevented from diffusing and polluting the apparatus.

Further, the first cleaning assembly 600 may further include a first cleaning dust extraction member 630, and the first cleaning dust extraction member 630 is communicated with the cavity of the first cleaning housing 620 for timely extracting dust in the first cleaning housing 620.

Referring to fig. 2 and 6, the laser processing apparatus may further include a blanking assembly 700. The blanking assembly 700 is disposed downstream of the conveying assembly 500 and is used for blanking the workpiece 110.

In the first embodiment of the present application, the blanking assembly 700 blanks the workpiece 110 on the supporting platform 510 after the supporting platform 510 carries the workpiece 110 to be cleaned by the cleaning assembly 400, or after the supporting platform 510 carries the workpiece 110 to be cleaned by the first cleaning assembly 600.

In the second embodiment of the present application, the blanking assembly 700 blanks the workpiece 110 on the turning platform 540 after the turning platform 540 drives the workpiece 110 to be cleaned by the cleaning assembly 400, or after the turning platform 540 drives the workpiece 110 to be cleaned by the first cleaning assembly 600.

Referring to fig. 6, the blanking assembly 700 includes a blanking transfer structure 710 and a workpiece 110 storage structure. The workpiece 110 storage structure is used for storing the processed workpieces 110; the material transferring structure 710 is movably disposed between the conveying assembly 500 and the storage structure, and is used for transferring the workpiece 110 on the supporting platform 510 or the overturning platform 540 of the conveying assembly 500 to the storage structure of the workpiece 110.

Further, referring to fig. 8, the blanking transfer structure 710 includes a blanking member 711 and a blanking driving member 712. Wherein, a blanking member 711 is disposed downstream of the conveying assembly 500, and a blanking driving member 712 is drivingly connected to the blanking member 711 for driving the blanking member 711 to transfer the workpiece 110 on the supporting platform 510 or the turning platform 540 of the conveying assembly 500 to the workpiece 110 storage structure.

In the embodiment of the present application, the blanking member 711 may be a vacuum adsorption device; the blanking drive 712 can be a two-dimensional motion platform or a three-dimensional motion platform. It should be noted that the specific structural arrangement of the blanking member 711 and the blanking driving member 712 is a mature technology in the prior art, and does not belong to the improvement point of the present application, and the present application only selects and uses suitable ones from the blanking members 711 and the blanking driving members 712 of various types.

Referring to fig. 7, the workpiece 110 storage structure includes an NG frame 721 and at least one finished frame 722. The NG material block 721 is used for loading the defective work pieces 110, and the finished material block 722 is used for installing the good work pieces 110.

It can be understood that, in practical use, the cleaning assembly 400 generally has a detection structure for positioning and detecting the workpiece 110 so as to accurately clean the cleaning portion 120 of the workpiece 110, so that before the cleaning assembly 400 cleans the workpiece 110, the detection structure can be used to determine the workpiece 110 to determine whether the workpiece 110 is good or bad, and the blanking assembly 700 blanks the workpiece 110 into the corresponding material frame according to the detection information of the detection structure.

That is to say, the laser processing device of the present application, by providing the blanking assembly 700 at the downstream of the conveying assembly 500, can realize blanking of the processed workpiece 110, improve the automation degree of the laser processing device, and improve the processing efficiency of the workpiece 110.

Referring to fig. 2 and 6, the laser processing apparatus may further include a second cleaning assembly 800. The second cleaning assembly 800 is disposed downstream of the first cleaning assembly 600 and is used for cleaning the cleaned workpiece 110 and removing dust adhered to the workpiece 110 during the cleaning process and the cutting process of the workpiece 110.

Specifically, after the workpiece 110 is transferred from the supporting platform 510 or the overturning platform 540 to the feeding material transferring structure 710 in the conveying assembly 500, one end of the workpiece 110 (i.e., the other end not cleaned by the first cleaning assembly 600) originally contacting the supporting platform 510 or the overturning platform 540 is exposed, the feeding material transferring structure 710 drives the workpiece 110 to move, so that the other end of the workpiece 110 not cleaned by the first cleaning assembly 600 acts on the second cleaning assembly 800, and the second cleaning assembly 800 cleans the workpiece 110, thereby completely cleaning the workpiece 110.

Referring to fig. 7, the second cleaning assembly 800 includes a second cleaning member 810 and a second cleaning drive member 820. Wherein the second cleaning member 810 is disposed downstream of the first cleaning assembly 600; the second cleaning driving member 820 is in driving connection with the second cleaning member 810 for driving the second cleaning member 810 to rotate.

In the present application, the second cleaning member 810 may be a brush or other cleaning tool.

Specifically, when the blanking transfer structure 710 drives the workpiece 110 to move and one end of the workpiece 110 away from the blanking transfer structure 710 contacts with the second cleaning member 810, the second cleaning driving member 820 drives the second cleaning member 810 to rotate, and the second cleaning member 810 cleans another surface of the workpiece 110 opposite to the cleaning surface.

Further, the second cleaning assembly 800 further includes a second cleaning housing 830, the second cleaning member 810 is movably disposed in the cavity of the second cleaning housing 830, and a second opening 840 is disposed on the upper surface of the second cleaning housing 830, the second cleaning member 810 contacts the workpiece 110 through the second opening 840, so that dust generated in the second cleaning process is collected in the second cleaning housing 830, and the dust is prevented from diffusing and polluting the apparatus.

Further, the second cleaning assembly 800 may further include a second cleaning dust-pumping element 850, and the second cleaning dust-pumping element 850 is communicated with the cavity of the second cleaning housing 830 for timely pumping away the dust in the second cleaning housing 830.

Referring to fig. 2, the laser processing apparatus further includes a workpiece loading assembly 900. The workpiece loading assembly 900 is disposed upstream of the cleaning assembly 400 along the moving direction of the conveying assembly 500, and is used for loading the workpiece 110 onto the conveying assembly 500, and the conveying assembly 500 drives the workpiece 110 to move to the cleaning assembly 400 for cleaning.

It can be understood that, the laser processing device of the present application, by integrating the cutting assembly 300 and the cleaning assembly 400 on the same device, improves the automation degree of the laser processing device and reduces the processing cost of the workpiece 110 compared to the existing laser processing device which can only cut the workpiece 110 but cannot clean it. However, in order to further improve the compatibility of the laser processing apparatus of the present application and reduce the cost of processing the workpiece 110 in some factories, for some existing laser processing apparatuses in some factories, the workpiece 110 produced by cutting the substrate 100 by the existing laser processing apparatuses may be loaded on the workpiece loading assembly 900 of the present application, so as to clean the workpiece 110 produced by the existing laser processing apparatuses by using the cleaning assembly 400 in the laser processing apparatus of the present application.

Referring to FIG. 9, the workpiece loading assembly 900 includes a loading frame 910 and a loading pusher 920. The feeding frame 910 is disposed along the moving direction of the turning platform 540, and the feeding frame 910 is used for loading the workpiece 110 cut by the external device; the feeding pushing member 920 is movably disposed in the feeding frame 910, and is configured to push the workpiece 110 loaded in the feeding frame 910 to move toward a direction close to the turning platform 540, so that the workpiece 110 can be taken by the turning platform 540.

It should be noted that the workpiece 110 is transferred from the workpiece loading assembly 900 to the turning platform 540 in the same manner as the workpiece 110 is transferred from the supporting platform 510 to the turning platform 540, and therefore, the description thereof is omitted.

Referring to fig. 2, the laser processing apparatus further includes a take-up assembly 1000. The winding assembly 1000 is disposed downstream of the cutting assembly 300 along the moving direction of the substrate 100, and cooperates with the unwinding assembly 200 to drive the substrate 100 to move, so as to collect the cut substrate 100.

Specifically, after the unwinding assembly 200 conveys the substrate 100 to the cutting area of the cutting assembly 300, the cutting assembly 300 cuts the substrate 100, the mirror transfer assembly 500 of the workpiece 110 generated by cutting is transferred to the cleaning assembly 400 for cleaning, the cut substrate 100 continues to move to the winding assembly 1000 under the action of the unwinding assembly 200 and the winding assembly 1000, and the winding assembly 1000 collects the cut substrate 100.

It should be noted that, the specific structural arrangement of the unwinding assembly 200 and the winding assembly 1000 in the present application is a mature technology, and does not belong to the improvement point of the present application, and the present application only selects and uses suitable ones from the unwinding assembly 200 and the winding assembly 1000 in various models.

The present application is intended to cover any variations, uses, or adaptations of the invention using its general principles and without departing from the spirit or essential characteristics thereof.

Claims (12)

1. A laser machining apparatus, characterized by comprising:

the unwinding assembly is used for providing and conveying a base material;

the cutting assembly is arranged on the moving path of the base material and is used for cutting a required workpiece on the base material;

the cleaning assembly is used for cleaning the part to be cleaned of the workpiece; and

the conveying assembly comprises a supporting platform, a first conveying driving piece and a second conveying driving piece; wherein the content of the first and second substances,

the first transmission driving part is in driving connection with the supporting platform and at least used for driving the supporting platform to move back and forth between the cutting assembly and the cleaning assembly;

the second transmission driving part is in driving connection with the supporting platform, and when the supporting platform is located in a cutting area of the cutting assembly, the second transmission driving part is used for driving the supporting platform to move towards a direction close to or far away from the base material.

2. The laser machining apparatus of claim 1 wherein the conveyor assembly further comprises a flipping platform and a flipping drive; wherein the content of the first and second substances,

the overturning platform is arranged along the movement direction of the supporting platform and is used for transferring the workpiece loaded on the supporting platform; and

the overturning driving piece is in driving connection with the overturning platform and used for driving the overturning platform to drive the workpiece to overturn, so that one end of a part to be cleaned of the workpiece is located in a cleaning range of the cleaning assembly.

3. The laser machining apparatus of claim 2 wherein the transfer assembly further includes a third transfer drive drivingly connected to the flipping platform for driving the flipping platform to transfer the workpiece to the cleaning zone of the cleaning assembly.

4. The laser processing apparatus according to claim 2 or 3, wherein the tilting platform includes an object carrier, the object carrier is connected to the tilting driving member, and the object carrier has an object carrier surface, and the object carrier surface is provided with a plurality of suction holes for sucking the workpiece.

5. The laser machining apparatus of claim 1 further comprising a first cleaning assembly disposed downstream of the cleaning assembly in the direction of movement of the support platform, the support platform moving the cleaned workpiece through the cleaning assembly such that an end of the workpiece remote from the support platform acts on the first cleaning assembly.

6. The laser processing apparatus of claim 3, further comprising a first cleaning assembly disposed downstream of the cleaning assembly in the direction of movement of the flipping platform, the flipping platform moving the workpiece after being cleaned by the cleaning assembly such that an end of the workpiece remote from the flipping platform acts on the first cleaning assembly.

7. The laser processing apparatus of claim 1, further comprising a blanking assembly disposed downstream of the conveyor assembly; wherein the content of the first and second substances,

the blanking assembly comprises a blanking transfer structure and a workpiece storage structure, wherein the blanking transfer structure is movably arranged between the conveying assembly and the workpiece storage structure and is used for transferring the workpiece on the supporting platform to the workpiece storage structure.

8. The laser processing apparatus of claim 3, further comprising a blanking assembly disposed downstream of the conveyor assembly; wherein the content of the first and second substances,

the blanking assembly comprises a blanking transfer structure and a workpiece storage structure, wherein the blanking transfer structure is movably arranged between the conveying assembly and the workpiece storage structure and is used for transferring the workpieces on the turnover platform to the workpiece storage structure.

9. The laser processing apparatus according to claim 7 or 8, further comprising a second cleaning assembly disposed along a moving direction of the blanking transfer structure, wherein the blanking transfer structure drives the workpiece to move in a direction close to the workpiece storage structure, so that an end of the workpiece opposite to the cleaning portion acts on the second cleaning assembly.

10. The laser processing apparatus according to claim 2 or 3, further comprising a workpiece loading assembly disposed upstream of the cleaning assembly in a moving direction of the conveying assembly for loading the workpiece onto the conveying assembly, wherein the conveying assembly moves the workpiece to the cleaning assembly for cleaning.

11. The laser machining apparatus of claim 10 wherein the workpiece loading assembly includes a loading frame and a loading pusher; wherein the content of the first and second substances,

the feeding frame is arranged along the movement direction of the overturning platform and used for loading a workpiece cut by external equipment; and

the feeding pushing piece is movably arranged in the feeding frame and used for pushing the workpiece to move towards the direction close to the overturning platform, so that the workpiece can be taken by the overturning platform.

12. The laser processing apparatus of claim 1, further comprising a winding assembly disposed downstream of the cutting assembly along a direction of movement of the substrate and cooperating with the unwinding assembly to drive the substrate to move for collecting the cut substrate.

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