CN216451556U - 散热测试用模拟热源 - Google Patents
散热测试用模拟热源 Download PDFInfo
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- CN216451556U CN216451556U CN202123231840.3U CN202123231840U CN216451556U CN 216451556 U CN216451556 U CN 216451556U CN 202123231840 U CN202123231840 U CN 202123231840U CN 216451556 U CN216451556 U CN 216451556U
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- 238000012360 testing method Methods 0.000 title claims abstract description 44
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 85
- 238000009434 installation Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 3
- 238000004088 simulation Methods 0.000 abstract description 12
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 238000011056 performance test Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
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CN202123231840.3U CN216451556U (zh) | 2021-12-20 | 2021-12-20 | 散热测试用模拟热源 |
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CN202123231840.3U CN216451556U (zh) | 2021-12-20 | 2021-12-20 | 散热测试用模拟热源 |
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CN216451556U true CN216451556U (zh) | 2022-05-06 |
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CN202123231840.3U Active CN216451556U (zh) | 2021-12-20 | 2021-12-20 | 散热测试用模拟热源 |
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TR01 | Transfer of patent right |
Effective date of registration: 20221219 Address after: 213300 Floor 1 and 2, No. 31, Chuangzhi Road, Kunlun Street, Liyang City, Changzhou City, Jiangsu Province Patentee after: Changzhou Microenthalpy New Material Technology Co.,Ltd. Address before: 100082 room 101-a501, 5 / F, block a, building 1, courtyard 4, Yongjia North Road, Haidian District, Beijing Patentee before: BEIJING WEIHAN TECHNOLOGY CO.,LTD. Patentee before: CHANGZHOU WEIHAN THERMAL CONTROL TECHNOLOGY Co.,Ltd. |
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TR01 | Transfer of patent right | ||
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Effective date of registration: 20240111 Address after: Room 501, 5th Floor, Building 13, Courtyard 3, Fengxiu Middle Road, Haidian District, Beijing, 100082 Patentee after: BEIJING WEIHAN TECHNOLOGY CO.,LTD. Address before: 213300 Floor 1 and 2, No. 31, Chuangzhi Road, Kunlun Street, Liyang City, Changzhou City, Jiangsu Province Patentee before: Changzhou Microenthalpy New Material Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240516 Address after: 050200, No.3 Industrial Park, Shangzhuang Town, Luquan District, Shijiazhuang City, Hebei Province Patentee after: Hebei Microenthalpy New Material Technology Co.,Ltd. Country or region after: China Address before: Room 501, 5th Floor, Building 13, Courtyard 3, Fengxiu Middle Road, Haidian District, Beijing, 100082 Patentee before: BEIJING WEIHAN TECHNOLOGY CO.,LTD. Country or region before: China |