CN216450022U - Inclined fan array air-cooling heat dissipation device - Google Patents
Inclined fan array air-cooling heat dissipation device Download PDFInfo
- Publication number
- CN216450022U CN216450022U CN202123293332.8U CN202123293332U CN216450022U CN 216450022 U CN216450022 U CN 216450022U CN 202123293332 U CN202123293332 U CN 202123293332U CN 216450022 U CN216450022 U CN 216450022U
- Authority
- CN
- China
- Prior art keywords
- heat
- array
- electronic chip
- air
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 55
- 238000001816 cooling Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000002791 soaking Methods 0.000 claims 1
- 230000008901 benefit Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An inclined fan array air-cooled heat dissipation device comprises a fan control circuit interface, a fan control circuit, an inclined fan array, a heat input interface, a heat pipe array and a heat dissipation sheet, wherein the output end of the fan control circuit interface is connected with the input end of the fan control circuit, the output end of the fan control circuit is connected with the input end of the inclined fan array, the output end of the inclined fan array is connected with one input end of the heat dissipation sheet, the output end of the heat input interface is connected with the input end of the heat pipe array, and the output end of the heat pipe array is connected with the other input end of the heat dissipation sheet.
Description
Technical Field
The utility model relates to an air-cooled heat dissipation device with an inclined fan array, in particular to an air-cooled heat dissipation device which dissipates heat of an electronic chip by adopting the inclined fan array, a heat pipe array and a heat dissipation sheet.
Background
The mode of adopting a plurality of fans to establish ties can increase the wind pressure, does benefit to and blows through the fin. The radiator with a plurality of fans connected in series adopted in the computer case with the standard height is often out of standard in thickness, and a great problem is brought to the compatibility of the radiator.
Compared with the air cooling heat dissipation device of a processor in the current market, the air cooling heat dissipation device has the advantages of compact size, excellent performance, flexible configuration and the like.
Disclosure of Invention
The utility model aims to provide an inclined fan array air-cooling heat dissipation device which has the advantages of compact size, excellent performance, flexible configuration and the like by adopting an inclined fan array, a heat pipe array and a heat dissipation sheet to dissipate heat of an electronic chip.
In order to realize the purpose, the utility model adopts the technical scheme that: the fan control circuit receives processor temperature information provided by a temperature sensor in an electronic chip through the fan control circuit interface to control the rotating speed of the inclined fan array, the heat pipe array is connected with the electronic chip through the heat input interface to receive heat of the electronic chip and conduct the heat to the radiating fins, airflow of the inclined fan array penetrates through the radiating fins, and the heated airflow is discharged out of a computer case to be radiated.
The fan control circuit interface is used for establishing electrical connection between the temperature sensor in the electronic chip and the fan control circuit of the inclined fan array air-cooled heat dissipation device and providing processor temperature information provided by the temperature sensor in the electronic chip to the fan control circuit of the inclined fan array air-cooled heat dissipation device;
the fan control circuit is a digital pulse width modulation control chip and is used for controlling the rotating speed of the inclined fan array air-cooled heat dissipation device according to the processor temperature information provided by the temperature sensor in the electronic chip, and the working principle is not repeated as various digital pulse width modulation control chips are available in the market;
the inclined fan array is a plurality of axial flow fans which are obliquely arranged and used for pushing air in the case to form airflow and blow the airflow through the radiating fins for heat dissipation, wherein one main fan is clamped between the two groups of radiating fins, the included angle between the rotating shaft of the fan blade and the circuit board is less than 90 degrees and greater than zero degrees, and a plurality of auxiliary fans are positioned in front of, above and behind the two groups of radiating fins;
the heat input interface is used for connecting the electronic chip and a heat pipe array of the inclined fan array air-cooled heat dissipation device, the surface of the heat input interface, which is in contact with the electronic chip, is coated with heat-conducting silicone grease or liquid metal, and the surface of the heat input interface, which is in contact with the heat pipe array, is connected with the heat pipe array in a welding mode;
the heat pipe array is used for efficiently conducting heat led in from the heat input interface to the radiating fins;
the radiating fins and the heat pipe array are tightly connected by adopting a fin penetrating process or a reflow soldering process.
The working principle of the utility model is as follows: in use, the electronic chip is in intimate contact with the tilted fan array air-cooled heat sink, including electrical and thermal connections. The temperature sensor in the electronic chip is connected with a fan control circuit of the inclined fan array air-cooled heat dissipation device through a fan control circuit interface of the inclined fan array air-cooled heat dissipation device, and the fan control circuit controls the rotating speed of an inclined fan array of the inclined fan array air-cooled heat dissipation device according to processor temperature information provided by the temperature sensor in the electronic chip; the electronic chip is connected with the heat pipe array of the inclined fan array air-cooled heat dissipation device through the heat input interface of the inclined fan array air-cooled heat dissipation device, the heat pipe array is used for efficiently conducting heat led in from the heat input interface to the heat dissipation fins, the inclined fan array conducts forced convection heat dissipation on the heat conducted from the heat pipe array to the heat dissipation fins, hot air passing through the heat dissipation fins is directly discharged out of the computer case, one main fan of the inclined fan array is clamped between the two groups of heat dissipation fins, the included angle between the rotating shaft of the fan blades and the circuit board is smaller than 90 degrees and larger than zero degrees, a plurality of auxiliary fans are positioned in front of the two groups of heat dissipation fins, the upper side and the rear side can be installed on the computer case with the standard height, and therefore the working temperature of the electronic chip is effectively reduced.
Due to the adoption of the technical scheme, the utility model has the following advantages:
1. the novel air-cooled radiator with small volume and high-efficiency heat dissipation is realized;
2. the heat dissipation capability of the electronic chip is enhanced, and the calculation performance of the electronic chip is indirectly improved.
Drawings
FIG. 1 is a block diagram of the present invention;
fig. 2 is a schematic structural diagram of the present invention.
Detailed Description
The utility model is further illustrated by the following examples in conjunction with the accompanying drawings: as shown in fig. 1-2, it includes a fan control circuit interface 1, a fan control circuit 2, an inclined fan array 3, a heat input interface 4, a heat pipe array 5 and a heat sink 6, an output end of the fan control circuit interface 1 is connected with an input end of the fan control circuit 2, an output end of the fan control circuit 2 is connected with an input end of the inclined fan array 3, an output end of the inclined fan array 3 is connected with one input end of the heat sink 6, an output end of the heat input interface 4 is connected with an input end of the heat pipe array 5, an output end of the heat pipe array 5 is connected with another input end of the heat sink 6, the fan control circuit 2 receives processor temperature information provided by a temperature sensor in an electronic chip through the fan control circuit interface 1, controls the rotation speed of the inclined fan array 3, the heat pipe array 5 is connected with the electronic chip through the heat input interface 4, the heat is received and conducted to the radiating fins 6, the airflow of the inclined fan array 3 passes through the radiating fins 6, and the heated airflow is discharged out of the computer case for heat dissipation.
The fan control circuit interface 1 is used for establishing electrical connection between the temperature sensor in the electronic chip and the fan control circuit 2 of the inclined fan array air-cooled heat dissipation device, and providing processor temperature information provided by the temperature sensor in the electronic chip to the fan control circuit 2 of the inclined fan array air-cooled heat dissipation device;
the fan control circuit 2 is a digital pulse width modulation control chip and is used for controlling the rotating speed of the inclined fan array 3 of the inclined fan array air-cooled heat dissipation device according to the processor temperature information provided by a temperature sensor in the electronic chip, and the working principle is not repeated as various digital pulse width modulation control chips are available in the market;
the inclined fan array is a plurality of axial flow fans which are obliquely arranged and used for pushing air in the case to form airflow and blow the airflow through the radiating fins for heat dissipation, wherein one main fan is clamped between the two groups of radiating fins, the included angle between the rotating shaft of the fan blade and the circuit board is less than 90 degrees and greater than zero degrees, and a plurality of auxiliary fans are positioned in front of, above and behind the two groups of radiating fins;
the heat input interface 4 is used for connecting the electronic chip and a heat pipe array 5 of the inclined fan array air-cooled heat dissipation device, the surface of the heat input interface, which is in contact with the electronic chip, is coated with heat-conducting silicone grease or liquid metal, and the surface of the heat input interface, which is in contact with the heat pipe array 5, is connected with the heat pipe array in a welding mode;
the heat pipe array 5 is used for efficiently conducting heat led from the heat input interface 4 to the heat radiating fins 6;
the radiating fins 6 are tightly connected with the heat pipe array 5 by adopting a fin penetrating process or a reflow soldering process.
The working principle of the utility model is as follows: in use, the electronic chip is in intimate contact with the tilted fan array air-cooled heat sink, including electrical and thermal connections. A temperature sensor in the electronic chip is connected with a fan control circuit 2 of the inclined fan array air-cooled heat dissipation device through a fan control circuit interface 1 of the inclined fan array air-cooled heat dissipation device, and the fan control circuit 2 controls the rotating speed of an inclined fan array 3 of the inclined fan array air-cooled heat dissipation device according to processor temperature information provided by the temperature sensor in the electronic chip; the electronic chip is connected with a heat pipe array 5 of the inclined fan array air-cooled heat dissipation device through a heat input interface 4 of the inclined fan array air-cooled heat dissipation device, the heat pipe array 5 is used for efficiently conducting heat led in from the heat input interface 4 to a heat dissipation fin 6, the inclined fan array 3 conducts the heat conducted from the heat pipe array 5 to the heat dissipation fin 6 to carry out forced convection heat dissipation, hot air passing through the heat dissipation fin 6 is directly exhausted out of a computer case, a main fan of the inclined fan array 3 is clamped between two groups of heat dissipation fins 6, an included angle between a rotating shaft of a fan blade and a circuit board is smaller than 90 degrees and larger than zero degrees, a plurality of auxiliary fans are positioned in front of the two groups of heat dissipation fins 6, the auxiliary fans are arranged above and behind the two groups of heat dissipation fins 6, and can be arranged on the computer case with standard height, and accordingly the working temperature of the electronic chip is effectively reduced.
The fan control circuit 2 of the present invention is a digital pulse width modulation control chip, which belongs to the prior art, so the present invention is not described again.
The heat pipe array 5 is a normal temperature heat pipe, and the working temperature is 0-250 ℃.
The heat pipe array 5 is made of copper, copper alloy, aluminum or aluminum alloy.
The heat input interface 4 is made of copper, copper alloy, aluminum or aluminum alloy.
The heat input interface 4 and the electronic chip are fixed by a metal clamp.
The heat input interface 4 and the heat pipe array 5 of the inclined fan array air-cooled heat dissipation device are fixed by a metal clamp.
The radiating fins 6 are tightly connected with the heat pipe array 5 by adopting a fin penetrating process or a reflow soldering process.
Claims (7)
1. The utility model provides an inclined fan array forced air cooling heat abstractor which characterized in that: the fan control circuit receives processor temperature information provided by a temperature sensor in an electronic chip through the fan control circuit interface to control the rotating speed of the inclined fan array, the heat pipe array is connected with the electronic chip through the heat input interface to conduct heat to the radiating fins, airflow of the inclined fan array passes through the radiating fins, and the heated airflow is discharged out of a computer case to be radiated;
the fan control circuit interface is used for establishing electrical connection between the temperature sensor in the electronic chip and a fan control circuit of the electronic chip air-cooling heat dissipation device and providing processor temperature information provided by the temperature sensor in the electronic chip to the fan control circuit of the electronic chip air-cooling heat dissipation device;
the inclined fan array is a plurality of axial flow fans which are obliquely arranged and used for pushing air in the case to form airflow and blow the airflow through the radiating fins for heat dissipation, wherein one main fan is clamped between the two groups of radiating fins, the included angle between the rotating shaft of the fan blade and the circuit board is less than 90 degrees and greater than zero degrees, and a plurality of auxiliary fans are positioned in front of, above and behind the two groups of radiating fins;
the heat input interface is used for connecting the electronic chip and the heat pipe array of the electronic chip air-cooling heat dissipation device, and the two sides of the heat input interface are respectively in close contact with the heat pipe array of the electronic chip and the heat pipe array of the electronic chip air-cooling heat dissipation device so as to establish high-efficiency heat connection;
the heat pipe array is used for efficiently conducting heat led in from the heat input interface to the radiating fins;
the radiating fins and the heat pipe array are tightly connected by adopting a fin penetrating process or a reflow soldering process.
2. The inclined fan array air-cooled heat sink of claim 1, wherein: the heat input interface is a metal base or a soaking plate.
3. The inclined fan array air-cooled heat sink of claim 1, wherein: the heat pipe array is a normal temperature heat pipe, and the working temperature is 0-250 ℃.
4. The inclined fan array air-cooled heat sink of claim 1, wherein: the heat pipe array is made of copper, copper alloy, aluminum or aluminum alloy.
5. The inclined fan array air-cooled heat sink of claim 1, wherein: the heat input interface is made of copper, copper alloy, aluminum or aluminum alloy.
6. The inclined fan array air-cooled heat sink of claim 1, wherein: the surface of the heat input interface, which is in contact with the electronic chip, is coated with heat-conducting silicone grease or liquid metal, and the surface of the heat input interface, which is in contact with the heat pipe array, is connected with the heat pipe array in a welding mode.
7. The inclined fan array air-cooled heat sink of claim 1, wherein: the heat input interface and the electronic chip are fixed by a metal clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123293332.8U CN216450022U (en) | 2021-12-26 | 2021-12-26 | Inclined fan array air-cooling heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123293332.8U CN216450022U (en) | 2021-12-26 | 2021-12-26 | Inclined fan array air-cooling heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216450022U true CN216450022U (en) | 2022-05-06 |
Family
ID=81377161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123293332.8U Expired - Fee Related CN216450022U (en) | 2021-12-26 | 2021-12-26 | Inclined fan array air-cooling heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216450022U (en) |
-
2021
- 2021-12-26 CN CN202123293332.8U patent/CN216450022U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200826436A (en) | Motor control device | |
| CN216450022U (en) | Inclined fan array air-cooling heat dissipation device | |
| JP2009277699A (en) | Heat sink, heat sink assembly, semiconductor module, and semiconductor device with cooling device | |
| CN210605614U (en) | Heat abstractor for computer machine case | |
| CN114077294A (en) | Inclined fan array air-cooling heat dissipation device | |
| CN216450021U (en) | Air cooling heat dissipation device with inclined fan | |
| CN210721349U (en) | Computer chip heat abstractor | |
| CN210835975U (en) | Computer chip heat abstractor with show function | |
| CN110582189B (en) | Heat pipe type temperature control cabinet using heat pipe as heat conducting element | |
| CN210924478U (en) | Air-cooled radiator with formula wind channel of turning back | |
| CN212211802U (en) | Microwave equipment with novel heat radiation structure | |
| CN111045504A (en) | Air-cooled radiator with formula wind channel of turning back | |
| CN208300186U (en) | Air-cooled/water cooling two uses radiator | |
| CN213755497U (en) | Air-cooling and water-cooling integrated radiator | |
| CN212851604U (en) | Embedded radiator for power electronic element | |
| CN212135374U (en) | Rack-mounted server cooling system | |
| CN110955314A (en) | Computer GPU integral type water-cooling radiator | |
| CN214411180U (en) | Miniaturized quick heat abstractor of high power | |
| CN220545193U (en) | High heat dissipation type thick film hybrid integrated circuit | |
| CN218632406U (en) | Heat radiation structure for communication antenna equipment | |
| CN210042686U (en) | Dual-heat-dissipation heat dissipation module | |
| CN112306200A (en) | Computer chip heat abstractor | |
| CN219288017U (en) | Heat dissipation device for heat dissipation of electronic device | |
| CN217721821U (en) | Copper pipe heat dissipation heat sink | |
| CN216282947U (en) | Heat pipe radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220506 |