CN216414956U - PCB mainboard device beneficial to heat dissipation - Google Patents
PCB mainboard device beneficial to heat dissipation Download PDFInfo
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- CN216414956U CN216414956U CN202122965149.1U CN202122965149U CN216414956U CN 216414956 U CN216414956 U CN 216414956U CN 202122965149 U CN202122965149 U CN 202122965149U CN 216414956 U CN216414956 U CN 216414956U
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- water tank
- cooling water
- mainboard
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Abstract
The utility model discloses a PCB mainboard device beneficial to heat dissipation, and relates to a PCB mainboard heat dissipation device, which comprises a support frame and a mainboard, wherein the mainboard is arranged on the upper surface of the support frame; the support frame lower surface is provided with the second heat sink that provides the cooling for the mainboard lower surface, and this application discloses a realization has guaranteed the normal operating of equipment to the radiating operation of mainboard structure, has increased the life of PCB mainboard, prevents to generate heat and causes the influence to the performance of PCB mainboard, has increased the degree of automation of equipment, has guaranteed that work efficiency is not influenced does benefit to radiating PCB mainboard device.
Description
Technical Field
The utility model relates to the technical field of PCB mainboard heat dissipation devices, in particular to a PCB mainboard device beneficial to heat dissipation.
Background
Printed circuit boards ("printed circuit boards") are also known as printed circuit boards, and are providers of electrical connections for electronic components. The printed circuit board is generally denoted as "PCB" and cannot be called "PCB board". Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board.
The PCB mainboard frequently can be accompanied with and generate heat in the in-process of using besiedly, if this kind of generate heat does not obtain timely processing, can cause the influence to the normal operating of PCB mainboard, causes the reduction to the performance of PCB mainboard to can lead to the fact the reduction to the life of PCB mainboard.
SUMMERY OF THE UTILITY MODEL
The PCB mainboard device is beneficial to heat dissipation, and by arranging the first cooling device and the second cooling device, the heat dissipation operation of a mainboard structure is realized, the normal operation of equipment is ensured, the service life of the PCB mainboard is prolonged, the influence of heating on the performance of the PCB mainboard is prevented, the automation degree of the equipment is increased, and the working efficiency is not influenced.
The technical purpose of the utility model is realized by the following technical scheme:
a PCB mainboard device beneficial to heat dissipation comprises a support frame and a mainboard, wherein the mainboard is arranged on the upper surface of the support frame, a lower pressing support is hinged to the upper surface of the support frame, and a first cooling device is arranged on one side, facing the mainboard, of the lower pressing support; the support frame lower surface is provided with the second heat sink that provides the cooling for the mainboard lower surface.
Through adopting above-mentioned technical scheme, through setting up first heat sink and second heat sink, realize having guaranteed the normal operating of equipment to the heat dissipation operation of mainboard structure, increased the life of PCB mainboard, prevent to generate heat and cause the influence to the performance of PCB mainboard, increased the degree of automation of equipment, guaranteed that work efficiency is not influenced.
The utility model is further configured to: the cooling device comprises two cooling supports, wherein the two cooling supports are respectively and fixedly arranged on two sides of the lower surface of the lower pressing support, a supporting plate is fixed in the cooling supports, a cooling fan is arranged on one side of the supporting plate in a rotating mode, the air outlet direction of the cooling fan faces the position of the main board, and an air outlet is formed in the lower pressing support in a penetrating mode.
Through adopting above-mentioned technical scheme, realized the cooling operation to the PCB mainboard through setting up cooling support and cooling fan, guaranteed the normal operating of equipment, realized to the circulation of air of PCB mainboard top, can spread the heat that the PCB mainboard gave out, thereby prevent that the heat from piling up the rising that leads to the temperature, increased the cooling effect of PCB mainboard, realize the quick conduction to PCB mainboard upper temperature.
The utility model is further configured to: the second cooling device comprises a first cooling water tank, the first cooling water tank is fixed on one side of the lower surface of the support frame, a first cooling pipeline communicated with the inside of the first cooling water tank is arranged on one side of the first cooling water tank, the two ends of the first cooling pipeline are communicated with the inside of the first cooling water tank, and the first cooling pipeline and the contact part of the mainboard are both in a structure shaped like a Chinese character 'shan'.
Through adopting above-mentioned technical scheme, guaranteed through setting up first cooling water tank and can carry out the heat dissipation processing for PCB mainboard lower surface, guaranteed the normal operating of equipment, prevent that the PCB mainboard from receiving the influence because the high temperature leads to the performance, guaranteed that the life of PCB mainboard can not receive the temperature influence, further increased the heat dispersion of device, guaranteed the normal operating of equipment, increased the degree of automation of equipment.
The utility model is further configured to: the opposite side of support frame lower surface is fixed with second cooling water tank, second cooling water tank one side is provided with the inside second cooling pipe of intercommunication, second cooling pipe both ends all with the inside intercommunication of second cooling water tank, just second cooling pipe all is chevron structure with mainboard contact segment, just second cooling pipe is mutually pegged graft with first cooling pipe and is cooperated.
Through adopting above-mentioned technical scheme, through setting up second cooling water tank and second cooling pipe, guaranteed to further increase the cooling effect to the PCB mainboard, guaranteed the normal operating of equipment, increased the cooling effect to the PCB mainboard, guaranteed the normal operating of equipment, reduced equipment and caused the possibility of influence at the operation in-process because of the temperature, let equipment can long-time steady operation, guaranteed that the life of PCB mainboard is not influenced.
The utility model is further configured to: first cooling water tank and second cooling water tank one side all rotate and are provided with auxiliary fan, auxiliary fan's air-out direction is just to first cooling water tank and second cooling water tank.
Through adopting above-mentioned technical scheme, realize the cooling operation to first cooling water tank and second cooling water tank through setting up auxiliary fan, guaranteed that the inside liquid of first cooling water tank and second cooling water tank can remain low temperature work throughout, increased the degree of automation of equipment, reduced the heat production of equipment, guaranteed to provide stable cooling operation for the PCB mainboard, guaranteed the normal operating of equipment.
The utility model is further configured to: first cooling water tank, second cooling water tank, first cooling pipeline and second cooling pipeline are formed by the heat conduction material preparation of high coefficient of heat conductivity.
Through adopting above-mentioned technical scheme, through setting up the heat conduction material, guaranteed the normal operating of equipment, guaranteed that completion that can be quick reaches to reaching of temperature, increased the degree of automation of equipment, reduced the influence of temperature to the PCB mainboard, guaranteed the normal operating of equipment, increased the life of PCB mainboard.
The utility model is further configured to: and setting a preset threshold value of the temperature of the main board, starting the first cooling water tank when the temperature of the main board is less than or equal to the preset threshold value, starting the auxiliary fan of the first cooling water tank, and starting the auxiliary fan of the second cooling water tank when the temperature of the main board is greater than the preset threshold value.
Through adopting above-mentioned technical scheme, realized the energy-conserving effect to equipment, guaranteed to let equipment cool down the operation to the PCB mainboard according to actual conditions, guaranteed the normal operating of equipment, increased the work efficiency of equipment, can realize the cooling operation of PCB mainboard fast when the temperature is high, can realize energy-conserving effect when the temperature is low.
In conclusion, the beneficial technical effects of the utility model are as follows:
(1) through setting up first heat sink and second heat sink, realize having guaranteed the normal operating of equipment to the radiating operation of mainboard structure, increased the life of PCB mainboard, prevent to generate heat and cause the influence to the performance of PCB mainboard, increased the degree of automation of equipment, guaranteed that work efficiency is not influenced.
(2) Realized the cooling operation to the PCB mainboard through setting up cooling support and cooling fan, guaranteed the normal operating of equipment, realized to the circulation of air of PCB mainboard top, can spread the heat that the PCB mainboard distributed out, thereby prevent that the heat from piling up the rising that leads to the temperature, increased the cooling effect of PCB mainboard, realize the quick conduction to PCB mainboard upper temperature.
(3) Through setting up first cooling water tank, guaranteed to carry out the thermal treatment for PCB mainboard lower surface, guaranteed the normal operating of equipment, prevent that the PCB mainboard from receiving the influence because the high temperature leads to the performance, guaranteed that the life of PCB mainboard can not receive the temperature influence, further increased the heat dispersion of device, guaranteed the normal operating of equipment, increased the degree of automation of equipment.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic cross-sectional view of a cooling rack in accordance with an embodiment of the present invention;
FIG. 3 is a bottom view of the support bracket in one embodiment of the present invention;
FIG. 4 is a schematic view of the construction of an auxiliary support in one embodiment of the present invention.
Reference numerals: 1. a support frame; 2. pressing the bracket downwards; 3. cooling the bracket; 4. a cooling port; 5. a support plate; 6. a cooling fan; 7. a first motor; 8. an air outlet; 9. a first cooling water tank; 10. a first cooling duct; 11. a second cooling water tank; 12. a second cooling duct; 13. an auxiliary support; 14. an auxiliary fan.
Detailed Description
The following description of the exemplary embodiments of the present application, taken in conjunction with the accompanying drawings, includes various details of the embodiments of the application for the understanding of the same, which are to be considered exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present application. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.
Refer to fig. 1 and fig. 2, a do benefit to radiating PCB mainboard, including support frame 1 and mainboard, support frame 1 is the rectangle structure, the articulated push down support 2 that is provided with of support frame 1 upper surface, push down support 2 and be fixed with two cooling support 3 towards one side of mainboard, 3 symmetric distribution in the both sides of support frame 1 lower surface of cooling support, cooling support 3 is the rectangle structure, cooling support 3 runs through and has seted up cooling mouth 4, cooling mouth 4 internal fixation has backup pad 5, backup pad 5 one side is all rotated and is provided with cooling fan 6, backup pad 5 opposite side all is fixed with a plurality of first motor 7, the output shaft of first motor 7 and the coaxial fixed of cooling fan 6 that correspond, cooling fan 6's air-out direction all is towards the mainboard position, push down support 2 runs through and has seted up air outlet 8.
Referring to fig. 1 and 3, one side of support frame 1 lower surface is fixed with first cooling water tank 9, and first cooling water tank 9 one side is provided with the inside first cooling pipe 10 of intercommunication, and first cooling pipe 10 both ends all communicate with the inside of first cooling water tank 9, and first cooling pipe 10 all is the chevron structure with mainboard contact segment, is provided with small-size water pump in the first cooling water tank 9, can let the liquid in the first cooling water tank 9 flow in first cooling pipe 10.
The opposite side of 1 lower surface of support frame is fixed with second cooling water tank 11, 11 one sides of second cooling water tank are provided with the inside second cooling pipe 12 of intercommunication, 12 both ends of second cooling pipe all communicate with 11 inside of second cooling water tank, second cooling pipe 12 all is the chevron structure with mainboard contact segment, be provided with small-size water pump in the second cooling water tank 11, can let the liquid in the second cooling water tank 11 flow in second cooling pipe 12, second cooling pipe 12 and first cooling pipe 10 are pegged graft mutually and are cooperated, and need to explain be, first cooling water tank 9, second cooling water tank 11, first cooling pipe 10 and second cooling pipe 12 are formed by the heat conduction material preparation of high coefficient of heat conductivity.
Referring to fig. 1 and 4, an auxiliary support 13 is fixed on each of the first cooling water tank 9 and the second cooling water tank 11, an auxiliary fan 14 is rotatably disposed on each of the auxiliary supports 13, and the air outlet direction of the auxiliary fan 14 is opposite to the first cooling water tank 9 and the second cooling water tank 11.
In an implementation manner of the present application, a preset threshold of the temperature of the main board is set, when the temperature of the main board is less than or equal to the preset threshold, the first cooling water tank 9 starts to work, and the auxiliary fan 14 of the first cooling water tank 9 is started, and when the temperature of the main board is greater than the preset threshold, the second cooling water tank 11 starts to work, and the auxiliary fan 14 of the second cooling water tank 11 is started.
The working principle of the embodiment is as follows: realize the heat dissipation operation to the mainboard structure through the aforesaid setting, guaranteed the normal operating of equipment, increased the life of PCB mainboard, prevent to generate heat and cause the influence to the performance of PCB mainboard, increased the degree of automation of equipment, guaranteed that work efficiency is not influenced.
The above-described embodiments should not be construed as limiting the scope of the present application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (7)
1. The utility model provides a do benefit to radiating PCB mainboard device, includes support frame (1) and mainboard, its characterized in that: the main board is arranged on the upper surface of the support frame (1), the upper surface of the support frame (1) is hinged with a lower pressing support (2), and one side, facing the main board, of the lower pressing support (2) is provided with a first cooling device;
the lower surface of the support frame (1) is provided with a second cooling device for cooling the lower surface of the main board.
2. A PCB motherboard assembly facilitating heat dissipation as recited in claim 1, wherein: the cooling device comprises two cooling supports (3) and two cooling supports (3) which are respectively fixedly arranged on two sides of the lower surface of the pressing support (2), a supporting plate (5) is fixed in the cooling supports (3), a cooling fan (6) is arranged on one side of the supporting plate (5) in a rotating mode, the air outlet direction of the cooling fan (6) faces towards the position of a main board, and an air outlet (8) is formed in the pressing support (2) in a penetrating mode.
3. A PCB motherboard assembly facilitating heat dissipation as recited in claim 1, wherein: the second cooling device comprises a first cooling water tank (9), wherein the first cooling water tank (9) is fixed on one side of the lower surface of the support frame (1), a first cooling pipeline (10) inside the communication is arranged on one side of the first cooling water tank (9), two ends of the first cooling pipeline (10) are communicated with the inside of the first cooling water tank (9), and the first cooling pipeline (10) and the contact part of the mainboard are both in a herringbone structure.
4. A PCB motherboard assembly facilitating heat dissipation as recited in claim 3, wherein: the opposite side of support frame (1) lower surface is fixed with second cooling water tank (11), second cooling water tank (11) one side is provided with inside second cooling pipe (12) of intercommunication, second cooling pipe (12) both ends all communicate with second cooling water tank (11) are inside, just second cooling pipe (12) all are chevron structure with mainboard contact segment, just second cooling pipe (12) and first cooling pipe (10) are pegged graft the cooperation mutually.
5. A PCB mainboard device facilitating heat dissipation according to claim 4, wherein: first cooling water tank (9) and second cooling water tank (11) one side all rotate and are provided with auxiliary fan (14), the air-out direction of auxiliary fan (14) is just to first cooling water tank (9) and second cooling water tank (11).
6. A PCB mainboard device facilitating heat dissipation according to claim 4, wherein: first cooling water tank (9), second cooling water tank (11), first cooling pipe (10) and second cooling pipe (12) are formed by the heat conduction material preparation.
7. A PCB mainboard device facilitating heat dissipation according to claim 4, wherein: setting a preset threshold value of the temperature of the main board, starting a first cooling water tank (9) when the temperature of the main board is less than or equal to the preset threshold value, starting an auxiliary fan (14) of the first cooling water tank (9), and starting a second cooling water tank (11) when the temperature of the main board is greater than the preset threshold value, and starting the auxiliary fan (14) of the second cooling water tank (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122965149.1U CN216414956U (en) | 2021-11-30 | 2021-11-30 | PCB mainboard device beneficial to heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122965149.1U CN216414956U (en) | 2021-11-30 | 2021-11-30 | PCB mainboard device beneficial to heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216414956U true CN216414956U (en) | 2022-04-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122965149.1U Active CN216414956U (en) | 2021-11-30 | 2021-11-30 | PCB mainboard device beneficial to heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216414956U (en) |
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2021
- 2021-11-30 CN CN202122965149.1U patent/CN216414956U/en active Active
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