CN110727328B - Loongson computer mainboard based on VPX standard - Google Patents
Loongson computer mainboard based on VPX standard Download PDFInfo
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- CN110727328B CN110727328B CN201911296956.XA CN201911296956A CN110727328B CN 110727328 B CN110727328 B CN 110727328B CN 201911296956 A CN201911296956 A CN 201911296956A CN 110727328 B CN110727328 B CN 110727328B
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Abstract
The invention discloses a VPX standard-based Loongson computer mainboard which comprises a mainboard, a Loongson chip arranged on the surface of the mainboard, an air cooling mechanism arranged below the mainboard, and a water cooling mechanism arranged inside the mainboard and positioned above the air cooling mechanism. The invention has the beneficial effects that: the air cooling mechanism can be convenient for the device to blow away a large amount of heat that the mainboard produced through wind through the wind that sets up, radiating effect preferred. The heating panel through setting up is convenient for play support and heat dissipation to the mainboard, and the steady operation of the mainboard of being convenient for provides sufficient support space through the support column that sets up, and the bottom of mainboard is sent into with wind to the mechanism of being convenient for air-cooled. The main board in the computer case is cooled by the arranged air cooling mechanism, the air supply outlet is completely contacted with the bottom of the main board through the arranged flat air supply outlet, and air blown out from the fan blades can be sent into the air supply outlet through the arranged air collecting cover.
Description
Technical Field
The invention relates to a computer mainboard, in particular to a Loongson computer mainboard based on a VPX standard, and belongs to the technical field of computer mainboards.
Background
Computer motherboards are generally rectangular circuit boards on which the main circuitry that makes up the computer is mounted, and the motherboards play a significant role in the overall microcomputer system. The type and grade of the motherboard determines the type and grade of the entire microcomputer system. The performance of the motherboard affects the performance of the entire microcomputer system.
When the existing computer mainboard is used, heat is easily generated, and the heat dissipation performance of various mainboards is different. When hydroelectric power generation, the computer that hydroelectric generating set connects just needs to adopt very big heat dissipation mechanism to dispel the heat to the mainboard, and computer work load is great, generates heat very easily, and it is not ideal to carry away most heat in the short time inside, and the heat on the computer mainboard is not gone out, leads to the computer overheated, can influence generating set's normal electricity generation, needs alternate use generating set to generate electricity, will make generating set appear the outage district of neutral position like this, causes economic loss.
Disclosure of Invention
The invention aims to solve the problems that when the existing hydroelectric power is generated, a computer connected with a hydroelectric generating set needs to adopt a large heat dissipation mechanism to dissipate heat of a main board, the computer has large workload and is easy to heat, most of heat needs to be transported out in a short time, the heat on the main board of the computer cannot be dissipated, the computer is overheated, the normal power generation of the generating set is influenced, the generating set needs to be alternately used for power generation, and a neutral shutdown area of the generating set occurs to cause economic loss.
The purpose of the invention can be realized by the following technical scheme: the utility model provides a godson computer mainboard based on VPX standard, includes the mainboard, sets up mainboard surperficial godson piece sets up the air cooling mechanism of mainboard below sets up the mainboard below just is located the water cooling mechanism of air cooling mechanism top sets up the tip of mainboard with the fixed a plurality of heat conduction copper sheet of mainboard sets up the mainboard bottom is used for supporting the heating panel of mainboard, the bottom of heat conduction copper sheet is fixed the heating panel be provided with between the heat conduction copper sheet and be used for radiating heat dissipation seam on the surface, per two, the below of heating panel is provided with the support frame of fixing on the pillar, the pillar bottom is provided with the bottom plate that is used for stabilizing the pillar. The air cooling mechanism that sets up can be convenient for the device through the wind blow take away a large amount of heats that the mainboard produced, and the heat conduction copper sheet of mainboard end fixing can be with heat transfer for the heat conduction copper sheet from the mainboard, and the heat on some heat conduction copper sheets can be taken away through the heat dissipation seam to the heat conduction copper sheet, can also take away some heats through water cooling mechanism, just so can guarantee that the mainboard is in radiating state always, radiating effect preferred. The heat dissipation plate is convenient for play support and heat dissipation to the mainboard through the setting, and the steady operation of the mainboard of being convenient for provides sufficient support space through the support column that sets up, and the bottom of mainboard is sent into with wind to the mechanism of being convenient for air-cooled, and the bottom plate can be convenient for fix the quick-witted incasement portion at the computer.
Preferably, the air cooling mechanism comprises a fan fixed above the support frame, fan blades arranged at the top of the fan, an air collecting cover arranged inside the heat dissipation plate, an air supply outlet arranged at the top of the air collecting cover, and an exhaust pipe arranged on one side of the air supply outlet and communicated with the air supply outlet. The mainboard of computer machine incasement portion cools off through the air cooling mechanism that sets up, and a large amount of heats can be taken away in the forced air cooling, through the flat exhaust pipe that sets up for the exhaust pipe contacts with the bottom of mainboard completely, thereby takes away a large amount of heats, can send into the inside of supply-air outlet with the wind that the flabellum blew off through the air-collecting cover that sets up.
Preferably, the water cooling mechanism comprises a water pump fixed on the support frame, a water storage tank arranged at the top of the water pump, the water storage tank is fixed at the bottom of the heat dissipation plate, a first water inlet pipe arranged above the water storage tank, a second water inlet pipe arranged at one end of the first water inlet pipe and positioned inside the heat-conducting copper sheet, a blocking mechanism arranged inside the second water inlet pipe and used for blocking water backflow, a spiral pipe arranged at one side of the second water inlet pipe and communicated with the second water inlet pipe at the top, the spiral pipe is positioned inside the heat-conducting copper sheet, a sewer pipe arranged at the bottom of the spiral pipe and positioned inside the heat dissipation plate, each sewer pipe is connected with a collecting pipe through a water collecting pipe, the collecting pipe is connected with the return pipe, the return pipe is communicated with the water storage tank, and a fine water pipe arranged on the side wall of the water storage tank and used for water inflow, the water inlet valve is arranged on the thin water pipe and used for controlling water inflow, and the water inlet valve is fixed on the side wall of the heat dissipation plate. Can input the inside of second inlet tube with water through the first inlet tube that sets up, second inlet tube top and spiral pipe intercommunication, the spiral pipe is in the inside of heat conduction copper sheet, the area increase of spiral pipe and heat conduction copper sheet contact, it is more excellent to absorb the thermal effect that the heat conduction copper sheet transmitted from the mainboard, downcomer through setting up can be with the inside water input of each spiral pipe to the inside of gathering the water pipe, and then send water to the inside of wet return and flow into the inside of holding tank, the inside water of holding tank can flow back to the in-process of holding tank at the return pipe, dispel the heat in the inside of heating panel, the heating panel can outwards discharge the heat of wet return transportation in-process, the temperature just can reach the normal atmospheric temperature when rivers get back to the holding tank, be favorable to the water pump to carry out the heat with the inside water input of holding tank to water cooling mechanism's inside.
Preferably, the blocking mechanism comprises a rotating mechanism arranged on the side wall of the second water inlet pipe, an elastic baffle arranged on the rotating mechanism, and a clamping mechanism arranged on the elastic baffle, wherein the clamping mechanism is positioned above the rotating mechanism. The second inlet tube cross-section that is located the length section of blocking mechanism is square structure, plays the function that blocks to the rivers through the elastic baffle that sets up, makes blocking mechanism realize the pivoted through the slewing mechanism who sets up, realizes cutting apart the inside rivers of second inlet tube through the block mechanism that sets up to it is easy that the second inlet tube of being convenient for makes progress water delivery, and the water delivery is difficult downwards, and the water pump of being convenient for carries out water delivery.
Preferably, slewing mechanism is including fixing the commentaries on classics cover of second inlet tube lateral wall sets up at the pinhole that changes the cover inside and change round pin looks adaptation, change cover and change round pin swing joint, set up the pivot of changeing round pin tip, the lateral wall of pivot is connected with flexible baffle. The cooperation of changeing the cover and changeing the round pin through the setting can let the elastic baffle rotate to the condition of leaking can not appear in elastic baffle pivoted process, slewing mechanism connects and is the plane in second inlet tube both sides, makes the elastic baffle be convenient for rotate, and the junction that rotates back water moreover and can not follow and change the cover and change the round pin flows downwards, blocks that the effect is good.
Preferably, block mechanism is including fixing the first connecting plate and the second connecting plate of elastic baffle tip set up the fagging of the L shape structure of first connecting plate tip sets up the fagging tip is the joint of cylindrical structure, the bottom of joint is fixed with the joint post of downward bellied, the diameter of joint post is less than the diameter of joint, the joint post fills up with filling up groove assorted card, it is in to fill up the groove setting the surface of second connecting plate. Through the card pad that sets up and the block of packing up the groove to the realization is sealed, and difficult emergence dislocation, through the joint post and the laminating of packing up the groove that set up, it is sealed through the card pad.
Preferably, the elastic baffle is of an arc-shaped structure, and the thickness of the bottom of the elastic baffle is larger than that of the top of the elastic baffle. The rotation of the elastic baffle is facilitated.
A heat dissipation method of a Loongson computer mainboard based on a VPX standard specifically comprises the following steps:
preferably, the step one: the water inlet valve is connected with the thin water pipe, the water inlet valve is opened, water enters the water storage tank from the thin water pipe, the water pump is opened when the water in the water storage tank is full, the water pump inputs the water into the first water inlet pipe, the water can flow into the second water inlet pipe from the first water inlet pipe, the blocking mechanism in the second water inlet pipe can enable the water to move upwards and prevent the water from moving downwards, so that the water delivery of the water pump can be facilitated, when the water enters the second water inlet pipe, the elastic baffle in the second water inlet pipe is extruded by the water flow, the elastic baffle can rotate towards two sides, the rotating shaft at the bottom of the elastic baffle can rotate, the rotating pins at two ends of the rotating shaft can rotate in the pin holes in the rotating sleeve, when the water pumping is stopped, the first connecting plate and the second connecting plate are extruded by the water flow from top to bottom due to the arc-shaped structures, directly clamping the first connecting plate and the second connecting plate together, wherein the first connecting plate is positioned above the second connecting plate, so that the clamping column at the bottom of the clamping head at the end part of the first connecting plate is clamped into the pad groove, because the clamping pad is fixed at the bottom of the clamping joint, the clamping pad can be sealed with the pad groove, and water does not leak after sealing, thereby finishing preventing water from flowing backwards from the second water inlet pipe and entering the spiral pipe from the second water inlet pipe, therefore, a large amount of heat can be taken away by the spiral pipe in the heat conducting copper sheets, the heat radiating seam arranged on the heat conducting copper sheets can increase the heat radiating efficiency of the heat conducting copper sheets, the heat of the heat conducting copper sheets can enter a sewer pipe along with water flow, the sewer pipe inputs water into the water collecting pipe, the water collecting pipe collects and conveys the water into a water collecting pipe, and finally the water can enter a water return pipe with a flat structure from the water collecting pipe and flow into the water storage tank;
preferably, step two: when opening the water pump, air cooling mechanism also opens, make the fan rotate, the fan will be followed the fan-collecting cover and inputed the air supply opening with wind, it is inside that the bottom of fan-collecting cover covers the fan blade of fan, make the wind that the fan blew off can not run off, it becomes high to take away thermal efficiency, air supply opening and exhaust pipe all can blow to the bottom of mainboard, because the exhaust pipe is flat structure, the area of contact of exhaust pipe and mainboard is big, take away the heat of mainboard bottom very easily, the heat is discharged from the tip of exhaust pipe.
Compared with the prior art, the invention has the beneficial effects that:
the air cooling mechanism that sets up can be convenient for the device through the wind blow take away a large amount of heats that the mainboard produced, and the heat conduction copper sheet of mainboard end fixing can be with heat transfer for the heat conduction copper sheet from the mainboard, and the heat on some heat conduction copper sheets can be taken away through the heat dissipation seam to the heat conduction copper sheet, can also take away some heats through water cooling mechanism, just so can guarantee that the mainboard is in radiating state always, radiating effect preferred. The heat dissipation plate is convenient for play support and heat dissipation to the mainboard through the setting, and the steady operation of the mainboard of being convenient for provides sufficient support space through the support column that sets up, and the bottom of mainboard is sent into with wind to the mechanism of being convenient for air-cooled, and the bottom plate can be convenient for fix the quick-witted incasement portion at the computer. The mainboard of computer machine incasement portion cools off through the air cooling mechanism that sets up, and a large amount of heats can be taken away in the forced air cooling, through the flat exhaust pipe that sets up for the exhaust pipe contacts with the bottom of mainboard completely, thereby takes away a large amount of heats, can send into the inside of supply-air outlet with the wind that the flabellum blew off through the air-collecting cover that sets up.
Can input the inside of second inlet tube with water through the first inlet tube that sets up, second inlet tube top and spiral pipe intercommunication, the spiral pipe is in the inside of heat conduction copper sheet, the area increase of spiral pipe and heat conduction copper sheet contact, it is more excellent to absorb the thermal effect that the heat conduction copper sheet transmitted from the mainboard, downcomer through setting up can be with the inside water input of each spiral pipe to the inside of gathering the water pipe, and then send water to the inside of wet return and flow into the inside of holding tank, the inside water of holding tank can flow back to the in-process of holding tank at the return pipe, dispel the heat in the inside of heating panel, the heating panel can outwards discharge the heat of wet return transportation in-process, the temperature just can reach the normal atmospheric temperature when rivers get back to the holding tank, be favorable to the water pump to carry out the heat with the inside water input of holding tank to water cooling mechanism's inside. The control of the liquid flow is realized through the arranged rotating mechanism, the card and the mechanism, so that cold water can enter the inside of the spiral pipe but can not flow back from the second water inlet pipe, and hot water is prevented from being brought back to the inside of the second water inlet pipe; the fan assists the heat dissipation to the wet return of water cooling mechanism top at radiating in-process, and the wet return is inside all to take the hot water after the cooling back from the spiral pipe, and the fan cools off the wet return.
3. The second inlet tube cross-section that is located the length section of blocking mechanism is square structure, plays the function that blocks to the rivers through the elastic baffle that sets up, makes blocking mechanism realize the pivoted through the slewing mechanism who sets up, realizes cutting apart the inside rivers of second inlet tube through the block mechanism that sets up to it is easy that the second inlet tube of being convenient for makes progress water delivery, and the water delivery is difficult downwards, and the water pump of being convenient for carries out water delivery. The cooperation of changeing the cover and changeing the round pin through the setting can let the elastic baffle rotate to the condition of leaking can not appear in elastic baffle pivoted process, slewing mechanism connects and is the plane in second inlet tube both sides, makes the elastic baffle be convenient for rotate, and the junction that rotates back water moreover and can not follow and change the cover and change the round pin flows downwards, blocks that the effect is good. Through the card pad that sets up and the block of packing up the groove to the realization is sealed, and difficult emergence dislocation, through the joint post and the laminating of packing up the groove that set up, it is sealed through the card pad.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic overall perspective view of the present invention;
FIG. 2 is a second schematic view of the overall structure of the present invention;
FIG. 3 is a schematic view of the internal structure of the present invention;
FIG. 4 is a side sectional view of the present invention;
FIG. 5 is an enlarged view of the area A of FIG. 3;
FIG. 6 is an enlarged view of the detail of the area B in FIG. 3 according to the present invention;
FIG. 7 is an enlarged view of the detail of the area C in FIG. 4 according to the present invention;
FIG. 8 is an enlarged detail view of the area D in FIG. 5 according to the present invention;
FIG. 9 is an enlarged view of the detail of the area E in FIG. 8 according to the present invention;
FIG. 10 is a schematic view of the rotating mechanism of the present invention;
in the figure: 1. a thermally conductive copper sheet; 2. heat dissipation seams; 3. a dragon chip; 4. a main board; 5. a water cooling mechanism; 51. a water pump; 52. a water storage tank; 53. a first water inlet pipe; 54. a second water inlet pipe; 55. a spiral tube; 56. a water inlet valve; 57. a water collecting pipe; 58. a water collection pipe; 59. a sewer pipe; 510. an elastic baffle plate; 511. rotating the pin; 512. rotating the sleeve; 513. a first connecting plate; 514. a supporting plate; 515. a clamping head; 516. a clamping column; 517. a pad groove; 518. a clamping pad; 519. a second connecting plate; 520. a rotating shaft; 521. a pin hole; 522. a water return pipe; 6. an air cooling mechanism; 61. a fan; 62. a fan blade; 63. a wind collecting cover; 64. an exhaust duct; 65. an air supply outlet; 7. a support frame; 8. a heat dissipation plate; 9. a pillar; 10. a base plate.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-10, a godson computer motherboard based on VPX standard includes a motherboard 4, a godson chip 3 disposed on the surface of the motherboard 4, an air cooling mechanism 6 disposed below the motherboard 4, a water cooling mechanism 5 disposed below the motherboard 4 and above the air cooling mechanism 6, a plurality of heat-conducting copper sheets 1 disposed at the end of the motherboard 4 and fixed to the motherboard 4, a heat-dissipating plate 8 disposed at the bottom of the motherboard 4 for supporting the motherboard 4, the bottom of the heat-conducting copper sheets 1 is fixed on the surface of the heat-dissipating plate 8, a heat-dissipating seam 2 for dissipating heat is disposed between every two heat-conducting copper sheets 1, a support frame 7 fixed to a support column 9 is disposed below the heat-dissipating plate 8, and a bottom plate 10 for stabilizing the support column 9 is disposed at the bottom of the support column 9. Can be convenient for the device through the wind cooling mechanism 6 that sets up blow away a large amount of heats that the mainboard produced through wind, heat conduction copper sheet 1 of 4 end fixing of mainboard can be with heat from the mainboard pass on for heat conduction copper sheet 1, heat on heat conduction copper sheet 1 can take away some heat conduction copper sheet 1 through heat dissipation seam 2, can also take away some heat through water cooling mechanism 5, just so can guarantee that mainboard 4 is in radiating state always, radiating effect preferred. The heat dissipation plate 8 is convenient for play support and heat dissipation to mainboard 4 through the setting, and the steady operation of mainboard 4 of being convenient for provides sufficient support space through the support column 9 that sets up, and the bottom of mainboard 4 is sent into with wind to the mechanism 6 of being convenient for air-cooled, and bottom plate 10 can be convenient for fix the quick-witted incasement portion at the computer.
Specifically, the air cooling mechanism 6 includes a fan 61 fixed above the support frame 7, a fan blade 62 disposed on the top of the fan 61, an air collecting cover 63 disposed inside the heat dissipating plate 8, an air supply opening 65 disposed on the top of the air collecting cover 63, and an exhaust duct 64 disposed on one side of the air supply opening 65 and communicated with the air supply opening 65. The mainboard 4 inside the computer case is cooled by the air cooling mechanism which is arranged, a large amount of heat can be taken away by air cooling, the air supply opening 65 and the exhaust pipe 64 are completely contacted with the bottom of the mainboard 4 through the flat air supply opening 65 which is arranged, a large amount of heat is taken away, and air blown out by the fan blades 62 can be sent into the air supply opening 65 through the air collecting cover 63 which is arranged.
Specifically, the water cooling mechanism 5 includes a water pump 51 fixed on the support frame 7, a water storage tank 52 arranged at the top of the water pump 51, the water storage tank 52 is fixed at the bottom of the heat dissipation plate 8, a first water inlet pipe 53 arranged above the water storage tank 52, a second water inlet pipe 54 arranged at one end of the first water inlet pipe 53 and located inside the heat conduction copper sheet 1, a blocking mechanism arranged inside the second water inlet pipe 54 and used for blocking water backflow, a spiral pipe 55 arranged on one side of the second water inlet pipe 54 and communicated with the second water inlet pipe 54 at the top, the spiral pipe 55 is located inside the heat conduction copper sheet 1, a sewer pipe 59 arranged at the bottom of the spiral pipe 55 and located inside the heat dissipation plate 8, and each sewer pipe 59 is connected with a collective water pipe 57 through a water collection pipe. The collective water pipe 57 is connected to the return pipe 522, the return pipe 522 is connected to the water reservoir 52, a water pipe for water intake is provided on the side wall of the water reservoir 52, and a water intake valve 56 for controlling the amount of water intake is provided on the water pipe, and the water intake valve 56 is fixed to the side wall of the heat radiating plate 8. The water can be input into the second water inlet pipe 54 through the arranged first water inlet pipe 53, the top of the second water inlet pipe 54 is communicated with the spiral pipe 55, the spiral pipe 55 is arranged inside the heat-conducting copper sheet 1, the contact area between the spiral pipe 55 and the heat-conducting copper sheet 1 is increased, the effect of absorbing the heat transferred from the mainboard 4 by the heat-conducting copper sheet 1 is better, the water inside each spiral pipe 55 can be input to the inside of the collective water pipe 57 through the provided downcomer 59, and then, the water is sent to the inside of the return pipe 522 to flow into the inside of the water storage tank 52, the water inside the water storage tank 52 flows back to the water storage tank 52 through the return pipe 522, the heat dissipation is performed inside the heat dissipation plate 8, the heat dissipation plate 8 can discharge the heat during the transportation process of the return pipe 522 to the outside, when the water returns to the water storage tank 52, the temperature of the water can reach the normal temperature, which is favorable for the water pump 51 to input the water in the water storage tank 52 into the water cooling mechanism 5 for heat dissipation.
Specifically, the blocking mechanism includes a rotating mechanism disposed on the sidewall of the second water inlet pipe 54, an elastic baffle 510 disposed on the rotating mechanism, and a clamping mechanism disposed on the elastic baffle 510, and the clamping mechanism is located above the rotating mechanism. The second inlet tube cross-section that is located the length section of blocking mechanism is square structure, plays the function that blocks to rivers through the elastic baffle 510 that sets up, makes blocking mechanism realize the pivoted through the slewing mechanism who sets up, realizes cutting apart the inside rivers of second inlet tube 54 through the block mechanism that sets up to it is easy that the second inlet tube 54 of being convenient for makes progress water delivery, and water delivery is difficult downwards, and the water pump 51 of being convenient for carries out water delivery.
Specifically, the rotating mechanism comprises a rotating sleeve 512 fixed on the side wall of the second water inlet pipe 54, a pin hole 521 arranged in the rotating sleeve 512 and matched with the rotating pin 511, the rotating sleeve 512 is movably connected with the rotating pin 511, a rotating shaft 520 arranged at the end part of the rotating pin 511, and the side wall of the rotating shaft 520 is connected with an elastic baffle 510. The cooperation through the commentaries on classics cover 512 that sets up and commentaries on classics round pin 511 can let elastic baffle 510 rotate to the condition that can not appear leaking at elastic baffle 510 pivoted process, slewing mechanism connects and is the plane in second inlet tube 54 both sides, makes elastic baffle 511 be convenient for rotate, and the water can not follow commentaries on classics cover 512 and commentaries on classics round pin 511 junction downflow after rotating moreover, and it is good to block the effect.
Specifically, block mechanism is including fixing first connecting plate 513 and the second connecting plate 519 at elastic baffle 510 tip, the fagging 514 of the L shape structure of setting at first connecting plate 513 tip, the setting is the joint 515 of cylindrical structure at fagging 514 tip, the bottom of joint 515 is fixed with the joint post 516 of downward bellied, the diameter of joint post 516 is less than the diameter of joint 515, joint post 516 and pad groove 517 assorted card pad 518, pad groove 517 sets up the surface at second connecting plate 519. Through the card pad 518 and the block that fills up the groove 517 that set up to realize sealed, and difficult emergence dislocation, through the joint post 516 that sets up and the laminating of filling up the groove, it is sealed through card pad 518.
Specifically, the elastic baffle 510 is a circular arc structure, and the thickness of the bottom of the elastic baffle 510 is greater than the thickness of the top. The rotation of the elastic baffle 510 is facilitated, and the sealing effect is better.
The working principle is as follows: first, the water inlet valve 56 is connected to the thin water pipe, the water inlet valve 56 is opened to allow water to enter the water storage tank 52 from the thin water pipe, the water pump 51 is opened when the water storage tank 52 is full of water, the water pump 51 inputs water into the first water inlet pipe 53, the water flows into the second water inlet pipe 54 from the first water inlet pipe 53, the blocking mechanism inside the second water inlet pipe 54 allows the water to move upwards and prevents the water from moving downwards, so that the water delivery of the water pump 51 is facilitated, when the water enters the second water inlet pipe 54, the elastic baffle 510 inside the second water inlet pipe 54 is pressed by the water flow, so that the elastic baffle 510 can rotate towards two sides, the rotating shaft 520 at the bottom of the elastic baffle 510 rotates, the rotating pins 511 at two ends of the rotating shaft 520 rotate inside the pin holes 521 inside the rotating sleeve 512, and when the water pumping is stopped, the first connecting plate 513 and the second connecting plate 519 are arc-shaped structures, the first connecting plate 513 and the second connecting plate 519 are directly clamped together under the extrusion of water flow from top to bottom in the second water inlet pipe 54, the first connecting plate 513 is located above the second connecting plate 519, so that the clamping column 516 at the bottom of the clamping head 515 at the end of the first connecting plate 513 is clamped into the pad groove 517, as the clamping pad 518 is fixed at the bottom of the clamping head 515, the clamping pad 518 can be sealed with the pad groove 517 and is not leaked after sealing, the water backflow from the second water inlet pipe 54 is prevented, the water can enter the spiral pipe 55 from the second water inlet pipe 54, so that the spiral pipe 55 takes away heat in the heat-conducting copper sheet 1, the heat-radiating seam 2 arranged on the heat-conducting copper sheet 1 can increase the heat-radiating efficiency of the heat-conducting copper sheet 1, the heat of the heat-conducting copper sheet 1 can be input into the second water inlet pipe 54 through the blocking mechanism along with the water flow from the first water inlet pipe 53, the second water inlet pipe, the spiral pipe adopts helical structure for the area of spiral pipe and copper sheet contact is big, and water from the spiral pipe 55 bottom outflow enters into downcomer 59, and downcomer 59 inputs the inside of collector pipe 58 with water, and collector pipe 58 can be gathered water and is carried the inside of gathering water pipe 57, and last water can flow into the inside that water storage tank 52 was flowed into to wet return 522 that gathers water pipe 57 flat structure, realizes the circulation flow of water, takes away the inside heat of copper sheet.
When opening water pump 51, air cooling mechanism 6 also opens, make fan 61 rotate, fan 61 can be with wind from the fan housing 63 input to air supply opening 65, it is inside that fan housing 63's bottom covers fan blade 62 of fan 61, make the wind that fan 61 blew out can not run off, it becomes high to take away thermal efficiency, air supply opening 65 and the 64 pipe of airing exhaust all can blow to mainboard 4's bottom, because exhaust pipe 64 is flat structure, take away the heat of mainboard 4 bottom very easily, the heat is discharged from the tip of exhaust pipe 64, air cooling mechanism is blowing and is taken away the heat on the dragon chip 3 simultaneously, can also blow for wet return 522, flat structure's wet return 522 is because heat radiating area is big, can take away a large amount of heat when air cooling mechanism bloies, thereby can assist the cooling to water cooling mechanism.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (6)
1. The Loongson computer mainboard based on the VPX standard is characterized by comprising a mainboard (4), a Loongson chip (3) arranged on the surface of the mainboard (4), an air cooling mechanism (6) arranged below the mainboard (4), a water cooling mechanism (5) arranged below the mainboard (4) and positioned above the air cooling mechanism (6), a plurality of heat-conducting copper sheets (1) arranged at the end part of the mainboard (4) and fixed with the mainboard (4), a heat-radiating plate (8) arranged at the bottom of the mainboard (4) and used for supporting the mainboard (4), wherein the bottom of each heat-conducting copper sheet (1) is fixed on the surface of the heat-radiating plate (8), a heat-radiating seam (2) used for radiating is arranged between every two heat-conducting copper sheets (1), a supporting frame (7) fixed on a supporting column (9) is arranged below the heat-radiating plate (8), a bottom plate (10) for stabilizing the support post (9) is arranged at the bottom of the support post (9);
the air cooling mechanism (6) comprises a fan (61) fixed above the support frame (7), fan blades (62) arranged at the top of the fan (61), a wind collecting cover (63) arranged inside the heat dissipation plate (8), an air supply outlet (65) arranged at the top of the wind collecting cover (63), and an exhaust pipe (64) arranged on one side of the air supply outlet (65) and communicated with the air supply outlet (65);
the water cooling mechanism (5) comprises a water pump (51) fixed on the support frame (7), a water storage tank (52) arranged at the top of the water pump (51), the water storage tank (52) is fixed at the bottom of the heat dissipation plate (8), a first water inlet pipe (53) arranged above the water storage tank (52), a second water inlet pipe (54) arranged at one end of the first water inlet pipe (53) and positioned inside the heat conduction copper sheet (1), a blocking mechanism arranged inside the second water inlet pipe (54) and used for blocking water backflow, a spiral pipe (55) arranged at one side of the second water inlet pipe (54) and communicated with the second water inlet pipe (54) at the top, the spiral pipe (55) is positioned inside the heat conduction copper sheet (1), and a sewer pipe (59) arranged at the bottom of the spiral pipe (55) and positioned inside the heat dissipation plate (8), each sewer pipe (59) is connected with a water collecting pipe (57) through a water collecting pipe (58), the water collecting pipe (57) is connected with a water return pipe (522), the water return pipe (522) is communicated with the water storage tank (52), a thin water pipe which is arranged on the side wall of the water storage tank (52) and used for water inlet, a water inlet valve (56) which is arranged on the thin water pipe and used for controlling water inlet amount, and the water inlet valve (56) is fixed on the side wall of the heat dissipation plate (8).
2. A VPX standard based Loongson computer motherboard according to claim 1, wherein the blocking mechanism comprises a rotating mechanism disposed on the sidewall of the second water inlet pipe (54), an elastic baffle plate (510) disposed on the rotating mechanism, a snap mechanism disposed on the elastic baffle plate (510), and the snap mechanism is located above the rotating mechanism.
3. A VPX standard-based Loongson computer mainboard as claimed in claim 2, wherein the rotating mechanism comprises a rotating sleeve (512) fixed on the side wall of the second water inlet pipe (54), a pin hole (521) arranged inside the rotating sleeve (512) and matched with a rotating pin (511), the rotating sleeve (512) is movably connected with the rotating pin (511), a rotating shaft (520) is arranged at the end of the rotating pin (511), and the side wall of the rotating shaft (520) is connected with an elastic baffle plate (510).
4. A VPX standard-based Loongson computer motherboard according to claim 2, wherein the clamping mechanism comprises a first connecting plate (513) and a second connecting plate (519) fixed at the end of the elastic baffle (510), a supporting plate (514) with an L-shaped structure arranged at the end of the first connecting plate (513), a clamping head (515) with a cylindrical structure arranged at the end of the supporting plate (514), a clamping column (516) protruding downwards is fixed at the bottom of the clamping head (515), the diameter of the clamping column (516) is smaller than that of the clamping head (515), the clamping column (516) is provided with a clamping pad (518) matched with a pad groove (517), and the pad groove (517) is arranged on the surface of the second connecting plate (519).
5. A VPX standard-based Loongson computer motherboard as recited in claim 4, wherein the elastic baffle (510) is of a circular arc structure, and the thickness dimension of the bottom of the elastic baffle (510) is larger than that of the top.
6. The Loongson computer motherboard based on the VPX standard as claimed in claim 1, wherein the operating method of the Loongson computer motherboard specifically comprises the following steps:
the method comprises the following steps: the water inlet valve (56) is connected with the thin water pipe, the water inlet valve (56) is opened, water enters the water storage tank (52) from the thin water pipe, the water pump (51) is opened when the water in the water storage tank (52) is full, the water pump (51) inputs the water into the first water inlet pipe (53), the water can flow into the second water inlet pipe (54) from the first water inlet pipe (53), the blocking mechanism in the second water inlet pipe (54) can enable the water to move upwards and prevent the water from moving downwards, so that the water delivery of the water pump (51) is facilitated, when the water enters the second water inlet pipe (54), because the elastic baffle (510) in the second water inlet pipe (54) is extruded by the water flow, the elastic baffle (510) can rotate towards two sides, the rotating shaft (520) at the bottom of the elastic baffle (510) can rotate, the rotating pins (511) at two ends of the rotating shaft (520) can rotate in the pin hole (521) in the rotating sleeve (512), when the water pumping is stopped, the first connecting plate (513) and the second connecting plate (519) are in an arc-shaped structure and are extruded by water flow in the second water inlet pipe (54) from top to bottom, the first connecting plate (513) and the second connecting plate (519) are directly clamped together, the first connecting plate (513) is positioned above the second connecting plate (519), a clamping column (516) at the bottom of a clamping joint (515) at the end part of the first connecting plate (513) is clamped into a pad groove (517), a clamping pad (518) is fixed at the bottom of the clamping joint (515), the clamping pad (518) can be sealed with the pad groove (517), water is not leaked after sealing, the water is prevented from flowing backwards from the second water inlet pipe (54) downwards, the water can enter the spiral pipe (55) from the second water inlet pipe (54), the spiral pipe (55) takes away heat in the copper sheet (1), and the heat radiation seam (2) arranged in the heat conduction pipe (1) can increase the heat radiation efficiency of the copper sheet (1), the heat of the heat-conducting copper sheets (1) can be input into a second water inlet pipe (54) from a first water inlet pipe (53) through a blocking mechanism along with water flow, the second water inlet pipe (54) inputs water into the interior of a spiral pipe (55), the spiral pipe adopts a spiral structure, so that the contact area between the spiral pipe and the copper sheets is large, water flowing out of the bottom of the spiral pipe (55) enters a sewer pipe (59), the sewer pipe (59) inputs the water into a water collecting pipe (58), the water collecting pipe (58) can collect and convey the water into a water collecting pipe (57), and finally the water can enter a water return pipe (522) of a flat structure from the water collecting pipe (57) and flow into a water storage tank (52), so that the circulating flow of the water is realized, and the heat in the copper sheets (1) is taken away;
step two: when the water pump (51) is turned on, the air cooling mechanism (6) is also turned on, so that the fan (61) rotates, the fan (61) can input wind into the wind feeding port (65) from the wind collecting cover (63), the bottom of the wind collecting cover (63) covers fan blades (62) of the fan (61) into the air collecting cover, the wind feeding port (65) and the exhaust pipe (64) can blow wind to the bottom of the main board (4), the exhaust pipe (64) is of a flat structure, and heat is discharged from the end part of the exhaust pipe (64).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911296956.XA CN110727328B (en) | 2019-12-17 | 2019-12-17 | Loongson computer mainboard based on VPX standard |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911296956.XA CN110727328B (en) | 2019-12-17 | 2019-12-17 | Loongson computer mainboard based on VPX standard |
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| CN110727328B true CN110727328B (en) | 2020-04-14 |
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| CN111007934B (en) * | 2020-03-11 | 2020-05-22 | 北京中航科电测控技术股份有限公司 | Rack-mounted server mainboard based on Loongson 3A4000 |
| CN111459257B (en) * | 2020-06-22 | 2020-09-18 | 北京中航科电测控技术股份有限公司 | Reinforced computer board card with thermal protection structure and use method thereof |
| CN111800938A (en) * | 2020-07-29 | 2020-10-20 | 东莞权利得工业设计有限公司 | PCB substrate with heat dissipation structure and working method thereof |
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| CN201461202U (en) * | 2009-05-08 | 2010-05-12 | 四川华电科技投资实业有限责任公司 | Circulating water cooling device of hydraulic turbine generator unit in hydropower station |
| CN207976809U (en) * | 2018-01-16 | 2018-10-16 | 闫志文 | A kind of computer hardware Special heat dissipating cabinet |
| CN209248443U (en) * | 2018-11-01 | 2019-08-13 | 西安诚安嵌入式计算机技术有限公司 | A kind of heat radiation device for computer case with water cooling function |
| CN109557989B (en) * | 2018-12-06 | 2019-09-13 | 邢国政 | A kind of computer temperature control device |
| CN208922200U (en) * | 2018-12-17 | 2019-05-31 | 石家庄臻蓝创业孵化器有限公司 | A kind of double radiator structures of desktop computer |
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