CN218104045U - PCB mainboard that heat dispersion is good - Google Patents
PCB mainboard that heat dispersion is good Download PDFInfo
- Publication number
- CN218104045U CN218104045U CN202222413000.7U CN202222413000U CN218104045U CN 218104045 U CN218104045 U CN 218104045U CN 202222413000 U CN202222413000 U CN 202222413000U CN 218104045 U CN218104045 U CN 218104045U
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- heat dissipation
- fixedly connected
- seted
- mounting bracket
- pcb
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- 239000006185 dispersion Substances 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 55
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 239000002826 coolant Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 230000006978 adaptation Effects 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a PCB mainboard that heat dispersion is good relates to PCB mainboard heat dissipation technical field, which comprises a mounting bracket, top one side fixedly connected with connecting block of mounting bracket, the connecting block internal rotation is connected with the pivot, the same clamp plate of the equal fixedly connected with in both ends of pivot, the connector has been seted up on the clamp plate, the equal fixedly connected with fixed block in bottom both sides of clamp plate, two four installing ports have all been seted up to one side of fixed block, equal fixedly connected with motor in four installing ports, four the output of motor is all fixed the heat dissipation fan that has cup jointed. The utility model discloses when using, fixedly connected with a plurality of connecting rod in the recess that the mounting bracket was seted up, the top of connecting rod is provided with the heating panel, the top and the PCB mainboard sliding connection of heating panel, and be provided with the cooling tube in the heating panel, and the flow has high performance heat conduction coolant liquid in the cooling tube, makes the motor drive the heat dissipation fan and carries out quick heat dissipation to it through the vent.
Description
Technical Field
The utility model relates to a PCB mainboard heat dissipation technical field, in particular to PCB mainboard that heat dispersion is good.
Background
The PCB is called a printed circuit board, also called a printed circuit board, and is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. The PCB mainboard is the control unit carrier among all kinds of electronic equipment, especially in devices such as computer, and the working strength of mainboard is bigger, also can produce a large amount of heats, needs to install heat radiation structure on the PCB mainboard and realizes the heat dissipation.
For example, chinese patent publication No. CN216414956U discloses a PCB main board device beneficial to heat dissipation, and relates to a PCB main board heat dissipation device, which includes a support frame and a main board, wherein the main board is disposed on an upper surface of the support frame, a lower support frame is hinged to the upper surface of the support frame, and a first cooling device is disposed on one side of the lower support frame facing the main board; the support frame lower surface is provided with the second heat sink that provides the cooling for the mainboard lower surface, and this application discloses a realization has guaranteed the normal operating of equipment to the radiating operation of mainboard structure, has increased the life of PCB mainboard, prevents to generate heat and causes the influence to the performance of PCB mainboard, has increased the degree of automation of equipment, has guaranteed that work efficiency is not influenced does benefit to radiating PCB mainboard device.
However, in the present case, the mainboard is mutually supported through cooling fan and cooling water tank, dispels the heat to the PCB mainboard of installing on the support frame, nevertheless is using cooling water tank to carry out the in-process that cools down to the PCB board, and water stain can appear in the cooling water tank, produces certain influence to the work of PCB mainboard. Therefore, the PCB mainboard that heat dispersion is good that this application provides satisfies the demand.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a PCB mainboard that heat dispersion is good to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the present application provides the following technical solutions: the utility model provides a PCB mainboard that heat dispersion is good, includes the mounting bracket, top one side fixedly connected with connecting block of mounting bracket, the connecting block internal rotation is connected with the pivot, the same clamp plate of the equal fixedly connected with in both ends of pivot, the connector has been seted up on the clamp plate, the equal fixedly connected with fixed block in bottom both sides of clamp plate, two four installing ports have all been seted up to one side of fixed block, equal fixedly connected with motor in four installing ports, four the equal fixed heat dissipation fan that has cup jointed of output of motor, a plurality of vent has all been seted up to the both sides of mounting bracket, the installing port that fixed block one side was seted up and the vent looks adaptation that the mounting bracket both sides were seted up, set up flutedly on the mounting bracket, a plurality of connecting rod of top fixedly connected with of recess, a plurality of the same heating panel of the equal fixedly connected with in top of connecting rod, fixedly connected with cooling tube in the heating panel, the top sliding connection of heating panel has the PCB mainboard.
Preferably, four the motor and the heat dissipation fan are distributed at one side of the fixed block at equal intervals, and the motor and the heat dissipation fan are matched with four mounting holes formed in the fixed block.
Preferably, the radiating plate is internally and fixedly connected with a radiating pipe, and heat conducting cooling liquid is arranged in the radiating pipe.
Preferably, the pressing plate is rotatably connected with the mounting frame through a rotating shaft, and the angle range of motion between the pressing plate and the mounting frame is zero to one hundred fifty degrees.
Preferably, the connecting rods are distributed in the groove formed in the mounting frame at equal intervals, and one end of each connecting rod is fixedly connected with the heating panel.
Preferably, the PCB main board is matched with a connecting port formed in the pressing plate.
To sum up, the utility model discloses a technological effect and advantage:
1. the utility model discloses it is rational in infrastructure, when the PCB mainboard need dispel the heat in the use, motor and heat dissipation fan in the fixed block through clamp plate bottom both sides fixed connection, the vent of seting up with the mounting bracket both sides cooperates, dispel the heat to the PCB mainboard, a plurality of connecting rod of fixedly connected with in the recess that the mounting bracket was seted up simultaneously, the top of connecting rod is provided with the heating panel, the top and the PCB mainboard sliding connection of heating panel, and be provided with the cooling tube in the heating panel, it has high performance heat conduction coolant liquid to flow in the cooling tube, make the motor drive heat dissipation fan carry out quick heat dissipation to it through the vent, prevent to generate heat and lead to the fact the influence to the performance of PCB mainboard, the degree of automation of equipment has been increased, it is not influenced to have guaranteed work efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic perspective view of a PCB main board with good heat dissipation performance;
FIG. 2 is an expanded view of a three-dimensional structure of a PCB motherboard with good heat dissipation performance;
FIG. 3 is a schematic view of a three-dimensional connection structure of a heat dissipation fan structure in a PCB motherboard with good heat dissipation performance;
FIG. 4 is a schematic view of a three-dimensional connection structure of a mounting bracket structure in a PCB motherboard with good heat dissipation performance;
fig. 5 is a schematic view of a three-dimensional connection structure of a heat dissipation plate in a PCB motherboard with good heat dissipation performance.
In the figure: 1. a mounting frame; 2. a PCB main board; 3. pressing a plate; 4. a fixed block; 5. a motor; 6. a vent; 7. a heat dissipation fan; 8. a rotating shaft; 9. a heat dissipation plate; 10. a connecting rod; 11. a radiating pipe; 12. a connecting port; 13. and (7) connecting the block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b): referring to fig. 1-5, a PCB main board with good heat dissipation performance comprises a mounting rack 1, a connecting block 13 is fixedly connected to one side of the top of the mounting rack 1, a rotating shaft 8 is rotatably connected to the connecting block 13, two ends of the rotating shaft 8 are fixedly connected to a same pressing plate 3, a connecting port 12 is formed on the pressing plate 3, two sides of the bottom of the pressing plate 3 are fixedly connected to fixed blocks 4, four mounting ports are formed on one side of the two fixed blocks 4, motors 5 are fixedly connected to the four mounting ports, heat dissipation fans 7 are fixedly sleeved on output ends of the four motors 5, a plurality of ventilation ports 6 are formed on two sides of the mounting rack 1, a mounting port formed on one side of the fixed block 4 is matched with the ventilation ports 6 formed on two sides of the mounting rack 1, a groove is formed on the mounting rack 1, a plurality of connecting rods 10 are fixedly connected to the top of the groove, a plurality of heat dissipation plates 9 are fixedly connected to the top of the connecting rods 10, a heat dissipation pipe 11 is fixedly connected to the top of the PCB main board 2, when the PCB main board is required to dissipate heat, the heat generated by the heat dissipation fans 9, the heat generated by the heat dissipation fans, the heat dissipation devices, the heat dissipation pipes 10, the heat dissipation devices are connected to the heat dissipation plates, the heat dissipation devices, the heat dissipation fans 9, the heat dissipation devices are provided with the heat dissipation pipes 10, and the heat dissipation devices, the work efficiency is not affected.
Referring to fig. 1-3, four motors 5 and heat dissipation fans 7 are equidistantly distributed on one side of the fixing block 4, the motors 5 and the heat dissipation fans 7 are adapted to four mounting ports formed on the fixing block 4, and the heat dissipation fans 7 work synchronously, thereby greatly improving the heat dissipation performance of the PCB motherboard.
Referring to fig. 4 and 5, a heat dissipating pipe 11 is fixedly connected to the heat dissipating plate 9, and a heat conducting cooling liquid is disposed in the heat dissipating pipe 11, and the heat conducting cooling liquid can rapidly dissipate heat transmitted by the heat dissipating plate 9 without generating water stain on the periphery of the heat conducting pipe.
Referring to fig. 1, 2 and 4, the pressing plate 3 is rotatably connected to the mounting bracket 1 through a rotating shaft 8, and the angle range of motion between the pressing plate 3 and the mounting bracket 1 is zero to one hundred fifty degrees, so that the PCB motherboard can be mounted and dismounted through the movable pressing plate 3.
Please refer to fig. 1, fig. 2, fig. 4 and fig. 5 show, a plurality of connecting rod 10 is the equidistance in the recess that mounting bracket 1 was seted up and distributes, and the one end and the heating panel 9 fixed connection of a plurality of connecting rod 10, realized the circulation of air to PCB mainboard 2 below, can spread the heat that PCB mainboard 2 distributed out, thereby prevent that the heat from piling up and leading to the rising of temperature, the cooling effect of PCB mainboard 2 has been increased, the realization is to the quick conduction of PCB mainboard 2 upper temperature.
This practical theory of operation: the installation and the use of the device are subject to relevant safety regulations, and misoperation is avoided. This device is when using, when the PCB mainboard need dispel the heat in the use, motor 5 and heat dissipation fan 7 in 3 bottom both sides fixed connection's of clamp plate fixed block 4, the vent 6 that a plurality of heat dissipation fan 7 synchronous workings and mounting bracket 1 both sides were seted up cooperatees, dispel the heat to the PCB mainboard, the heat dispersion of PCB mainboard has been improved greatly, fixedly connected with a plurality of connecting rod 10 in the recess that mounting bracket 1 was seted up simultaneously, the top of connecting rod 10 is provided with heating panel 9, realized the circulation of air to PCB mainboard below, can spread the heat that the PCB mainboard distributes, thereby prevent that the heat from piling up and leading to the rising of temperature, the cooling effect of PCB mainboard has been increased, realize the quick conduction to temperature on the PCB mainboard, top and PCB mainboard sliding connection of heating panel 9, and be provided with cooling tube 11 in the heating panel 9, it has high performance heat conduction coolant liquid to flow in the cooling tube 1, make the motor drive heat dissipation fan 7 carry out quick heat dissipation to it through vent 6, prevent to generate heat and cause the influence to the performance of PCB mainboard, the degree of automation of equipment has been increased, work efficiency is not influenced.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. The utility model provides a PCB mainboard that heat dispersion is good, includes mounting bracket (1), top one side fixedly connected with connecting block (13) of mounting bracket (1), the internal rotation of connecting block (13) is connected with pivot (8), the same clamp plate (3) of the equal fixedly connected with in both ends of pivot (8), connector (12), its characterized in that have been seted up on clamp plate (3): the equal fixedly connected with fixed block in bottom both sides (4) of clamp plate (3), two four installing ports have all been seted up to one side of fixed block (4), equal fixedly connected with motor (5) in four installing ports, four the output of motor (5) is all fixed to have cup jointed heat dissipation fan (7), a plurality of vent (6) have all been seted up to the both sides of mounting bracket (1), vent (6) looks adaptation that the installing port that fixed block (4) one side was seted up and mounting bracket (1) both sides were seted up, set up flutedly on mounting bracket (1), the top fixedly connected with a plurality of connecting rod (10) of recess, a plurality of the equal fixedly connected with in top of connecting rod (10) is same heating panel (9), fixedly connected with cooling tube (11) in heating panel (9), the top sliding connection of heating panel (9) has PCB mainboard (2).
2. The PCB main board with good heat dissipation performance of claim 1, wherein: four motor (5) and heat dissipation fan (7) are the equidistance and distribute in one side of fixed block (4), and motor (5) and heat dissipation fan (7) and four installing port looks adaptations that fixed block (4) were seted up.
3. The PCB main board with good heat dissipation performance of claim 1, wherein: fixedly connected with cooling tube (11) in heating panel (9), be provided with heat conduction coolant liquid in cooling tube (11).
4. The PCB main board with good heat dissipation performance of claim 1, wherein: the pressing plate (3) is rotatably connected with the mounting rack (1) through a rotating shaft (8), and the angle range of motion between the pressing plate (3) and the mounting rack (1) is zero to one hundred fifty degrees.
5. The PCB main board with good heat dissipation performance of claim 1, wherein: the connecting rods (10) are distributed in the grooves formed in the mounting rack (1) at equal intervals, and one ends of the connecting rods (10) are fixedly connected with the heat dissipation plate (9).
6. The PCB main board with good heat dissipation performance of claim 1, wherein: the PCB main board (2) is matched with a connecting port (12) formed in the pressing plate (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222413000.7U CN218104045U (en) | 2022-09-13 | 2022-09-13 | PCB mainboard that heat dispersion is good |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202222413000.7U CN218104045U (en) | 2022-09-13 | 2022-09-13 | PCB mainboard that heat dispersion is good |
Publications (1)
Publication Number | Publication Date |
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CN218104045U true CN218104045U (en) | 2022-12-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202222413000.7U Active CN218104045U (en) | 2022-09-13 | 2022-09-13 | PCB mainboard that heat dispersion is good |
Country Status (1)
Country | Link |
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CN (1) | CN218104045U (en) |
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2022
- 2022-09-13 CN CN202222413000.7U patent/CN218104045U/en active Active
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Legal Events
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 518000 Building 1, Jiangbian Industrial Zone, Songgang street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongyi Trading Tai Circuit Co.,Ltd. Country or region after: China Address before: 518105 Building 1, Jiangbian Industrial Zone, Songgang street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN TTE CIRCUIT LTD. Country or region before: China |
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CP03 | Change of name, title or address |