CN216413110U

CN216413110U - High-efficiency high-temperature-resistant light-emitting diode

Info

Publication number: CN216413110U
Application number: CN202123003206.4U
Authority: CN
Inventors: 王爱华; 张金国
Original assignee: Shenzhen Huachuangwei Photoelectric Co ltd
Current assignee: Shenzhen Huachuangwei Photoelectric Co ltd
Priority date: 2021-12-01
Filing date: 2021-12-01
Publication date: 2022-04-29
Anticipated expiration: 2031-12-01

Abstract

The utility model discloses a high-efficiency high-temperature-resistant light-emitting diode which comprises a shell, wherein a cavity is formed in the shell, a transparent epoxy resin layer is fixedly connected to the cavity of the shell, a cathode frame and an anode frame are respectively and fixedly connected to two sides of the bottom end of the cavity of the shell, a cathode bowl is formed in the top end of the cathode frame, a wafer is fixedly connected to the cathode bowl of the cathode frame, a circular cavity is formed in the bottom end of the shell, a wiring board is fixedly connected to the inner wall of the top end of the circular cavity of the shell, circular through holes are formed in two sides of the bottom end of the shell, pins are fixedly connected to the circular through holes of the shell, the top ends of the pins are fixedly connected with wiring terminals, the diameter of the wiring terminals is equal to the distance between the pins and the wiring board, and a sliding ring is slidably connected to the outer portion of the bottom end of the shell. According to the utility model, by arranging the wiring terminal and the pin, when the device is pulled by the outside, the normal connection of the internal cathode frame and the internal anode frame is not damaged, and the practicability of the device is improved.

Description

High-efficiency high-temperature-resistant light-emitting diode

Technical Field

The utility model relates to the technical field of high-efficiency high-temperature-resistant light-emitting diodes, in particular to a high-efficiency high-temperature-resistant light-emitting diode.

Background

A light emitting diode, referred to As an LED for short, is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc., and emits visible light when electrons and holes are recombined, and thus can be used to make a light emitting diode. In circuits and instruments as indicator lights or to form text or numerical displays.

Through retrieval, the pins of the conventional efficient heat-resistant light-emitting diode may need to be straightened in advance when the light-emitting diode is used, but when the pins are straightened, the internal parts of the pins are loosened due to overlarge external traction force, so that the normal operation of the device is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a high-efficiency high-temperature-resistant light-emitting diode.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a high-efficient high temperature resistant emitting diode, includes the shell, the inside cavity of having seted up of shell, the shell is at the transparent epoxy layer of fixedly connected with of cavity department, other fixedly connected with negative pole frame and positive pole frame are equallyd divide to the shell in the bottom both sides of cavity, the negative pole bowl has been seted up on negative pole frame top, the negative pole is put up fixedly connected with wafer in negative pole bowl department, and circular cavity has been seted up to the shell bottom, the shell is at the fixedly connected with wiring board of the top inner wall department of circular cavity, circular through-hole has all been seted up to shell bottom both sides, the shell is at circular through-hole fixedly connected with pin, and pin top fixedly connected with binding post, binding post's diameter equals the distance between pin and the wiring board.

Further, a sliding ring is connected to the outer portion of the bottom end of the outer shell in a sliding mode.

Furthermore, the outside of the sliding ring is fixedly connected with a cloth sleeve ring, and quartz powder is arranged inside the cloth sleeve ring.

Furthermore, the outer part of the bottom end of the shell is fixedly connected with a metal heat conduction ring.

Furthermore, a plurality of annular heat dissipation grooves are formed in the outer portion of the metal heat conduction ring.

The utility model has the beneficial effects that:

1. through setting up the wiring board, circular through-hole, pin and binding post, when the outside pin of device received the traction of external force, the traction force that at first the pin received transmitted to binding post department, and outside traction force has been offset to the effort between binding post and the shell to avoided outside traction force to pass through the direct effect of pin and held in place at inside negative pole frame and positive pole, thereby avoided the device pin to receive outside and pull damage often.

2. Through setting up the slip ring, quartz powder and cloth lantern ring, when the device diode is installed on the base plate, the slip ring can be because self gravity is automatic to slide down according to the outside shape of base plate, and the cloth lantern ring is inside this moment owing to there is quartz powder to the cloth lantern ring can take place deformation according to outside base plate shape, thereby makes the gap between device and the base plate closely laminate, has improved the dustproof performance of device.

3. Through setting up annular radiating groove, when the device during operation, annular radiating groove has increased the area of contact of device with the outside air to the heat transfer of device, radiating effect have been improved.

Drawings

FIG. 1 is a front view of a high efficiency, high temperature resistant LED as set forth in example 1;

FIG. 2 is a front view of a high efficiency, high temperature resistant LED as set forth in example 1;

fig. 3 is a side view of the ring-shaped groove of a high-efficiency high-temperature resistant light emitting diode in example 2.

In the figure: the solar cell comprises a shell 1, a pin 2, a cathode frame 3, an anode frame 4, a cathode bowl 5, a wafer 6, a transparent epoxy resin layer 7, a wiring board 8, a wiring terminal 9, a circular cavity 10, a sliding ring 11, a cloth ring 12, quartz powder 13, a metal heat conducting ring 14 and an annular heat dissipation groove 15.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-2, a high-efficiency high-temperature resistant light emitting diode comprises a housing 1, a cavity is formed in the housing 1, a transparent epoxy resin layer 7 is bonded on the housing 1 at the cavity, a cathode frame 3 and an anode frame 4 are respectively bonded on two sides of the bottom end of the cavity of the housing 1, a cathode bowl 5 is formed at the top end of the cathode frame 3, a wafer 6 is bonded on the cathode bowl 5 of the cathode frame 3, a circular cavity 10 is formed at the bottom end of the housing 1, a wiring board 8 is bonded on the inner wall of the top end of the circular cavity 10 of the housing 1, circular through holes are formed on two sides of the bottom end of the housing 1, pins 2 are bonded on the circular through holes of the housing 1, a wiring terminal 9 is bonded on the top end of the pins 2, the diameter of the wiring terminal 9 is equal to the distance between the pins 2 and the wiring board 8, when the pins 2 outside the device are pulled by external force, firstly, the traction force applied to the pins 2 is transmitted to the wiring terminal 9, the external traction is counteracted by the action force between the connecting terminal 9 and the shell 1, so that the external traction is prevented from directly acting on the internal cathode frame 3 and the anode frame 4 through the pin 2, and the pin 2 of the device is prevented from being damaged when receiving the external traction.

Wherein, the outside sliding connection in shell 1 bottom has slip ring 11, slip ring 11 outside bonds has cloth lantern ring 12, and cloth lantern ring 12 is inside to be equipped with quartz powder 13, the outside bonding in shell 1 bottom has metal heat conduction ring 14, when the device diode is installed on the base plate, slip ring 11 can be because self gravity is automatic to slide down according to the outside shape of base plate, cloth lantern ring 12 is inside this moment owing to there is quartz powder, thereby cloth lantern ring 12 can take place deformation according to outside base plate shape, thereby make the gap between device and the base plate closely laminate, the dustproof performance of device has been improved.

The working principle is as follows: when the pin 2 outside the device is pulled by external force, firstly the traction force applied to the pin 2 is transferred to the connecting terminal 9, and the external traction force is offset by the acting force between the connecting terminal 9 and the shell 1, so that the external traction force is prevented from directly acting on the cathode frame 3 and the anode frame 4 inside through the pin 2, and the pin 2 of the device is prevented from being damaged when being pulled by external force.

When the device diode is installed on the substrate, the sliding ring 11 can automatically slide down due to self gravity according to the external shape of the substrate, and at the moment, the inside of the cloth sleeve ring 12 is deformed according to the shape of the external substrate due to the existence of quartz powder, so that the gap between the device and the substrate is tightly attached, and the dust prevention performance of the device is improved.

Example 2

Referring to fig. 3, in this embodiment, compared with embodiment 1, in order to improve the heat dissipation efficiency of the device, a plurality of annular heat dissipation grooves 15 are formed outside the metal heat conduction ring 14, and when the device works, the annular heat dissipation grooves 15 increase the contact area between the device and the outside air, thereby improving the heat exchange and heat dissipation effects of the device.

When the device works, the annular heat dissipation groove 15 increases the contact area of the device and the outside air, so that the heat exchange and heat dissipation effects of the device are improved.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A high-efficiency high-temperature-resistant light-emitting diode comprises a shell (1), wherein a cavity is formed in the shell (1), the shell (1) is fixedly connected with a transparent epoxy resin layer (7) at the cavity, the shell (1) is respectively and fixedly connected with a cathode frame (3) and an anode frame (4) at two sides of the bottom end of the cavity, a cathode bowl (5) is arranged at the top end of the cathode frame (3), the cathode frame (3) is fixedly connected with a wafer (6) at the cathode bowl (5), the high-efficiency high-temperature-resistant light-emitting diode is characterized in that a circular cavity (10) is formed at the bottom end of the shell (1), a wiring board (8) is fixedly connected with the shell (1) at the inner wall of the top end of the circular cavity (10), circular through holes are formed at two sides of the bottom end of the shell (1), pins (2) are fixedly connected with the pins (2) at the circular through holes, and wiring terminals (9) are fixedly connected with the top ends of the pins (2), the diameter of the connecting terminal (9) is equal to the distance between the pin (2) and the wiring board (8).

2. The high-efficiency high-temperature-resistant light-emitting diode (LED) as claimed in claim 1, wherein a sliding ring (11) is slidably connected to the outside of the bottom end of the housing (1).

3. The high-efficiency high-temperature-resistant light-emitting diode according to claim 2, wherein a cloth ring (12) is fixedly connected to the outside of the sliding ring (11), and quartz powder (13) is arranged inside the cloth ring (12).

4. The high-efficiency high-temperature-resistant light-emitting diode according to claim 3, wherein a metal heat-conducting ring (14) is fixedly connected to the outside of the bottom end of the housing (1).

5. The high-efficiency high-temperature-resistant light-emitting diode as claimed in claim 4, wherein a plurality of annular heat dissipation grooves (15) are formed outside the metal heat conduction ring (14).