CN216413067U - SOP type ceramic package packaging structure - Google Patents
SOP type ceramic package packaging structure Download PDFInfo
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- CN216413067U CN216413067U CN202123365946.2U CN202123365946U CN216413067U CN 216413067 U CN216413067 U CN 216413067U CN 202123365946 U CN202123365946 U CN 202123365946U CN 216413067 U CN216413067 U CN 216413067U
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Abstract
The utility model discloses an SOP type ceramic shell packaging structure, which comprises a ceramic base and an outer lead frame, wherein the ceramic base is provided with a plurality of lead wires; the chip is arranged in the ceramic base and is adhered to the chip adhesion area of the bottom layer; the outer lead frame is provided with a plurality of leads, each lead is provided with an upward arc-shaped structure, one end of each lead is welded on the bonding pad on the back of the chip bonding area, and the other end of each lead is used for being welded with a welding point on the PCB. The structure is particularly suitable for large-size SOP type ceramic shells, the spring effect is provided at the arched structure of the lead, and the stress generated by expansion with heat and contraction with cold after the large-size SOP type ceramic shells are attached on a PCB is eliminated, so that the reliability of the assembly of the large-size SOP type ceramic shells is improved.
Description
Technical Field
The utility model relates to an SOP type ceramic shell packaging structure.
Background
The device such as a semiconductor integrated circuit, a hybrid integrated circuit and the like is packaged by adopting a mounting type shell, although the thermal expansion coefficient of a material (4J29/4J42) used by a lead of a ceramic shell is relatively close to that of a PCB (printed circuit board), certain difference exists, particularly certain large-size SOP type ceramic shells are assembled on the PCB, and after the SOP type ceramic shells are assembled on the PCB, the thermal expansion of the ceramic and the PCB is inconsistent in the processes of thermal expansion and cold contraction, and larger stress can be generated, so that the connection point of the ceramic shell and the PCB is torn, and the electrical connection of the device is failed.
Disclosure of Invention
The purpose of the utility model is as follows: aiming at the prior art, the SOP type ceramic shell packaging structure is provided, eliminates the stress generated by expansion and contraction after the SOP type ceramic shell is attached on a PCB, and is particularly suitable for large-size SOP type ceramic shells.
The technical scheme is as follows: an SOP type ceramic shell packaging structure comprises a ceramic base and an outer lead frame; the chip is arranged in the ceramic base and is adhered to the chip adhesion area of the bottom layer; the outer lead frame is provided with a plurality of leads, each lead is provided with an upwards formed arc-shaped structure, one end of each lead is welded on the bonding pad on the back of the chip bonding area, and the other end of each lead is used for being welded with a welding point on the PCB.
Further, the radius of the inner ring of the circular arc-shaped structure is smaller than 1.5 mm.
Furthermore, the thickness of the lead is 0.15-0.25 mm.
Further, the radius of the inner ring of the circular arc-shaped structure is 1 mm.
Has the advantages that: the utility model improves the existing large-size SOP type ceramic shell packaging structure, the spring effect is provided at the arched structure of the lead, and the stress generated by expansion and contraction after the large-size SOP type ceramic shell is attached on the PCB is eliminated, thereby improving the reliability of the assembly of the large-size SOP type ceramic shell and effectively solving the problem of electric connection failure between the large-size SOP type ceramic shell and the PCB.
Drawings
FIG. 1 is a schematic view of an SOP type ceramic package structure according to the present invention.
Detailed Description
The utility model is further explained below with reference to the drawings.
As shown in fig. 1, an SOP type ceramic package structure includes a ceramic base 1 and an outer lead frame. The chip is placed in the ceramic base 1 and bonded to the underlying chip bonding area. The outer lead frame is provided with a plurality of leads 3 which are arranged side by side, and the thickness of each lead 3 is 0.15-0.25 mm. Each lead 3 is provided with an upward arc-shaped structure, and the radius of the inner ring of the arc-shaped structure is less than 1.5mm, preferably 1 mm. One end of the lead 3 is welded on a welding pad on the back surface of the chip bonding area, and the other end is used for being welded with a welding point 5 on the PCB 4.
In the structure of the utility model, the ceramic base 1 is made of alumina ceramic, the lead is made of iron-nickel materials such as 4J29/4J42 and the like, the arc-shaped structure on the lead is formed by adopting a bending die, and the solder for soldering the lead is Ag72Cu28 or silver-based solder.
Taking the CSOP72P-01 type large-size SOP type ceramic shell of a power module product as an example, according to the conventional design, bent leads cannot be adopted, namely, a straight lead mode can be adopted according to the height limit requirement of the product. Assuming that the operating temperature rises to 165 ℃ during the operation of the device, the difference in expansion of the ceramic body between the PCB board and the ceramic base is calculated: the thermal expansion coefficient of PCB board is 18 multiplied by 10-6℃-1The coefficient of thermal expansion of the ceramic is 7 x 10-6℃-1The lead spacing of the ceramic is 50.15mm, the lead spacing of the PCB is 50.30mm, and the ceramic expansion delta L =50.15 multiplied by 7 multiplied by 10 at 165 DEG C-6X 165=0.058mm, PCB board expansion Δ L =50.30 x 18 x 10 at 165 ℃-6X 165=0.15mm, resulting in a difference in expansion =0.15-0.058=0.092 mm.
The calculated expansion difference results in excessive stress on the welding point of the device and the PCB, so that the risk of electrical connection failure is generated. In the structure of the utility model, the arch structure of the lead provides a spring effect, so that the stress of the welding point 5 is sufficiently buffered redundantly, and the reliability of connection is ensured.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (4)
1. The SOP type ceramic shell packaging structure is characterized by comprising a ceramic base (1) and an outer lead frame; the chip is arranged in the ceramic base (1) and is adhered to the chip adhesion area of the bottom layer; the outer lead frame is provided with a plurality of leads (3), each lead (3) is provided with an upwards-formed arc-shaped structure, one end of each lead (3) is welded on the bonding pad at the back of the chip bonding area, and the other end of each lead is welded with a welding point (5) on the PCB (4).
2. The SOP type ceramic housing package structure of claim 1, wherein an inner circle radius of the circular arc shaped structure is less than 1.5 mm.
3. The SOP type ceramic package structure of claim 2, wherein the thickness of the lead (3) is 0.15-0.25 mm.
4. The SOP type ceramic housing package structure of claim 2, wherein an inner circle radius of the circular arc structure is 1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123365946.2U CN216413067U (en) | 2021-12-29 | 2021-12-29 | SOP type ceramic package packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123365946.2U CN216413067U (en) | 2021-12-29 | 2021-12-29 | SOP type ceramic package packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216413067U true CN216413067U (en) | 2022-04-29 |
Family
ID=81286440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123365946.2U Active CN216413067U (en) | 2021-12-29 | 2021-12-29 | SOP type ceramic package packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216413067U (en) |
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2021
- 2021-12-29 CN CN202123365946.2U patent/CN216413067U/en active Active
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