CN216410632U - Liquid collecting device for flow test of CMP (chemical mechanical polishing) cleaning machine - Google Patents
Liquid collecting device for flow test of CMP (chemical mechanical polishing) cleaning machine Download PDFInfo
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- CN216410632U CN216410632U CN202122966095.0U CN202122966095U CN216410632U CN 216410632 U CN216410632 U CN 216410632U CN 202122966095 U CN202122966095 U CN 202122966095U CN 216410632 U CN216410632 U CN 216410632U
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Abstract
The utility model provides a liquid collecting device for flow rate test of a CMP cleaning machine, which can collect liquid without contacting a roller brush, so that the roller brush is not polluted. The liquid collection device includes: a main body portion comprising: a rectangular box-shaped body having a space formed therein; and first and second arm portions provided on first and second opposite side walls of the box-like body, respectively, and configured to be supported on the side walls of the brush unit; and a valve body disposed on the first sidewall of the box-shaped body at a position near the bottom of the box-shaped body, wherein a height of the body is smaller than a depth of the roll brush disposed in the brush unit.
Description
Technical Field
The present invention relates to the field of semiconductor manufacturing, and more particularly, to a liquid collection apparatus for flow testing of Chemical Mechanical Polishing (CMP) cleaners.
Background
In the fabrication of semiconductor devices, a Chemical Mechanical Polishing (CMP) process is often used to polish the surface of a wafer (on which portions of device structures may have been formed) so that its surface becomes flat, so that subsequent processes can be performed on the flat surface.
The CMP tool is mainly composed of two parts: a polisher (polish) and a cleaner (cleaner). The polishing machine is mainly used for polishing wafers, and the cleaning machine is mainly used for cleaning polished wafers. Specifically, the polished wafer is placed in a brush unit (brush box) of a cleaning machine, and a liquid (e.g., a chemical cleaning liquid and/or deionized water) is ejected from a nozzle to remove particles and slurry residues on the surface of the wafer.
The flow rates of the chemical cleaning solution and the deionized water are one of the key parameters of the CMP process. When cleaning efficiency is problematic, it is often necessary to check the flow of chemical cleaning solution and/or deionized water. In the past, this was done by placing a collection bag (bag) into the brush unit to collect the liquid, and then performing a flow test. However, since the collection bag may contact the roll brush installed in the brush unit of the washing machine during the collection process, the roll brush may be contaminated. The operator then has to replace the roller brush, which not only results in waste (meaning increased costs) but also increases the operator workload.
SUMMERY OF THE UTILITY MODEL
The present invention has been made to solve at least the above problems.
The utility model provides a liquid collecting device for flow test of a CMP (chemical mechanical polishing) cleaning machine, which comprises a brushing unit, wherein a rolling brush for cleaning the surface of a polished wafer is arranged in the brushing unit, and the liquid collecting device is characterized by comprising: a main body portion comprising: a rectangular box-shaped body having a space formed therein; and first and second arm portions provided on first and second opposite side walls of the box-like body, respectively, and configured to be supportable on side walls of the brush unit; and a valve body provided on the first sidewall of the box-shaped body at a position near a bottom of the box-shaped body, wherein a height of the body is smaller than a depth of the roll brush provided in the brush unit.
In some embodiments, the first arm includes a first arm section extending upward from the first side wall and formed integrally with the first side wall, and a second arm section perpendicular to the first arm section and extending outward of the box-shaped body from the first arm section, the second arm includes a third arm section extending upward from the second side wall and formed integrally with the second side wall, and a fourth arm section perpendicular to the third arm section and extending outward of the box-shaped body from the third arm section, and the fourth arm section is flush with the second arm section in a horizontal direction.
In some embodiments, a reinforcement plate is formed below the first arm portion.
In some embodiments, the second arm segment is longer than the fourth arm segment.
In some embodiments, the box-like body has a lower bottom at the first side wall than at the second side wall.
In some embodiments, the valve body is a ball valve.
In some embodiments, the body portion and the valve body are made of a soluble Polytetrafluoroethylene (PFA) material.
In some embodiments, the body portion and the valve body are made of Polytetrafluoroethylene (PFTE) material.
In the flow test of the CMP cleaning machine, by using the liquid collecting device according to the embodiment of the utility model, the liquid can be collected without contacting the roller brush, so the roller brush is not polluted. This work can save hundreds of dollars each time, since the rolling brush does not need to be replaced. Meanwhile, the whole testing process only needs about 5 minutes, and compared with the prior art, the testing process saves at least 2 hours.
Drawings
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The drawings are only exemplary and are not limiting of the embodiments. In the drawings, wherein like reference numerals refer to like elements, in which:
fig. 1 shows a schematic perspective view of a brushing unit in a washing machine.
Figure 2a is a schematic perspective view illustrating a liquid collection device for CMP cleaner flow testing in accordance with an embodiment of the present invention.
FIG. 2b is a schematic side view showing a liquid collection apparatus for CMP cleaner flow testing in accordance with an embodiment of the present invention
Figure 2c is a schematic bottom view showing a liquid collection apparatus for CMP cleaner flow testing in accordance with an embodiment of the present invention.
Fig. 3 is a schematic state diagram showing the use of the liquid collecting apparatus for CMP cleaner flow rate test according to the embodiment of the present invention.
It will be appreciated that for simplicity and/or clarity of illustration, elements illustrated in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. In addition, in order to make the concept of the present invention easier to understand, elements known in the art are omitted in the drawings. Moreover, unless explicitly stated, or otherwise apparent from the context, the dimensions of the figures do not represent the exact dimensions and/or dimensional proportions of the various elements depicted herein.
Detailed Description
In the following description, numerous specific details are set forth. However, the embodiments described herein may be practiced without certain specific details. In particular embodiments, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Furthermore, although the "x direction", "y direction", or "z direction" may be used in the following description, this is merely for convenience of explanation and does not limit the present invention.
As mentioned above, in the manufacturing process of semiconductor devices, a CMP process is often used to polish the surface of a wafer. The main problem of CMP is high residual particle content. Depending on the type of CMP and the polishing conditions, these particles may be physically adsorbed on the surface or partially embedded in the substrate due to the mechanical pressure exerted by the polishing pad. Typically, mechanical force by roller brush scrubbing combined with the use of chemical solutions is required to remove these residual particles.
For this reason, the cleaning machine in the CMP process is mainly used to clean the polished wafer.
Fig. 1 shows a schematic perspective view of a brushing unit 100 in a washing machine. As shown in fig. 1, the brush unit 100 includes a main body 101 having a substantially rectangular parallelepiped shape. The body portion 101 is formed as a box-shaped body having a hollow inside, and has a side wall. Inside the body portion 101, one or more rows of nozzles 103 are provided extending in the x-direction. A liquid, such as a chemical cleaning solution and/or deionized water, may be ejected from the nozzle 103 to clean the polished wafer to remove particles and slurry residues on the wafer surface. It should be understood that although in fig. 1 only one row of nozzles is shown on each of the two opposing side walls, there may be more than two rows of nozzles in the z-direction on each side wall side.
Further, in the main body 101, a roller brush 105 is provided below the nozzle 103 on each side wall side where the nozzle 103 is provided, for cleaning the polished wafer by a mechanical force.
It should be understood that one or more other well-known components in the brush unit are omitted from fig. 1 for clarity of illustration and ease of understanding of the technical concept of the present invention.
As described above, when cleaning efficiency is problematic, it is often necessary to check the flow rate of the chemical cleaning solution and/or the deionized water. In the past, this was done by placing a collection bag into the brush unit to collect the liquid, and then performing a flow test. Since a plastic bag with high cleanliness for storing general solid waste or chemical waste is commonly used in a semiconductor manufacturing line, such a plastic bag has been used as a collection bag for collecting liquid for the purpose of performing such an inspection.
However, since the collection bag is flexible, the roll brush installed in the brush unit of the washing machine may be contacted during the liquid collection process, and thus the roll brush may be contaminated. The operator then has to replace the roller brush, which not only results in waste (meaning increased costs) but also increases the operator workload.
On the other hand, when the flow rate of the liquid is high, the collection bag may be displaced from the fixed position by the impact of the liquid ejected from the nozzle, and the predetermined liquid may not be collected correctly.
Fig. 2a is a schematic perspective view illustrating a liquid collection apparatus 200 for CMP cleaner flow rate testing according to an embodiment of the present invention, fig. 2b is a schematic side view illustrating the liquid collection apparatus 200 for CMP cleaner flow rate testing according to an embodiment of the present invention, and fig. 2c is a schematic bottom view illustrating the liquid collection apparatus 200 for CMP cleaner flow rate testing according to an embodiment of the present invention.
As shown in fig. 2a-2c, a liquid collection device 200 for CMP cleaner flow testing according to an embodiment of the present invention includes a body portion 201. The main body 201 has a box-shaped body 203 having a substantially rectangular parallelepiped shape and a hollow interior for collecting liquid (e.g., chemical cleaning liquid and/or deionized water) ejected from nozzles of the brush unit.
The box-like body 203 has side walls 205a, 205b, 205c, 205 d. A first arm 207 and a second arm 209 are formed on opposite side walls (e.g., 205a and 205c in fig. 2 a) of the box-like body 203, respectively. In some embodiments, the first arm 207 may be formed on the sidewall 205a, and the second arm 209 may be formed on the sidewall 205c opposite the sidewall 205 a. The first arm 207 and the second arm 209 are configured to be supported on a side wall of the brush unit 100. In other words, the first arm portion 207 and the second arm portion 209 can hold the box-shaped body portion 203 at a prescribed height within the main body portion 101 of the brush unit 100.
The height of the main body 201 (the z-direction distance from the first arm 207 and the second arm 209 to the bottom of the box-shaped body 203) is set to be smaller than the depth of the roll brush set in the brush unit (the z-direction distance from the top of the side wall of the brush unit to the upper surface of the roll brush).
In some embodiments, the first arm 207 includes a first arm segment 207a and a second arm segment 207b that is substantially perpendicular to the first arm segment 207 a. In some embodiments, the first arm segment 207a extends upward (z-direction shown in fig. 2 b) from the sidewall 205a, integrally formed with the sidewall 205 a. The second arm segment 207b extends from the first arm segment 207a towards the outside of the box-like body 203. Similarly, the second arm portion 209 includes a third arm segment 209a and a fourth arm segment 209b that is substantially perpendicular to the third arm segment 209 a. The third arm section 209a extends upward from the side wall 205c and is formed integrally with the side wall 205 c. The fourth arm section 209b extends from the third arm section 209a towards the outside of the box-like body 203. The fourth arm segment 209b is flush with the second arm segment 207b in the horizontal direction (x-direction shown in fig. 2 b).
In addition, the liquid collecting apparatus 200 for CMP cleaner flow rate test according to the embodiment of the present invention further includes a valve body 211. The valve body 211 is used to drain the liquid collected in the liquid collection device 200 for testing. In some embodiments, the valve body 211 is provided on a side wall (for example, the side wall 205a) of the box-like body 203 where the arm (for example, the first arm 207) is formed, at a position near the bottom.
In some of these embodiments, the second arm segment 207b is arranged to be longer than the fourth arm segment 209b to enable the first arm 207 provided with the valve body 211 to better bear on the side wall of the brush unit.
In some of these embodiments, a reinforcing plate 213 is formed below the arm portion (e.g., the first arm portion 207) of the box-like body 203 on the side where the valve body 211 is provided. The reinforcement plate 213 serves to enable the first arm portion 207 to be more firmly supported on the side wall of the brush unit.
In some embodiments, the valve body 211 may be a ball valve.
In some embodiments, the bottom of the box-like body 203 at the side where the valve body 211 is provided (for example, the side wall 205a) is configured to be lower than the bottom at the opposite side (for example, the side wall 250c), so that the liquid collected in the liquid collecting device 200 easily flows out of the valve body 211.
In some embodiments, body portion 201 and valve body 211 may be made of a soluble Polytetrafluoroethylene (PFA) material.
In some embodiments, body portion 201 and valve body 211 may be made of Polytetrafluoroethylene (PFTE) material.
In some embodiments, the body 201 and the valve body 211 may be made of other materials that meet the requirements of a clean room and are acid and alkali resistant.
Fig. 3 is a schematic state diagram showing the use of the liquid collecting apparatus 200 for CMP cleaner flow rate test according to the embodiment of the present invention. In fig. 3, indicated at circle "a" is the valve body 211 of the liquid collection device 200.
As mentioned above, when the cleaning efficiency is problematic, it is necessary to check the flow rate of the chemical cleaning liquid and/or the deionized water. At this time, as shown in fig. 3, the liquid collection device 200 for CMP cleaner flow rate test according to the embodiment of the present invention may be placed in the brush unit 100 of the cleaner, in which the first arm 207 and the second arm 209 are supported on the side wall of the brush unit 100, and the valve body 211 is in a closed state. At this time, the liquid collecting apparatus 200 may collect the liquid (e.g., the chemical cleaning liquid and/or the deionized water) ejected from the nozzle.
Once collected, the fluid collection device 200 is removed and the fluid collection device 200 is placed on a table. Then, the valve body 211 is opened, and the liquid discharged from the liquid collecting apparatus 200 is received by the measuring cylinder, and a flow rate test is performed.
Since the height of the liquid collection device 200 (the z-direction distance from the first arm 207 and the second arm 209 to the bottom of the box-shaped body 203) for the CMP cleaner flow rate test according to the embodiment of the present invention is smaller than the depth of the roll brush disposed in the brush unit (the z-direction distance from the top of the side wall of the brush unit to the upper surface of the roll brush), when the liquid collection device 200 is placed in the brush unit 100, the roll brush 105 will be located below the liquid collection device 200 without contacting the bottom of the liquid collection device 200, and therefore, the liquid collection device 200 will not touch the roll brush during collection, and contamination of the roll brush will not be caused.
Here, it should be understood that the inside of the box-like body 203 of the liquid collecting device 200 may be designed to be as deep as possible in order to be able to contain more liquid, avoiding a situation where liquid overflows from the liquid collecting device 200 when the liquid flow rate is fast, while ensuring that the bottom of the liquid collecting device 200 does not touch the roller brush.
Further, it should also be understood that when multiple rows of nozzles are provided in the z-direction in the brush unit, the liquid collection device 200 need only collect liquid ejected from the uppermost row of nozzles, as is often the case.
In the CMP cleaner flow test, by using the liquid collecting apparatus 200 according to the embodiment of the present invention, the liquid can be collected without contacting the roll brush, and therefore, the roll brush is not contaminated. This work can save hundreds of dollars each time, since the rolling brush does not need to be replaced. Meanwhile, the whole testing process only needs about 5 minutes, and compared with the prior art, the testing process saves at least 2 hours.
It will be understood that the use of the ordinal adjectives "first", "second", "third", etc., to refer to an element herein, merely serve to distinguish between different elements, and do not imply that the elements so referred to must be in a given sequence, either temporally, spatially, or in other respects.
In addition, it should be understood that although the present invention has been described with respect to particular embodiments, one skilled in the art, upon reading the specification, may make modifications to one or more features thereof without departing from the spirit and scope of the present invention. Accordingly, the description is not intended to limit the utility model. Rather, the scope of the utility model is to be defined only by the claims appended hereto, and by their equivalents.
Claims (8)
1. A liquid collecting device for a flow test of a CMP cleaning machine, the cleaning machine including a brush unit in which a roll brush for cleaning a surface of a polished wafer is disposed, the liquid collecting device comprising:
a main body portion comprising:
a rectangular box-shaped body having a space formed therein; and
first and second arm portions provided on first and second opposite side walls of the box-like body, respectively, and configured to be supported on side walls of the brush unit; and
a valve body provided on the first side wall of the box-like body at a position near the bottom of the box-like body,
wherein a height of the body part is smaller than a depth of the roll brush provided in the brush unit.
2. The fluid collection apparatus for CMP cleaner flow testing of claim 1, wherein,
the first arm includes a first arm segment extending upward from the first side wall and formed integrally with the first side wall, and a second arm segment perpendicular to the first arm segment and extending outward of the box-like body from the first arm segment,
the second arm portion includes a third arm portion extending upward from the second side wall and formed integrally with the second side wall, and a fourth arm portion extending outward from the third arm portion and perpendicular to the third arm portion
The fourth arm segment is horizontally flush with the second arm segment.
3. The fluid collection apparatus for CMP cleaner flow testing of claim 2, wherein a stiffener plate is formed under the first arm.
4. The liquid collection apparatus for CMP cleaner flow testing of claim 2, wherein the second arm segment is longer than the fourth arm segment.
5. The liquid collection device for CMP cleaner flow testing of claim 1, wherein the box-like body has a lower bottom at the first sidewall than at the second sidewall.
6. The liquid collection apparatus for CMP cleaner flow testing of claim 1, wherein the valve body is a ball valve.
7. The fluid collection apparatus for CMP cleaner flow testing of claim 1, wherein the body portion and the valve body are made of a soluble polytetrafluoroethylene material.
8. The fluid collection apparatus for CMP cleaner flow testing of claim 1, wherein the body portion and the valve body are made of a polytetrafluoroethylene material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122966095.0U CN216410632U (en) | 2021-11-29 | 2021-11-29 | Liquid collecting device for flow test of CMP (chemical mechanical polishing) cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122966095.0U CN216410632U (en) | 2021-11-29 | 2021-11-29 | Liquid collecting device for flow test of CMP (chemical mechanical polishing) cleaning machine |
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| CN216410632U true CN216410632U (en) | 2022-04-29 |
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| CN202122966095.0U Active CN216410632U (en) | 2021-11-29 | 2021-11-29 | Liquid collecting device for flow test of CMP (chemical mechanical polishing) cleaning machine |
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