CN216390247U - Construction power consumption safety is with switch board that has hollow heat radiation structure - Google Patents
Construction power consumption safety is with switch board that has hollow heat radiation structure Download PDFInfo
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- CN216390247U CN216390247U CN202123158532.2U CN202123158532U CN216390247U CN 216390247 U CN216390247 U CN 216390247U CN 202123158532 U CN202123158532 U CN 202123158532U CN 216390247 U CN216390247 U CN 216390247U
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Abstract
The application provides a construction power consumption safety is with switch board that has cavity heat radiation structure belongs to switch board technical field. This construction power consumption safety is with switch board that has hollow heat radiation structure, including switch board body and radiator unit. In the above-mentioned realization process, the inside coolant liquid of first heat dissipation cavity can absorb the heat of switch board body inside and connecting plate, then cool down first fin through the semiconductor refrigeration piece, the water pump absorbs the coolant liquid from the bottom of first heat dissipation cavity through the connecting pipe, the coolant liquid of cooler bin inside can get into again inside first heat dissipation cavity through the top from first heat dissipation cavity under the effect of water pump, and then absorb the heat of switch board body inside and connecting plate, possess better cooling radiating effect, and can effectually prevent that impurity such as external dust from getting into inside the switch board body, can improve the life of the inside electrical components of switch board body.
Description
Technical Field
The application relates to the field of power distribution cabinets, in particular to a power distribution cabinet with a hollow heat dissipation structure for construction power safety.
Background
Switch board in use, inside electrical components can produce the heat, these heat accumulations are in the switch board, cause electrical components's in the switch board damage easily, influence normal work, traditional switch board heat dissipation is through setting up the fan on the casing and carry out ventilation cooling, radiating effect is relatively poor, and because the reason of dirt resistance, impurity such as external dust can enter into the cabinet internal through the fan, therefore can cause the influence to electrical components's in the switch board life.
SUMMERY OF THE UTILITY MODEL
In order to compensate above not enough, this application provides a construction power consumption safety is with switch board that has hollow heat radiation structure, aims at improving the relatively poor and inside problem of advancing the ash easily of traditional switch board radiating effect.
The embodiment of the application provides a construction power consumption safety is with switch board that has hollow heat radiation structure, including switch board body and radiator unit.
The power distribution cabinet is characterized in that a first heat dissipation cavity is formed in the shell wall of the power distribution cabinet body, a connecting plate is arranged in the power distribution cabinet body, one side of the connecting plate is fixedly inserted in the first heat dissipation cavity, a second heat dissipation cavity is formed in the connecting plate, and the second heat dissipation cavity is communicated with the first heat dissipation cavity.
The heat dissipation assembly comprises a cooling box, semiconductor refrigeration pieces, first fins, a cooling piece, a water pump and a connecting pipe, wherein the cooling box is connected to the top wall of the power distribution cabinet body, the cooling box is communicated with the top of the first heat dissipation cavity, the semiconductor refrigeration pieces are connected with the cooling box, the first fins are located inside the cooling box, the first fins are connected with heat absorbing surfaces of the semiconductor refrigeration pieces, the cooling piece is connected with heat releasing surfaces of the semiconductor refrigeration pieces, the water pump is connected with the outer wall of the power distribution cabinet body, a liquid outlet of the water pump is communicated with the cooling box, a liquid sucking port of the water pump is communicated with the connecting pipe, and the connecting pipe is communicated with the bottom of the first heat dissipation cavity.
In the implementation process, the first heat dissipation cavity and the cooling box are both provided with cooling liquid, when in use, the cooling liquid in the first heat dissipation cavity can absorb the heat in the power distribution cabinet body and the connecting plate, then the first fin is cooled through the semiconductor refrigeration sheet, further the cooling liquid in the cooling box is cooled, then the heat release surface of the semiconductor refrigeration sheet is cooled through the cooling piece, the cooling effect of the semiconductor refrigeration sheet on the first fin is increased, the water pump absorbs the cooling liquid from the bottom of the first heat dissipation cavity through the connecting pipe, the cooling liquid absorbed by the water pump can be discharged into the cooling box, the cooling liquid entering the cooling box can be cooled by the first fin, the cooling liquid in the cooling box can enter the first heat dissipation cavity again from the top of the first heat dissipation cavity under the action of the water pump, further the heat in the power distribution cabinet body and the connecting plate can be absorbed, possess better cooling radiating effect, and can effectually prevent that impurity such as external dust from getting into the switch board body inside, can improve the life of the inside electrical components of switch board body.
In a specific embodiment, a cabinet door is arranged on one side of the power distribution cabinet body, and a handle is arranged on one side of the cabinet door.
In a specific implementation scheme, the plate body of connecting plate is provided with a plurality of, a plurality of connecting plate evenly connect in inside the switch board body.
In a specific embodiment, one side of each of the plurality of connecting plates is fixedly inserted into the first heat dissipation cavity, the second heat dissipation cavity is formed in each of the plurality of connecting plates, and the plurality of second heat dissipation cavities are communicated with the first heat dissipation cavity.
In a specific embodiment, a plurality of connecting holes are formed in the upper surface and the lower surface of each connecting plate, and are uniformly distributed.
In a specific implementation scheme, a first through opening is formed in the top wall of the power distribution cabinet body, the first through opening is communicated with the top of the first heat dissipation cavity, and a second through opening is formed in the bottom wall of the cooling box and is communicated with the first through opening.
In a specific embodiment, the outer wall of the cooling box is sleeved with a heat shield, and the bottom surface of the heat shield is connected with the top wall of the power distribution cabinet body.
In a specific embodiment, the heat absorbing surface of the semiconductor refrigeration sheet is provided with second fins, the sheet body of the second fins is fixedly penetrated through the top wall of the cooling box, and the first fins are connected with the second fins.
In a specific embodiment, the first fins are provided in a plurality, the first fins are all located inside the cooling box, and the first fins are all connected with the second fins.
In a specific implementation scheme, the cooling piece includes third fin, fourth fin and radiator fan, the one side of third fin with the exothermic face of semiconductor refrigeration piece links to each other, the fourth fin is provided with a plurality of, a plurality of the even connection in of the one side of fourth fin in the another side of third fin, radiator fan's outer wall and a plurality of the another side of fourth fin links to each other.
Drawings
In order to more clearly explain the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic cross-sectional structure view of a power distribution cabinet with a hollow heat dissipation structure for construction electrical safety according to an embodiment of the present disclosure;
fig. 2 is a schematic sectional structure view of a power distribution cabinet body provided in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a connection plate according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of a cooling box provided in an embodiment of the present application;
fig. 6 is a schematic structural view of a cooling member according to an embodiment of the present application.
In the figure: 100-a power distribution cabinet body; 110 — a first heat dissipation cavity; 120-a connecting plate; 121-a second heat dissipation cavity; 122-connecting hole; 130-a cabinet door; 131-a handle; 140-a first port; 200-a heat dissipation assembly; 210-a cooling tank; 211-a second port; 220-semiconductor refrigerating sheet; 221-a second fin; 230-a first fin; 240-cooling piece; 241-a third fin; 242-a fourth fin; 243-cooling fan; 250-a water pump; 260-connecting pipe; 270-heat shield.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
To make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1, the present application provides a power distribution cabinet with a hollow heat dissipation structure for construction electrical safety, which includes a power distribution cabinet body 100 and a heat dissipation assembly 200.
Referring to fig. 1-3, a first heat dissipation cavity 110 is formed inside a wall of a power distribution cabinet body 100, a coolant is disposed inside the first heat dissipation cavity 110, a plurality of connection boards 120 are disposed inside the power distribution cabinet body 100, the plurality of connection boards 120 are uniformly connected inside the power distribution cabinet body 100, the connection boards 120 are used for connecting electrical components, the electrical components can be connected to the connection boards 120, one side of each connection board 120 is fixedly inserted into the first heat dissipation cavity 110, a second heat dissipation cavity 121 is disposed inside each connection board 120, the second heat dissipation cavity 121 is communicated with the first heat dissipation cavity 110, one side of each connection board 120 is fixedly inserted into the first heat dissipation cavity 110, the second heat dissipation cavities 121 are disposed inside the plurality of connection boards 120, and the plurality of second heat dissipation cavities 121 are communicated with the first heat dissipation cavity 110, connecting holes 122 have all been seted up on the upper and lower two sides of a plurality of connecting plate 120, and connecting hole 122 makes things convenient for electrical components to connect on connecting plate 120, and a plurality of has all been seted up to connecting hole 122, a plurality of connecting hole 122 evenly distributed, and one side of switch board body 100 is provided with cabinet door 130, and the one side of cabinet door 130 is provided with handle 131.
Referring to fig. 1, 4, 5 and 6, the heat dissipation assembly 200 includes a cooling box 210, a semiconductor cooling plate 220, a first fin 230, a cooling member 240, a water pump 250 and a connection pipe 260, the cooling box 210 is connected to the top wall of the power distribution cabinet body 100, the cooling box 210 is provided with a cooling liquid, the cooling box 210 is communicated with the top of the first heat dissipation cavity 110, the top wall of the power distribution cabinet body 100 is provided with a first through opening 140, the first through opening 140 is communicated with the top of the first heat dissipation cavity 110, the bottom wall of the cooling box 210 is provided with a second through opening 211, the second through opening 211 is communicated with the first through opening 140, an outer wall of the cooling box 210 is sleeved with a heat insulation cover 270, the bottom surface of the heat insulation cover 270 is connected with the top wall of the power distribution cabinet body 100, the heat insulation cover 270 is used for isolating external heat, and the influence of the external heat on the cooling box 210 can be reduced.
In this embodiment, the semiconductor refrigeration piece 220 is connected with the cooling box 210, the semiconductor refrigeration piece 220 is fixed to run through in the roof of heat exchanger 270, first fin 230 is located inside the cooling box 210, first fin 230 links to each other with the heat absorption surface of semiconductor refrigeration piece 220, the heat absorption surface of semiconductor refrigeration piece 220 is provided with second fin 221, the fixed roof that runs through in the cooling box 210 of sheet body of second fin 221, first fin 230 links to each other with second fin 221, first fin 230 is provided with a plurality of, a plurality of first fin 230 all is located inside the cooling box 210, a plurality of first fin 230 all links to each other with second fin 221.
In this embodiment, the cooling member 240 is connected to the heat releasing surface of the semiconductor chilling plate 220, the cooling member 240 includes a third fin 241, a fourth fin 242 and a heat dissipating fan 243, one surface of the third fin 241 is connected to the heat releasing surface of the semiconductor chilling plate 220, the fourth fin 242 is provided with a plurality of pieces, one surface of the plurality of fourth fins 242 is uniformly connected to the other surface of the third fin 241, the outer wall of the heat dissipating fan 243 is connected to the other surface of the plurality of fourth fins 242, the heat dissipating fan 243 is opened to cool the third fin 241 and the fourth fin 242 and further cool the heat releasing surface of the semiconductor chilling plate 220, the water pump 250 is connected to the outer wall of the power distribution cabinet body 100, the liquid outlet of the water pump 250 is communicated with the cooling box 210, the liquid suction port of the water pump 250 is communicated with the connecting pipe 260, and the connecting pipe 260 is communicated with the bottom of the first heat dissipating cavity 110.
This construction power consumption safety is with theory of operation that has cavity heat radiation structure's switch board: the first heat dissipation cavity 110 and the cooling box 210 are both provided with cooling liquid, when in use, the cooling liquid in the first heat dissipation cavity 110 can absorb heat in the power distribution cabinet body 100 and the connecting plate 120, then the semiconductor chilling plate 220 is opened, the semiconductor chilling plate 220 can cool the first fin 230, further cool the cooling liquid in the cooling box 210, then the heat dissipation fan 243 is opened to dissipate heat of the third fin 241 and the plurality of fourth fins 242, the cooling effect of the semiconductor chilling plate 220 on the first fin 230 is increased, then the water pump 250 is opened, the water pump 250 absorbs the cooling liquid from the bottom of the first heat dissipation cavity 110 through the connecting pipe 260, the cooling liquid absorbed by the water pump 250 can be discharged into the cooling box 210, the cooling liquid entering the cooling box 210 can be cooled by the first fin 230, the cooling liquid in the cooling box 210 can reenter the first heat dissipation cavity 110 through the second through hole 211 and the first through hole 140 under the effect of the water pump 250, and then absorb the heat inside switch board body 100 and connecting plate 120, possess better cooling radiating effect, and can effectually prevent that impurity such as external dust from getting into switch board body 100 inside, can improve switch board body 100 inside electrical components's life.
It should be noted that the specific model specifications of the semiconductor refrigeration sheet 220, the water pump 250 and the cooling fan 243 need to be determined by type selection according to the actual specification of the device, and the specific type selection calculation method adopts the prior art, so detailed description is omitted.
The power supply of the semiconductor cooling fins 220, the water pump 250 and the cooling fan 243 and the principle thereof will be apparent to those skilled in the art and will not be described in detail herein.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A power distribution cabinet with a hollow heat dissipation structure for construction power utilization safety is characterized by comprising
The heat dissipation structure comprises a power distribution cabinet body (100), wherein a first heat dissipation cavity (110) is formed in the wall of the power distribution cabinet body (100), a connecting plate (120) is arranged in the power distribution cabinet body (100), one side of the connecting plate (120) is fixedly inserted into the first heat dissipation cavity (110), a second heat dissipation cavity (121) is formed in the connecting plate (120), and the second heat dissipation cavity (121) is communicated with the first heat dissipation cavity (110);
the heat dissipation assembly (200) comprises a cooling box (210), a semiconductor refrigeration sheet (220), a first fin (230), a cooling piece (240), a water pump (250) and a connecting pipe (260), wherein the cooling box (210) is connected to the top wall of the power distribution cabinet body (100), the cooling box (210) is communicated with the top of the first heat dissipation cavity (110), the semiconductor refrigeration sheet (220) is connected with the cooling box (210), the first fin (230) is positioned inside the cooling box (210), the first fin (230) is connected with a heat absorption surface of the semiconductor refrigeration sheet (220), the cooling piece (240) is connected with a heat release surface of the semiconductor refrigeration sheet (220), the water pump (250) is connected with the outer wall of the power distribution cabinet body (100), and a liquid outlet of the water pump (250) is communicated with the cooling box (210), the liquid suction port of the water pump (250) is communicated with the connecting pipe (260), and the connecting pipe (260) is communicated with the bottom of the first heat dissipation cavity (110).
2. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a cabinet door (130) is disposed on one side of the switch board body (100), and a handle (131) is disposed on one side of the cabinet door (130).
3. The switch board with hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a plurality of connection boards (120) are provided, and a plurality of connection boards (120) are uniformly connected inside the switch board body (100).
4. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 3, wherein one side of each of the plurality of connecting plates (120) is fixedly inserted into the first heat dissipation cavity (110), the second heat dissipation cavities (121) are formed in each of the plurality of connecting plates (120), and the plurality of second heat dissipation cavities (121) are communicated with the first heat dissipation cavity (110).
5. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 4, wherein a plurality of connecting holes (122) are formed in the upper surface and the lower surface of each of the plurality of connecting plates (120), a plurality of connecting holes (122) are formed in each of the plurality of connecting holes, and the plurality of connecting holes (122) are uniformly distributed.
6. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a first port (140) is formed on a top wall of the switch board body (100), the first port (140) is communicated with a top portion of the first heat dissipation cavity (110), a second port (211) is formed on a bottom wall of the cooling box (210), and the second port (211) is communicated with the first port (140).
7. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a heat shield (270) is sleeved on an outer wall of the cooling box (210), and a bottom surface of the heat shield (270) is connected with a top wall of the switch board body (100).
8. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein the heat absorption surface of the semiconductor cooling plate (220) is provided with a second fin (221), the body of the second fin (221) is fixed to penetrate through the top wall of the cooling box (210), and the first fin (230) is connected with the second fin (221).
9. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 8, wherein a plurality of first fins (230) are provided, the plurality of first fins (230) are located inside the cooling box (210), and the plurality of first fins (230) are connected to the second fins (221).
10. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein the cooling member (240) comprises a third fin (241), a fourth fin (242) and a heat dissipation fan (243), one surface of the third fin (241) is connected with the heat dissipation surface of the semiconductor chilling plate (220), the fourth fin (242) is provided with a plurality of pieces, one surface of the plurality of fourth fins (242) is uniformly connected with the other surface of the third fin (241), and the outer wall of the heat dissipation fan (243) is connected with the other surface of the plurality of fourth fins (242).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123158532.2U CN216390247U (en) | 2021-12-15 | 2021-12-15 | Construction power consumption safety is with switch board that has hollow heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123158532.2U CN216390247U (en) | 2021-12-15 | 2021-12-15 | Construction power consumption safety is with switch board that has hollow heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216390247U true CN216390247U (en) | 2022-04-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123158532.2U Active CN216390247U (en) | 2021-12-15 | 2021-12-15 | Construction power consumption safety is with switch board that has hollow heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216390247U (en) |
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2021
- 2021-12-15 CN CN202123158532.2U patent/CN216390247U/en active Active
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