CN216390247U - A power distribution cabinet with a hollow heat dissipation structure for construction electricity safety - Google Patents

Abstract

The application provides a construction power consumption safety is with switch board that has cavity heat radiation structure belongs to switch board technical field. This construction power consumption safety is with switch board that has hollow heat radiation structure, including switch board body and radiator unit. In the above-mentioned realization process, the inside coolant liquid of first heat dissipation cavity can absorb the heat of switch board body inside and connecting plate, then cool down first fin through the semiconductor refrigeration piece, the water pump absorbs the coolant liquid from the bottom of first heat dissipation cavity through the connecting pipe, the coolant liquid of cooler bin inside can get into again inside first heat dissipation cavity through the top from first heat dissipation cavity under the effect of water pump, and then absorb the heat of switch board body inside and connecting plate, possess better cooling radiating effect, and can effectually prevent that impurity such as external dust from getting into inside the switch board body, can improve the life of the inside electrical components of switch board body.

Description

A power distribution cabinet with a hollow heat dissipation structure for construction electricity safety

technical field

The present application relates to the field of power distribution cabinets, and in particular, to a power distribution cabinet with a hollow heat dissipation structure for construction electricity safety.

Background technique

When the power distribution cabinet is in use, the internal electrical components will generate heat, and this heat will accumulate in the power distribution cabinet, which will easily cause damage to the electrical components in the power distribution cabinet and affect normal work. A fan is installed on the top for ventilation and heat dissipation, and the effect of heat dissipation is poor, and due to dust resistance, external dust and other impurities will enter the cabinet through the fan, which will affect the service life of the electrical components in the power distribution cabinet.

Utility model content

In order to make up for the above deficiencies, the present application provides a power distribution cabinet with a hollow heat dissipation structure for construction electricity safety, which aims to improve the problems of poor heat dissipation effect and easy ash entry in the traditional power distribution cabinet.

The embodiment of the present application provides a power distribution cabinet with a hollow heat dissipation structure for construction electricity safety, including a power distribution cabinet body and a heat dissipation component.

The inside of the shell wall of the power distribution cabinet body is provided with a first heat dissipation cavity, the interior of the power distribution cabinet body is provided with a connecting plate, and one side of the connecting plate is fixedly inserted into the inside of the first heat dissipation cavity A second heat dissipation cavity is opened inside the connecting plate, and the second heat dissipation cavity is communicated with the first heat dissipation cavity.

The heat dissipation assembly includes a cooling box, a semiconductor cooling fin, a first fin, a cooling element, a water pump and a connecting pipe, the cooling box is connected to the top wall of the power distribution cabinet body, and the cooling box is connected to the first fin. The top of the heat dissipation cavity is connected, the semiconductor refrigeration fin is connected to the cooling box, the first fin is located inside the cooling box, and the first fin is connected to the heat absorbing surface of the semiconductor refrigeration fin , the cooling element is connected to the heat release surface of the semiconductor refrigeration sheet, the water pump is connected to the outer wall of the power distribution cabinet body, the liquid outlet of the water pump is connected to the cooling box, and the suction of the water pump is connected to the cooling box. The liquid port is communicated with the connecting pipe, and the connecting pipe is communicated with the bottom of the first heat dissipation cavity.

In the above implementation process, both the first heat dissipation cavity and the cooling box are provided with cooling liquid. When in use, the cooling liquid in the first heat dissipation cavity will absorb the heat inside the power distribution cabinet body and the connecting plate, and then pass through the semiconductor refrigeration. The cooling element cools the first fin, and then cools the cooling liquid inside the cooling box, and then cools the heat release surface of the semiconductor refrigeration sheet through the cooling element to increase the cooling effect of the semiconductor cooling sheet on the first fin, and the water pump passes through the cooling element. The connecting pipe absorbs the cooling liquid from the bottom of the first cooling cavity, the cooling liquid sucked by the water pump will be discharged into the cooling box, the cooling liquid entering the cooling box will be cooled by the first fins, and the cooling liquid inside the cooling box will be in the cooling box. Under the action of the water pump, it re-enters the interior of the first heat dissipation cavity from the top of the first heat dissipation cavity, and then absorbs the heat inside the power distribution cabinet body and the connection board, which has a good cooling and heat dissipation effect, and can effectively prevent the outside world. The dust and other impurities can enter the inside of the power distribution cabinet body, which can improve the service life of the electrical components inside the power distribution cabinet body.

In a specific embodiment, a cabinet door is provided on one side of the power distribution cabinet body, and a handle is provided on one side of the cabinet door.

In a specific embodiment, the board body of the connecting board is provided with several pieces, and the several connecting boards are evenly connected inside the power distribution cabinet body.

In a specific implementation, one side of several of the connecting plates is fixedly inserted into the inside of the first heat dissipation cavity, and the second heat dissipation cavity is opened in the interior of several of the connecting plates , and several of the second heat dissipation cavities are all communicated with the first heat dissipation cavity.

In a specific embodiment, the upper and lower sides of several of the connection plates are provided with connection holes, and each of the connection holes is provided with several connection holes, and the several connection holes are evenly distributed.

In a specific embodiment, the top wall of the power distribution cabinet body is provided with a first through opening, the first through opening is communicated with the top of the first heat dissipation cavity, and the bottom of the cooling box is The wall is provided with a second through opening, and the second through opening communicates with the first through opening.

In a specific embodiment, a heat shield is sleeved on the outer wall of the cooling box, and the bottom surface of the heat shield is connected to the top wall of the power distribution cabinet body.

In a specific embodiment, the heat absorbing surface of the semiconductor refrigeration sheet is provided with a second fin, the sheet body of the second fin is fixed through the top wall of the cooling box, and the first fin is A sheet is connected to the second fin.

In a specific embodiment, a plurality of the first fins are provided, and the plurality of the first fins are all located inside the cooling box, and the plurality of the first fins are all connected with the second fins. The fins are connected.

In a specific embodiment, the cooling member includes a third fin, a fourth fin and a cooling fan, one side of the third fin is connected to the heat release side of the semiconductor refrigeration sheet, and the first There are several four fins. One side of several fourth fins is evenly connected to the other side of the third fin, and the outer wall of the cooling fan is connected to the other side of several fourth fins. connected.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic cross-sectional structural diagram of a power distribution cabinet with a hollow heat dissipation structure for construction electricity safety provided by an embodiment of the present application;

2 is a schematic cross-sectional structural diagram of a power distribution cabinet body provided by an embodiment of the present application;

3 is a schematic structural diagram of a connecting plate provided by an embodiment of the present application;

4 is a schematic structural diagram of a heat dissipation assembly provided by an embodiment of the present application;

5 is a schematic structural diagram of a cooling box provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a cooling member provided by an embodiment of the present application.

In the figure: 100-distribution cabinet body; 110-first cooling cavity; 120-connecting plate; 121-second cooling cavity; 122-connecting hole; 130-cabinet door; 131-handle; 140-first pass 200- cooling assembly; 210-cooling box; 211-second port; 220-semiconductor cooling fin; 221-second fin; 230-first fin; 240-cooling piece; 241-third fin ; 242- the fourth fin; 243- cooling fan; 250- water pump; 260- connecting pipe; 270- heat shield.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments This is a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Referring to FIG. 1 , the present application provides a power distribution cabinet with a hollow heat dissipation structure for construction electricity safety, including a power distribution cabinet body 100 and a heat dissipation assembly 200 .

Referring to FIGS. 1-3 , a first heat dissipation cavity 110 is opened inside the shell wall of the power distribution cabinet body 100 , the first heat dissipation cavity 110 is provided with cooling liquid, and the interior of the power distribution cabinet body 100 is provided with a connecting plate 120 . The board body of the connection board 120 is provided with several pieces. The several connection boards 120 are evenly connected to the inside of the power distribution cabinet body 100. The connection boards 120 are used to connect electrical components, and the electrical components can be connected to the One side is fixedly inserted into the first heat dissipation cavity 110 , and a second heat dissipation cavity 121 is opened inside the connecting plate 120 . The second heat dissipation cavity 121 is communicated with the first heat dissipation cavity 110 . One side is fixedly inserted into the first heat dissipation cavity 110 , and the interior of the plurality of connecting plates 120 is provided with a second heat dissipation cavity 121 , and the plurality of second heat dissipation cavities 121 are all communicated with the first heat dissipation cavity 110 . , the upper and lower sides of several connecting plates 120 are provided with connecting holes 122, the connecting holes 122 are convenient for electrical components to be connected on the connecting plates 120, the connecting holes 122 are all provided with several, and the several connecting holes 122 are evenly distributed. A cabinet door 130 is provided on one side of the 100 , and a handle 131 is provided on one side of the cabinet door 130 .

1 , 4 , 5 and 6 , the heat dissipation assembly 200 includes a cooling box 210 , a semiconductor cooling fin 220 , a first fin 230 , a cooling member 240 , a water pump 250 and a connecting pipe 260 , and the cooling box 210 is connected to the power distribution cabinet body The top wall of the power distribution cabinet 100, the cooling box 210, is provided with cooling liquid, the cooling box 210 is communicated with the top of the first heat dissipation cavity 110, and the top wall of the power distribution cabinet body 100 is provided with a first port 140, the first port 140 It is communicated with the top of the first heat dissipation cavity 110, the bottom wall of the cooling box 210 is provided with a second through port 211, the second through port 211 is communicated with the first through port 140, and the outer wall of the cooling box 210 is sleeved with a heat insulation The cover 270, the bottom surface of the heat shield 270 is connected with the top wall of the power distribution cabinet body 100, the heat shield 270 is used to isolate the external heat, and can reduce the influence of the external heat on the cooling box 210.

In this embodiment, the semiconductor refrigeration sheet 220 is connected to the cooling box 210 , the semiconductor refrigeration sheet 220 is fixed through the top wall of the heat shield 270 , the first fins 230 are located inside the cooling box 210 , and the first fins 230 are connected to the semiconductor refrigeration sheet 210 . The heat-absorbing surfaces of the fins 220 are connected to each other, and the heat-absorbing surfaces of the semiconductor refrigeration fins 220 are provided with second fins 221. The fins 221 are connected, and there are several first fins 230 . The several first fins 230 are all located inside the cooling box 210 , and the several first fins 230 are all connected to the second fins 221 .

In this embodiment, the cooling member 240 is connected to the heat release surface of the semiconductor cooling fin 220, the cooling member 240 includes a third fin 241, a fourth fin 242 and a cooling fan 243, and one side of the third fin 241 is connected to the semiconductor cooling fin 241. The radiating surfaces of the 220 are connected to each other, and several fourth fins 242 are provided. One side of the several fourth fins 242 is evenly connected to the other side of the third fin 241, and the outer wall of the cooling fan 243 is connected to several fourth fins. The other side of the fin 242 is connected, and the cooling fan 243 can be turned on to cool the third fins 241 and the fourth fins 242, thereby cooling the heat release surface of the semiconductor refrigeration sheet 220. The water pump 250 is connected to the outer wall of the power distribution cabinet body 100. The liquid outlet of the water pump 250 is communicated with the cooling box 210 , the liquid suction port of the water pump 250 is communicated with the connecting pipe 260 , and the connecting pipe 260 is communicated with the bottom of the first heat dissipation cavity 110 .

The working principle of the power distribution cabinet with a hollow heat dissipation structure for construction electricity safety: the first heat dissipation cavity 110 and the cooling box 210 are both provided with cooling liquid. When in use, the cooling liquid in the first heat dissipation cavity 110 will be absorbed The heat in the power distribution cabinet body 100 and the connection board 120 is then turned on, and the semiconductor cooling fins 220 are turned on. The semiconductor cooling fins 220 will cool the first fins 230, thereby cooling the cooling liquid inside the cooling box 210, and then turn on the cooling fan. 243 dissipates heat to the third fins 241 and several fourth fins 242 to increase the cooling effect of the semiconductor refrigeration fins 220 on the first fins 230, and then turn on the water pump 250, and the water pump 250 passes through the connecting pipe 260 from the first heat dissipation cavity The bottom of the 110 absorbs the cooling liquid, the cooling liquid absorbed by the water pump 250 will be discharged into the cooling tank 210, the cooling liquid entering the cooling tank 210 will be cooled by the first fins 230, and the cooling liquid inside the cooling tank 210 will be in the water pump 250. Under the action of the second port 211 and the first port 140, it re-enters the inside of the first heat dissipation cavity 110, and then absorbs the heat inside the power distribution cabinet body 100 and the connection board 120, which has a better cooling and heat dissipation effect, and The external dust and other impurities can be effectively prevented from entering the inside of the power distribution cabinet body 100 , and the service life of the electrical components inside the power distribution cabinet body 100 can be improved.

It should be noted that the specific models and specifications of the semiconductor refrigeration sheet 220, the water pump 250 and the cooling fan 243 need to be selected and determined according to the actual specifications of the device. .

The power supply of the semiconductor cooling chip 220 , the water pump 250 and the cooling fan 243 and their principles are clear to those skilled in the art, and will not be described in detail here.

The above descriptions are merely examples of the present application, and are not intended to limit the protection scope of the present application. For those skilled in the art, various modifications and changes may be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application. It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited to this. should be covered within the scope of protection of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims (10)

1. A power distribution cabinet with a hollow heat dissipation structure for construction power utilization safety is characterized by comprising

The heat dissipation structure comprises a power distribution cabinet body (100), wherein a first heat dissipation cavity (110) is formed in the wall of the power distribution cabinet body (100), a connecting plate (120) is arranged in the power distribution cabinet body (100), one side of the connecting plate (120) is fixedly inserted into the first heat dissipation cavity (110), a second heat dissipation cavity (121) is formed in the connecting plate (120), and the second heat dissipation cavity (121) is communicated with the first heat dissipation cavity (110);

the heat dissipation assembly (200) comprises a cooling box (210), a semiconductor refrigeration sheet (220), a first fin (230), a cooling piece (240), a water pump (250) and a connecting pipe (260), wherein the cooling box (210) is connected to the top wall of the power distribution cabinet body (100), the cooling box (210) is communicated with the top of the first heat dissipation cavity (110), the semiconductor refrigeration sheet (220) is connected with the cooling box (210), the first fin (230) is positioned inside the cooling box (210), the first fin (230) is connected with a heat absorption surface of the semiconductor refrigeration sheet (220), the cooling piece (240) is connected with a heat release surface of the semiconductor refrigeration sheet (220), the water pump (250) is connected with the outer wall of the power distribution cabinet body (100), and a liquid outlet of the water pump (250) is communicated with the cooling box (210), the liquid suction port of the water pump (250) is communicated with the connecting pipe (260), and the connecting pipe (260) is communicated with the bottom of the first heat dissipation cavity (110).

2. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a cabinet door (130) is disposed on one side of the switch board body (100), and a handle (131) is disposed on one side of the cabinet door (130).

3. The switch board with hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a plurality of connection boards (120) are provided, and a plurality of connection boards (120) are uniformly connected inside the switch board body (100).

4. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 3, wherein one side of each of the plurality of connecting plates (120) is fixedly inserted into the first heat dissipation cavity (110), the second heat dissipation cavities (121) are formed in each of the plurality of connecting plates (120), and the plurality of second heat dissipation cavities (121) are communicated with the first heat dissipation cavity (110).

5. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 4, wherein a plurality of connecting holes (122) are formed in the upper surface and the lower surface of each of the plurality of connecting plates (120), a plurality of connecting holes (122) are formed in each of the plurality of connecting holes, and the plurality of connecting holes (122) are uniformly distributed.

6. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a first port (140) is formed on a top wall of the switch board body (100), the first port (140) is communicated with a top portion of the first heat dissipation cavity (110), a second port (211) is formed on a bottom wall of the cooling box (210), and the second port (211) is communicated with the first port (140).

7. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein a heat shield (270) is sleeved on an outer wall of the cooling box (210), and a bottom surface of the heat shield (270) is connected with a top wall of the switch board body (100).

8. The switch board with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein the heat absorption surface of the semiconductor cooling plate (220) is provided with a second fin (221), the body of the second fin (221) is fixed to penetrate through the top wall of the cooling box (210), and the first fin (230) is connected with the second fin (221).

9. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 8, wherein a plurality of first fins (230) are provided, the plurality of first fins (230) are located inside the cooling box (210), and the plurality of first fins (230) are connected to the second fins (221).

10. The power distribution cabinet with the hollow heat dissipation structure for construction electrical safety according to claim 1, wherein the cooling member (240) comprises a third fin (241), a fourth fin (242) and a heat dissipation fan (243), one surface of the third fin (241) is connected with the heat dissipation surface of the semiconductor chilling plate (220), the fourth fin (242) is provided with a plurality of pieces, one surface of the plurality of fourth fins (242) is uniformly connected with the other surface of the third fin (241), and the outer wall of the heat dissipation fan (243) is connected with the other surface of the plurality of fourth fins (242).

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