CN216389298U

CN216389298U - Solid brilliant mechanism of semiconductor paster

Info

Publication number: CN216389298U
Application number: CN202122731863.4U
Authority: CN
Inventors: 程飞; 江艳峰; 郭俊军; 唐传晖
Original assignee: Shenzhen Aoxing Intelligent Equipment Co ltd
Current assignee: Shenzhen Aoxing Intelligent Equipment Co ltd
Priority date: 2021-11-09
Filing date: 2021-11-09
Publication date: 2022-04-26
Anticipated expiration: 2031-11-09

Abstract

The utility model provides a die bonding mechanism for a semiconductor chip, which relates to the technical field of chip mounter equipment and comprises a moving component and an adsorption component, the moving component comprises a transverse platform and a longitudinal platform, the adsorption component comprises a main seat, the top surface of the main seat is provided with a motor, one end of the motor is provided with an eccentric shaft, the eccentric shaft is positioned in the through hole at one side of the base, the surface of one end of the eccentric shaft is sleeved with the connecting rod, the bottom surface of the main base is fixed with a supporting plate, one side of the supporting plate is fixed with a guide rail by a bolt, one side of the supporting plate is provided with a sliding plate, and the slide and the guide rail are movably connected, a connecting shaft is arranged in the through hole on one surface of the slide, and one end of the connecting shaft is embedded in the through hole on one end of the connecting rod, so that the lifting structure of the existing equipment is changed, the damage to parts is reduced after long-time use, the disassembly and maintenance of workers are convenient, the equipment is simple, and the manufacturing cost is low.

Description

Solid brilliant mechanism of semiconductor paster

Technical Field

The utility model relates to the technical field of chip mounter equipment, in particular to a semiconductor chip mounting and die bonding mechanism.

Background

According to the patent number CN201810943053.5, the chip mounting device comprises a chip mounting base and an anti-deviation jig, wherein a vacuum suction pipe for absorbing a chip mounting element is convexly arranged on the chip mounting base towards the anti-deviation jig, the anti-deviation jig penetrates through an anti-deviation channel for the vacuum suction pipe to penetrate through, and the vacuum suction pipe absorbs the chip mounting element and extends into the anti-deviation channel; the bearing device comprises a bearing table, and the bearing table is adjustable in width and bears the board to be attached; the conveying device comprises a patch conveying mechanism used for conveying the bearing table to the position below the patch device, the patch conveying mechanism comprises first rails, the two first rails are arranged in parallel, the bearing table is connected with the two first rails in a sliding mode and limited to slide in the length direction of the two first rails, and when the bearing table slides to the position below the vacuum suction pipe along the length direction of the two first rails, the vacuum suction pipe attaches the patch element to the plate to be attached; the LED chip mounter is high in chip mounting precision and efficiency and can adapt to boards to be mounted in different models.

The structure and the process flow of chip mounter are introduced to above-mentioned patent, are absorbing the equipment that removes comparatively complicated to the product in the patent, and are with high costs, use for a long time and have reduced the life of equipment, absorb the easy damage of equipment that removes, are not convenient for dismantle the maintenance.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a die bonding mechanism for a semiconductor chip.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides a solid brilliant mechanism of semiconductor paster, includes removal subassembly and absorption subassembly, the removal subassembly includes horizontal platform and vertical platform, the absorption subassembly includes the main seat, main seat top surface is equipped with the motor, motor one end is equipped with the eccentric shaft, and the eccentric shaft is located the through-hole of base one side, connecting rod has been cup jointed on eccentric shaft one end surface, main seat bottom surface is fixed with the backup pad, one side bolt fastening of backup pad has the guide rail, one side of backup pad is equipped with the slide, and slide and guide rail swing joint, be equipped with the connecting axle in the through-hole of slide one side, and connecting axle one end gomphosis in the through-hole of connecting rod one end.

Preferably, the base is fixed on the top surface of the main base through bolts, the motor is fixed with the base, the rotating end of the motor is embedded in the through hole of the base, and the rotating end of the motor passes through the coupler and the eccentric shaft.

Preferably, one side of the connecting rod is provided with a fixing component, the fixing component is sleeved on the surface of one end of the eccentric shaft, and the fixing component is fixed with the eccentric shaft through threads.

Preferably, the motor is located on the top surface of the moving end of the longitudinal platform, and the main seat is fixed to the top surface of the moving end of the longitudinal platform through a bolt.

Preferably, the slide simultaneously is equipped with the buffering fixing base, buffering fixing base simultaneously is equipped with the slip track, the buffering fixing base simultaneously is equipped with the buffering sliding seat, and the buffering sliding seat mutually supports with the slip track.

Preferably, the surface of the buffering fixing seat is fixed with an adjusting plate, one side of the buffering fixing seat is fixed with a clamping block, and an electromagnet is clamped in a groove of the clamping block.

Preferably, the buffering sliding seat one side is fixed with the magnet suction disc, magnet suction disc side is equipped with the arm seat, and the arm seat assembles in buffering sliding seat one side, the laminating of arm seat surface has the linking arm, and the linking arm is connected with the arm seat through the round pin axle, linking arm top surface recess internal fixation has the suction nozzle.

Advantageous effects

According to the utility model, the adsorption component and the moving component are assembled into a whole, the position of the adsorption component is adjusted through the transverse platform and the longitudinal platform of the moving component, the motor of the adsorption component is connected with the eccentric shaft through the coupler, the eccentric shaft is connected with the sliding plate through the connecting rod, the sliding plate is connected onto the supporting plate through the guide rail, the bearing in the through hole of the supporting plate is embedded in the groove at one end of the connecting rod, the motor provides power, the rotary motion is converted into up-and-down motion through the eccentric shaft, the sliding plate is moved up and down, a product is absorbed through the suction nozzle, the lifting structure of the existing equipment is changed, the damage to parts is reduced after long-time use, the disassembly and maintenance of workers are facilitated, the equipment is simple, and the manufacturing cost is low.

According to the suction nozzle, the sliding rail is connected with the buffer movable seat and the buffer fixed seat, the connecting arm is assembled on the arm seat and positioned by the pin shaft, meanwhile, the arm seat is fixed on the buffer movable seat to achieve the buffer function of the suction nozzle, the electromagnet is fixed in the clamping block, the pressure of the suction nozzle is controlled by controlling the current of the electromagnet, the suction nozzle connecting part can be buffered when the equipment is lifted up and down, and the service life of the equipment is prolonged.

Drawings

FIG. 1 is an isometric view of the present invention;

FIG. 2 is an overall schematic view of the present invention;

figure 3 is an exploded view of the adsorbent assembly of the present invention.

Illustration of the drawings:

1. a moving assembly; 101. a transverse platform; 102. a longitudinal platform; 2. an adsorption component; 201. a main base; 202. a support plate; 203. a guide rail; 204. a motor; 205. a base; 206. an eccentric shaft; 207. a connecting rod; 208. a slide plate; 209. a connecting shaft; 210. a fixing assembly; 211. a buffer fixing seat; 212. a sliding track; 213. an adjusting plate; 214. a buffer movable seat; 215. a magnet suction plate; 216. an arm base; 217. a suction nozzle; 218. a clamping block; 219. an electromagnet; 220. a connecting arm.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-3, a die bonding mechanism for semiconductor chip comprises a moving assembly 1 and an adsorption assembly 2, wherein the moving assembly 1 comprises a horizontal platform 101 and a longitudinal platform 102, the adsorption assembly 2 comprises a main base 201, a motor 204 is arranged on the top surface of the main base 201, the motor 204 is arranged on the top surface of the moving end of the longitudinal platform 102, the main base 201 is fixed with the top surface of the moving end of the longitudinal platform 102 through a bolt, an eccentric shaft 206 is arranged at one end of the motor 204, the eccentric shaft 206 is arranged in a through hole at one side of a base 205, a base 205 is fixed on the top surface of the main base 201 through a bolt, the motor 204 is fixed with the base 205, the rotating end of the motor 204 is embedded in the through hole of the base 205, the rotating end of the motor 204 is matched with the eccentric shaft 206 through a coupler, the eccentric shaft 206 is matched with a bearing in the through hole at one side of the main base 201 and is limited through a bearing cover, a connecting rod 207 is sleeved on one end surface of the eccentric shaft 206, a fixing assembly 210 is arranged on one side of the connecting rod 207, fixed subassembly 210 cup joints the surface with eccentric shaft 206 one end, fixed subassembly 210 and eccentric shaft 206 thread tightening, fixed subassembly 210 includes the bearing, bearing cap and lock nut constitute, carry out spacing fixed with connecting rod 207 and eccentric shaft 206 through fixed subassembly 210, main seat 201 bottom surface is fixed with backup pad 202, backup pad 202 one side bolt fastening has guide rail 203, backup pad 202 simultaneously is equipped with slide 208, slide 208 and guide rail 203 swing joint, be equipped with connecting axle 209 in the through-hole of slide 208 one side, connecting axle 209 one end gomphosis is in the through-hole of connecting rod 207 one end.

One side of the sliding plate 208 is provided with a buffer fixed seat 211, one side of the buffer fixed seat 211 is provided with a sliding rail 212, one side of the buffer fixed seat 211 is provided with a buffer movable seat 214, the buffer movable seat 214 is matched with the sliding rail 212, the buffer fixed seat 211 and the buffer movable seat 214 are connected in a sliding manner, when the motor 204 works, the eccentric shaft 206 is driven to lift the sliding plate 208 to realize a buffer effect on the suction nozzle 217, the surface of the buffer fixed seat 211 is fixedly provided with an adjusting plate 213, the adjusting plate 213 is used for adjusting the left and right rotation of the buffer fixed seat 211 and adjusting the level, one side of the buffer fixed seat 211 is fixedly provided with a clamping block 218, an electromagnet 219 is clamped in a groove of the clamping block 218, one side of the buffer movable seat 214 is fixedly provided with a magnet suction plate 215, the magnet suction plate 215 and the electromagnet 219 are used for controlling the pressure of the suction nozzle 217, the side of the magnet suction plate 215 is provided with an arm seat 216, the arm seat 216 is assembled on one side of the buffer movable seat 214, the arm seat 216 is adhered with a connecting arm 220, the connecting arm 220 is connected with the arm base 216 through a pin shaft, and a suction nozzle 217 is fixed in a groove on the top surface of the connecting arm 220.

The working principle of the utility model is as follows: the adsorption component 2 and the moving component 1 are assembled into a whole, the position of the adsorption component 2 is adjusted through the transverse platform 101 and the longitudinal platform 102 of the moving component 1, the motor 204 of the adsorption component 2 is connected with the eccentric shaft 206 through a coupler, the eccentric shaft 206 is connected with the sliding plate 208 through the connecting rod 207, the sliding plate 208 is connected to the supporting plate 202 through the guide rail 203, the connecting shaft 209 in the through hole of the supporting plate 202 is embedded in the groove at one end of the connecting rod 207, the motor 204 provides power, the rotating motion is converted into the up-and-down motion through the eccentric shaft 206, the sliding plate 208 moves up and down, the product is absorbed through the suction nozzle 217, the sliding track 212 is connected with the buffer movable seat 214 and the buffer fixed seat 211, the connecting arm 220 is assembled on the arm seat 216 and is positioned by the pin shaft, meanwhile, the arm seat 216 is fixed on the buffer movable seat 214 to realize the buffer function of the suction nozzle 217, the electromagnet 219 is fixed in the clamping block 218, the pressure of the suction nozzle 217 is controlled by controlling the current of the electromagnet 219, and the connection part of the suction nozzle 217 can be buffered when the equipment is lifted up and down.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a solid brilliant mechanism of semiconductor paster, includes removal subassembly (1) and adsorption component (2), its characterized in that: the moving assembly (1) comprises a transverse platform (101) and a longitudinal platform (102), the adsorption assembly (2) comprises a main seat (201), a motor (204) is arranged on the top surface of the main seat (201), an eccentric shaft (206) is arranged at one end of the motor (204), the eccentric shaft (206) is located in a through hole in one side of a base (205), a connecting rod (207) is sleeved on the surface of one end of the eccentric shaft (206), a supporting plate (202) is fixed on the bottom surface of the main seat (201), a guide rail (203) is fixed on one surface of the supporting plate (202) through a bolt, a sliding plate (208) is arranged on one surface of the supporting plate (202), the sliding plate (208) is movably connected with the guide rail (203), a connecting shaft (209) is arranged in the through hole on one surface of the sliding plate (208), and one end of the connecting shaft (209) is embedded in the through hole in one end of the connecting rod (207).

2. The die bonding mechanism for semiconductor patches as claimed in claim 1, which is characterized in that: the top surface of the main seat (201) is fixed with a base (205) through bolts, the motor (204) is fixed with the base (205), the rotating end of the motor (204) is embedded in a through hole of the base (205), and the rotating end of the motor (204) is connected with the eccentric shaft (206) through a coupling.

3. The die bonding mechanism for semiconductor patches as claimed in claim 1, which is characterized in that: one side of the connecting rod (207) is provided with a fixing component (210), the fixing component (210) is sleeved on the surface of one end of the eccentric shaft (206), and the fixing component (210) is in threaded fixing with the eccentric shaft (206).

4. The die bonding mechanism for semiconductor patches as claimed in claim 1, which is characterized in that: the motor (204) is positioned on the top surface of the moving end of the longitudinal platform (102), and the main seat (201) is fixed with the top surface of the moving end of the longitudinal platform (102) through a bolt.

5. The die bonding mechanism for semiconductor patches as claimed in claim 1, which is characterized in that: slide (208) one side is equipped with buffering fixing base (211), buffering fixing base (211) one side is equipped with slip track (212), buffering fixing base (211) one side is equipped with buffering sliding seat (214), and buffers sliding seat (214) and mutually supports with slip track (212).

6. The die bonding mechanism for semiconductor patches as claimed in claim 5, wherein: the surface of the buffer fixing seat (211) is fixed with an adjusting plate (213), one side of the buffer fixing seat (211) is fixed with a clamping block (218), and an electromagnet (219) is clamped in a groove of the clamping block (218).

7. The die bonding mechanism for semiconductor patches as claimed in claim 5, wherein: buffering movable seat (214) one side is fixed with magnet suction plate (215), magnet suction plate (215) side is equipped with arm seat (216), and arm seat (216) assemble in buffering movable seat (214) one side, arm seat (216) surface laminating has linking arm (220), and linking arm (220) are connected with arm seat (216) through the round pin axle, linking arm (220) top surface recess internal fixation has suction nozzle (217).