CN216376522U - Suction nozzle structure - Google Patents
Suction nozzle structure Download PDFInfo
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- CN216376522U CN216376522U CN202122323144.9U CN202122323144U CN216376522U CN 216376522 U CN216376522 U CN 216376522U CN 202122323144 U CN202122323144 U CN 202122323144U CN 216376522 U CN216376522 U CN 216376522U
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- suction nozzle
- accommodating space
- rod
- suction
- gas distribution
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Abstract
A suction nozzle structure, comprising: the suction nozzle rod is provided with an air channel, the air channel is extended to form an accommodating space, the accommodating space is provided with a binding surface and a clamping hook, and the outer side of the clamping hook is provided with a chamfer; the suction nozzle is provided with a suction nozzle attaching surface, a clamping part and an adsorption surface, the suction nozzle is embedded in the accommodating space of the suction nozzle rod, a plurality of gas distribution strips are arranged on the suction nozzle attaching surface, the suction nozzle attaching surface and the plurality of gas distribution strips form a gas distribution space, and the gas distribution space is provided with a plurality of gas through holes which penetrate through to the adsorption surface. The clamping part of the suction nozzle is provided with the slide-in chamfer, and the outside of the clamping hook of the accommodating space of the suction nozzle rod is provided with the chamfer, so that the suction nozzle and the suction nozzle rod can be simply and quickly assembled and embedded, and the effect that the suction nozzle and the suction nozzle rod are simply combined and are not easy to separate is achieved.
Description
Technical Field
The present invention relates to a suction nozzle, and more particularly, to a suction nozzle structure.
Background
In terms of the development of modern science and technology, in the process of carrying and moving, increasingly tiny chips, wafers or glass substrates are prone to be stained with natural settlement foreign matters in air, so that the manufacturing yield is reduced, or the objects to be moved are scratched and damaged in the moving process, therefore, the automatic production is developed, the objects to be moved are adsorbed and moved in a machine space in a vacuum or negative pressure extraction mode, and the purposes of reducing the air settlement foreign matters and scratching and damaging in the moving process are achieved.
At present, a suction nozzle for sucking a chip, a wafer or a glass substrate is generally provided, as disclosed in taiwan patent No. M573076, a dovetail-shaped receiving space is provided on both sides of a suction nozzle rod, and the suction nozzle rod are fixedly arranged corresponding to the dovetail-shaped receiving space, an air flow channel is reserved between the suction nozzle and the suction nozzle rod, and during the moving process, the surface of the chip, the wafer or the glass substrate which is increasingly tiny is easily stained with natural deposition foreign matters in air, which leads to the reduction of the manufacturing yield or the scratch, damage and other conditions during the moving process, so that the internal-suction production is developed, the object to be moved is sucked and moved in a machine space by means of vacuum or negative pressure extraction, and the purposes of reducing the air deposition foreign matters and scratching, damage and the like during the moving process are achieved, the suction nozzle is provided with a plurality of air through holes, so as to realize the effect of gas shunting to a plurality of gas through holes.
However, when the suction nozzle is assembled, the suction nozzle and the suction nozzle rod are in a dovetail shape, so that the assembly can only be slid in from the front side to the rear side, and the suction nozzle may gradually deviate from the center position of the suction nozzle rod along with the use time during the use process after the suction nozzle is slid in the suction nozzle rod, thereby causing the adverse effects of improper suction after the suction nozzle is deviated, or the suction nozzle gradually slides out of the suction nozzle rod.
Therefore, how to correct the above-mentioned defects is a technical difficulty to be solved by the present invention.
Disclosure of Invention
The present invention is directed to a suction nozzle structure to solve the above problems.
To achieve the above object, the present invention provides a suction nozzle structure, including:
the suction nozzle rod is provided with an air channel, the air channel is extended to form an accommodating space, the accommodating space is provided with a binding surface and a clamping hook, and the outer side of the clamping hook is provided with a chamfer;
the suction nozzle is provided with a suction nozzle attaching surface, a clamping part and an adsorption surface, a sliding chamfer is arranged on the clamping part, the suction nozzle is embedded in the accommodating space of the suction nozzle rod, the suction nozzle attaching surface of the suction nozzle is attached to the attaching surface of the accommodating space of the suction nozzle rod, a plurality of gas distribution strips are arranged on the suction nozzle attaching surface, the suction nozzle attaching surface and the plurality of gas distribution strips form a gas distribution space, and the gas distribution space is provided with a plurality of gas through holes which penetrate through to the adsorption surface.
Preferably, the suction nozzle is made of an elastic material.
The clamping part of the suction nozzle is provided with the slide-in chamfer, and the outside of the clamping hook of the accommodating space of the suction nozzle rod is provided with the chamfer, so that the suction nozzle and the suction nozzle rod can be simply and quickly assembled and embedded, and the effect of simple combination and difficult detachment is achieved.
Preferably, the suction surface of the suction nozzle is a rough surface.
The suction nozzle is provided with a rough surface on the suction surface, so that when the suction nozzle is closed to vacuumize and put down the object after the chip, the wafer or the glass substrate is sucked at the designated position, the chip, the wafer or the glass substrate is not easy to stick on the suction surface of the suction nozzle due to the fact that the suction surface of the suction nozzle is a rough surface, and the anti-sticking effect is achieved.
Drawings
FIG. 1: a schematic diagram of the combined implementation of the present invention;
FIG. 2: is an exploded schematic view of the present invention;
FIG. 3: is a cross-sectional schematic view of a nozzle stem of the present invention;
FIG. 4: is a schematic view of the nozzle binding surface of the nozzle of the utility model;
FIG. 5: is a schematic top view of the nozzle binding surface of the nozzle of the utility model;
FIG. 6: FIG. 5 is a schematic cross-sectional view of the nozzle of the present invention;
FIG. 7: the suction nozzle of the utility model has a very rough adsorption surface;
FIG. 8: is a schematic sectional view of the combination of the present invention.
Description of the reference numerals
1, a suction nozzle rod;
11, a gas channel;
12, an accommodating space;
13, binding surface;
14, a clamping hook;
141, chamfering;
2, a suction nozzle;
21, suction nozzle binding surface;
211 gas flow distribution bars;
12, a gas shunting space;
213, gas through holes;
22, a clamping part;
221, sliding into a chamfer;
and 23, adsorption surface.
Detailed Description
For the purpose of facilitating a concise understanding of other features and advantages of the utility model, and the efficacy achieved thereby, the utility model will be described in detail with reference to the accompanying drawings, in which:
referring to fig. 1 to 3, a nozzle structure includes:
a suction nozzle rod 1, the suction nozzle rod 1 is provided with an air channel 11, the air channel 11 is extended to be provided with an accommodating space 12, the accommodating space 12 is provided with a binding surface 13 and a clamping hook 14, and the outer side of the clamping hook 14 is provided with a chamfer 141;
referring to fig. 4, a nozzle 2 is provided, the nozzle 2 has a nozzle attachment surface 21, a fastening portion 22, and an adsorption surface 23, the fastening portion 22 has a sliding chamfer 221, the nozzle 2 is embedded in the accommodating space 12 of the nozzle rod 1, and the nozzle attachment surface 21 of the nozzle 2 is attached to the attachment surface 13 of the accommodating space 12 of the nozzle rod 1, referring to fig. 5 and 6, a plurality of gas distribution strips 211 are provided on the nozzle attachment surface 21, the nozzle attachment surface 21 and the plurality of gas distribution strips 211 form a gas distribution space 212, and the gas distribution space 212 has a plurality of gas through holes 213 penetrating to the adsorption surface.
Preferably, the suction nozzle 2 is made of an elastic material.
The engagement portion 22 of the nozzle 2 is provided with the slide-in chamfer 221, and the outer side of the hook 14 of the accommodating space 12 of the nozzle rod 1 is provided with the chamfer 141, so that the nozzle 2 and the nozzle rod 1 can be simply and quickly assembled and embedded, and the effect of simple assembly and difficult detachment is realized, as shown in fig. 1 and 7.
More preferably, the suction surface 23 of the suction nozzle 2 is a rough surface.
Referring to fig. 7, since the suction surface 23 of the suction nozzle 2 is rough, when the vacuum suction is turned off to put down the chip, wafer or glass substrate adsorbed in this embodiment after the chip, wafer or glass substrate is at a predetermined position, the chip, wafer or glass substrate is not easily adhered to the suction surface 23 of the suction nozzle 2 due to the rough surface of the suction surface 23 of the suction nozzle 2, thereby achieving the anti-adhesion effect.
Claims (4)
1. A suction nozzle structure, comprising:
the suction nozzle rod is provided with an air channel, the air channel is extended to form an accommodating space, the accommodating space is provided with a binding surface and a clamping hook, and the outer side of the clamping hook is provided with a chamfer;
the suction nozzle is provided with a suction nozzle attaching surface, a clamping part and an adsorption surface, the suction nozzle is embedded in the accommodating space of the suction nozzle rod, the suction nozzle attaching surface of the suction nozzle is attached to the attaching surface of the accommodating space of the suction nozzle rod, a plurality of gas distribution strips are arranged on the suction nozzle attaching surface, the suction nozzle attaching surface and the plurality of gas distribution strips form a gas distribution space, and the gas distribution space is provided with a plurality of gas through holes which penetrate through to the adsorption surface.
2. A suction nozzle structure according to claim 1, wherein the engaging portion of the suction nozzle is provided with a slide-in chamfer.
3. The suction nozzle structure as claimed in claim 1, wherein the suction nozzle is made of an elastic material.
4. The suction nozzle structure as claimed in claim 1, wherein the suction surface of the suction nozzle is a rough surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122323144.9U CN216376522U (en) | 2021-09-24 | 2021-09-24 | Suction nozzle structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122323144.9U CN216376522U (en) | 2021-09-24 | 2021-09-24 | Suction nozzle structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216376522U true CN216376522U (en) | 2022-04-26 |
Family
ID=81241382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122323144.9U Active CN216376522U (en) | 2021-09-24 | 2021-09-24 | Suction nozzle structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216376522U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116528502A (en) * | 2023-07-05 | 2023-08-01 | 北京三重华星电子科技有限公司 | Patch device |
-
2021
- 2021-09-24 CN CN202122323144.9U patent/CN216376522U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116528502A (en) * | 2023-07-05 | 2023-08-01 | 北京三重华星电子科技有限公司 | Patch device |
| CN116528502B (en) * | 2023-07-05 | 2023-08-22 | 北京三重华星电子科技有限公司 | Patch device |
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