CN203788249U - Slice removing system of small quartz crystal resonator chip after coating film - Google Patents

Slice removing system of small quartz crystal resonator chip after coating film Download PDF

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Publication number
CN203788249U
CN203788249U CN201420130904.1U CN201420130904U CN203788249U CN 203788249 U CN203788249 U CN 203788249U CN 201420130904 U CN201420130904 U CN 201420130904U CN 203788249 U CN203788249 U CN 203788249U
Authority
CN
China
Prior art keywords
wafer
base
crystal resonator
air inlet
turnover disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420130904.1U
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Chinese (zh)
Inventor
廖其飞
辜批林
吴宗泽
王臻
潘春琴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
East Crystal Electronic Jinhua Co ltd
Original Assignee
DONGJING ELECTRONIC Co Ltd ZHEJIANG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGJING ELECTRONIC Co Ltd ZHEJIANG filed Critical DONGJING ELECTRONIC Co Ltd ZHEJIANG
Priority to CN201420130904.1U priority Critical patent/CN203788249U/en
Application granted granted Critical
Publication of CN203788249U publication Critical patent/CN203788249U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model belongs to the fixture field of a quartz crystal component and especially relates to a slice removing system of a small quartz crystal resonator chip after coating a film. The system comprises a pedestal, a vacuum generator, a solenoid valve, a foot switch and a wafer turnover disc. The system is characterized in that the pedestal is provided with an inner edge embossment and an outer edge embossment; an air inlet of an inner cavity of the pedestal is connected to a vacuum port of the vacuum generator; an air inlet of the vacuum generator is connected to an air outlet of the solenoid valve; the solenoid valve is provided with a compressed air inlet and a solenoid valve switch; the wafer turnover disc is formed by wafer placing grooves whose middle portions are with through holes and a positioning hole; a station and a quantity of the wafer placing grooves are the same with a station and a quantity of film coating fixtures; the positioning hole is matched with a positioning pin of each film coating fixture. According to the system, a pressure difference is used to safely and effectively separate the wafer and a silver plating fixture; wafer scratches and dropping can be reduced; manual correction is reduced too; efficiency is increased, pollution is avoided and the service life of the film coating fixtures is prolonged.

Description

After a kind of small-sized quartz-crystal resonator wafer plated film, tear sheet system open
Technical field
The utility model belongs to manufactures quartz-crystal resonator technical field, specifically after a kind of small-sized quartz-crystal resonator wafer plated film, tears sheet system open.
Background technology
The wafer of quartz-crystal resonator, after completing vacuum coating, generally all will, through tearing sheet open, be turned to added glue of wafer turnover disc wait by the wafer that has plated electrode and fix.Due in coating process, between part wafer and silver-plated tool, have certain be connected and not easily separated, directly manually tear open in the process of sheet, upper cover plate easily takes up wafer and causes and drops or scratch, to the product operator sticking up, can manual correction again flow back to wafer turnover disc, efficiency is low, in makeover process, can cause pollution unavoidably, causes electrical characteristic unstable.Sometimes operating personnel also can remove to knock plated film upper cover plate with tweezers and in process, stick up too many wafer to avoid upper cover plate to start, yet knock in process and also can have certain damage to wafer itself, wafer appearance and performance are affected, thereby reduce crystal qualification rate, knock for a long time in addition and can make film coating jig distortion, shorten its life cycle, increase material consumption cost.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provide a kind of can effectively solve tear open after wafer plated film sheet efficiency low, tear open and in sheet process, cause scuffing, pollute and cause tearing sheet system open after the unsettled small-sized quartz-crystal resonator wafer plated film of electrical characteristic.
The utility model is realized by the following technical solutions:
After a kind of small-sized quartz-crystal resonator wafer plated film, tear sheet system open, comprise base, vacuum generator, electromagnetically operated valve, foot switch, wafer turnover disc, it is characterized in that: on base, be useful on and support the inward flange projection of film coating jig and wafer turnover disc and protruding for the outward flange of fixedly film coating jig and wafer turnover disc, base intracavity air inlet is communicated with the vacuum port of vacuum generator, the air inlet of vacuum generator is communicated with the gas outlet of electromagnetically operated valve, electromagnetically operated valve is also with compressed air inlet port and electromagnetic valve switch, wafer turnover disc is comprised of wafer standing groove and the location hole of Intermediate Gray through hole, the station of wafer standing groove and quantity are consistent with station and the quantity of film coating jig, location hole mates with the alignment pin of film coating jig.
The utility model base intracavity air inlet one end is recessed to air inlet bottom, and one end, air inlet opposite and base inward flange projection are contour, and two ends form slope together, and base inward flange projection size is mated with wafer turnover disc with film coating jig; Base outward flange convexity base inward flange projection is slightly high, and the concrete silver-plated tool of ratio and the thickness of wafer turnover disc and slightly high, can be positioned at the two in base inward flange projection.
Base of the present utility model is also provided with base outward flange groove, and base outward flange groove is slightly lower than base inward flange projection, facilitates the placement of film coating jig and wafer turnover disc and picks up upset.
The utility model electromagnetic valve switch is foot switch, for controlling electromagnetically operated valve, is communicated with and closes.
The utility model adopts technique scheme, be intended to by pressure differential wafer is separated safely and effectively with silver-plated tool, can reduce wafer scratches and drops, reduce manually and revise, raise the efficiency, avoid polluting, extend film coating jig useful life, greatly improve the stability of wafer utilance and product electrical characteristic.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model support system.
Fig. 2 is the structural representation of the utility model wafer turnover disc.
Embodiment
With reference to the accompanying drawings, embodiment of the present utility model is described further.
In Fig. 1 and Fig. 2, after a kind of small-sized quartz-crystal resonator wafer plated film, tear sheet system open, comprise base 1, vacuum generator 3, electromagnetically operated valve 4, foot switch 5, wafer turnover disc 2, base 1 is by base intracavity 6, base outward flange projection 7, base outward flange groove 8, base inward flange projection 9, base intracavity air inlet 10 forms, base intracavity air inlet 10 one end are recessed to air inlet bottom, one end, air inlet opposite and base inward flange projection are contour, the two ends together gradient are 60 ° of slopes, base inward flange projection 9 is for supporting film coating jig and wafer turnover disc 2, its size is mated with wafer turnover disc 2 with film coating jig, base outward flange projection 7 is than protruding 9 height of base inward flange, and the concrete silver-plated tool of ratio and the thickness of wafer turnover disc and slightly high, can be positioned at the two in base inward flange projection 9, base outward flange groove 8 is slightly lower than base inward flange projection 9, facilitates the placement of film coating jig and wafer turnover disc and picks up upset, wafer turnover disc 2 is by wafer standing groove 16(Intermediate Gray through hole) and location hole 17 form, the station of wafer standing groove and quantity are consistent with station and the quantity of silver-plated tool, location hole mates with the alignment pin of silver-plated tool.
The utility model base intracavity air inlet 10 is communicated with vacuum generator vacuum port 11, vacuum generator with air inlet 12 in gas outlet 13, vacuum generator air inlet 12 is communicated with electromagnetically operated valve gas outlet 14, electromagnetically operated valve air inlet 15 connects compressed air, and the connection of electromagnetically operated valve is controlled with closing by foot switch 5.
Vacuum generator 3 of the present utility model is with filter; Described electromagnetically operated valve 4 is normal-closed electromagnetic valve, and conducting during energising, closes during power-off.
When the utility model is used, the tool that the wafer that has plated electrode is housed is put in base inward flange projection 9 fixing, step on foot switch 5, electromagnetically operated valve 4 conductings, vacuum generator 3 is started working, the air-flow of vacuum generator vacuum port 11 adsorbs the wafer in silver-plated tool, now can open smoothly upper cover plate and the electric pole plate of film coating jig, then the location hole of wafer turnover disc 17 is corresponding fixing with the alignment pin of silver-plated tool, now wafer turnover disc 2 covers film coating jig, unclamp foot switch 5 simultaneously, silver-plated tool and wafer turnover disc 2 are together picked up to 180 ° of upsets to be put back in base inward flange projection 9 fixing, now wafer turnover disc 2 below, step on foot switch 5, vacuum pneumatic is attached to chip sucking in wafer standing groove 16 by the through hole on wafer turnover disc 2, now film coating jig is opened, the wafer turnover disc 2 that wafer is housed is put into ready hand basket holding point glue.
The utility model base 1, wafer turnover disc 2 all adopt stainless steel material.

Claims (9)

1. after a small-sized quartz-crystal resonator wafer plated film, tear sheet system open, comprise base, vacuum generator, electromagnetically operated valve, foot switch, wafer turnover disc, it is characterized in that: on base, be useful on and support the inward flange projection of film coating jig and wafer turnover disc and protruding for the outward flange of fixedly film coating jig and wafer turnover disc, base intracavity air inlet is communicated with the vacuum port of vacuum generator, the air inlet of vacuum generator is communicated with the gas outlet of electromagnetically operated valve, electromagnetically operated valve is also with compressed air inlet port and electromagnetic valve switch, wafer turnover disc is comprised of wafer standing groove and the location hole of Intermediate Gray through hole, the station of wafer standing groove and quantity are consistent with station and the quantity of film coating jig, location hole mates with the alignment pin of film coating jig.
2. after small-sized quartz-crystal resonator wafer plated film according to claim 1, tear sheet system open, it is characterized in that: base inward flange projection size is mated with wafer turnover disc with film coating jig; Base outward flange convexity base inward flange projection is slightly high, and the concrete silver-plated tool of ratio and the thickness of wafer turnover disc and slightly high, can be positioned at the two in base inward flange projection.
3. after small-sized quartz-crystal resonator wafer plated film according to claim 1 and 2, tear sheet system open, it is characterized in that: base is also provided with base outward flange groove, base outward flange groove is slightly lower than base inward flange projection.
4. after small-sized quartz-crystal resonator wafer plated film according to claim 1 and 2, tear sheet system open, it is characterized in that: base intracavity air inlet one end is recessed to air inlet bottom, one end, air inlet opposite and base inward flange projection are contour, and two ends form slope together.
5. after small-sized quartz-crystal resonator wafer plated film according to claim 4, tear sheet system open, it is characterized in that: described ramp slope is 60 °.
6. after small-sized quartz-crystal resonator wafer plated film according to claim 1 and 2, tear sheet system open, it is characterized in that: described electromagnetic valve switch is foot switch.
7. after small-sized quartz-crystal resonator wafer plated film according to claim 1, tear sheet system open, it is characterized in that: described vacuum generator is with filter.
8. after small-sized quartz-crystal resonator wafer plated film according to claim 1, tear sheet system open, it is characterized in that: described electromagnetically operated valve is normal-closed electromagnetic valve.
9. after small-sized quartz-crystal resonator wafer plated film according to claim 1, tear sheet system open, it is characterized in that: described base, wafer turnover disc all adopt stainless steel material.
CN201420130904.1U 2014-03-21 2014-03-21 Slice removing system of small quartz crystal resonator chip after coating film Expired - Lifetime CN203788249U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420130904.1U CN203788249U (en) 2014-03-21 2014-03-21 Slice removing system of small quartz crystal resonator chip after coating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420130904.1U CN203788249U (en) 2014-03-21 2014-03-21 Slice removing system of small quartz crystal resonator chip after coating film

Publications (1)

Publication Number Publication Date
CN203788249U true CN203788249U (en) 2014-08-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106378730A (en) * 2016-11-24 2017-02-08 南京中电熊猫晶体科技有限公司 Negative-pressure adsorption clamp device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106378730A (en) * 2016-11-24 2017-02-08 南京中电熊猫晶体科技有限公司 Negative-pressure adsorption clamp device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20170512

Address after: 321016 Zhejiang, Jinhua, Hong Hong West Road, No. 555

Patentee after: EAST CRYSTAL ELECTRONIC JINHUA Co.,Ltd.

Address before: 321000 Zhejiang, Jinhua, Hong Hong West Road, No. 555

Patentee before: ZHEJIANG EAST CRYSTAL ELECTRONIC CO.,LTD.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140820